CN109037479B - Packaging method and display panel - Google Patents
Packaging method and display panel Download PDFInfo
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- CN109037479B CN109037479B CN201810847514.9A CN201810847514A CN109037479B CN 109037479 B CN109037479 B CN 109037479B CN 201810847514 A CN201810847514 A CN 201810847514A CN 109037479 B CN109037479 B CN 109037479B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The embodiment of the application provides a packaging method and a display panel, wherein the packaging method comprises the following steps: providing a substrate to be packaged and a cover plate; forming an inorganic packaging layer on a substrate to be packaged; forming an intermediate layer containing a photosensitive material on the inorganic encapsulation layer, and irradiating the intermediate layer with light of a preset wavelength to form a bonding layer; forming an organic encapsulation layer on the bonding layer; and implementing a preset temperature treatment process to enable the photosensitive material in the bonding layer to be respectively bonded with the inorganic packaging layer and the organic packaging layer so as to finally form the packaging film. The bonding layer enables the inorganic packaging layer and the organic packaging layer to be bonded more tightly, the capacity of the packaging film for bearing external force is improved, the probability of peeling of the interface between the inorganic packaging layer and the organic packaging layer is reduced, the blocking effect of the packaging film is further improved, the packaging film is formed on the substrate in the display panel by adopting the packaging method, water vapor and oxygen can be effectively prevented from contacting the substrate, and the substrate is prevented from being corroded and damaged.
Description
Technical Field
The application relates to the technical field of display panel packaging, in particular to a packaging method and a display panel.
Background
An OLED (Organic Light-Emitting semiconductor or Organic electroluminescent display) is a display illumination technology which has been developed in recent years, and is widely used because of its advantages such as high response, high contrast, flexibility, and the like. Especially in the display field, the application prospect of the OLED is very broad, for example, the related technology of the OLED is generally adopted in the display panel which is developed vigorously at present.
Since the OLED device is easily damaged by moisture and oxygen, the display panel using the OLED device must be effectively packaged. In order to adapt to the characteristic that the display panel is bendable, the packaging film of the display panel also needs to have certain flexibility. In the prior art, a packaging film of a display panel is generally formed by overlapping an inorganic packaging layer and an organic packaging layer, the inorganic packaging layer can block external water vapor and oxygen, and the organic packaging layer can ensure the surface of the packaging film to be flat and release stress.
However, in the prior art, the adhesion between the inorganic encapsulation layer and the organic encapsulation layer of the encapsulation film is not tight enough, which may affect the barrier effect of the encapsulation film. For example, after the display panel is subjected to an external force (e.g., the display panel is subjected to a force during a carrying process or a force during a bending process), an interface between the inorganic encapsulation layer and the organic encapsulation layer may peel off, so that a gap may be generated between the inorganic encapsulation layer and the organic encapsulation layer, and moisture and oxygen may enter the gap and contact with a substrate for display in the display panel, so that the substrate may be corroded and damaged, and thus, the barrier effect of the encapsulation film may completely fail.
In summary, the prior art has a defect that the substrate in the display panel is corroded and damaged due to the fact that the packaging film cannot effectively block water vapor.
Disclosure of Invention
The application provides a packaging method and a display panel aiming at the defects of the existing mode, and aims to solve the technical problem that in the prior art, a substrate in the display panel is corroded and damaged due to the fact that a packaging film cannot effectively block water vapor.
In a first aspect, an embodiment of the present application provides a packaging method, including: providing a substrate to be packaged and a cover plate; forming an inorganic packaging layer on a substrate to be packaged; forming an intermediate layer containing a photosensitive material on the inorganic encapsulation layer, and irradiating the intermediate layer with light of a preset wavelength to form a bonding layer; forming an organic encapsulation layer on the bonding layer; and implementing a preset temperature treatment process to enable the photosensitive material in the bonding layer to be respectively bonded with the inorganic packaging layer and the organic packaging layer so as to finally form the packaging film.
Optionally, in this embodiment, the inorganic encapsulation layer is a silicon oxide layer, and the photosensitive material in the intermediate layer includes a cage-type polysilsesquioxane-based polyurethane that includes a siloxane bond and a covalent bond between silicon and another group; the organic encapsulation layer is an organic resin layer, and the organic resin layer comprises an oxyethylene group.
Optionally, in an embodiment of the present application, irradiating the intermediate layer with light of a predetermined wavelength to form the bonding layer includes: irradiating the intermediate layer with light of a predetermined wavelength to break the siloxane bond in the intermediate layer or the covalent bond between silicon and other groups to obtain a bonding layer comprising silicon atoms having dangling bonds and oxygen atoms.
Optionally, in this embodiment of the application, a preset temperature treatment process is performed to combine the photosensitive material in the bonding layer with the inorganic encapsulation layer and the organic encapsulation layer, respectively, so as to finally form an encapsulation film, where the preset temperature treatment process includes: the preset temperature treatment process is performed such that the silicon atoms having the dangling bonds in the bonding layer are bonded to the oxyethylene groups in the organic resin layer and the oxygen atoms having the dangling bonds are bonded to the siloxy groups in the silicon oxide layer.
Optionally, in this embodiment of the application, after forming an inorganic encapsulation layer on a substrate to be encapsulated, and before forming an intermediate layer containing a photosensitive material on the inorganic encapsulation layer, the method further includes: and roughening the surface of the inorganic packaging layer by adopting a plasma bombardment method.
Optionally, in this embodiment of the application, after the performing the preset temperature treatment process, the method further includes: and (5) implementing a drying process.
Optionally, in this embodiment of the application, the temperature range of the preset temperature treatment process is 100 to 120 degrees celsius, and the time range is 10 to 20 minutes.
Optionally, in an embodiment of the present application, forming an inorganic encapsulation layer on a substrate to be encapsulated includes: and depositing an inorganic packaging layer on the substrate to be packaged by adopting an atomic layer deposition process.
Optionally, in an embodiment of the present application, forming the organic encapsulation layer on the bonding layer includes: and coating or ink-jet printing the bonding layer to form an organic packaging layer.
In a second aspect, an embodiment of the present application further provides a display panel, where the display panel is packaged by using the packaging method provided in the embodiment of the present application; the display panel includes an encapsulation film including: an inorganic encapsulation layer, a bonding layer, and an organic encapsulation layer on a substrate in the display panel, and a photosensitive material in the bonding layer is bonded to the inorganic encapsulation layer and the organic encapsulation layer, respectively.
Optionally, in an embodiment of the present application, the inorganic encapsulation layer is a silicon oxide layer, the photosensitive material in the bonding layer includes cage polysilsesquioxane-based polyurethane, and the organic encapsulation layer is an organic resin layer.
Optionally, in an embodiment of the present application, the thickness of the inorganic encapsulation layer is 10 nm to 200 nm;
and/or the bonding layer has a thickness of 95 to 105 nanometers;
and/or the organic encapsulation layer has a thickness of 0.5 to 5 nanometers.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
in the process of forming the packaging film, the intermediate layer is irradiated by light with a preset wavelength to enable the photosensitive material to generate chemical change to form a bonding layer, and the bonding layer, the inorganic packaging layer and the organic packaging layer are subjected to chemical reaction through a preset temperature treatment process to enable the photosensitive material in the bonding layer to be respectively bonded with the inorganic packaging layer and the organic packaging layer, so that the inorganic packaging layer and the organic packaging layer are bonded more tightly by the chemical bonding method, the capability of the packaging film for bearing external force is improved, the probability of peeling of the interface between the inorganic packaging layer and the organic packaging layer of the packaging film is reduced, the barrier effect of the packaging film is further improved, the packaging film is formed on the substrate for displaying in the display panel by adopting the packaging method provided by the embodiment of the application, and the contact between water vapor and oxygen and the substrate can be effectively prevented, the substrate is prevented from being corroded and damaged, and the quality of the display panel comprising the substrate is guaranteed.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flowchart of a packaging method according to an embodiment of the present disclosure;
fig. 2 is a schematic flowchart of an extended packaging method according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
FIG. 4 is an enlarged view of a portion A of FIG. 3 according to an exemplary embodiment of the present disclosure;
FIG. 5a is a first structural formula of a cage polysilsesquioxane-based polyurethane as provided in an example herein;
FIG. 5b is a second structural formula of a cage polysilsesquioxane-based polyurethane as provided in an example herein;
FIG. 5c is a third structural formula of a cage polysilsesquioxane-based polyurethane as provided in the examples herein;
in the figure:
1-a substrate; 2-cover plate;
3-packaging the film; 31-an inorganic encapsulation layer; 32-a bonding layer; 33-organic encapsulation layer.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
An embodiment of the present application provides a packaging method, a flow diagram of the method is shown in fig. 1, and the method includes:
s1, providing a substrate 1 to be packaged and a cover plate 2, and forming an inorganic packaging layer 31 on the substrate 1 to be packaged;
s2, forming an intermediate layer containing a photosensitive material on the inorganic encapsulation layer 31;
s3, irradiating the intermediate layer with light of a predetermined wavelength to form the bonding layer 32;
s4, forming an organic encapsulation layer 33 on the bonding layer 32;
s5, performing a predetermined temperature treatment process so that the photosensitive material in the bonding layer 32 is bonded to the inorganic encapsulation layer 31 and the organic encapsulation layer 33, respectively, to finally form the encapsulation film 3.
In the process of the formed packaging film 3 in the embodiment of the application, the intermediate layer enables the photosensitive material to generate chemical change and form the bonding layer 32 after being irradiated by light with preset wavelength, the bonding layer 32, the inorganic packaging layer 31 and the organic packaging layer 33 generate chemical reaction through a preset temperature treatment process, the photosensitive material in the bonding layer 32 is enabled to be respectively bonded with the inorganic packaging layer 31 and the organic packaging layer 33, the bonding between the inorganic packaging layer 31 and the organic packaging layer 33 is enabled to be more compact through the chemical bonding mode, the capability of bearing external force of the packaging film 3 is improved, the probability of the peeling phenomenon of the interface between the inorganic packaging layer 31 and the organic packaging layer 33 of the packaging film 3 is reduced, and further the blocking effect of the packaging film 3 is improved. The substrate for displaying in the display panel is used as the substrate 1 to be packaged, and the packaging film 3 is formed on the substrate 1 by adopting the packaging method provided by the embodiment of the application, so that the contact between water vapor and oxygen and the substrate 1 can be effectively prevented, the substrate 1 is prevented from being corroded and damaged, and the quality of the display panel comprising the substrate 1 is ensured.
Optionally, in the embodiment of the present application, the inorganic encapsulation layer 31 is a silicon oxide layer. The photosensitive material in the intermediate layer includes a cage-type polysilsesquioxane-based polyurethane (POSS-based polyurethane) having a structural formula including at least three forms as shown in fig. 5a to 5c, which include a silicon-oxygen bond and a covalent bond between silicon and other groups. The organic encapsulation layer 33 is an organic resin layer including an oxyethylene group.
The above steps are described in detail below.
Alternatively, S3 in this embodiment of the present application, irradiating the intermediate layer with light of a preset wavelength to form the bonding layer 32, includes:
the intermediate layer is irradiated with light of a predetermined wavelength to break the silicon oxygen bond in the intermediate layer or the covalent bond between silicon and other groups, resulting in a bonding layer 32 comprising silicon atoms and oxygen atoms having dangling bonds. Wherein, the light with the preset wavelength can adopt ultraviolet light.
Optionally, at S5 in this embodiment, a preset temperature treatment process is performed to combine the photosensitive material in the bonding layer 32 with the inorganic encapsulation layer 31 and the organic encapsulation layer 33, respectively, so as to finally form the encapsulation film 3, where the preset temperature treatment process includes:
the preset temperature treatment process is performed such that the silicon atoms having dangling bonds in the bonding layer 32 are bonded to the oxyethylene groups in the organic resin layer and the oxygen atoms having dangling bonds are bonded to the siloxy groups in the silicon oxide layer. The temperature range of the preset temperature treatment process may be 100 to 120 ℃, and the time range may be 10 to 20 minutes.
In the embodiment of the application, ultraviolet light is used for irradiating cage type polysilsesquioxane based polyurethane to break the silicon-oxygen bond and the covalent bond between silicon and other groups to obtain the combination of silicon atom with dangling bond and oxygen atom, and then a preset temperature treatment process is carried out to combine the silicon atom with dangling bond in the combination layer 32 with the oxyethylene group in the organic resin layer and combine the oxygen atom with dangling bond with the silicon-oxygen group in the silicon oxide layer, thereby realizing the combination of the combination layer 32 with the organic resin layer and the silicon oxide layer through chemical reaction.
In the prior art, when the display panel is bent, in addition to the peeling phenomenon occurring at the interface between the inorganic encapsulation layer 31 and the organic encapsulation layer 33 of the encapsulation film 3, the inorganic encapsulation layer 31 may also generate cracks due to its poor spreadability, and water vapor and oxygen may enter the encapsulation film 3 through the organic encapsulation layer 33 and may permeate into the cracks, and further contact with the substrate 1 in the display panel, so that the substrate 1 is corroded and damaged. In the anchor coat 32 of this application embodiment, its photosensitive material includes cage type polysilsesquioxane base polyurethane, this cage type polysilsesquioxane base polyurethane is an organic inorganic hybrid molecule, can reduce the surface energy of organic encapsulation layer 33, thereby increase the hydrophobicity of organic encapsulation layer 33, steam and oxygen just can't get into encapsulation film 3 from organic encapsulation layer 33, just can't permeate inorganic layer's crackle just naturally, this barrier effect of encapsulation film 3 has been improved further, the risk that base plate 1 among the display panel was corroded the damage has been reduced.
Optionally, in this embodiment of the application, after forming the inorganic encapsulation layer 31 on the substrate 1 to be encapsulated at S1, and before forming the intermediate layer including the photosensitive material on the inorganic encapsulation layer 31 at S2, the method further includes:
the surface of the inorganic encapsulation layer 31 is roughened using a plasma bombardment method.
The roughened surface of the inorganic encapsulating layer 31 contributes to an improvement in the bonding strength between the inorganic encapsulating layer 31 and the bonding layer 32. In one aspect, the roughened surface of the inorganic encapsulation layer 31 and the surface of the bonding layer 32 may form an interlaced structure therebetween, which helps to increase adhesion therebetween and bonding strength. On the other hand, after the surface of the inorganic encapsulating layer 31 is roughened, the surface area of the inorganic encapsulating layer 31 is increased, which increases the contact area between the inorganic encapsulating layer 31 and the bonding layer 32, further increases the number of oxygen atoms and silicon oxygen groups bonded between the inorganic encapsulating layer 31 and the bonding layer, and further increases the bonding strength between the inorganic encapsulating layer and the bonding layer.
Optionally, in this embodiment of the application, after the step of performing the preset temperature treatment process at S5, the method further includes:
and (5) implementing a drying process. The baking process helps the encapsulation film 3 to be cured quickly. In the embodiment of the application, the temperature range of the drying process may be 80 to 100 degrees celsius, and the time range may be 30 to 60 minutes.
Optionally, in this embodiment of the application, the step of providing a substrate 1 to be packaged and a cover plate 2, and the step of forming the inorganic encapsulation layer 31 on the substrate 1 to be packaged specifically includes:
an inorganic encapsulation Layer 31 is deposited on the substrate 1 to be encapsulated using an Atomic Layer Deposition (ALD) process. Atomic layer deposition is a process of depositing a substance as a monoatomic film layer by layer onto a substrate surface. In an atomic layer deposition process, the chemical reaction of a new atomic film is directly related to the previous one in such a way that only one layer of atoms is deposited per reaction. The inorganic packaging layer 31 is formed by adopting an atomic layer deposition process, so that the thickness uniformity of the inorganic packaging layer 31 can be ensured, and the flatness of the display panel is improved; in addition, the inorganic packaging layer 31 with uniform thickness can avoid the phenomenon of local stress concentration in the stress process, and avoid the structure from being damaged by stress.
Optionally, in this embodiment of the application, the forming of the organic encapsulation layer 33 on the bonding layer 32 at S4 specifically includes:
an organic encapsulation layer 33 is formed on the bonding layer 32 by Coating (Coating) or inkjet Printing (IJP). Coating and inkjet printing can improve material usage rate and also simplify the formation process of the organic encapsulation layer 33.
An embodiment of the present application further provides an extended encapsulation method, and a flowchart of the method is shown in fig. 2, where the method includes:
s11, providing a substrate 1 to be packaged and a cover plate 2, and forming a silicon oxide layer on the substrate 1 to be packaged;
and S12, roughening the surface of the silicon oxide layer by adopting a plasma bombardment method.
S13, forming an intermediate layer containing cage type polysilsesquioxane-based polyurethane on the silicon oxide layer;
s14, irradiating the middle layer by ultraviolet light to break the silicon-oxygen bond of the cage polysilsesquioxane-based polyurethane and the covalent bond between silicon and other groups to obtain a bonding layer 32 containing silicon atoms and oxygen atoms with dangling bonds;
s15, forming an organic resin layer on the bonding layer 32;
s16, performing a preset temperature treatment process such that the silicon atoms having dangling bonds in the bonding layer 32 are bonded to the oxyethylene groups in the organic resin layer, and the oxygen atoms having dangling bonds are bonded to the siloxy groups in the silicon oxide layer;
and S17, performing a drying process to finally form the packaging film 3.
Optionally, in this embodiment of the application, after performing a drying process to finally form the encapsulation film 3 at S17, the method further includes: the cover plate 2 is covered on the encapsulation film 3.
Based on the same inventive concept, the embodiments of the present application further provide a display panel, which has a structure as shown in fig. 3 and 4, wherein the thickness, the area size, and the shape of each layer in the drawings do not reflect the real ratio of each layer, and the purpose is only to schematically illustrate the embodiments of the present application. The display panel is packaged by adopting the packaging method provided by the embodiment of the application. The display panel includes an encapsulation film 3, and the encapsulation film 3 includes: an inorganic encapsulation layer 31, a bonding layer 32, and an organic encapsulation layer 33 on a substrate 1 in the display panel, and a photosensitive material in the bonding layer 33 is bonded to the inorganic encapsulation layer 31 and the organic encapsulation layer 33, respectively.
Alternatively, in the present embodiment, the inorganic encapsulating layer 31 is a silicon oxide layer, the photosensitive material in the bonding layer 32 includes cage type polysilsesquioxane-based polyurethane, and the organic encapsulating layer 33 is an organic resin layer.
Specifically, in the present embodiment, the photosensitive material in the bonding layer 32 includes a cage-type polysilsesquioxane-based polyurethane in a bonded state in which silicon atoms of the cage-type polysilsesquioxane-based polyurethane are bonded to oxyethylene groups in the organic resin layer and oxygen atoms of the cage-type polysilsesquioxane-based polyurethane are bonded to siloxy groups in the silicon oxide layer.
Optionally, in the embodiment of the present application, the thickness of the inorganic encapsulation layer 31 is 10 nm to 200 nm.
Optionally, the bonding layer 32 has a thickness of 95 to 105 nanometers.
Optionally, the thickness of the mechanical encapsulation layer 33 is 0.5 nm to 5 nm.
Optionally, the substrate 1 in the display panel provided in the embodiment of the present application includes an OLED (Organic Light-Emitting Diode).
Optionally, the display panel provided in the embodiment of the present application further includes a cover plate 2, and the cover plate 2 covers the encapsulation film 3.
The display panel provided by the embodiment of the application can be applied to various display devices, for example, the display panel can be as follows: the display device comprises a desktop computer, a tablet computer, a notebook computer, a mobile phone, a PDA, a GPS, a vehicle-mounted display, a projection display, a video camera, a digital camera, an electronic watch, a calculator, an electronic instrument, an instrument, a liquid crystal panel, electronic paper, a television, a display, a digital photo frame, a navigator and other products or components with display functions, and can be applied to multiple fields of public display, illusion display and the like.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. in the process of forming the packaging film, the intermediate layer is irradiated by light with a preset wavelength to enable the photosensitive material to generate chemical change to form a bonding layer, and the bonding layer, the inorganic packaging layer and the organic packaging layer are subjected to chemical reaction through a preset temperature treatment process to enable the photosensitive material in the bonding layer to be respectively bonded with the inorganic packaging layer and the organic packaging layer, so that the inorganic packaging layer and the organic packaging layer are bonded more tightly by the chemical bonding method, the capability of the packaging film for bearing external force is improved, the probability of peeling of the interface between the inorganic packaging layer and the organic packaging layer of the packaging film is reduced, the barrier effect of the packaging film is further improved, the packaging film is formed on the substrate of the display panel by adopting the packaging method provided by the embodiment of the application, and the contact between water vapor and oxygen and the substrate can be effectively prevented, the substrate is prevented from being corroded and damaged, and the quality of the display panel comprising the substrate is guaranteed.
2. In the anchor coat of this application embodiment, its photosensitive material includes cage type polysilsesquioxane base polyurethane, this cage type polysilsesquioxane base polyurethane is an organic inorganic hybrid molecule, can reduce the surface energy on organic encapsulation layer, thereby increase the hydrophobicity on organic encapsulation layer, steam and oxygen just can't get into the encapsulation film from organic encapsulation layer, just can't permeate the crackle on inorganic layer just naturally, this barrier effect of encapsulation film has just been improved further, the risk that the base plate among the display panel was corroded and damaged has been reduced.
3. In the embodiment of the application, after the surface of the inorganic packaging layer is roughened, the bonding strength between the inorganic packaging layer and the bonding layer is improved. In one aspect, the roughened surface of the inorganic encapsulation layer and the surface of the bonding layer can form an interlaced structure therebetween, which helps to increase adhesion therebetween and increase bonding strength. On the other hand, after the surface of the inorganic packaging layer is roughened, the surface area of the inorganic packaging layer is increased, so that the contact area between the inorganic packaging layer and the bonding layer is increased, the number of oxygen atoms and silicon oxygen groups bonded between the inorganic packaging layer and the bonding layer is increased, and the bonding strength of the inorganic packaging layer and the bonding layer is further increased.
4. According to the embodiment of the application, the inorganic packaging layer is formed by adopting the atomic layer deposition process, so that the thickness uniformity of the inorganic packaging layer can be ensured, and the flatness of the display panel is improved; in addition, the inorganic packaging layer has uniform thickness, so that the phenomenon of local stress concentration in the stress process can be avoided, and the structure is prevented from being damaged by stress.
5. According to the embodiment of the application, the material utilization rate can be improved by adopting coating or ink-jet printing, and the forming process of the inorganic packaging layer can be simplified.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (8)
1. A method of packaging, comprising:
providing a substrate to be packaged and a cover plate;
forming an inorganic packaging layer on the substrate to be packaged, wherein the inorganic packaging layer is a silicon oxide layer;
forming an intermediate layer containing a photosensitive material on the inorganic encapsulation layer, and irradiating the intermediate layer with light of a preset wavelength to form a bonding layer; the photosensitive material in the intermediate layer comprises a cage polysilsesquioxane-based polyurethane comprising siloxane bonds and covalent bonds between silicon and other groups; the irradiating the intermediate layer with light of a predetermined wavelength to form a bonding layer includes: irradiating the intermediate layer with light of a preset wavelength to break silicon-oxygen bonds in the intermediate layer or covalent bonds between silicon and other groups to obtain a bonding layer containing silicon atoms with dangling bonds and oxygen atoms;
forming an organic encapsulation layer on the bonding layer, wherein the organic encapsulation layer is an organic resin layer comprising an oxyethylene group;
implementing a preset temperature treatment process to enable the photosensitive material in the bonding layer to be respectively bonded with the inorganic encapsulation layer and the organic encapsulation layer so as to finally form an encapsulation film, wherein the preset temperature treatment process comprises the following steps: performing a preset temperature treatment process such that silicon atoms having dangling bonds in the bonding layer are bonded to the oxyethylene groups in the organic resin layer and oxygen atoms having dangling bonds are bonded to the siloxy groups in the silicon oxide layer.
2. The method according to claim 1, wherein after the forming of the inorganic encapsulation layer on the substrate to be encapsulated and before the forming of the intermediate layer comprising the photosensitive material on the inorganic encapsulation layer, further comprising: and roughening the surface of the inorganic packaging layer by adopting a plasma bombardment method.
3. The method according to claim 1, further comprising, after the performing the predetermined temperature treatment process: and (5) implementing a drying process.
4. The method according to claim 1, wherein the predetermined temperature treatment process is performed at a temperature ranging from 100 ℃ to 120 ℃ for a time ranging from 10 minutes to 20 minutes.
5. The method of claim 1, wherein forming an inorganic encapsulation layer on the substrate to be encapsulated comprises: and depositing the inorganic packaging layer on the substrate to be packaged by adopting an atomic layer deposition process.
6. The method of claim 1, wherein forming an organic encapsulation layer on the bonding layer comprises: and coating or ink-jet printing the bonding layer to form the organic packaging layer.
7. A display panel, wherein the display panel is packaged by the packaging method according to any one of claims 1 to 6;
the display panel includes an encapsulation film including: an inorganic encapsulation layer, a bonding layer and an organic encapsulation layer on a substrate in the display panel, and a photosensitive material in the bonding layer is bonded to the inorganic encapsulation layer and the organic encapsulation layer, respectively; the photosensitive material in the bonding layer comprises cage-type polysilsesquioxane-based polyurethane, the inorganic packaging layer is a silicon oxide layer, and the organic packaging layer is an organic resin layer.
8. The display panel according to claim 7,
the thickness of the inorganic packaging layer is 10 to 200 nanometers;
and/or the bonding layer has a thickness of 95 to 105 nanometers;
and/or the organic encapsulation layer has a thickness of 0.5 to 5 nanometers.
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| CN103764301A (en) * | 2011-08-01 | 2014-04-30 | 富士胶片株式会社 | Functional film manufacturing method and functional film |
| CN107302014A (en) * | 2017-07-17 | 2017-10-27 | 上海天马有机发光显示技术有限公司 | A kind of organic electroluminescence display panel, its display device and preparation method thereof |
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| JP4324718B2 (en) * | 2000-05-30 | 2009-09-02 | カシオ計算機株式会社 | Electroluminescent device |
| CN1878735A (en) * | 2003-11-13 | 2006-12-13 | 住友商事株式会社 | Flexible substrate and coating liquid |
| CN101974227A (en) * | 2010-05-20 | 2011-02-16 | 复旦大学 | Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof |
| CN103764301A (en) * | 2011-08-01 | 2014-04-30 | 富士胶片株式会社 | Functional film manufacturing method and functional film |
| CN107302014A (en) * | 2017-07-17 | 2017-10-27 | 上海天马有机发光显示技术有限公司 | A kind of organic electroluminescence display panel, its display device and preparation method thereof |
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