JP6170627B2 - Electronic device manufacturing method and composite film - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic device such as an organic EL device sealed with a gas barrier film or the like, and a composite film used in the method for manufacturing the electronic device.

Electronic devices that deteriorate due to moisture, such as organic EL devices and solar cells, are sealed with various sealing members. Electronic devices are usually sealed with glass. On the other hand, for the purpose of reducing the weight and improving the impact resistance, the sealing of electronic devices using a plastic film has been studied.
Moreover, in manufacture of an electronic device, the functional film which expresses the target function, such as a gas barrier film and an optical film, is also affixed.

  For manufacturing electronic devices by sealing such electronic devices or attaching functional films, composite films having films attached to both sides of an adhesive layer are used.

For example, in Patent Document 1, as a composite film (protective laminate) for sealing an organic EL device, a pressure-sensitive adhesive layer, a protective film that can be peeled and removed from the pressure-sensitive adhesive layer, and a pressure-sensitive adhesive layer And a surface base material having gas barrier properties attached to the surface base material, the surface base material has an inorganic oxide vapor-deposited layer formed on a transparent base material, and the peel strength of the pressure-sensitive adhesive layer is Composite films that are 100 mN / 25 mm or less are described.
According to this composite film, the organic EL device main body is sealed with a surface substrate having gas barrier properties, with easy handling and good workability, and further suppressing deterioration of the gas barrier properties of the protective film due to peeling. Thus, an organic EL device can be manufactured.

Patent Document 2 discloses that a composite film (baseless double-sided pressure-sensitive adhesive sheet) used for manufacturing an electronic device has a release film on both sides of the pressure-sensitive adhesive layer, and at least one of the release films is biaxial. An oriented polyester film, a coating layer, and a release agent layer are provided in this order, and the amount of oligomer on the surface of the release agent layer after heating this release film at 180 ° C. for 10 minutes is 1. Composite films that are 0.000 mg / m ² or less are described.
According to this composite film, in the manufacture of an electronic device in which a functional film is adhered by the pressure-sensitive adhesive layer, it is possible to reduce foreign matters resulting from the oligomer of the pressure-sensitive adhesive layer.

JP 2009-28946 A JP 2014-25069 A

In manufacturing an organic EL device using a composite film described in Patent Document 1, first, the protective film is peeled from the composite film. Next, the composite film is stuck to the organic EL device body in which the organic EL element is formed on the base material with the pressure-sensitive adhesive layer facing. Thereby, an organic EL device main body is sealed by a surface base material, ie, a gas barrier film, and an organic EL device is manufactured.
In the manufacture of an electronic device using the composite film described in Patent Document 2, one release film is peeled off, and a functional film that expresses a target function is attached to the pressure-sensitive adhesive layer. Next, the other release film is peeled off, and the electronic device is manufactured by attaching the composite film with the pressure-sensitive adhesive layer facing the electronic device body on which the electronic element is formed on the base material.

  In such a conventional method of manufacturing an electronic device, when an electronic device such as an organic EL device or a solar battery whose element deteriorates due to moisture is produced, the electronic device may be deteriorated due to moisture contained in the adhesive layer. Yes.

In order to avoid this inconvenience, it is also conceivable to dry the pressure-sensitive adhesive layer of the composite film prior to attaching the composite film to the electronic device body.
However, in the conventional manufacturing method of an electronic device, since a protective film etc. are stuck to the adhesive layer of a composite film, an adhesive layer cannot be dried appropriately.

It is also conceivable that the protective film or the like is peeled off to dry the pressure-sensitive adhesive layer, and then the composite film is attached to the main body of the electronic device.
However, in this manufacturing method, foreign matter adheres to the exposed adhesive layer during drying, and a defect or the like of the electronic device occurs due to the foreign matter.
To prevent adhesion of foreign matter into the pressure-sensitive adhesive layer, highly it is necessary to perform the drying of the adhesive layer in a cleaning atmosphere, increase of equipment cost, increase in production cost, decrease in productivity and the like Will occur.

An object of the present invention is to solve such problems of the prior art, and in the manufacture of electronic devices such as organic EL devices in which an organic EL device body is sealed with a gas barrier film, An object of the present invention is to provide a method of manufacturing an electronic device that can prevent deterioration and suppress an increase in production cost and the like, and a composite film used in the manufacturing method.

In order to achieve this object, an electronic device manufacturing method according to the present invention includes a pressure-sensitive adhesive layer, a first film attached to one surface of the pressure-sensitive adhesive layer, and a pressure-sensitive adhesive layer opposite to the first film. A composite film having a second film adhered to the surface and having a water vapor transmission rate of 100 g / (m ² · day) or more at a temperature of 40 ° C. and a relative humidity of 90% of the first film A drying step of drying the layers;
From the composite film obtained by drying the pressure-sensitive adhesive layer, a peeling step for peeling the first film,
There is provided a method for producing an electronic device, comprising: an adhesive step in which a composite film from which a first film is peeled is attached to an electronic device body with an adhesive layer facing the electronic device body.

In such an electronic device manufacturing method of the present invention, the second film preferably has a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less at a temperature of 40 ° C. and a relative humidity of 90%. .
Moreover, between the drying process and the peeling process, the first peeling process which peels a 2nd film from a composite film, and the first sticking process which sticks a gas barrier film to the adhesive layer of the composite film which peeled the 2nd film. It is preferable to perform a peeling process on the composite film to which the gas barrier film is attached.
The gas barrier film preferably has a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less at a temperature of 40 ° C. and a relative humidity of 90%.
Furthermore, it is preferable that the electronic device body is an organic EL device body formed by forming an organic EL element on a substrate.

In addition, the composite film of the present invention includes a pressure-sensitive adhesive layer, a first film bonded to one surface of the pressure-sensitive adhesive layer, and a second film bonded to the surface of the pressure-sensitive adhesive layer opposite to the first film. And
In addition, a composite film is provided in which the first film has a vapor permeability of 100 g / (m ² · day) or more at a temperature of 40 ° C. and a relative humidity of 90%.

In such a composite film of the present invention, the second film preferably has a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less at a temperature of 40 ° C. and a relative humidity of 90%.
Moreover, it is preferable that a 2nd film has a support body and the combination of the smoothing film | membrane used as the foundation | substrate of a gas barrier film and a gas barrier film | membrane formed at least 1 on the support body.
The gas barrier film is preferably made of any one of nitride, oxide and oxynitride.
Moreover, it is preferable that a 1st film has a base film and the peeling layer formed in one surface of a base film.
Furthermore, it is preferable that the base film is a triacetyl cellulose film and the release layer is mainly composed of polydimethylsiloxane.

According to the present invention, in the production of an organic EL device that seals the organic EL device body with a gas barrier film having an adhesive layer, etc., the adhesive layer can be easily and reliably dried and dried. It is possible to prevent foreign matter from adhering to the adhesive layer at the time. That is, according to the present invention, the organic EL device main body can be sealed with a composite film in which no foreign matter adheres and the adhesive layer is reliably dried.
Therefore, according to the present invention, it is possible to stably manufacture a high-quality electronic device that is free from moisture, foreign matter, deterioration and defects caused by it.

1A is a flowchart for explaining an example of a method for manufacturing an electronic device according to the present invention, and FIG. 1B is a flowchart for explaining another example of a method for manufacturing an electronic device according to the present invention. is there. It is a conceptual diagram for demonstrating an example of the manufacturing method of the electronic device of this invention, and the composite film of this invention. It is a conceptual diagram for demonstrating another example of the manufacturing method of the electronic device of this invention, and the composite film of this invention. 4A is a diagram conceptually showing an example of the first film of the composite film of the present invention, and FIG. 4B conceptually shows an example of the gas barrier film used for the composite film of the present invention. FIG.

  Hereinafter, the manufacturing method of an electronic device and the composite film of the present invention will be described in detail based on the preferred examples shown in the accompanying drawings.

  FIG. 1A shows a flowchart of an example of a method for manufacturing an electronic device of the present invention. FIG. 2 conceptually shows a method for manufacturing an electronic device of the present invention corresponding to the flowchart of FIG.

Method for producing an electronic device of the present invention shown in FIG. 1 (A) and 2 to prepare the composite film 10, drying process, and subjected to a peeling step and the adhering step, the organic EL device as an electronic device 12 is manufactured. In the following description, the manufacturing method of the electronic device of the present invention is also simply referred to as the manufacturing method of the present invention.
In addition, the example shown to FIG. 1 (A) and FIG. 2 is an example which utilized the manufacturing method and composite film 10 of this invention for manufacture of the organic EL device 12. FIG. However, the present invention can be suitably used for manufacturing various electronic devices other than this. Specifically, the production method and composite film of the present invention can be suitably used for production of electronic devices such as organic solar cells, organic transistors, liquid crystal displays, quantum dot displays, and electronic paper.

In the manufacturing method of the present invention, first, the composite film 10 is prepared. This composite film 10 is the composite film of the present invention used in the production method of the present invention.
As conceptually shown in FIG. 2, the composite film 10 includes an adhesive layer 16, a first film 18, and a second film 20.

  The pressure-sensitive adhesive layer 16 is used to seal the organic EL device body 24 by sticking the second film 20 or a functional film 32 described later to the organic EL device body 24.

As long as the adhesive layer 16 can attach the 2nd film 20 or the functional film 32 mentioned later, and the organic EL device main body 24 with sufficient adhesive force (adhesive force), various well-known adhesives are used. Is available. Moreover, it is preferable that the adhesive layer 16 has elasticity which can fill the level | step difference of the organic EL element 24b and the base material 24a.
Specific examples of the material for forming the pressure-sensitive adhesive layer 16 include pressure-sensitive adhesives such as acrylic ester resin, polyurethane, acrylic resin, ethylene-vinyl acetate copolymer (EVA), polyolefin, silicone resin, and rubber-based material. Is done.

The thickness of the pressure-sensitive adhesive layer 16 depends on the type and characteristics of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 16, the configuration of the organic EL device main body 24 (electronic device main body), and the like. What is necessary is just to set suitably the thickness which can stick 24 reliably and can fill the level | step difference of the organic EL element 24b and the base material 24a.
According to the study of the present inventor, the thickness of the pressure-sensitive adhesive layer 16 is preferably 0.5 to 200 μm, more preferably 3 to 60 μm.

The first film 18 is a film provided to protect the adhesive layer 16 until the composite film 10 is attached to the organic EL device body 24.
The first film 18 is peeled from the composite film 10 when the composite film 10 is attached to the organic EL device body 24. Therefore, it is preferable that the first film 18 is attached to the pressure-sensitive adhesive layer 16 with good peelability (release property).

In the present invention, the first film 18 has a water vapor transmission rate of 100 g / (m ² · day) or more at a temperature of 40 ° C. and a relative humidity of 90%. In the following description, the water vapor transmission rate at a temperature of 40 ° C. and a relative humidity of 90% is also simply referred to as a water vapor transmission rate.
As will be described later, in the production method of the present invention, first, in the drying step, the pressure-sensitive adhesive layer 16 of the composite film 10 is dried with the first film 18 and the second film 20 attached. Thereafter, in the peeling step, the first film 18 is peeled off, and in the sticking step, the composite film 10A from which the first film 18 has been peeled off is stuck to the organic EL device body 24.
Here, the first film 18 has a water vapor transmission rate of 100 g / (m ² · day) or more. Therefore, even if drying is performed with the first film 18 and the second film 20 adhered, the water vapor evaporated from the pressure-sensitive adhesive layer 16 is released through the first film 18. Therefore, according to the manufacturing method of the present invention, the pressure-sensitive adhesive layer 16 can be reliably dried while the first film 18 and the second film 20 are adhered. And since it drys in the state which stuck the 1st film 18 and the 2nd film 20, the adhesion of the foreign material to the adhesive layer 16 can also be prevented.

If the water vapor transmission rate of the first film 18 is less than 100 g / (m ² · day), it is difficult to dry the pressure-sensitive adhesive layer 16. The time for the drying process in order to reliably dry the pressure-sensitive adhesive layer 16. In order to reliably dry the pressure-sensitive adhesive layer 16, it is necessary to tighten the conditions of the drying process, which causes inconveniences such as a burden on the pressure-sensitive adhesive layer 16 and the second film 20.
Considering the above points, the water vapor permeability of the first film 18 is preferably 200 g / (m ² · day) or more, and more preferably 500 g / (m ² · day) or more.
In the present invention, the water vapor transmission rate may be measured according to JIS Z 0208-1976.

The first film 18 has a water vapor transmission rate of 100 g / (m ² · day) or more, can cover the pressure-sensitive adhesive layer 16 and prevent adhesion of foreign matters, and can be attached to the pressure-sensitive adhesive layer 16 with good peelability. If so, various sheet-like materials can be used.
As an example, a conceptually shown in FIG. 4 (A) is formed by forming a release layer (release layer) 18b for imparting peelability to the pressure-sensitive adhesive layer 16 on a base film 18a serving as a main body. One film 18A is exemplified.

If the water vapor transmission rate of the first film 18 is 100 g / (m ² · day) or more, various films (sheet-like materials) can be used as the base film 18a, and the release layer 18b is also an adhesive. Various known materials that can impart the releasability of the sheet-like material to the surface can be used.

In order to set the water vapor transmission rate of the first film 18 to 100 g / (m ² · day) or more, both the base film 18a and the release layer 18b preferably have a high water vapor transmission rate.
Specifically, as the first film 18, a film made of triacetyl cellulose (TAC), diacetyl cellulose, nitrocellulose, nylon or the like is preferably exemplified.
Moreover, as the peeling layer 18b, a layer mainly composed of polydimethylsiloxane (PDMS), polyvinyl alcohol (PVA) or the like is preferably exemplified. Note that the release layer 18b may be formed by a known method such as a coating method in accordance with a forming material or the like.
Especially, the 1st film 18 formed by forming the peeling layer 18b which has PDMS as a main component in the TAC film as the base film 18a is utilized suitably.

The thickness of the first film 18 that does not have the base film 18a and the release layer 18b is an adhesive depending on the forming material of the first film 18 if the water vapor transmission rate is 100 g / (m ² · day) or more. What is necessary is just to set the thickness which can fully protect the agent layer 16 suitably.
According to the study of the present inventor, the thickness of the base film 18a and the like is preferably 5 to 250 μm, and more preferably 20 to 120 μm.
Moreover, what is necessary is just to set the thickness which can provide sufficient peelability suitably for the thickness of the peeling layer 18b according to the forming material of the peeling layer 18b.

In the composite film 10, the 2nd film 20 is affixed on the surface on the opposite side to the 1st film 18 of the adhesive layer 16. FIG.
As the second film 20, various known film-like materials can be used.
Preferably, the 2nd film 20 is a film which expresses the target function when it becomes the organic EL device 12.
Especially, it is preferable that the 2nd film 20 is a film which has gas barrier property whose water-vapor-permeation rate is 1 * 10 < ^-3 > g / (m < ² > * day) or less. As described above, the water vapor transmission rate in the present invention is the water vapor transmission rate at a temperature of 40 ° C. and a relative humidity of 90%. As the second film 20 having a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less, a so-called gas barrier film formed by forming a gas barrier layer on a support is preferably exemplified.

In addition, the 2nd film 20 which expresses the target function can use the functional film which expresses various functions besides a gas barrier film.
As an example, functional films, such as optical films, such as a color film (color filter), an antireflection film, a polarizing film, and a protective film for protecting an organic EL device from mechanical damage, are illustrated.
Among them, the gas barrier film is preferably exemplified as the second film 20 in that the effect of drying the pressure-sensitive adhesive layer 16 can be maximized. Among them, a gas barrier film having a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less is preferably exemplified as the second film 20.

Various known gas barrier films can be used as the second film 20.
Among them, as the second film 20, an organic / inorganic laminated type gas barrier having, as a gas barrier layer, one or more combinations of an inorganic film exhibiting gas barrier properties and an organic film serving as a base of the inorganic film on the support. A film is preferably used.

FIG. 4B conceptually shows an example of a gas barrier film that can be used as the second film 20. Further, the gas barrier film 26 can be suitably used as a functional film 32 described later.
The gas barrier film 26 shown in FIG. 4B has a structure in which a gas barrier layer 30 is formed on a support 28. The gas barrier layer 30 includes an inorganic film 30b that exhibits gas barrier properties, and an organic film 30a for planarizing the formation surface of the inorganic film 30b under the inorganic film 30b.
In the gas barrier film 26 shown in FIG. 4B, the gas barrier layer 30 includes an organic film 30a on the support 28, an inorganic film 30b on the organic film 30a, and an organic film 30a on the inorganic film 30b. And an inorganic film 30b on the organic film 30a. That is, the gas barrier layer 30 has two combinations of the underlying organic film 30a and the inorganic film 30b.

In the gas barrier film used in the present invention, the gas barrier layer 30 is not limited to the structure having two combinations of the underlying organic film 30a and the inorganic film 30b as shown in the example of the drawing. Various configurations can be used as long as they have one or more combinations with the inorganic film 30b.
For example, it may be a two-layer gas barrier layer having only one combination of the underlying organic film 30a and the inorganic film 30b. Alternatively, it may be a gas barrier layer having three or more combinations of the underlying organic film 30a and the inorganic film 30b and having a configuration of six or more layers. Alternatively, an inorganic film may be formed on the support 28, and one or more combinations of the underlying organic film 30a and the inorganic film 30b may be formed thereon.

In the gas barrier film 26 shown in FIG. 4B, various known sheet-like materials that can be used as the support for the gas barrier film can be used as the support 28.
Specifically, as the support 28, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), polystyrene, polyamide, polyvinyl chloride, polycarbonate, polyacrylonitrile, polyimide, poly Plastic films made of various plastics (polymer materials) such as acrylate, polymethacrylate, polycarbonate (PC), cycloolefin polymer (COP), cycloolefin copolymer (COC), triacetyl cellulose (TAC), transparent polyimide, Preferably exemplified.

The inorganic film 30b mainly exhibits gas barrier properties in the gas barrier film 26.
As the material for forming the inorganic film 30b, various layers made of an inorganic compound exhibiting gas barrier properties can be used. Among these, nitrides, oxides, and oxynitrides are preferably used.
Specifically, metal oxides such as aluminum oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide, and indium tin oxide (ITO); metal nitrides such as aluminum nitride; metal carbides such as aluminum carbide; silicon oxide, Silicon oxides such as silicon oxynitride, silicon oxycarbide, silicon oxynitride carbide; silicon nitrides such as silicon nitride and silicon nitride carbide; silicon carbides such as silicon carbide; hydrides thereof; mixtures of two or more of these; and Inorganic compounds such as these hydrogen-containing materials are preferably exemplified.
In particular, silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide are preferably used because they are highly transparent and can exhibit excellent gas barrier properties. Of these, silicon nitride is particularly suitable for its excellent gas barrier properties and high transparency.

The organic film 30a is a layer made of an organic compound, and is obtained by crosslinking (polymerizing) an organic compound that becomes the organic film 30a.
The organic film 30a functions as a base layer for properly forming the inorganic film 30b that exhibits gas barrier properties. By having such a base organic film 30a, the surface on which the inorganic film 30b is formed can be flattened and made uniform to be in a state suitable for the formation of the inorganic film 30b.
In the laminated type gas barrier film in which the underlying organic film 30a and the inorganic film 30b are laminated, it becomes possible to form an appropriate inorganic film 30b on the entire surface of the film without any gap, and has excellent gas barrier properties. A gas barrier film can be obtained.

Various known organic compounds (resins / polymer compounds) can be used as the material for forming the organic film 30a.
Specifically, polyester, acrylic resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamideimide, polyetherimide, cellulose acylate, polyurethane, poly Ether ether ketone, polycarbonate, alicyclic polyolefin, polyarylate, polyether sulfone, polysulfone, fluorene ring modified polycarbonate, alicyclic modified polycarbonate, fluorene ring modified polyester, acryloyl compound, thermoplastic resin, or polysiloxane, etc. An organic silicon compound film is preferably exemplified. A plurality of these may be used in combination.

  Among them, the organic film 30a composed of a polymer of a radical polymerizable compound and / or a cationic polymerizable compound having an ether group as a functional group is preferable from the viewpoint of excellent glass transition temperature and strength.

In particular, in addition to the above strength, the glass transition temperature is 120 ° C. mainly composed of acrylate and / or methacrylate monomers and oligomer polymers in terms of low refractive index, high transparency and excellent optical properties. The above acrylic resin and methacrylic resin are preferably exemplified as the organic film 30a.
Among them, in particular, dipropylene glycol di (meth) acrylate (DPGDA), 1,9-nonanediol di (meth) acrylate (A-NOD-N), 1,6 hexanediol diacrylate (A-HD-N), Bifunctional or higher acrylate and / or methacrylate monomers such as trimethylolpropane tri (meth) acrylate (TMPTA), (modified) bisphenol A di (meth) acrylate, dipentaerythritol hexa (meth) acrylate (DPHA), etc. An acrylic resin and a methacrylic resin mainly composed of a polymer are preferably exemplified. It is also preferable to use a plurality of these acrylic resins and methacrylic resins.

  By forming the organic film 30a with an acrylic resin or a methacrylic resin, particularly an acrylic resin or a methacrylic resin having a bifunctional or higher functionality, the inorganic film 30b can be formed on a base having a solid skeleton, so that it is denser and has a higher gas barrier property. The inorganic film 30b can be formed.

  In the composite film 10, various known films (sheet-like materials) can be used as the second film 20 in addition to the functional film such as the gas barrier film 26.

For example, the second film 20 may have a release layer similar to that of the first film 18 and may be peeled from the composite film 10 before sealing the organic EL device body 24.
Accordingly, the second film 20 may be the same as the first film 18.
Alternatively, the second film 20 may be a PET film, a PEN film, a PE film or the like on which a release layer is formed. At this time, the water vapor transmission rate of the second film 20 may be 100 g / (m ² · day) or more or less than 100 g / (m ² · day).

If the 2nd film 20 is functional films, such as a gas barrier film, the thickness of the 2nd film 20 should just be the thickness which can express the target function according to the structure of a film, etc.
Moreover, what is necessary is just to set suitably the thickness which fully acts as a protective film of the adhesive layer 16 according to a forming material etc., when the 2nd film 20 peels.

What is necessary is just to produce such a composite film 10 by a well-known method according to the formation material of the adhesive layer 16, the formation material of the 1st film 18, and the 2nd film.
As an example, a method of applying a coating material (composition) to be the pressure-sensitive adhesive layer 16 on the surface of the first film 18, laminating the second film 20 on the coating material, and depending on the forming material of the pressure-sensitive adhesive layer 16 Then, a method of producing the composite film 10 by curing the paint is exemplified. At this time, when the first film 18 and / or the second film 20 have a release layer, the release layer faces the pressure-sensitive adhesive layer 16.

As shown in FIG. 1A and FIG. 2, in the manufacturing method of the present invention, when such a composite film 10 is prepared, the pressure-sensitive adhesive layer 16 of the composite film 10 is dried in a drying step.
As described above, in the production method of the present invention, the composite film 10 has a water vapor permeability of 100 g / (m ² · day) or more in the first film 18 adhered to the pressure-sensitive adhesive layer 16.
Therefore, the water vapor released from the pressure-sensitive adhesive layer 16 by drying is discharged to the outside through the first film 18, so that the pressure-sensitive adhesive layer 16 can be reliably dried. Moreover, since the first film 18 is provided, it is possible to prevent foreign matter from adhering to the pressure-sensitive adhesive layer 16.

The pressure-sensitive adhesive layer 16 in the drying step may be dried by a known method such as heat drying, vacuum drying, or heat vacuum drying.
In the drying step, the pressure-sensitive adhesive layer 16 is preferably dried until the moisture content of the pressure-sensitive adhesive layer 16 is 200 ppm or less, and the pressure-sensitive adhesive layer 16 is dried until the moisture content of the pressure-sensitive adhesive layer 16 is 100 ppm or less. It is more preferable to carry out. Thereby, deterioration of the organic EL device due to moisture can be more suitably suppressed.
Therefore, the drying conditions that can be placed in the drying process may be set as appropriate according to the materials for forming the first film 18 and the pressure-sensitive adhesive layer 16.

  When the drying process is completed, a peeling process for peeling the first film 18 from the composite film 10 is then performed. The first film 18 may be peeled from the composite film 10 by a known method.

  Here, when the second film 20 is the same as the first film 18 or when the second film is a film in which a release layer is formed on a PET film, the second film 20 is peeled from the composite film 10. If it is, the process B shown in the flowchart of FIG. 1B and the conceptual diagram of FIG. 3 is performed after the drying process, and then the peeling process is performed.

  At this time, first, a first peeling process is performed to peel the second film 20 from the composite film 10 that has finished the drying process, as shown in FIGS. The second film 20 may be peeled by a known method.

Next, as shown in FIG. 1 (B) and FIG. 3, a functional film 32 that expresses a target function such as gas barrier properties is adhered to the pressure-sensitive adhesive layer 16 from which the second film 20 has been peeled off. A landing process is performed.
As the functional film 32, various functional films exemplified as the second film 20 such as the gas barrier film 26 and the optical film can be suitably used. Of these, the gas barrier film is preferably used in that the effect of drying the pressure-sensitive adhesive layer 16 can be maximized. Among them, a gas barrier film having a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less is particularly preferably used.

  The functional film 32 may be attached in the first attaching step by a known method such as lamination, pressure bonding, or heat pressure bonding according to the material for forming the pressure-sensitive adhesive layer 16 or the like.

In addition, when the 2nd film 20 is a thing peeled from the composite film 10, you may perform a previous peeling process and a previous sticking process before a drying process.
In this case, after preparing the composite film 10, first, the first peeling process for peeling the second film is performed, and then the first bonding process for bonding the functional film 32 to the pressure-sensitive adhesive layer 16 is performed, and thereafter A drying step and a peeling step are performed.

When the peeling step is completed, as shown in FIGS. 1A and 2, the composite film 10 </ b> A from which the first film 18 is peeled off is applied to the organic EL device main body 24 with the adhesive layer 16 facing the organic EL device main body 24. The sticking process to stick is performed.
The organic EL device body 24 is formed by forming one or more organic EL elements 24b on the surface of a substrate 24a such as a glass plate or a metal plate having an insulating layer.

By performing the sticking process, the organic EL device main body 24 is manufactured by sealing the organic EL device main body 24 with the second film 20 such as a gas barrier film or the functional film 32.
Here, as described above, in the production method of the present invention, the pressure-sensitive adhesive layer 16 is suitably dried, and the adhesion of foreign matter to the pressure-sensitive adhesive layer 16 is also suppressed. Therefore, the organic EL device 12 manufactured by the present invention is a high-quality organic EL device 12 that suppresses deterioration due to moisture and is free from defects due to foreign matters.

  In the production method of the present invention, the bonding of the composite film 10A from which the first film 18 has been peeled off to the organic EL device body 24 is a known method depending on the material for forming the pressure-sensitive adhesive layer 16, such as lamination, pressure bonding, and heat pressure bonding. It can be done by the method.

As described above, the manufacturing method of the present invention can be used for manufacturing various electronic devices in addition to the organic EL device 12. Therefore, as an electronic device main body, the organic solar cell main body formed by forming one or more photoelectric conversion elements on the base material, the organic transistor main body formed by forming one or more organic transistor elements on the base material, and at least one base material A liquid crystal display body formed by forming a liquid crystal shutter, a quantum dot display body formed by forming one or more quantum dot elements on a base material, and an electronic paper body formed by forming one or more display elements on a base material Is possible.
Here, the method of the present invention is suitable for the production of the organic EL device 12 in the illustrated example in that the adhesive layer 16 is dried to prevent the electronic device from being deteriorated by moisture. Used for

As mentioned above, the manufacturing method of this invention has a drying process, a peeling process, and a sticking process. Here, in the manufacturing method of this invention, in order to prevent the moisture absorption of the adhesive layer 16 dried at the drying process, it is preferable to perform a drying process-a sticking process in the atmosphere which controlled the dew point. Management of this atmosphere includes the atmosphere of the environment which transfers a composite film between each process in a drying process-a sticking process.
Specifically, the drying step to the attaching step are preferably performed in an atmosphere in which the dew point is controlled to −40 ° C. or lower, and more preferably performed in an atmosphere in which the dew point is controlled to −60 ° C. or lower. Thereby, deterioration of the organic EL device due to moisture can be more suitably suppressed.
In addition, when performing a tip peeling process and a tip sticking process between a drying process-a sticking process, it is preferable to perform these processes also in the atmosphere of the said low dew point.

  As mentioned above, although the manufacturing method and composite film of the electronic device of this invention were demonstrated in detail, this invention is not limited to the above-mentioned example, In the range which does not deviate from the summary of this invention, various improvement and change are performed. Of course, you may.

  Hereinafter, the present invention will be described in more detail with reference to specific examples of the present invention.

<Production of gas barrier film>
A PEN film (Teonex Q65FA, manufactured by Teijin DuPont) was prepared as the support 28.

TMPTA (manufactured by Daicel Celltech), silane coupling agent (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.) and polymerizable acidic compound (KARAMER PM-21, manufactured by Nippon Kayaku Co., Ltd.) in a mass ratio of 14.1: 3. A composition was prepared by mixing at 5: 1.
18.6 g of this composition, 1.4 g of an ultraviolet polymerization initiator (Lamberti, ESACURE KTO46), and 180 g of 2-butanone were mixed to prepare a paint for forming the organic film 30a.

The prepared paint was applied to the surface of the prepared support 28 (PEN film). The coating was applied using a wire bar so that the coating thickness was 5 μm.
Next, the paint is dried at room temperature for 5 minutes, and then irradiated with ultraviolet light from a high-pressure mercury lamp (accumulated dose of about 1 J / cm ² ) in a chamber in which the oxygen concentration is 0.1% by the dry nitrogen substitution method. The paint composition was cured. Thereby, an organic film 30a having a thickness of 600 nm ± 50 nm was formed on the surface of the support 28.

A silicon nitride film having a thickness of 40 nm was formed on the organic film 30a as the inorganic film 30b.
The inorganic film 30b (silicon nitride film) was formed by using a general CCP (capacitively coupled plasma) -CVD apparatus. As source gases, silane gas (flow rate 160 sccm), ammonia gas (flow rate 370 sccm), hydrogen gas (flow rate 590 sccm), and nitrogen gas (flow rate 240 sccm) were used. The film forming pressure was 40 Pa. The power supply was a high frequency power supply with a frequency of 13.56 MHz, and the plasma excitation power was 2.5 kW.

An organic film 30a having a thickness of 600 nm ± 50 nm is formed on the inorganic film 30b in the same manner as described above, and a silicon nitride film having a thickness of 40 nm is formed on the organic film 30a in the same manner as described above. It formed as the inorganic film | membrane 30b.
Thereby, as shown in FIG. 4B, a gas barrier film 26 in which the gas barrier layer 30 having two combinations of the underlying organic film 30a and the inorganic film 30b was formed on the surface of the support 28 was produced.
According to JIS Z 0208-1976, the water vapor transmission rate of the gas barrier film 26 was measured and found to be 1 × 10 ⁻³ g / (m ² · day) or less.

<Production of organic EL device body>
A conductive glass substrate (surface resistance value 10Ω / □) having an ITO film was washed with 2-propanol, and then subjected to UV-ozone treatment for 10 minutes. The following organic compound layers were sequentially deposited on this substrate (anode) by vacuum deposition.
(First hole transport layer)
Copper phthalocyanine film thickness 10nm
(Second hole transport layer)
N, N'-diphenyl-N, N'-dinaphthylbenzidine film thickness 40nm
(Light emitting layer and electron transport layer)
Tris (8-hydroxyquinolinato) aluminum film thickness 60nm
Finally, 1 nm of lithium fluoride and 100 nm of metallic aluminum were sequentially deposited to form a cathode, and a 5 μm thick silicon nitride film was formed thereon by a parallel plate type CCP-CVD method.
As a result, an organic EL device body 24 as shown in FIG. 2 was prepared by forming the organic EL element 24b on the surface of the glass substrate as the base material 24a.

[Example 1]
As the 1st film 18 and the 2nd film 20, the film which formed the PDMS film | membrane of thickness 5micrometer as a peeling layer on the surface of a TAC film of thickness 40micrometer was prepared.
It was 2050 g / (m < ² > * day) when the vapor | steam permeability | transmittance of this 1st film 18 was measured based on JISZ0208-1976.

A two-component thermosetting acrylic ester liquid resin (SK Dyne 1831, manufactured by Soken Chemical Co., Ltd.) was applied to the release layer of the first film 18. The liquid resin was applied with an applicator.
Next, the second film 20 is laminated with the release layer facing the liquid resin, and the liquid resin is cured at 80 ° C. for 30 minutes, thereby forming the first film 18 and the second film on the adhesive layer 16 having a thickness of 20 μm. A composite film 10 to which the film 20 was attached was produced.

The composite film 10 was put in a glove box whose dew point was adjusted to −60 ° C. In addition, all subsequent processes were performed in a glove box whose dew point was adjusted to −60 ° C.
The composite film 10 placed in the glove box was heat-treated at 80 ° C. for 24 hours, and the pressure-sensitive adhesive layer 16 was dried.

After the composite film 10 was cooled to room temperature, the second film 20 was peeled off. Next, the previously produced gas barrier film 26 was attached to the pressure-sensitive adhesive layer 16 with the gas barrier layer 30 facing the pressure-sensitive adhesive layer 16.
Next, the first film 18 was peeled off. Furthermore, the adhesive layer 16 is directed to the organic EL element 24b, the composite film 10A from which the first film 18 has been peeled off is attached to the organic EL device body 24 prepared earlier, and the organic EL device body 24 is changed to a gas barrier. The organic EL device 12 as shown in FIG. 2 sealed with the composite film 10A having the film 26 and the pressure-sensitive adhesive layer 16 was produced.

[Example 2]
The composite film is the same as in Example 1 except that the gas barrier film 26 prepared previously is used as the second film 20 and the gas barrier film 30 is attached to the adhesive layer 16 with the gas barrier layer 30 facing the adhesive layer 16. 10 was produced.

The composite film 10 was put in a glove box whose dew point was adjusted to −60 ° C. In addition, all subsequent processes were performed in a glove box whose dew point was adjusted to −60 ° C.
The composite film 10 placed in the glove box was heat-treated in the same manner as in Example 1 to dry the pressure-sensitive adhesive layer 16.

  After the composite film 10 is cooled to room temperature, the first film 18 is peeled off, and the composite film 10A from which the first film 18 is peeled off is attached to the organic EL device main body 24 prepared in the same manner as in Example 1. Then, the organic EL device main body 24 was sealed with the composite film 10 </ b> A having the gas barrier film 26 and the pressure-sensitive adhesive layer 16, and the organic EL device 12 as shown in FIG. 2 was produced.

[Example 3]
Example 2 except that the second film 20 of the composite film 10 is a film in which a film of 5 μm thick ethylene-vinyl acetate copolymer (EVA) is formed as a release layer on the surface of a 50 μm thick PET film. In the same manner as in Example 1, an organic EL device 12 was produced.

[Comparative Example 1]
Example 1 except that the first film 18 and the second film 20 of the composite film 10 are both films in which an EVA film having a thickness of 5 μm is formed as a release layer on the surface of a PET film having a thickness of 50 μm. Thus, an organic EL device 12 was produced.
It was 15g / (m < ² > * day) when the vapor | steam permeability | transmittance of this 1st film 18 was measured based on JISK7129-2008.

[Comparative Example 2]
An organic EL device 12 was produced in the same manner as in Example 2 except that the first film 18 of the composite film 10 was the same as that in Comparative Example 1.

[Comparative Example 3]
After putting the composite film in the glove box and peeling off the first film 18, the composite film is heat-treated to dry the adhesive layer 16, and then the composite film 10A is attached to the organic EL device body 24. An organic EL device 12 was produced in the same manner as in Comparative Example 2 except that this was performed.

<Evaluation (OLED test)>
The organic EL device 12 thus produced was left in an environment at 60 ° C. for 24 hours. In this environment, humidification is not performed.
Thereafter, the organic EL device 12 was caused to emit light by applying a voltage of 7 V using a Keithley SMU2400 type source measure unit, and the light emitting surface was observed using a microscope to evaluate the size of the dark spot. .
The case where a dark spot having a diameter of a circumscribed circle of 300 μm or more could not be confirmed was evaluated as good; the case where a dark spot having a size exceeding 300 μm was confirmed was evaluated as “not possible”.
The results are shown in the table below.

As shown in Table 1, the organic EL device 12 according to the production method of the present invention in which the first film 18 has a water vapor transmission rate of 2050 g / (m ² · day) has no dark spot of 300 μm or more, and has high quality. Organic EL device.
On the other hand, Comparative Example 1 and Comparative Example 2 in which the water vapor permeability of the first film is 15 g / (m ² · day) cannot properly dry the pressure-sensitive adhesive layer 16 in the drying step. When left in a 60 ° C. environment for 24 hours, it is considered that the organic EL element deteriorated due to moisture discharged from the pressure-sensitive adhesive layer 16 and a dark spot of 300 μm or more was generated.
Moreover, although it is thought that the comparative example 3 which performed the drying process after peeling the 1st film was able to dry the adhesive layer 16 appropriately, a foreign material adheres to the adhesive layer 16 during drying, It is considered that a defect of the organic EL element was caused due to the foreign matter, and a dark spot of 300 μm or more was generated.
From the above results, the effects of the present invention are clear.

  It can be suitably used for manufacturing an electronic device such as an organic EL device.

DESCRIPTION OF SYMBOLS 10 Composite film 12 Organic EL device 16 Adhesive layer 18 1st film 18a Base film 18b Peeling layer 20 2nd film 24 Organic EL element main body 24a Base material 24b Organic EL element 26 Gas barrier film 28 Support body 30 Gas barrier layer 30a Organic film 30b Inorganic membrane

Claims (10)

An adhesive layer, a first film adhered to one surface of the adhesive layer, and a second film adhered to a surface opposite to the first film of the adhesive layer, and A drying step of drying the pressure-sensitive adhesive layer of a composite film having a water vapor permeability of 100 g / (m ² · day) or more at a temperature of 40 ° C. and a relative humidity of 90% of the first film;
A peeling step of peeling the first film from the composite film obtained by drying the pressure-sensitive adhesive layer,
A method for producing an electronic device, comprising: a step of attaching the composite film from which the first film has been peeled off to the electronic device body with the pressure-sensitive adhesive layer facing the electronic device body. 2. The method of manufacturing an electronic device according to claim 1, wherein the second film has a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less at a temperature of 40 ° C. and a relative humidity of 90%. Between the drying step and the peeling step, a first peeling step for peeling the second film from the composite film, and a first sticking for sticking the gas barrier film to the adhesive layer of the composite film from which the second film has been peeled off Perform the process,
The manufacturing method of the electronic device of Claim 1 or 2 which performs the said peeling process to the composite film which stuck the said gas barrier film. The method for producing an electronic device according to claim 3, wherein the gas barrier film has a water vapor permeability of 1 × 10 ⁻³ g / (m ² · day) or less at a temperature of 40 ° C. and a relative humidity of 90%.   The said electronic device main body is an organic EL device main body formed by forming an organic EL element in a base material, The manufacturing method of the electronic device of any one of Claims 1-4. An adhesive layer, a first film attached to one surface of the adhesive layer, and a second film attached to a surface opposite to the first film of the adhesive layer;
The second film has a support and a combination of a gas barrier film formed on the support and a smoothing film serving as a base of the gas barrier film,
And the vapor | steam permeability | transmittance in the temperature of 40 degreeC and relative humidity 90% of the said 1st film is 100 g / (m < ² > * day) or more, The composite film characterized by the above-mentioned. The composite film according to claim 6, wherein the second film has a water vapor transmission rate of 1 × 10 ⁻³ g / (m ² · day) or less at a temperature of 40 ° C. and a relative humidity of 90%. The composite film according to claim 6 or 7 , wherein the gas barrier film is made of any one of a nitride, an oxide, and an oxynitride. The composite film according to any one of claims 6 to 8 , wherein the first film has a base film and a release layer formed on one surface of the base film. The composite film according to claim 9 , wherein the base film is a triacetyl cellulose film, and the release layer is mainly composed of polydimethylsiloxane.