JP2004536452A5

JP2004536452A5 -

Info

Publication number: JP2004536452A5
Application number: JP2003511391A
Authority: JP
Filing date: 2002-07-02
Publication date: 2008-02-21

Claims

A device having at least a first and a second plurality of paths,
The first plurality of paths have at least two paths disposed in electrical isolation from each other and oriented in a first complementary relationship;
At least a first number of the second plurality of paths is disposed electrically separated from a second number of the second plurality of paths;
At least two paths of the second plurality of paths are electrically separated from the first plurality of paths.

The first number of at least two paths of the second plurality of paths are electrically coupled together;
The device of claim 1, wherein the second number of at least two paths of the second plurality of paths are electrically coupled to each other.

The first number of the second plurality of paths is an odd number of 1 or more;
The second number of the second plurality of paths is an odd number greater than or equal to 1,
The first number of at least two paths of the second plurality of paths are electrically coupled together;
The device of claim 1, wherein the second number of at least two paths of the second plurality of paths are electrically coupled to each other.

The device of claim 1, further comprising a spacing material that is at least spaced from the two paths of the circuit.

The device of claim 4, wherein the spacing material comprises a dielectric.

The first number of the second plurality of paths is a first alignment;
The device of claim 1, wherein the second number of the second plurality of paths is a second alignment.

The first number of the second plurality of paths is a first superimposed alignment;
The device of claim 1, wherein the second number of the second plurality of paths is a second superimposed alignment.

The device according to claim 6, wherein the first alignment and the second alignment are superimposed alignments.

The device of claim 7, wherein the first alignment and the second alignment are located in at least one on the other.

The first number of at least two paths of the paths are arranged electrically coupled to each other in the first alignment;
The second number of at least two paths of the paths are arranged in electrical coupling with each other in the second alignment;
The first number of the paths is an odd path of 1 or more, and the second number of the paths is an odd path of 1 or more;
The device according to claim 1, wherein a total number of the first plurality of paths is an even number of at least two or more.

The first number of at least two paths of the second plurality of paths are arranged in a first alignment electrically coupled to each other;
The second number of at least two paths of the second plurality of paths are arranged in a second alignment electrically coupled to each other;
The device according to claim 1, wherein a total number of the first plurality of paths is an even number of at least two or more.

The device of claim 10, further comprising a spacing material that is at least spaced from the path of the circuit arrangement.

The device of claim 11, wherein the four paths of the circuit arrangement are electrically isolated from each other.

The first plurality of paths are a plurality of shielded paths;
The device of claim 1, wherein the second plurality of paths is a plurality of shielded paths.

An electrical arrangement having at least a first and a second plurality of paths,
The first plurality of paths has at least one pair of paths electrically separated from each other and arranged in complementary positions;
At least a first number of the second plurality of paths is arranged to be electrically separated from a second number of the second plurality of paths, and the second plurality of paths are the first number Having at least two paths electrically separated from the plurality of paths;
The first number of at least two paths of the second plurality of paths are electrically coupled together;
An electrical arrangement characterized in that a second number of at least two paths of the second plurality of paths are electrically coupled to each other.

The electrical arrangement of claim 15, further comprising a spacing material that maintains at least a distance from the path of the circuit arrangement.

The electrical arrangement of claim 15, wherein at least four paths of the circuit arrangement are electrically isolated from each other.

The electrical arrangement of claim 15, wherein at least six paths of the circuit arrangement are electrically isolated from each other.

The second plurality of paths has at least two paths arranged in co-planar with each other;
The electrical arrangement of claim 15, wherein at least four paths of the circuit arrangement are electrically isolated from each other.

The first and second plurality of paths are stacked in a non-cooperative plane,
The electrical arrangement of claim 15, wherein at least four paths of the circuit arrangement are electrically isolated from each other.

The first plurality of paths has a plurality of passages;
16. The electrical arrangement according to claim 15, wherein the second plurality of paths are a plurality of shielding paths.

A device having at least four paths,
Only each path of each of the plurality of paths is electrically coupled to each other;
The device, wherein at least two of the at least four plurality provide shielding for at least the other two of the at least four plurality of paths.

A device having at least a plurality of first, second, third and fourth paths,
Only each respective path of the plurality is electrically coupled to each other;
The first plurality shields the second plurality;
The device wherein the third plurality shields the fourth plurality.

At least a first and a second plurality of shielding paths;
A circuit arrangement having at least a first and a second plurality of shielded paths,
The shielding path and the shielding path are arranged alternately with the circuit arrangement,
Only each respective path of the plurality is electrically coupled to each other;
A circuit arrangement wherein the plurality of each of the circuit arrangements are electrically isolated from each other.

An integrated circuit package having at least one integrated circuit;
A plurality of paths conductively coupled together;
A first plurality of shields conductively coupled together;
A second plurality of shields conductively coupled together and at least electrically isolated from said first plurality of,
Each of the shields and the paths are interleaved, and the shields develop at least one low impedance path suitable for propagating energy away from the integrated circuit;
The path develops a low inductance path suitable for energy propagation within the package of the integrated circuit, the energy propagation being regulated by at least the plurality of shields.

27. The system of claim 26, wherein the first and second plurality of shields are each substantially coplanar.

One of the first or second plurality of shields has one of the centers of the shields, and the first and second plurality of shields and the path are substantially with respect to one of the centers. 27. The system of claim 26, wherein the system is arranged in a balanced and complementary symmetrical arrangement.

One of the first or second plurality of shields has one of the centers of the shields, and the first and second plurality of shields and the path are substantially with respect to one of the centers. 27. The system of claim 26, wherein the system is aligned.

27. The system of claim 26, wherein each of the first plurality of shields and the second plurality of shields has an odd number of shields.

13. A device according to any preceding claim, wherein the device is a first level interconnect arrangement for an integrated circuit.

13. A device according to any of claims 1 to 8 or 10 to 12, wherein the device is arranged as an uncoupled capacitor.

13. A device according to any of claims 1 to 8 or 10 to 12, wherein the device is arranged as a bypass capacitor.

13. A device according to any of claims 1-8 or 10-12, wherein the device is a first level interconnect arrangement coupled to an integrated circuit.
At least a first plurality is electrically coupled to the integrated circuit.

13. A device according to any of claims 1-8 or 10-12, wherein the device is a first level interconnect arrangement coupled to an integrated circuit.
The first plurality is electrically coupled to the integrated circuit;
The device wherein the second plurality is electrically isolated from the integrated circuit.

A first electrically conductive shielding layer present in the first plane;
A third electrically conductive shielding layer present in the third plane;
A fifth electrically conductive shielding layer present in the fifth plane;
The third plane between the first plane and the fifth plane;
A first electrically conductive electrode layer present in a second plane between the first plane and the third plane;
A third electrically conductive electrode layer present in a fourth plane between the third plane and the fifth plane;
A second electrically conductive shielding layer;
A fourth electrically conductive shielding layer;
A sixth electrically conductive shielding layer;
A second electrically conductive electrode layer;
A device having a fourth electrically conductive electrode layer,
The device is electrically connected to the first electrically conductive shielding layer, the third electrically conductive shielding layer, and the fifth electrically conductive shielding layer;
The first electrically conductive shielding layer, the third electrically conductive shielding layer, and the fifth electrically conductive shielding layer are laminated to form the first electrically conductive shield layer. The conductive electrode layer is substantially between the first electrically conductive shielding layer and the third electrically conductive shielding layer, and the third electrically conductive shielding layer. An electrode layer is substantially between the third electrically conductive shielding layer and the fifth electrically conductive shielding layer;
The device is electrically connected to the second electrically conductive shielding layer, the fourth electrically conductive shielding layer and the sixth electrically conductive shielding layer;
The second electrically conductive shielding layer, the fourth electrically conductive shielding layer, and the sixth electrically conductive shielding layer are stacked to form the second electrically conductive shield layer. A conductive electrode layer substantially between the second electrically conductive shield layer and the fourth electrically conductive shield layer, wherein the fourth electrically conductive shield layer; A device wherein an electrode layer is substantially between the fourth electrically conductive shielding layer and the sixth electrically conductive shielding layer.

The first electrically conductive shielding layer and the second electrically conductive shielding layer are in a first plane;
The first electrically conductive electrode layer and the second electrically conductive electrode layer are in a second plane between the first plane and the third plane;
The third electrically conductive shielding layer and the fourth electrically conductive shielding layer are in a third plane;
The fifth electrically conductive shielding layer and the sixth electrically conductive shielding layer are in a fifth plane;
The third electrically conductive electrode layer and the fourth electrically conductive electrode layer are present in a fourth plane between the third plane and the fifth plane. 38. The device of claim 37.

The first electrically conductive shielding layer, the third electrically conductive shielding layer, and the fifth electrically conductive shielding layer are the second electrically conductive shielding layer. 38. The device of claim 37, wherein the device is laminated on a shielding layer, the fourth electrically conductive shielding layer, and the sixth electrically conductive shielding layer.

The first electrically conductive electrode layer has a body region of the first electrically conductive layer and a tab region of the first electrically conductive layer, the first electrically conductive layer. A tab region of the electrically conductive layer protrudes from a body region of the first electrically conductive layer in a first direction of the second plane;
The third electrically conductive electrode layer defines a body region of the third electrically conductive layer and a tab region of the third electrically conductive layer, the third electrically conductive layer. 40. The device of claim 39, wherein a tab region of the electrically conductive layer protrudes from a body region of the third electrically conductive layer in a second direction opposite to the first direction. .

The second electrically conductive electrode layer has a body region of the second electrically conductive layer and a tab region of the second electrically conductive layer, the second electrically conductive layer. A tab region of the electrically conductive layer protrudes from a body region of the second electrically conductive layer in a third direction perpendicular to the first direction and the second direction;
The fourth electrically conductive electrode layer defines a body region of the fourth electrically conductive layer and a tab region of the fourth electrically conductive layer, and the fourth electrically conductive layer. 41. The device of claim 40, wherein a tab region of the electrically conductive layer protrudes from a body region of the fourth electrically conductive layer in a fourth direction opposite to the third direction. .

38. The device of claim 37, further comprising an additional electrically conductive electrode layer and an additional electrically conductive shielding layer.

38. The device of claim 37, further comprising an electrically conductive interconnect between the two layers of the device.

A sixth electrically conductive shield layer adjacent to the first electrically conductive shield layer and a seventh electrical conductor adjacent to the fifth electrically conductive shield layer; 38. The device of claim 37, further comprising an ionic shielding layer.

A set of electrically conductive interconnects;
Further comprising a set of pads protruding from the surface of the device;
38. The device of claim 37, wherein each of the electrically conductive interconnect sets connects to a different set of pads.

46. The device of claim 45, wherein at least some of the set of pads are designed for connection to an integrated circuit.