CN106793459A - A kind of multiplayer microwave circuit board interconnection structure - Google Patents
A kind of multiplayer microwave circuit board interconnection structure Download PDFInfo
- Publication number
- CN106793459A CN106793459A CN201611183725.4A CN201611183725A CN106793459A CN 106793459 A CN106793459 A CN 106793459A CN 201611183725 A CN201611183725 A CN 201611183725A CN 106793459 A CN106793459 A CN 106793459A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- microwave circuit
- multiplayer microwave
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
Abstract
The invention provides a kind of multiplayer microwave circuit board interconnection structure, hair button outside is arranged with dielectric, dielectric outside is arranged with metal framework, the rounded rectangle in section of dielectric, the outboard circuit plate of multiplayer microwave circuit board is provided with pad and microstrip line, the end face and contact pads of hair button；Metal level is provided between the outboard circuit plate and the secondary outboard circuit plate of multiplayer microwave circuit board, metal level is provided with and pad axis identical through hole, the diameter with diameter greater than pad of the through hole；The pad surrounding of multiplayer microwave circuit board is circumferentially evenly equipped with least four vias；Three lines hair button transmission structure is compared to, the structure can reduce by nearly 1/3 size, be assembled simply compared to for conventional coaxial connectors, and the factor of the structure influence microwave property is few, and reliability is high.
Description
Technical field
The present invention relates to board structure of circuit design field, more particularly to a kind of multiplayer microwave circuit board interconnection structure.
Background technology
Miniaturization, lightweight are the developing direction of current microwave module, and three-dimensional stacked encapsulating structure is compared to conventional two-dimensional
Plane packaging structure, multilayer is divided into by radio circuit, and stack-design is carried out in vertical direction, makes full use of space, can be effective
Reduction module volume, but how to solve the problems, such as the three-dimensional stacking structure microwave signal vertical transfer brought of design, be always this
The difficult point of research.
Prior art has two kinds by the way of：
1st, microwave signal perpendicular interconnection transmission is carried out by three lines hair button, the way of this structure is to seal three hair buttons
Dress in media as well, then medium is embedded into metal support, enables the transmission line perpendicular interconnection on two neighboring substrate, but
This transmission means takes up room larger, increased broadband design of Simulation difficulty.
2nd, vertically connected using conventional coaxial connectors, traditional coaxial connector dependable performance is cheap, but
It is that its size is very big, is unfavorable for small form factor requirements.
The content of the invention
It is at least one defect for overcoming above-mentioned prior art to exist, it is mutual the invention provides a kind of multiplayer microwave circuit board
Link structure, hair button outside is arranged with dielectric, and dielectric outside is arranged with metal framework, and the section of dielectric is in circle
Angular moment shape, the shape of dielectric can influence the laser propagation effect of microwave signal, and the dielectric of rounded rectangle can be in not shadow
Reduce space hold on the premise of ringing microwave signal transmission quality, the outboard circuit plate of multiplayer microwave circuit board be provided with pad and
Microstrip line, the end face and contact pads of hair button, carries out the signal transmission between multi-layer sheet and multi-layer sheet, then lead to by hair button
Cross pad and microstrip line is transferred signals to inside multi-layer sheet；
Metal level is provided between the outboard circuit plate and the secondary outboard circuit plate of multiplayer microwave circuit board, metal level is provided with
With pad axis identical through hole, through hole can increase the transmission performance of microwave signal；The through hole with diameter greater than pad
Diameter；Because metal level is compressed on outboard circuit plate, therefore through hole is equivalent to one on outboard circuit plate no compacting
The circle of metal, the circle is coaxial with pad and with diameter greater than pad diameter；
The pad surrounding of multiplayer microwave circuit board is circumferentially evenly equipped with least four vias；Via is metal aperture, for shielding
Magnetic interference.
Preferably, to three times, diameter can than through hole within the range for the twice of a diameter of pad diameter of the through hole
Increase the transmission performance of microwave signal to maximize.
Preferably, the via is through hole.
A kind of multiplayer microwave circuit board interconnection structure that the present invention is provided, is compared to three lines hair button transmission structure, should
Structure can reduce by nearly 1/3 size, be assembled simply compared to for conventional coaxial connectors, and the structure influence microwave property
Factor is few, and reliability is high.
Brief description of the drawings
Fig. 1 is the generalized section of multiplayer microwave circuit board interconnection structure；
Fig. 2 is the generalized section of the hair button in multiplayer microwave circuit board interconnection structure；
Fig. 3 is the schematic top plan view of the hair button in multiplayer microwave circuit board interconnection structure；
Fig. 4 is the outboard circuit plate schematic top plan view in multiplayer microwave circuit board interconnection structure；
Fig. 5 is the generalized section of the metal level in multiplayer microwave circuit board interconnection structure.
Reference：Hair button 1, dielectric 2, metal framework 3, outboard circuit plate 4, secondary outboard circuit plate 5, pad
61, microstrip line 62, metal level 7, through hole 8, via 9.
Specific embodiment
To make the purpose, technical scheme and advantage of present invention implementation clearer, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is further described in more detail.In the accompanying drawings, identical from start to finish or class
As label represent same or similar element or the element with same or like function.Described embodiment is the present invention
A part of embodiment, rather than whole embodiments.Embodiment below with reference to Description of Drawings is exemplary, it is intended to used
It is of the invention in explaining, and be not considered as limiting the invention.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward " are based on accompanying drawing institute
The orientation or position relationship for showing, are for only for ease of and describe of the invention and simplify description, signified rather than instruction or hint
Device or element with specific orientation, with specific azimuth configuration and operation, therefore it is not intended that must be protected to the present invention
Protect the limitation of scope.
Below by specific embodiment, the present invention is described in further detail.
Specific embodiment：
As shown in figure 1, the invention provides a kind of multiplayer microwave circuit board interconnection structure, as shown in Figures 2 and 3, hair knob
The outside of button 1 is arranged with dielectric 2, and the outside of dielectric 2 is arranged with metal framework 3, the rounded square in section of dielectric 2
Shape, the shape of dielectric 2 can influence the laser propagation effect of microwave signal, and the dielectric 2 of rounded rectangle can not influence
Space hold is reduced on the premise of microwave signal transmission quality；
As shown in figure 4, the outboard circuit plate 4 of multiplayer microwave circuit board is provided with pad 61 and microstrip line 62, hair button 1
End face is contacted with pad 61, and the signal transmission between multi-layer sheet and multi-layer sheet is carried out by hair button 1, then by pad 61 and micro-
Band line 62 is transferred signals to inside multi-layer sheet；
As shown in figure 5, being provided with metal between the outboard circuit plate 4 and the secondary outboard circuit plate 5 of multiplayer microwave circuit board
Layer 7, metal level 7 be provided with the axis identical through hole 8 of pad 61, through hole 8 can increase the transmission performance of microwave signal；It is described logical
To three times, diameter can maximize increase microwave than through hole 8 within the range to be believed the twice of the diameter of a diameter of pad 61 in hole 8
Number transmission performance；Because metal level 7 is compressed on outboard circuit plate 4, therefore through hole 8 is equivalent on outboard circuit plate 4
One circle without pressed metal, the circle is coaxial with pad 61 and with diameter greater than the diameter of pad 61；The weldering of multiplayer microwave circuit board
The surrounding of disk 61 is circumferentially evenly equipped with least four vias 9, and the via 9 is through hole；Via 9 is metal aperture, for armoured magnetic field
Interference.
The above, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in, all should
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of the claims
It is accurate.
Claims (3)
1. a kind of multiplayer microwave circuit board interconnection structure, it is characterised in that hair button (1) outside is arranged with dielectric (2), absolutely
Edge medium (2) outside is arranged with metal framework (3), the rounded rectangle in section of dielectric (2), outside multiplayer microwave circuit board
Lateral circuit plate (4) is provided with pad (61) and microstrip line (62), and the end face of hair button (1) is contacted with pad (61)；
Metal level (7), metal are provided between the outboard circuit plate (4) and the secondary outboard circuit plate (5) of multiplayer microwave circuit board
Layer (7) is provided with and pad (61) axis identical through hole (8), the diameter with diameter greater than pad (61) of the through hole (8)；
Pad (61) surrounding of multiplayer microwave circuit board is circumferentially evenly equipped with least four vias (9).
2. multiplayer microwave circuit board interconnection structure according to claim 1, it is characterised in that the diameter of the through hole (8)
It is the twice of pad (61) diameter to three times.
3. multiplayer microwave circuit board interconnection structure according to claim 1, it is characterised in that the via (9) is logical
Hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183725.4A CN106793459A (en) | 2016-12-20 | 2016-12-20 | A kind of multiplayer microwave circuit board interconnection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183725.4A CN106793459A (en) | 2016-12-20 | 2016-12-20 | A kind of multiplayer microwave circuit board interconnection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793459A true CN106793459A (en) | 2017-05-31 |
Family
ID=58895815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611183725.4A Pending CN106793459A (en) | 2016-12-20 | 2016-12-20 | A kind of multiplayer microwave circuit board interconnection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793459A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009711A (en) * | 2019-12-27 | 2020-04-14 | 航天科工微系统技术有限公司 | Microwave signal vertical interconnection structure |
| CN111640682A (en) * | 2020-05-31 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Gold wire bonding transition structure of separation device |
| CN114142266A (en) * | 2021-11-05 | 2022-03-04 | 中国航空工业集团公司雷华电子技术研究所 | Vertical interconnection structure between boards |
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| CN2886982Y (en) * | 2006-04-26 | 2007-04-04 | 华为技术有限公司 | Pcb |
| KR100987075B1 (en) * | 2009-09-17 | 2010-10-11 | 삼성탈레스 주식회사 | Radio frequency board assembly |
| CN103179782A (en) * | 2013-02-21 | 2013-06-26 | 广州兴森快捷电路科技有限公司 | Impedance-controlled low-loss single-ended via hole structure |
| CN203827598U (en) * | 2014-04-28 | 2014-09-10 | 中国电子科技集团公司第二十研究所 | Microwave vertical interconnect circuit by use of fuzz buttons for connection |
| CN204424416U (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | A kind of radio frequency vertical transition circuit based on hair button |
| CN105578714A (en) * | 2015-12-11 | 2016-05-11 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | Novel lamination structure of multilayer high-speed PCB and signal via-hole optimization method |
-
2016
- 2016-12-20 CN CN201611183725.4A patent/CN106793459A/en active Pending
Patent Citations (6)
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| CN2886982Y (en) * | 2006-04-26 | 2007-04-04 | 华为技术有限公司 | Pcb |
| KR100987075B1 (en) * | 2009-09-17 | 2010-10-11 | 삼성탈레스 주식회사 | Radio frequency board assembly |
| CN103179782A (en) * | 2013-02-21 | 2013-06-26 | 广州兴森快捷电路科技有限公司 | Impedance-controlled low-loss single-ended via hole structure |
| CN203827598U (en) * | 2014-04-28 | 2014-09-10 | 中国电子科技集团公司第二十研究所 | Microwave vertical interconnect circuit by use of fuzz buttons for connection |
| CN204424416U (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | A kind of radio frequency vertical transition circuit based on hair button |
| CN105578714A (en) * | 2015-12-11 | 2016-05-11 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | Novel lamination structure of multilayer high-speed PCB and signal via-hole optimization method |
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| 于争: "《信号完整性揭秘 于博士SI设计手记》", 30 September 2013 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009711A (en) * | 2019-12-27 | 2020-04-14 | 航天科工微系统技术有限公司 | Microwave signal vertical interconnection structure |
| CN111009711B (en) * | 2019-12-27 | 2021-10-01 | 航天科工微系统技术有限公司 | Microwave signal vertical interconnection structure |
| CN111640682A (en) * | 2020-05-31 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Gold wire bonding transition structure of separation device |
| CN111640682B (en) * | 2020-05-31 | 2022-07-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Gold wire bonding transition structure of separation device |
| CN114142266A (en) * | 2021-11-05 | 2022-03-04 | 中国航空工业集团公司雷华电子技术研究所 | Vertical interconnection structure between boards |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |