CN208173791U - Millimeter wave Massive MIMO antenna unit and array antenna - Google Patents
Millimeter wave Massive MIMO antenna unit and array antenna Download PDFInfo
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- CN208173791U CN208173791U CN201820438000.3U CN201820438000U CN208173791U CN 208173791 U CN208173791 U CN 208173791U CN 201820438000 U CN201820438000 U CN 201820438000U CN 208173791 U CN208173791 U CN 208173791U
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Abstract
Millimeter wave Massive mimo antenna unit, including successively spaced the first metal layer, second metal layer, the 4th metal layer, the 6th metal layer and connector from top to bottom；The first metal layer includes two parasitic patch；Second metal layer includes two radiation patch；4th metal layer includes two power splitters, and two power splitters are electrically connected with two radiation patch respectively；6th metal layer includes feeder line, and feeder line is electrically connected with two power splitters；Connector is electrically connected with feeder line.Antenna element makes full use of vertical space using multi-layer PCB technology and the interlayer interconnection technique of metallization VIA.Millimeter wave Massive MIMO array antenna, including according to 8 × 16 arrays arrange such as preceding antenna element, adjacent rows antenna element is staggered in the row direction, and adjacent two array antennas unit is staggered in a column direction, polarization mode is polarized using H, frequency range 28G.Array antenna, mutual coupling between array element is small, excellent electrical properties, and compact-sized, at low cost, high reliablity.
Description
Technical field
The utility model relates to communication antenna fields, specifically millimeter wave Massive mimo antenna unit and array
Antenna.
Background technique
As people require wireless communication higher and higher, third generation mobile communication system 5G is had become outside Current Domestic
The emphasis of research.5G the most intuitive feature is ultrahigh speed transmission, furthermore also needs to meet super large bandwidth, ultra-high capacity, ultra dense station
Point, super reliability, the whenever and wherever possible requirement such as accessibility.It realizes above-mentioned requirements, the key technology of many levels can be related to.?
Carrier wave frequency range level, according to Shannon's theorems C=Blog2 (1+S/N) it is found that data rate is closely bound up with usable spectrum.Due to
The frequency spectrum of Sub 6G all distributes, therefore millimeter wave（26.5 GHz ~300 GHz）With regard to having attracted extensive interest.In physics
Layer transportation level, the radio resource of Massive MIMO wireless technology energy deep exploitation Spatial Dimension significantly improve system spectrum
Efficiency and power efficiency.Therefore, after the two being combined, millimeter wave Massive MIMO wireless technology becomes reply eMBB
（Enhance Mobile Broadband：Enhance mobile bandwidth）The excellent selection of use-case.Millimeter wave Massive mimo antenna
It is the critical component of millimeter wave Massive MIMO wireless technology, to be able to achieve extensive commercialization, to millimeter wave Massive
More stringent requirements are proposed for mimo antenna, is respectively：Compact-sized, excellent electrical property, low cost, highly reliable etc..To be applied to
EMBB scene, frequency range 28G（ITU standard provides that its frequency range is：27.5 GHz~29.5 GHz）, horizontal beam is oriented to
For 60 degree of mimo antenna, beam position is it is determined that array element spacing, application band have defined the physics ruler of antenna element
It is very little, along with the structure design of active system is limited to frequency range and technique, the sky for causing antenna element and feeding network that can be laid out
Between it is extremely limited.
There are two types of common implementations for Massive mimo system in the world at present：One is antennas and active circuit elder generation mould
Block, remixes integrated, and another kind is that antenna and active circuit are directly integrated.Two schemes respectively have a superiority and inferiority, hybrid integrated due to
It can be dominant, and be easy where positioning performance problem in technique and cost with modularization, shortcoming is that size is bigger；Directly
It connects to integrate and dimensionally be dominant, more meet the following small form factor requirements, but the process is more complicated, higher cost accordingly.It is limited
In current technological level, also based on cost consideration, more often mimo system can tend to hybrid integrated, therefore, how subtract
The volume of small hybrid integrated Massive mimo system antenna becomes the emphasis of current research.
Utility model content
In order to solve deficiency in the prior art, the utility model provides a kind of millimeter wave Massive mimo antenna list
Member makes full use of vertical space, can be achieved at the same time compact-sized, excellent electrical property, low cost, it is highly reliable the advantages that；This is practical
Novel while providing a kind of application millimeter wave Massive mimo antenna cellular array antenna, the mutual coupling between array element is small, electric
Function admirable, and compact-sized, at low cost, high reliablity.
To achieve the goals above, the concrete scheme that the utility model uses for：Millimeter wave Massive mimo antenna list
Member, including successively spaced the first metal layer, second metal layer, the 4th metal layer, the 6th metal layer and company from top to bottom
Connect device；The first metal layer includes two parasitic patch；The second metal layer includes two radiation patch；4th gold medal
Belonging to layer includes two power splitters, and two power splitters are electrically connected with two radiation patch respectively, a power splitter, a radiation
Patch and the parasitic patch one bay of corresponding composition；6th metal layer includes feeder line, feeder line and two
The power splitter electrical connection, to make two bay electrical connections；The connector is electrically connected with the feeder line.
Further, first medium layer is additionally provided with above the first metal layer；The first metal layer and second
Air is also filled between metal layer；It is also disposed with from top to bottom between the second metal layer and the 4th metal layer
Second dielectric layer, the first bonding medium layer, third metal layer and third dielectric layer；4th metal layer and the 6th metal
It is also disposed with the second bonding medium layer, the 4th dielectric layer, fifth metal layer, third bonding medium layer from top to bottom between layer
With the 5th dielectric layer；Connector is additionally provided with below 6th metal layer.
Further, the third metal layer includes the first public metal ground plane, is lost in the first public metal ground plane
Two the first insulating isolation rings are carved, two power splitters pass through two the first metallization VIAs and two radiation respectively
Patch electrical connection, two the first metallization VIAs sequentially pass through the second dielectric layer, the first bonding medium layer, third gold
Belong to layer and the third dielectric layer, and two first metallization be each passed through when passing through third metal layer two first insulation every
From ring.
Further, the 4th metal layer further includes two the first metal connecting pieces and second metal connecting piece.
Further, the fifth metal layer includes the second public metal ground plane, is lost in the second public metal ground plane
Second insulating isolation ring is carved, passes through three group second between the second public metal ground plane and first metal ground plane
Metallization VIA is connected, and every group of second metallization VIA is set as several, and the second metallization VIA sequentially passes through described
Three dielectric layers, the 4th metal layer, the second bonding medium layer and the 4th dielectric layer, wherein two group of second metallization
Via hole is each passed through two first metal connecting pieces when passing through four metal layers and realizes electrical connection, another set the
Two metallization VIAs pass through second metal connecting piece when passing through four metal layers and realize electrical connection.
Further, two power splitters are electrically connected by a third metallization VIA with the feeder line, third gold
Categoryization via hole sequentially passes through the second bonding medium layer, the 4th dielectric layer, the fifth metal layer, third bonding
Dielectric layer and the 5th dielectric layer, and third metallization VIA pass through fifth metal layer when from second insulating isolation ring
It passes through.
Further, the 6th metal layer further includes a third metal connecting piece and a pad, and the feeder line is logical
It crosses pad to be electrically connected with connector, lead between the second public metal ground plane and the third metal connecting piece and pad
It crosses several the 4th metallization VIAs to be connected, the 4th metallization VIA sequentially passes through the third bonding medium layer and described
Five dielectric layers, all 4th metallization VIAs are electrically connected with third metal connecting piece.
Millimeter wave Massive MIMO array antenna, including the foregoing antenna element arranged according to 8 × 16 arrays,
Adjacent rows antenna element is staggered in the row direction, and adjacent two array antennas unit is staggered in a column direction, polarization side
Formula is polarized using H, frequency range 28G.
Further, the horizontal direction spacing between two adjacent antenna elements is 0.48 wavelength, Vertical Square
It is 0.72 wavelength to spacing.
Further, the array antenna is rectangle, and the length of antenna long side is 99mm, and the length of antenna short side is
58.4mm。
Beneficial effect：
1, the utility model provides a kind of millimeter wave Massive mimo antenna unit, using micro-strip paster antenna, weight
Gently, section it is low, it is easy manufacture, it is easy of integration；Based on the bay, the utility model passes through power splitter handle by the way of two-in-one
Two array elements are merged into an antenna element, reduce connector quantity, reduce cost；In turn, the antenna element of the utility model is adopted
With the structure of upper and lower multilayer, vertical direction space can make full use of, so that horizontal direction space is sufficient, radiation can be pasted
Piece, power splitter and connector three are effectively separated, so that compact-sized, flexible layout, is applicable to larger beam position
Mimo antenna；
2, the utility model provides a kind of millimeter wave Massive MIMO array antenna, is arranged, can be reduced using triangle battle array
Mutual coupling between array element, obtains preferable port isolation and return loss, and have compact-sized, excellent electrical property, low cost,
The advantages that high reliability, is suitable for extensive commercial.
Detailed description of the invention
Fig. 1 is the multilayered structure schematic diagram of the utility model millimeter wave Massive mimo antenna unit；
Fig. 2 is the side view of the utility model millimeter wave Massive mimo antenna unit；
Fig. 3 is the top view of the utility model millimeter wave Massive mimo antenna unit；
Fig. 4 is the perspective view of the utility model millimeter wave Massive mimo antenna unit（Without pad and connector）；
Fig. 5 is the top view of the utility model millimeter wave Massive MIMO array antenna；
Fig. 6 is the bottom view of the utility model millimeter wave Massive MIMO array antenna；
Fig. 7 is that the antenna beam of the utility model millimeter wave Massive MIMO array antenna is directed toward the 0 degree of face E figure；
Fig. 8 is the 60 degree of face E figures of beam position of the utility model millimeter wave Massive MIMO array antenna；
Fig. 9 is the return loss emulation and reality of certain Single port of the utility model millimeter wave Massive MIMO array antenna
Survey comparison diagram；
Figure 10 is the return loss signal of the wherein Single port of the utility model millimeter wave Massive MIMO array antenna
Figure.
Appended drawing reference：101, first medium layer, 102, the first metal layer, 103, air, 104, second metal layer, 105,
Second medium layer, the 106, first bonding medium layer, 107, third metal layer, 108, third dielectric layer, the 109, the 4th metal layer, 110,
Second bonding medium layer, the 111, the 4th dielectric layer, 112, fifth metal layer, 113, third bonding medium layer, the 114, the 5th medium
Layer, the 115, the 6th metal layer, 201, parasitic patch, 202, radiation patch, the 203, first public metal ground plane, 204, second is public
Metal ground plane altogether, the 205, first metallization VIA, the combination of 206, strip line-microstrip line shield opening, 207, third metallized
Hole, 208, radiation patch-strip line shield opening combination, 209, the combination of microstrip line shield opening, 210, pad hole combination, 211, second
Metallization VIA, the 212, the 4th metallization VIA, 301, connector, 302, power splitter, 303, feeder line, 304, pad, 501,
One insulating isolation ring, the 502, second insulating isolation ring, the 503, first metal connecting piece, the 504, second metal connecting piece, 505,
Three metal connecting pieces, 601, antenna long side, 602, antenna short side, 603, horizontal direction spacing, 604, vertical direction spacing.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figures 1 to 4, millimeter wave Massive mimo antenna unit, including from top to bottom successively spaced
One metal layer 102, second metal layer 104, the 4th metal layer 109, the 6th metal layer 115 and connector 301.
The first metal layer 102 includes two parasitic patch 201, and two parasitic patch 201 are square, and side length is equal to
0.5 medium wavelength in practical manufacturing process, is influenced, the side length of parasitic patch 201 is approximately equal to 0.5 Jie by manufacture craft
Matter wavelength.Parasitic patch 201 is for increasing antenna resonance point, to extend impedance bandwidth.
Second metal layer 104 includes two radiation patch 202, and two radiation patch 202 are square, and side length is equal to
0.5 medium wavelength in practical manufacturing process, is influenced, the side length of radiation patch 202 is approximately equal to 0.5 Jie by manufacture craft
Matter wavelength.
4th metal layer 109 includes two power splitters 302, and two power splitters 302 are strip line power splitter, two function point
Device 302 is electrically connected with two radiation patch 202 respectively, 302, radiation patch 202 of a power splitter and a parasitic patch
201 one bay of corresponding composition.
6th metal layer 115 includes feeder line 303, and feeder line 303 uses microstrip transmission line, feeder line 303 and two power splitters 302
Electrical connection, the power splitter 302 of two bays are electrically connected that two bays is made to be electrically connected jointly with a feeder line 303
It connects.
Connector 301 is electrically connected with feeder line 303, and connector 301 selects the interface mode of SMPM connector and TR component to carry out
Docking, convenient for assembly and disassembly.
In the antenna element of the utility model, bay use micro-strip paster antenna, it is light-weight, section is low, it is easy manufacture,
It is easy of integration；Based on the bay, the utility model is merged into two array elements by power splitter 302 by the way of two-in-one
One antenna element reduces connector quantity, reduces cost；In turn, the antenna element of the utility model uses the knot of upper and lower multilayer
Structure can make full use of vertical direction space, so that horizontal direction space is sufficient, it can be radiation patch 202, power splitter 302
301 three is effectively separated with connector, so that compact-sized, flexible layout, is applicable to the mimo antenna of larger beam position.
The top of the first metal layer 102 is additionally provided with first medium layer 101, and the first metal layer 102 overlays on first medium layer
On 101 lower surface, first layer pcb board is formed.
Air 103, air 103 and parasitic patch 201 are also filled between the first metal layer 102 and second metal layer 104
Cooperation, is extended impedance bandwidth, in the utility model others embodiment, air 103 can also be substituted for foam.
Second dielectric layer 105, are also disposed between second metal layer 104 and the 4th metal layer 109 from top to bottom
One bonding medium layer 106, third metal layer 107 and third dielectric layer 108.Second metal layer 104 overlays on second dielectric layer 105
Upper surface forms second layer pcb board.Third metal layer 107 overlays on the upper surface of third dielectric layer 108, the 4th metal layer 109 covers
In the lower surface of third dielectric layer 108, third layer pcb board is formed.First bonding medium layer 106 is by second dielectric layer 105 and
Three metal layers 107 bond together, so that second layer pcb board and third layer pcb board are adhesively fixed.
It is also disposed with the second bonding medium layer from top to bottom between 4th metal layer 109 and the 6th metal layer 115
110, the 4th dielectric layer 111, fifth metal layer 112, third bonding medium layer 113 and the 5th dielectric layer 114.Fifth metal layer
112 overlay on the lower surface of the 4th dielectric layer 111, form the 4th layer of pcb board.6th metal layer 115 overlays on the 5th dielectric layer 114
Lower surface forms layer 5 pcb board.4th metal layer 109 and the 4th dielectric layer 111 are bonded in by the second bonding medium layer 110
Together, so that third layer pcb board and the 4th layer of pcb board are adhesively fixed.Fifth metal layer 112 and the bonding of the 5th dielectric layer 114
Together, so that the 4th layer of pcb board and layer 5 PCB are adhesively fixed.
The utility model uses multi-layer PCB technology, can significantly save space, is conducive to the body for reducing antenna element
Product.In terms of material, the material of all metal layers is selected as copper, and All Media layer choosing material principle is：（1）From electrical angle
Degree selects the plate of the low Df of high band, high Dk and Lopro, and low Df and Lopro are to reduce feeding network line loss, high Dk
It is in order to enable bay miniaturization, is conducive to be laid out and reduce the mutual coupling between array element；（2）From the angle of structure process：①
The plate for selecting material harder is not easy warpage or bending after multi-layer board pressing；2. selecting plate CTE and copper CTE close, in height
Copper foil can keep size relatively stable when low temperature or temperature are followed；3. select peel strength it is high, connector in measurement or experiment with
TR component is not easily stripped when multiple.
Third metal layer 107 includes the first public metal ground plane 203, is etched in the first public metal ground plane 203
Two the first insulating isolation rings 501, two power splitters 302 are pasted by two the first metallization VIAs 205 and two radiation respectively
Piece 202 is electrically connected, therefore the first metallization VIA 205 also known as radiation patch-strip line probe, two the first metallization VIAs
205 sequentially pass through second dielectric layer 105, the first bonding medium layer 106, third metal layer 107 and third dielectric layer 108, and two
A first metallization is each passed through two the first insulating isolation rings 501 when passing through third metal layer 107, therefore will not be with the first public affairs
Metal ground plane 203 connects altogether.
4th metal layer 109 further includes two the first metal connecting pieces 503 and second metal connecting piece 504, and first
Metal connecting piece 503 and the equal semicircular in shape of the second metal connecting piece 504, and both ends are both configured to fillet, the connection of the first metal
The internal diameter of part 503 is equal with the radius of the first insulating isolation ring 501.
Fifth metal layer 112 includes the second public metal ground plane 204, is etched in the second public metal ground plane 204
One the second insulating isolation ring 502, the radius of the second insulating isolation ring 502 are equal with the internal diameter of the second metal connecting piece 504.The
It is connected between two public metal ground planes 204 and the first metal ground plane by three group of second metallization VIA 211, every group the
Two metallization VIAs 211 are set as several, every group of the equal semicircular in shape distribution of the second metallization VIA 211, the second metallization
Via hole 211 sequentially passes through third dielectric layer 108, the 4th metal layer 109, the second bonding medium layer 110 and the 4th dielectric layer 111.
Wherein the diameter of two group of second metallization VIA 211 is named as radiation patch-strip line less than the width of the first connector 503
Shield opening combination 208, two groups of radiation patch-strip line shield opening combination 208 are distinguished when passing through the 4th metal layer 109
Electrical connection is realized across two the first metal connecting pieces 503.The diameter of the second metallization VIA of another set 211 is less than the second gold medal
The width for having belonged to connector 504 is named as strip line-microstrip line shield opening combination 206, strip line-microstrip line shield opening combination
206, which pass through the second metal connecting piece 504 when passing through the 4th metal layer 109, realizes electrical connection.
Two power splitters 302 are electrically connected by a third metallization VIA 207 with feeder line 303, therefore third metallizes
Via hole 207 is also known as strip line-microstrip probe, and third metallization VIA 207 sequentially passes through the second bonding medium layer the 110, the 4th Jie
Matter layer 111, fifth metal layer 112, third bonding medium layer 113 and the 5th dielectric layer 114, and third metallization VIA 207 is worn
It is passed through from the second insulating isolation ring 502 when crossing fifth metal layer 112.
6th metal layer 115 further includes a third metal connecting piece 505 and a pad 304, and connector 301 is fixed on
On pad 304, feeder line 303 is electrically connected by pad 304 with connector 301, the second public metal ground plane 204 and third metal
It is connected between connector 505 and pad by several the 4th metallization VIAs 212, the 4th metallization VIA 212 is successively
Across third bonding medium layer 113 and the 5th dielectric layer 114, all 4th metallization VIAs 212 with third metal connecting piece
505 electrical connections.4th metallization VIA 212 includes microstrip line shield opening combination 209 and pad hole combination 210.
Radiation patch-strip line shield opening combination 208 and radiation patch-strip line probe（That is the first metallization VIA
205）It is formed and is similar to coaxial line structure, guiding and matching are played to the electromagnetic signal between radiation patch 202 and power splitter 302
Effect.Strip line-microstrip line shield opening combination 206, microstrip line shield opening combination 209 and strip line-microstrip probe（I.e.
Three metallization VIAs 207）It is formed and is similar to coaxial line structure, the electromagnetic signal between strip line 302 and microstrip line 303 is led
To with matched effect.The electromagnetic signal that pad hole combines between 210 pairs of connectors 301 and microstrip line 303 play guiding and
With effect.
As it can be seen in figures 5 and 6, based on above-mentioned millimeter wave Massive mimo antenna unit, the utility model provides one kind
Millimeter wave Massive MIMO array antenna is expert at including the antenna element as claimed in claim 1 arranged according to 8 × 16 arrays
Adjacent rows antenna element is staggered on direction, and adjacent two array antennas unit is staggered in a column direction, and polarization mode is adopted
It is polarized with H, frequency range 28G.Horizontal direction spacing 603 between two adjacent antenna elements is 0.48 wavelength, Vertical Square
It is 0.72 wavelength to spacing 604, horizontal direction beam position can reach ± 60 °, and vertical direction beam position can reach ±
15°.Entire array antenna is rectangle, and the length of antenna long side 601 is 99mm, and the length of antenna short side 602 is 58.4mm.
The millimeter wave Massive MIMO array antenna of the utility model is arranged using triangle battle array, can be reduced mutual between array element
Coupling obtains preferable port isolation and return loss, and has compact-sized, excellent electrical property, low cost, highly reliable etc. excellent
Point is suitable for extensive commercial.Array antenna Fa not be shown in Fig. 7 and Fig. 8 in 0 ° and 60 ° of directional diagrams, it is seen that minor lobe suppression level compared with
It is high.Wherein Fig. 9 is shown in the return loss emulation and actual measurement comparison of Single port, it is necessary to which explanation is：1. emulation and measured result are poor
It is different, it is plus SMPM connector, and by a system when carrying out whole emulation without addition SMPM connector mainly due to emulation, but surveying
Column test block influences；2. nevertheless, all of the port return loss measured result≤- 14dB, the fully sufficient engineering that meets is answered
With, and have certain surplus.The isolation of both ends of them mouth emulates and Figure 10 is shown in actual measurement comparison, it is necessary to explanation, all of the port
The measured result of isolation >=18dB.
It should also be noted that, herein, relational terms such as first and second and the like are used merely to one
Entity or operation are distinguished with another entity or operation, without necessarily requiring or implying between these entities or operation
There are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to contain
Lid non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (10)
1. millimeter wave Massive mimo antenna unit, it is characterised in that：Including successively spaced first gold medal from top to bottom
Belong to layer（102）, second metal layer（104）, the 4th metal layer（109）, the 6th metal layer（115）And connector（301）；
The first metal layer（102）Including two parasitic patch（201）；
The second metal layer（104）Including two radiation patch（202）；
4th metal layer（109）Including two power splitters（302）, two power splitters（302）Respectively with two radiation
Patch（202）Electrical connection, a power splitter（302）, a radiation patch（202）With a parasitic patch（201）It is corresponding
Form a bay；
6th metal layer（115）Including feeder line（303）, feeder line（303）With two power splitters（302）Electrical connection, from
And make two bay electrical connections；
The connector（301）With the feeder line（303）Electrical connection.
2. millimeter wave Massive mimo antenna unit as described in claim 1, it is characterised in that：The first metal layer
（102）Top be additionally provided with first medium layer（101）；
The first metal layer（102）And second metal layer（104）Between be also filled with air（103）；
The second metal layer（104）With the 4th metal layer（109）Between be also disposed with second medium from top to bottom
Layer（105）, the first bonding medium layer（106）, third metal layer（107）With third dielectric layer（108）；
4th metal layer（109）With the 6th metal layer（115）Between be also disposed with the second bonding from top to bottom
Dielectric layer（110）, the 4th dielectric layer（111）, fifth metal layer（112）, third bonding medium layer（113）With the 5th dielectric layer
（114）.
3. millimeter wave Massive mimo antenna unit as claimed in claim 2, it is characterised in that：The third metal layer
（107）Including the first public metal ground plane（203）, the first public metal ground plane（203）On etch two first insulation
Isolation ring（501）, two power splitters（302）Pass through two the first metallization VIAs respectively（205）With two radiation
Patch（202）Electrical connection, two the first metallization VIAs（205）Sequentially pass through the second dielectric layer（105）, it is described first viscous
Close dielectric layer（106）, third metal layer（107）With the third dielectric layer（108）, and two first metallization are passing through third
Metal layer（107）When be each passed through two the first insulating isolation rings（501）.
4. millimeter wave Massive mimo antenna unit as claimed in claim 2, it is characterised in that：4th metal layer
（109）It further include two the first metal connecting pieces（503）With second metal connecting piece（504）.
5. millimeter wave Massive mimo antenna unit as claimed in claim 4, it is characterised in that：The fifth metal layer
（112）Including the second public metal ground plane（204）, the second public metal ground plane（204）On etch one second insulation
Isolation ring（502）, the second public metal ground plane（204）Pass through three group of second metallization between first metal ground plane
Via hole（211）It is connected, every group of second metallization VIA（211）Several are set as, the second metallization VIA（211）Successively wear
Cross the third dielectric layer（108）, the 4th metal layer（109）, the second bonding medium layer（110）It is situated between with the described 4th
Matter layer（111）, wherein two group of second metallization VIA（211）Passing through the 4th metal layer（109）When be each passed through two
First metal connecting piece（503）Realize electrical connection, the second metallization VIA of another set（211）Passing through the 4th metal layer
（109）When pass through second metal connecting piece（504）Realize electrical connection.
6. millimeter wave Massive mimo antenna unit as claimed in claim 5, it is characterised in that：Two power splitters
（302）Pass through a third metallization VIA（207）With the feeder line（303）Electrical connection, third metallization VIA（207）Successively
Across the second bonding medium layer（110）, the 4th dielectric layer（111）, the fifth metal layer（112）, the third
Bonding medium layer（113）With the 5th dielectric layer（114）, and third metallization VIA（207）Across fifth metal layer（112）
When from second insulating isolation ring（502）In pass through.
7. millimeter wave Massive mimo antenna unit as claimed in claim 6, it is characterised in that：6th metal layer
（115）It further include a third metal connecting piece（505）With a pad（304）, the feeder line（303）Pass through pad（304）
With connector（301）Electrical connection, the second public metal ground plane（204）With the third metal connecting piece（505）And
Pass through several the 4th metallization VIAs between pad（212）It is connected, the 4th metallization VIA（212）Sequentially pass through described
Three bonding medium layers（113）With the 5th dielectric layer（114）, all 4th metallization VIAs（212）Connect with third metal
Fitting（505）Electrical connection.
8. millimeter wave Massive MIMO array antenna, it is characterised in that：Including according to 8 × 16 arrays arrange such as claim
Antenna element described in 1, adjacent rows antenna element is staggered in the row direction, in a column direction adjacent two array antennas unit
It is staggered, polarization mode is polarized using H, frequency range 28G.
9. millimeter wave Massive MIMO array antenna as claimed in claim 8, it is characterised in that：Two adjacent days
Horizontal direction spacing between line unit（603）For 0.48 wavelength, vertical direction spacing（604）For 0.72 wavelength.
10. millimeter wave Massive MIMO array antenna as claimed in claim 8, it is characterised in that：The array antenna is in
Rectangle, antenna long side（601）Length be 99mm, antenna short side（602）Length be 58.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820438000.3U CN208173791U (en) | 2018-03-29 | 2018-03-29 | Millimeter wave Massive MIMO antenna unit and array antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820438000.3U CN208173791U (en) | 2018-03-29 | 2018-03-29 | Millimeter wave Massive MIMO antenna unit and array antenna |
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| CN208173791U true CN208173791U (en) | 2018-11-30 |
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| CN201820438000.3U Active CN208173791U (en) | 2018-03-29 | 2018-03-29 | Millimeter wave Massive MIMO antenna unit and array antenna |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109980345A (en) * | 2019-03-22 | 2019-07-05 | 中国电子科技集团公司第三十八研究所 | A kind of on-chip antenna and antenna array |
| CN110504537A (en) * | 2019-08-28 | 2019-11-26 | 榆林学院 | One kind being based on two unit micro-strip mimo antenna of polynary parasitic surface structure broadband |
| WO2020134463A1 (en) * | 2018-12-28 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Millimeter-wave array antenna and mobile terminal |
| CN112310657A (en) * | 2020-10-21 | 2021-02-02 | 武汉虹信科技发展有限责任公司 | Electric connector and 5G antenna module |
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| WO2021227806A1 (en) * | 2020-05-12 | 2021-11-18 | 西安电子科技大学 | Antenna apparatus and electronic device |
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2018
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020134463A1 (en) * | 2018-12-28 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Millimeter-wave array antenna and mobile terminal |
| US11245202B2 (en) | 2018-12-28 | 2022-02-08 | AAC Technologies Pte. Ltd. | Millimeter wave array antenna and mobile terminal |
| CN109980345A (en) * | 2019-03-22 | 2019-07-05 | 中国电子科技集团公司第三十八研究所 | A kind of on-chip antenna and antenna array |
| CN110504537A (en) * | 2019-08-28 | 2019-11-26 | 榆林学院 | One kind being based on two unit micro-strip mimo antenna of polynary parasitic surface structure broadband |
| WO2021227806A1 (en) * | 2020-05-12 | 2021-11-18 | 西安电子科技大学 | Antenna apparatus and electronic device |
| CN112310657A (en) * | 2020-10-21 | 2021-02-02 | 武汉虹信科技发展有限责任公司 | Electric connector and 5G antenna module |
| CN112310657B (en) * | 2020-10-21 | 2022-10-11 | 武汉虹信科技发展有限责任公司 | Electric connector and 5G antenna module |
| CN112467368A (en) * | 2020-11-10 | 2021-03-09 | 武汉虹信科技发展有限责任公司 | Vibrator power division module and Massive MIMO antenna |
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