JP2004531095A5 - - Google Patents

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Publication number
JP2004531095A5
JP2004531095A5 JP2003509832A JP2003509832A JP2004531095A5 JP 2004531095 A5 JP2004531095 A5 JP 2004531095A5 JP 2003509832 A JP2003509832 A JP 2003509832A JP 2003509832 A JP2003509832 A JP 2003509832A JP 2004531095 A5 JP2004531095 A5 JP 2004531095A5
Authority
JP
Japan
Prior art keywords
contact element
protrusion
main portion
element according
back plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003509832A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004531095A (ja
JP4126013B2 (ja
Filing date
Publication date
Priority claimed from SE0102322A external-priority patent/SE523388C2/sv
Application filed filed Critical
Publication of JP2004531095A publication Critical patent/JP2004531095A/ja
Publication of JP2004531095A5 publication Critical patent/JP2004531095A5/ja
Application granted granted Critical
Publication of JP4126013B2 publication Critical patent/JP4126013B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003509832A 2001-06-27 2002-06-27 電子回路、電気接続素子および接触ばね用ハウジング、および電磁シールド・プロセス Expired - Fee Related JP4126013B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102322A SE523388C2 (sv) 2001-06-27 2001-06-27 Hölje för elektroniska anordningar med en öppning för instickskort samt kontaktelement för elektrisk förbindning mellan en panel för instickskort och ett apparathölje
PCT/SE2002/001292 WO2003003802A1 (en) 2001-06-27 2002-06-27 Housing for electronic circuits, electrically connecting element and contact spring, procedure for electromagnetic shielding

Publications (3)

Publication Number Publication Date
JP2004531095A JP2004531095A (ja) 2004-10-07
JP2004531095A5 true JP2004531095A5 (enExample) 2006-01-05
JP4126013B2 JP4126013B2 (ja) 2008-07-30

Family

ID=20284671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003509832A Expired - Fee Related JP4126013B2 (ja) 2001-06-27 2002-06-27 電子回路、電気接続素子および接触ばね用ハウジング、および電磁シールド・プロセス

Country Status (9)

Country Link
US (1) US7158388B2 (enExample)
EP (1) EP1407645B1 (enExample)
JP (1) JP4126013B2 (enExample)
KR (1) KR20040038920A (enExample)
CN (1) CN1331378C (enExample)
AT (1) ATE487360T1 (enExample)
DE (1) DE60238197D1 (enExample)
SE (1) SE523388C2 (enExample)
WO (1) WO2003003802A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251309A (ja) * 2004-03-04 2005-09-15 Hitachi Ltd ディスクアレイ装置
JP4672599B2 (ja) * 2006-05-26 2011-04-20 富士通テレコムネットワークス株式会社 プラグインユニット板の表示構造
SE533455C2 (sv) * 2009-10-23 2010-10-05 Clamco Invest Ab Hölje för elektronisk utrustning, innefattande kontakteringsanordning
SE534234C2 (sv) * 2009-10-23 2011-06-07 Clamco Invest Ab Hölje för elektronisk utrustning
US8270929B1 (en) * 2011-09-09 2012-09-18 Contech RF Devices, LLC RF shielding for mobile devices
CN110688337B (zh) * 2013-02-28 2023-07-07 甲骨文国际公司 架装式现场可更换单元的带外管理
CN104122961A (zh) * 2013-04-25 2014-10-29 鸿富锦精密工业（深圳）有限公司 机柜式服务器及虚拟服务器机箱
GB2515113B (en) 2013-06-14 2015-12-30 Eschmann Holdings Ltd Surgical table and method of operating the same
CN104238656A (zh) * 2013-06-24 2014-12-24 鸿富锦精密工业（深圳）有限公司 扩充卡固定装置
GB2516051B (en) 2013-07-09 2016-06-08 Eschmann Holdings Ltd Surgical tables
GB2516109B (en) 2013-07-12 2016-10-12 Eschmann Holdings Ltd Tabletop sections for surgical tables
CN105241293B (zh) * 2015-10-30 2017-05-31 成都标建铝业有限公司 一种增强散热效果的散热器型材
CN106647444B (zh) * 2016-10-31 2023-08-01 国网山东省电力公司莱芜供电公司 采用负反馈的电源调节装置及其调节方法
CN109358715B (zh) * 2018-10-26 2021-10-01 英业达科技有限公司 计算机机壳
BE1026757B1 (de) * 2018-11-07 2020-06-08 Phoenix Contact Gmbh & Co Baugruppe eines Elektronikgeräts mit einem Gerätegehäuse und einer Elektronikbaugruppe
CN112462862B (zh) * 2019-09-06 2023-04-07 英业达科技有限公司 用于扩充卡槽口的电磁遮蔽结构及其扩充卡挡板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907412A1 (de) * 1989-03-08 1990-09-13 Ant Nachrichtentech Gehaeusesystem zur aufnahme von elektrischen einschueben
JP3011379B2 (ja) * 1991-07-17 2000-02-21 北川工業株式会社 電磁波シールド用ガスケット
IT1255012B (it) * 1992-03-27 1995-10-13 Italtel Spa Dispositivo di schermatura elettromagnetica
US5957465A (en) * 1997-06-17 1999-09-28 Sun Microsystems, Inc. Modular EMC PCI card gasket
US5929376A (en) 1997-06-20 1999-07-27 Tektronix, Inc. Electromagnetic interference shield and method of manufacturing
US5952608A (en) * 1997-08-11 1999-09-14 Kim; Sun-Ki Finger strip for shielding electromagnetic wave and front panel assembly mounting the same
US6201711B1 (en) 1999-05-18 2001-03-13 Hewlett-Packard Company Computer system housing for attenuating electromagnetic inferference (EMI)
US6332618B1 (en) * 1999-09-20 2001-12-25 Telefonaktiebolaget Lm Ericsson (Publ) Double sided gasket
US6403879B1 (en) * 2000-06-21 2002-06-11 Hewlett-Packard Company Electronic chassis having an EMI gasket and integral ventilation holes
AU2001214591A1 (en) * 2000-11-03 2002-05-15 Instrument Specialities Company, Inc. Modular shielding of openings with passing cables
US6618271B1 (en) * 2002-04-01 2003-09-09 Gateway, Inc. EMI shield

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