DE60238197D1 - Elektrisch verbindendes element zwischen einer rückplatte und einer anderen rückplatte oder einem gehäuse für elektronische schaltungen - Google Patents

Elektrisch verbindendes element zwischen einer rückplatte und einer anderen rückplatte oder einem gehäuse für elektronische schaltungen

Info

Publication number
DE60238197D1
DE60238197D1 DE60238197T DE60238197T DE60238197D1 DE 60238197 D1 DE60238197 D1 DE 60238197D1 DE 60238197 T DE60238197 T DE 60238197T DE 60238197 T DE60238197 T DE 60238197T DE 60238197 D1 DE60238197 D1 DE 60238197D1
Authority
DE
Germany
Prior art keywords
frame
cover plates
opening
back plate
frame parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238197T
Other languages
German (de)
English (en)
Inventor
Bertil Lohman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bertil Lohman Design AB
Original Assignee
Bertil Lohman Design AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bertil Lohman Design AB filed Critical Bertil Lohman Design AB
Application granted granted Critical
Publication of DE60238197D1 publication Critical patent/DE60238197D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
DE60238197T 2001-06-27 2002-06-27 Elektrisch verbindendes element zwischen einer rückplatte und einer anderen rückplatte oder einem gehäuse für elektronische schaltungen Expired - Lifetime DE60238197D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102322A SE523388C2 (sv) 2001-06-27 2001-06-27 Hölje för elektroniska anordningar med en öppning för instickskort samt kontaktelement för elektrisk förbindning mellan en panel för instickskort och ett apparathölje
PCT/SE2002/001292 WO2003003802A1 (en) 2001-06-27 2002-06-27 Housing for electronic circuits, electrically connecting element and contact spring, procedure for electromagnetic shielding

Publications (1)

Publication Number Publication Date
DE60238197D1 true DE60238197D1 (de) 2010-12-16

Family

ID=20284671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60238197T Expired - Lifetime DE60238197D1 (de) 2001-06-27 2002-06-27 Elektrisch verbindendes element zwischen einer rückplatte und einer anderen rückplatte oder einem gehäuse für elektronische schaltungen

Country Status (9)

Country Link
US (1) US7158388B2 (enExample)
EP (1) EP1407645B1 (enExample)
JP (1) JP4126013B2 (enExample)
KR (1) KR20040038920A (enExample)
CN (1) CN1331378C (enExample)
AT (1) ATE487360T1 (enExample)
DE (1) DE60238197D1 (enExample)
SE (1) SE523388C2 (enExample)
WO (1) WO2003003802A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251309A (ja) * 2004-03-04 2005-09-15 Hitachi Ltd ディスクアレイ装置
JP4672599B2 (ja) * 2006-05-26 2011-04-20 富士通テレコムネットワークス株式会社 プラグインユニット板の表示構造
SE533455C2 (sv) * 2009-10-23 2010-10-05 Clamco Invest Ab Hölje för elektronisk utrustning, innefattande kontakteringsanordning
SE534234C2 (sv) * 2009-10-23 2011-06-07 Clamco Invest Ab Hölje för elektronisk utrustning
US8270929B1 (en) * 2011-09-09 2012-09-18 Contech RF Devices, LLC RF shielding for mobile devices
CN110678028B (zh) * 2013-02-28 2021-05-28 甲骨文国际公司 架装式现场可更换单元的带外管理
CN104122961A (zh) * 2013-04-25 2014-10-29 鸿富锦精密工业（深圳）有限公司 机柜式服务器及虚拟服务器机箱
GB2522806B (en) 2013-06-14 2016-01-06 Eschmann Holdings Ltd Surgical table and method of operating the same
CN104238656A (zh) * 2013-06-24 2014-12-24 鸿富锦精密工业（深圳）有限公司 扩充卡固定装置
GB2516051B (en) 2013-07-09 2016-06-08 Eschmann Holdings Ltd Surgical tables
GB2535054B (en) 2013-07-12 2017-01-11 Eschmann Holdings Ltd Tabletop sections for surgical tables
CN105241293B (zh) * 2015-10-30 2017-05-31 成都标建铝业有限公司 一种增强散热效果的散热器型材
CN106647444B (zh) * 2016-10-31 2023-08-01 国网山东省电力公司莱芜供电公司 采用负反馈的电源调节装置及其调节方法
CN109358715B (zh) * 2018-10-26 2021-10-01 英业达科技有限公司 计算机机壳
BE1026757B1 (de) * 2018-11-07 2020-06-08 Phoenix Contact Gmbh & Co Baugruppe eines Elektronikgeräts mit einem Gerätegehäuse und einer Elektronikbaugruppe
CN112462862B (zh) * 2019-09-06 2023-04-07 英业达科技有限公司 用于扩充卡槽口的电磁遮蔽结构及其扩充卡挡板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907412A1 (de) 1989-03-08 1990-09-13 Ant Nachrichtentech Gehaeusesystem zur aufnahme von elektrischen einschueben
JP3011379B2 (ja) * 1991-07-17 2000-02-21 北川工業株式会社 電磁波シールド用ガスケット
IT1255012B (it) * 1992-03-27 1995-10-13 Italtel Spa Dispositivo di schermatura elettromagnetica
US5957465A (en) * 1997-06-17 1999-09-28 Sun Microsystems, Inc. Modular EMC PCI card gasket
US5929376A (en) * 1997-06-20 1999-07-27 Tektronix, Inc. Electromagnetic interference shield and method of manufacturing
US5952608A (en) * 1997-08-11 1999-09-14 Kim; Sun-Ki Finger strip for shielding electromagnetic wave and front panel assembly mounting the same
US6201711B1 (en) * 1999-05-18 2001-03-13 Hewlett-Packard Company Computer system housing for attenuating electromagnetic inferference (EMI)
US6332618B1 (en) * 1999-09-20 2001-12-25 Telefonaktiebolaget Lm Ericsson (Publ) Double sided gasket
US6403879B1 (en) * 2000-06-21 2002-06-11 Hewlett-Packard Company Electronic chassis having an EMI gasket and integral ventilation holes
AU2001214591A1 (en) 2000-11-03 2002-05-15 Instrument Specialities Company, Inc. Modular shielding of openings with passing cables
US6618271B1 (en) * 2002-04-01 2003-09-09 Gateway, Inc. EMI shield

Also Published As

Publication number Publication date
SE0102322L (sv) 2002-12-28
CN1331378C (zh) 2007-08-08
SE0102322D0 (sv) 2001-06-27
US20040196627A1 (en) 2004-10-07
WO2003003802A1 (en) 2003-01-09
KR20040038920A (ko) 2004-05-08
SE523388C2 (sv) 2004-04-13
JP4126013B2 (ja) 2008-07-30
ATE487360T1 (de) 2010-11-15
EP1407645A1 (en) 2004-04-14
JP2004531095A (ja) 2004-10-07
US7158388B2 (en) 2007-01-02
EP1407645B1 (en) 2010-11-03
CN1547876A (zh) 2004-11-17

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