JP2004529386A - 減衰位相シフトフォトマスクブランクを製造するためのイオンビーム蒸着法 - Google Patents
減衰位相シフトフォトマスクブランクを製造するためのイオンビーム蒸着法 Download PDFInfo
- Publication number
- JP2004529386A JP2004529386A JP2002584084A JP2002584084A JP2004529386A JP 2004529386 A JP2004529386 A JP 2004529386A JP 2002584084 A JP2002584084 A JP 2002584084A JP 2002584084 A JP2002584084 A JP 2002584084A JP 2004529386 A JP2004529386 A JP 2004529386A
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- JP
- Japan
- Prior art keywords
- ion beam
- group
- target
- gas
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010884 ion-beam technique Methods 0.000 title claims abstract description 35
- 230000010363 phase shift Effects 0.000 title claims abstract description 26
- 238000001704 evaporation Methods 0.000 title claims abstract description 24
- 230000002238 attenuated effect Effects 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 12
- 150000002500 ions Chemical class 0.000 claims description 55
- 239000007789 gas Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 51
- 238000000151 deposition Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 35
- 239000002131 composite material Substances 0.000 claims description 18
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- 229910052786 argon Inorganic materials 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 11
- 229910052734 helium Inorganic materials 0.000 claims description 11
- 229910052743 krypton Inorganic materials 0.000 claims description 11
- 229910052754 neon Inorganic materials 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 229910052723 transition metal Inorganic materials 0.000 claims description 6
- 150000003624 transition metals Chemical class 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 239000010408 film Substances 0.000 description 56
- 238000007737 ion beam deposition Methods 0.000 description 34
- 230000008021 deposition Effects 0.000 description 28
- 230000003287 optical effect Effects 0.000 description 19
- 230000008569 process Effects 0.000 description 17
- 230000004907 flux Effects 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 238000001755 magnetron sputter deposition Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 150000004767 nitrides Chemical class 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- -1 nitrogen ions Chemical class 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000013077 target material Substances 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- 239000011261 inert gas Substances 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- 230000003595 spectral effect Effects 0.000 description 7
- 229910008484 TiSi Inorganic materials 0.000 description 6
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052724 xenon Inorganic materials 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 206010028980 Neoplasm Diseases 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 201000011510 cancer Diseases 0.000 description 3
- 238000000572 ellipsometry Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910004304 SiNy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000001659 ion-beam spectroscopy Methods 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- HEHINIICWNIGNO-UHFFFAOYSA-N oxosilicon;titanium Chemical compound [Ti].[Si]=O HEHINIICWNIGNO-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000391 spectroscopic ellipsometry Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28478001P | 2001-04-19 | 2001-04-19 | |
| PCT/US2002/012540 WO2002086620A2 (en) | 2001-04-19 | 2002-04-19 | Ion-beam deposition process for manufacturing attenuated phase shift photomask blanks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004529386A true JP2004529386A (ja) | 2004-09-24 |
| JP2004529386A5 JP2004529386A5 (enExample) | 2005-12-22 |
Family
ID=23091503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002584084A Pending JP2004529386A (ja) | 2001-04-19 | 2002-04-19 | 減衰位相シフトフォトマスクブランクを製造するためのイオンビーム蒸着法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6756160B2 (enExample) |
| EP (1) | EP1395876A2 (enExample) |
| JP (1) | JP2004529386A (enExample) |
| KR (1) | KR20040030590A (enExample) |
| CN (1) | CN1516826A (enExample) |
| AU (1) | AU2002254687A1 (enExample) |
| TW (1) | TW593708B (enExample) |
| WO (1) | WO2002086620A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011150267A (ja) * | 2009-12-24 | 2011-08-04 | Seiko Epson Corp | 光学物品およびその製造方法 |
| JP2013054368A (ja) * | 2012-10-22 | 2013-03-21 | Panasonic Corp | 赤外線光学フィルタおよびその製造方法 |
| JP2023108276A (ja) * | 2022-01-25 | 2023-08-04 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクの製造方法、及び表示装置の製造方法 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040115537A1 (en) * | 2002-04-19 | 2004-06-17 | Carcia Peter Francis | Ion-beam deposition process for manufacturing attenuated phase shift photomask blanks |
| US20040115343A1 (en) * | 2002-04-19 | 2004-06-17 | Carcia Peter Francis | Ion-beam deposition process for manufacturing multi-layered attenuated phase shift photomask blanks |
| US20040005416A1 (en) * | 2002-07-03 | 2004-01-08 | Cosmos Vacuum Technology Corporation | Method for making an anti-reflection coating on a substrate for the production of a polarizer |
| US7300556B2 (en) * | 2003-08-29 | 2007-11-27 | Hitachi Global Storage Technologies Netherlands B.V. | Method for depositing a thin film adhesion layer |
| KR20060120613A (ko) * | 2003-09-05 | 2006-11-27 | 쇼오트 아게 | 감쇄 위상 편이 마스크 블랭크 및 포토 마스크 |
| JP2008216587A (ja) * | 2007-03-02 | 2008-09-18 | Canon Inc | Si酸化膜の形成方法、配向膜および液晶光学装置 |
| US20160022300A1 (en) * | 2011-02-01 | 2016-01-28 | Korea University Research And Business Foundation | Spinning nanowires and method for inducing cell eradication using the same |
| CN102230179B (zh) * | 2011-06-22 | 2013-01-02 | 清华大学 | 一种制备金属纳米条纹的方法 |
| US20130302512A1 (en) * | 2012-05-09 | 2013-11-14 | Amedica Corporation | Methods for altering the surface chemistry of biomedical implants and related apparatus |
| US9925295B2 (en) | 2012-05-09 | 2018-03-27 | Amedica Corporation | Ceramic and/or glass materials and related methods |
| US11572617B2 (en) | 2016-05-03 | 2023-02-07 | Applied Materials, Inc. | Protective metal oxy-fluoride coatings |
| CN106222623A (zh) * | 2016-08-31 | 2016-12-14 | 北京埃德万斯离子束技术研究所股份有限公司 | 氮化物半导体薄膜及制备方法 |
| CN106282917B (zh) * | 2016-08-31 | 2018-04-27 | 北京埃德万斯离子束技术研究所股份有限公司 | 氮化镓基发光二极管及制备方法 |
| CN112095082A (zh) * | 2020-09-10 | 2020-12-18 | 天津津航技术物理研究所 | 一种变折射率氧化物薄膜的制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4890309A (en) | 1987-02-25 | 1989-12-26 | Massachusetts Institute Of Technology | Lithography mask with a π-phase shifting attenuator |
| JP2744069B2 (ja) | 1989-06-06 | 1998-04-28 | 三洋電機株式会社 | 薄膜の形成方法 |
| GB9519546D0 (en) * | 1995-09-25 | 1995-11-29 | Gec Marconi Avionics Holdings | Depositing optical coatings |
| US5897977A (en) * | 1996-05-20 | 1999-04-27 | E. I. Du Pont De Nemours And Company | Attenuating embedded phase shift photomask blanks |
| JPH11184067A (ja) * | 1997-12-19 | 1999-07-09 | Hoya Corp | 位相シフトマスク及び位相シフトマスクブランク |
| US6274280B1 (en) | 1999-01-14 | 2001-08-14 | E.I. Du Pont De Nemours And Company | Multilayer attenuating phase-shift masks |
| US6653027B2 (en) * | 2001-02-26 | 2003-11-25 | International Business Machines Corporation | Attenuated embedded phase shift photomask blanks |
-
2002
- 2002-04-16 US US10/123,724 patent/US6756160B2/en not_active Expired - Fee Related
- 2002-04-19 AU AU2002254687A patent/AU2002254687A1/en not_active Abandoned
- 2002-04-19 WO PCT/US2002/012540 patent/WO2002086620A2/en not_active Ceased
- 2002-04-19 CN CNA02812104XA patent/CN1516826A/zh active Pending
- 2002-04-19 KR KR10-2003-7013676A patent/KR20040030590A/ko not_active Withdrawn
- 2002-04-19 TW TW091108098A patent/TW593708B/zh not_active IP Right Cessation
- 2002-04-19 JP JP2002584084A patent/JP2004529386A/ja active Pending
- 2002-04-19 EP EP02723927A patent/EP1395876A2/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011150267A (ja) * | 2009-12-24 | 2011-08-04 | Seiko Epson Corp | 光学物品およびその製造方法 |
| JP2013054368A (ja) * | 2012-10-22 | 2013-03-21 | Panasonic Corp | 赤外線光学フィルタおよびその製造方法 |
| JP2023108276A (ja) * | 2022-01-25 | 2023-08-04 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクの製造方法、及び表示装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1395876A2 (en) | 2004-03-10 |
| CN1516826A (zh) | 2004-07-28 |
| KR20040030590A (ko) | 2004-04-09 |
| US6756160B2 (en) | 2004-06-29 |
| WO2002086620A2 (en) | 2002-10-31 |
| WO2002086620A3 (en) | 2003-09-12 |
| AU2002254687A1 (en) | 2002-11-05 |
| TW593708B (en) | 2004-06-21 |
| US20020187405A1 (en) | 2002-12-12 |
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