JP2004526308A5 - - Google Patents

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Publication number
JP2004526308A5
JP2004526308A5 JP2002561265A JP2002561265A JP2004526308A5 JP 2004526308 A5 JP2004526308 A5 JP 2004526308A5 JP 2002561265 A JP2002561265 A JP 2002561265A JP 2002561265 A JP2002561265 A JP 2002561265A JP 2004526308 A5 JP2004526308 A5 JP 2004526308A5
Authority
JP
Japan
Prior art keywords
polishing
coupling agent
polishing system
liquid carrier
hydroxy coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002561265A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004526308A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/000205 external-priority patent/WO2002061810A1/en
Publication of JP2004526308A publication Critical patent/JP2004526308A/ja
Publication of JP2004526308A5 publication Critical patent/JP2004526308A5/ja
Pending legal-status Critical Current

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JP2002561265A 2001-01-16 2002-01-04 シュウ酸アンモニウムを含有する研磨系及び方法 Pending JP2004526308A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26192801P 2001-01-16 2001-01-16
PCT/US2002/000205 WO2002061810A1 (en) 2001-01-16 2002-01-04 Ammonium oxalate-containing polishing system and method

Publications (2)

Publication Number Publication Date
JP2004526308A JP2004526308A (ja) 2004-08-26
JP2004526308A5 true JP2004526308A5 (https=) 2005-12-22

Family

ID=22995488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002561265A Pending JP2004526308A (ja) 2001-01-16 2002-01-04 シュウ酸アンモニウムを含有する研磨系及び方法

Country Status (6)

Country Link
US (1) US20020125461A1 (https=)
EP (1) EP1356502A1 (https=)
JP (1) JP2004526308A (https=)
CN (1) CN1255854C (https=)
MY (1) MY127299A (https=)
WO (1) WO2002061810A1 (https=)

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CN103649271A (zh) * 2011-06-30 2014-03-19 旭化成电子材料株式会社 蚀刻液及使用其的蚀刻方法
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CN104745087B (zh) * 2013-12-25 2018-07-24 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
CN104745083B (zh) * 2013-12-25 2018-09-14 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
CN104263248B (zh) * 2014-09-26 2016-06-29 深圳市力合材料有限公司 一种适用于低下压力的弱酸性铜抛光液

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