MY127299A - Ammonium oxalate-containing polishing system and method - Google Patents

Ammonium oxalate-containing polishing system and method

Info

Publication number
MY127299A
MY127299A MYPI20020109A MYPI20020109A MY127299A MY 127299 A MY127299 A MY 127299A MY PI20020109 A MYPI20020109 A MY PI20020109A MY PI20020109 A MYPI20020109 A MY PI20020109A MY 127299 A MY127299 A MY 127299A
Authority
MY
Malaysia
Prior art keywords
polishing system
polishing
ammonium oxalate
containing polishing
substrate
Prior art date
Application number
MYPI20020109A
Other languages
English (en)
Inventor
Zhou Renjie
Chou Homer
d hawkins Joseph
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY127299A publication Critical patent/MY127299A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI20020109A 2001-01-16 2002-01-14 Ammonium oxalate-containing polishing system and method MY127299A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26192801P 2001-01-16 2001-01-16

Publications (1)

Publication Number Publication Date
MY127299A true MY127299A (en) 2006-11-30

Family

ID=22995488

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20020109A MY127299A (en) 2001-01-16 2002-01-14 Ammonium oxalate-containing polishing system and method

Country Status (6)

Country Link
US (1) US20020125461A1 (https=)
EP (1) EP1356502A1 (https=)
JP (1) JP2004526308A (https=)
CN (1) CN1255854C (https=)
MY (1) MY127299A (https=)
WO (1) WO2002061810A1 (https=)

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CN102367012A (zh) * 2011-06-28 2012-03-07 苏州方暨圆节能科技有限公司 具有薄膜的铜散热器热管
CN102367011A (zh) * 2011-06-28 2012-03-07 苏州方暨圆节能科技有限公司 具有薄膜的铜散热器热管
CN102368030A (zh) * 2011-06-28 2012-03-07 苏州方暨圆节能科技有限公司 具有薄膜的铜冷却扁管
KR20140003591A (ko) * 2011-06-30 2014-01-09 아사히 가세이 이-매터리얼즈 가부시키가이샤 에칭액 및 그것을 이용한 에칭 방법
US8778212B2 (en) * 2012-05-22 2014-07-15 Cabot Microelectronics Corporation CMP composition containing zirconia particles and method of use
CN104371551B (zh) * 2013-08-14 2018-01-12 安集微电子（上海）有限公司 一种碱性阻挡层化学机械抛光液
CN104745087B (zh) * 2013-12-25 2018-07-24 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
CN104745083B (zh) * 2013-12-25 2018-09-14 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
CN104263248B (zh) * 2014-09-26 2016-06-29 深圳市力合材料有限公司 一种适用于低下压力的弱酸性铜抛光液

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Also Published As

Publication number Publication date
EP1356502A1 (en) 2003-10-29
US20020125461A1 (en) 2002-09-12
JP2004526308A (ja) 2004-08-26
CN1486505A (zh) 2004-03-31
CN1255854C (zh) 2006-05-10
WO2002061810A1 (en) 2002-08-08

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