JP2004510888A5 - - Google Patents

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Publication number
JP2004510888A5
JP2004510888A5 JP2002533357A JP2002533357A JP2004510888A5 JP 2004510888 A5 JP2004510888 A5 JP 2004510888A5 JP 2002533357 A JP2002533357 A JP 2002533357A JP 2002533357 A JP2002533357 A JP 2002533357A JP 2004510888 A5 JP2004510888 A5 JP 2004510888A5
Authority
JP
Japan
Prior art keywords
plating
copper
place
equipment
room
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002533357A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004510888A (ja
Filing date
Publication date
Priority claimed from US09/678,503 external-priority patent/US6413390B1/en
Application filed filed Critical
Publication of JP2004510888A publication Critical patent/JP2004510888A/ja
Publication of JP2004510888A5 publication Critical patent/JP2004510888A5/ja
Pending legal-status Critical Current

Links

JP2002533357A 2000-10-02 2001-06-04 半導体製造のための遠隔第２アノードを備えるめっき装置 Pending JP2004510888A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/678,503 US6413390B1 (en) 2000-10-02 2000-10-02 Plating system with remote secondary anode for semiconductor manufacturing
PCT/US2001/018229 WO2002029875A2 (en) 2000-10-02 2001-06-04 Plating system with remote secondary anode for semiconductor manufacturing

Publications (2)

Publication Number Publication Date
JP2004510888A JP2004510888A (ja) 2004-04-08
JP2004510888A5 true JP2004510888A5 (cg-RX-API-DMAC10.html) 2008-06-26

Family

ID=24723054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002533357A Pending JP2004510888A (ja) 2000-10-02 2001-06-04 半導体製造のための遠隔第２アノードを備えるめっき装置

Country Status (9)

Country Link
US (1) US6413390B1 (cg-RX-API-DMAC10.html)
EP (1) EP1323186B1 (cg-RX-API-DMAC10.html)
JP (1) JP2004510888A (cg-RX-API-DMAC10.html)
KR (1) KR100747132B1 (cg-RX-API-DMAC10.html)
CN (1) CN1333442C (cg-RX-API-DMAC10.html)
AU (1) AU2001275274A1 (cg-RX-API-DMAC10.html)
DE (1) DE60140305D1 (cg-RX-API-DMAC10.html)
TW (1) TW525245B (cg-RX-API-DMAC10.html)
WO (1) WO2002029875A2 (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649034B1 (en) * 2001-06-27 2003-11-18 Advanced Micro Devices, Inc. Electro-chemical metal alloying for semiconductor manufacturing
JP4014827B2 (ja) * 2001-07-25 2007-11-28 シャープ株式会社 メッキ処理装置
WO2003018874A2 (en) * 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
JP2005163080A (ja) * 2003-12-01 2005-06-23 Toshiba Corp めっき装置及びめっき方法
DE102005014748B4 (de) 2005-03-31 2007-02-08 Advanced Micro Devices, Inc., Sunnyvale Technik zum elektrochemischen Abscheiden einer Legierung mit chemischer Ordnung
CN102492971B (zh) * 2011-12-28 2014-09-17 无锡科硅电子技术有限公司 用于半导体基片表面进行电镀的装置
CN102560587B (zh) * 2012-02-08 2015-03-18 南通富士通微电子股份有限公司 电镀装置
CN103422150A (zh) * 2012-05-22 2013-12-04 泰州宏瑞新材料有限责任公司 用于电镀的重金属离子浓度调节槽及电镀装置
JP5692268B2 (ja) * 2013-03-25 2015-04-01 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
CN114929943A (zh) * 2020-01-09 2022-08-19 朗姆研究公司 半导体金属互连件的高速3d金属打印

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3144128C1 (de) * 1981-11-06 1983-06-09 Bayerische Motoren Werke AG, 8000 München Vorrichtung zum galvanischen Abscheiden eines Metalls auf einem metallischen Werkstueck
GB8911566D0 (en) * 1989-05-19 1989-07-05 Sun Ind Coatings Plating system
US5368711A (en) * 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
JPH04284691A (ja) * 1991-03-13 1992-10-09 Arumetsukusu:Kk プリント配線板の電気めっき方法
JPH04362199A (ja) * 1991-06-06 1992-12-15 Nec Corp 電気めっき装置
JPH05339800A (ja) * 1992-06-09 1993-12-21 Nec Corp 可溶性アノードと不溶性アノードを持つ噴流めっき装置
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
EP1027481A1 (en) * 1997-09-30 2000-08-16 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
JP3187011B2 (ja) * 1998-08-31 2001-07-11 日本電気株式会社 半導体装置の製造方法
US6197182B1 (en) * 1999-07-07 2001-03-06 Technic Inc. Apparatus and method for plating wafers, substrates and other articles

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