JP2004509432A - グロー放電プラズマ処理装置及びグロー放電プラズマ処理方法 - Google Patents
グロー放電プラズマ処理装置及びグロー放電プラズマ処理方法 Download PDFInfo
- Publication number
- JP2004509432A JP2004509432A JP2002526807A JP2002526807A JP2004509432A JP 2004509432 A JP2004509432 A JP 2004509432A JP 2002526807 A JP2002526807 A JP 2002526807A JP 2002526807 A JP2002526807 A JP 2002526807A JP 2004509432 A JP2004509432 A JP 2004509432A
- Authority
- JP
- Japan
- Prior art keywords
- glow discharge
- discharge plasma
- electrode
- processing apparatus
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 129
- 238000003672 processing method Methods 0.000 title claims 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000000126 substance Substances 0.000 claims abstract description 19
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 230000008016 vaporization Effects 0.000 claims abstract description 6
- 239000007789 gas Substances 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 19
- 239000011148 porous material Substances 0.000 claims description 17
- 239000001307 helium Substances 0.000 claims description 16
- 229910052734 helium Inorganic materials 0.000 claims description 16
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 16
- 239000003989 dielectric material Substances 0.000 claims description 11
- 238000009834 vaporization Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000000463 material Substances 0.000 abstract description 29
- 239000000203 mixture Substances 0.000 abstract description 20
- 238000009832 plasma treatment Methods 0.000 abstract description 14
- 230000008021 deposition Effects 0.000 abstract description 7
- 210000002381 plasma Anatomy 0.000 description 150
- 230000005684 electric field Effects 0.000 description 15
- 238000002474 experimental method Methods 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- 238000004381 surface treatment Methods 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000010412 perfusion Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920005597 polymer membrane Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- 239000011364 vaporized material Substances 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241000951498 Brachypteraciidae Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010891 toxic waste Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2425—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being flush with the dielectric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/660,003 US6441553B1 (en) | 1999-02-01 | 2000-09-12 | Electrode for glow-discharge atmospheric-pressure plasma treatment |
| PCT/US2001/042079 WO2002023960A1 (en) | 2000-09-12 | 2001-09-06 | Electrode for glow-discharge atmospheric plasma treatment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004509432A true JP2004509432A (ja) | 2004-03-25 |
| JP2004509432A5 JP2004509432A5 (https=) | 2005-04-21 |
Family
ID=24647726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002526807A Pending JP2004509432A (ja) | 2000-09-12 | 2001-09-06 | グロー放電プラズマ処理装置及びグロー放電プラズマ処理方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6441553B1 (https=) |
| EP (1) | EP1323338A4 (https=) |
| JP (1) | JP2004509432A (https=) |
| AU (1) | AU2001293260A1 (https=) |
| WO (1) | WO2002023960A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240381517A1 (en) * | 2021-09-10 | 2024-11-14 | Ushio Denki Kabushiki Kaisha | Dielectric barrier discharge plasma generator |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7067405B2 (en) * | 1999-02-01 | 2006-06-27 | Sigma Laboratories Of Arizona, Inc. | Atmospheric glow discharge with concurrent coating deposition |
| US6774018B2 (en) * | 1999-02-01 | 2004-08-10 | Sigma Laboratories Of Arizona, Inc. | Barrier coatings produced by atmospheric glow discharge |
| JP2001288572A (ja) * | 2000-01-31 | 2001-10-19 | Canon Inc | 堆積膜形成装置および堆積膜形成方法 |
| KR100421480B1 (ko) * | 2001-06-01 | 2004-03-12 | 엘지.필립스 엘시디 주식회사 | 유기절연막의 표면처리 방법 및 그를 이용한박막트랜지스터 기판 제조방법 |
| EP1441576B1 (en) * | 2001-10-22 | 2011-12-21 | Shibaura Mechatronics Corporation | Method for detecting an arc in a glow discharg apparatus and high-frequency arc discharge suppressor |
| US7887889B2 (en) * | 2001-12-14 | 2011-02-15 | 3M Innovative Properties Company | Plasma fluorination treatment of porous materials |
| DE10211976A1 (de) * | 2002-03-19 | 2003-10-02 | Bosch Gmbh Robert | Verfahren und Vorrichtung zumindest zur Sterilisation von Behältnissen und/oder deren Verschließelementen |
| WO2003093526A2 (de) * | 2002-04-29 | 2003-11-13 | Fachhochschule Hildesheim/Holzmin Den/Göttingen | Verfahren und vorrichtung zur behandlung der äusseren oberfläche eines metalldrahts, insbesondere als beschichtungsvorbehandlung . |
| US7288204B2 (en) | 2002-07-19 | 2007-10-30 | Fuji Photo Film B.V. | Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG) |
| US6909237B1 (en) * | 2002-07-25 | 2005-06-21 | The Regents Of The University Of California | Production of stable, non-thermal atmospheric pressure rf capacitive plasmas using gases other than helium or neon |
| WO2004021748A1 (ja) * | 2002-08-30 | 2004-03-11 | Sekisui Chemical Co., Ltd. | プラズマ処理装置 |
| EP1403902A1 (en) * | 2002-09-30 | 2004-03-31 | Fuji Photo Film B.V. | Method and arrangement for generating an atmospheric pressure glow discharge plasma (APG) |
| JP4233348B2 (ja) * | 2003-02-24 | 2009-03-04 | シャープ株式会社 | プラズマプロセス装置 |
| US20040258547A1 (en) * | 2003-04-02 | 2004-12-23 | Kurt Burger | Pump piston and/or elements sealing the pump piston, in particular a sealing ring of elastomeric material, and a device and method for coating an object of elastomeric material |
| WO2004090931A2 (en) * | 2003-04-10 | 2004-10-21 | Bae Systems Plc | Method and apparatus for treating a surface using a plasma discharge |
| KR101002335B1 (ko) | 2003-10-08 | 2010-12-17 | 엘지디스플레이 주식회사 | 상압 플라즈마 처리 장치 |
| JP2007512436A (ja) * | 2003-11-20 | 2007-05-17 | アピト コープ.エス.アー. | プラズマ薄膜堆積方法 |
| US20060054279A1 (en) * | 2004-09-10 | 2006-03-16 | Yunsang Kim | Apparatus for the optimization of atmospheric plasma in a processing system |
| DE102004043967B4 (de) * | 2004-09-11 | 2010-01-07 | Roth & Rau Ag | Anordnung und Verfahren zur Plasmabehandlung eines Substrates |
| US7855513B2 (en) * | 2004-09-28 | 2010-12-21 | Old Dominion University Research Foundation | Device and method for gas treatment using pulsed corona discharges |
| DE102004049783B4 (de) * | 2004-10-12 | 2009-03-19 | Je Plasmaconsult Gmbh | Vorrichtung zur Bearbeitung von Gütern unter Zuhilfenahme einer elektrischen Entladung |
| SK287455B6 (sk) | 2006-06-08 | 2010-10-07 | Fakulta Matematiky, Fyziky A Informatiky Univerzity Komensk�Ho | Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 |
| US20100009098A1 (en) * | 2006-10-03 | 2010-01-14 | Hua Bai | Atmospheric pressure plasma electrode |
| WO2008042128A1 (en) * | 2006-10-03 | 2008-04-10 | Dow Global Technologies, Inc. | Improved plasma electrode |
| SK51082006A3 (sk) * | 2006-12-05 | 2008-07-07 | Fakulta Matematiky, Fyziky A Informatiky Univerzitfakulta Matematiky, Fyziky A Informatiky Univerzity Komensk�Hoy Komensk�Ho | Zariadenie a spôsob úpravy povrchov kovov a metaloZariadenie a spôsob úpravy povrchov kovov a metaloidov, oxidov kovov a oxidov metaloidov a nitridovidov, oxidov kovov a oxidov metaloidov a nitridovkovov a nitridov metaloidovkovov a nitridov metaloidov |
| EP1944406A1 (en) | 2007-01-10 | 2008-07-16 | Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO | Method and apparatus for treating an elongated object with plasma |
| ITBO20070306A1 (it) | 2007-04-26 | 2008-10-27 | Tecnotessile Societa Naz Di Ricerca ... | Elettrodo e relativo apparato per la generazione di plasma a pressione atmosferica. |
| CN101679655A (zh) * | 2007-05-21 | 2010-03-24 | 陶氏环球技术公司 | 涂布物体 |
| WO2008147184A2 (en) * | 2007-05-25 | 2008-12-04 | Fujifilm Manufacturing Europe B.V. | Atmospheric pressure glow discharge plasma method and system using heated substrate |
| US20100255216A1 (en) * | 2007-11-29 | 2010-10-07 | Haley Jr Robert P | Process and apparatus for atmospheric pressure plasma enhanced chemical vapor deposition coating of a substrate |
| US20090142511A1 (en) * | 2007-11-29 | 2009-06-04 | Haley Jr Robert P | Process and apparatus for atmospheric pressure plasma enhanced chemical vapor deposition coating of a substrate |
| KR100974566B1 (ko) * | 2008-08-08 | 2010-08-06 | 한국생산기술연구원 | 상압 플라즈마 장치 |
| EP2180768A1 (en) * | 2008-10-23 | 2010-04-28 | TNO Nederlandse Organisatie voor Toegepast Wetenschappelijk Onderzoek | Apparatus and method for treating an object |
| US9120073B2 (en) * | 2009-06-05 | 2015-09-01 | Eon Labs, Llc | Distributed dielectric barrier discharge reactor |
| MX2012007950A (es) * | 2010-01-06 | 2012-08-01 | Dow Global Technologies Llc | Dispositivos fotovoltaicos resistentes a la humedad con capa de proteccion elastomerica de polisiloxano. |
| DE102011000261A1 (de) * | 2011-01-21 | 2012-07-26 | Hochschule für angewandte Wissenschaft und Kunst Fachhochschule Hildesheim/Holzminden/Göttingen | Dielektrische Koplanarentladungsquelle für eine Oberflächenbehandlung unter Atmosphärendruck |
| KR102124042B1 (ko) * | 2013-02-18 | 2020-06-18 | 삼성디스플레이 주식회사 | 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법 |
| MY183557A (en) * | 2013-03-15 | 2021-02-26 | Toray Industries | Plasma cvd device and plasma cvd method |
| US9666415B2 (en) * | 2015-02-11 | 2017-05-30 | Ford Global Technologies, Llc | Heated air plasma treatment |
| DE102015108884A1 (de) | 2015-06-04 | 2016-12-08 | Hochschule für Angewandte Wissenschaft und Kunst - Hildesheim/Holzminden/Göttingen | Vorrichtung zur Plasmabehandlung von insbesondere bandförmigen Objekten |
| US10882021B2 (en) | 2015-10-01 | 2021-01-05 | Ion Inject Technology Llc | Plasma reactor for liquid and gas and method of use |
| EP4226999A3 (en) | 2015-10-01 | 2023-09-06 | Milton Roy, LLC | Plasma reactor for liquid and gas and related methods |
| US12296313B2 (en) | 2015-10-01 | 2025-05-13 | Milton Roy, Llc | System and method for formulating medical treatment effluents |
| US11452982B2 (en) | 2015-10-01 | 2022-09-27 | Milton Roy, Llc | Reactor for liquid and gas and method of use |
| US10187968B2 (en) | 2015-10-08 | 2019-01-22 | Ion Inject Technology Llc | Quasi-resonant plasma voltage generator |
| US10046300B2 (en) | 2015-12-09 | 2018-08-14 | Ion Inject Technology Llc | Membrane plasma reactor |
| CN109790313A (zh) | 2016-09-30 | 2019-05-21 | 简·探针公司 | 经等离子体处理的表面上的组合物 |
| US11239057B2 (en) * | 2017-07-28 | 2022-02-01 | Sumitomo Electric Industries, Ltd. | Showerhead and method for manufacturing the same |
| JP2021132148A (ja) * | 2020-02-20 | 2021-09-09 | 東京エレクトロン株式会社 | ステージ、プラズマ処理装置及びプラズマ処理方法 |
| EP4320654A4 (en) | 2021-04-09 | 2025-06-11 | Applied Materials, Inc. | PRETREATMENT AND POSTTREATMENT OF ELECTRODE SURFACES |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4626876A (en) * | 1984-01-25 | 1986-12-02 | Ricoh Company, Ltd. | Solid state corona discharger |
| US5414324A (en) | 1993-05-28 | 1995-05-09 | The University Of Tennessee Research Corporation | One atmosphere, uniform glow discharge plasma |
| US5387842A (en) * | 1993-05-28 | 1995-02-07 | The University Of Tennessee Research Corp. | Steady-state, glow discharge plasma |
| US5456972A (en) | 1993-05-28 | 1995-10-10 | The University Of Tennessee Research Corporation | Method and apparatus for glow discharge plasma treatment of polymer materials at atmospheric pressure |
| US5669583A (en) | 1994-06-06 | 1997-09-23 | University Of Tennessee Research Corporation | Method and apparatus for covering bodies with a uniform glow discharge plasma and applications thereof |
| US5403453A (en) | 1993-05-28 | 1995-04-04 | The University Of Tennessee Research Corporation | Method and apparatus for glow discharge plasma treatment of polymer materials at atmospheric pressure |
| US5558843A (en) | 1994-09-01 | 1996-09-24 | Eastman Kodak Company | Near atmospheric pressure treatment of polymers using helium discharges |
| JPH08279495A (ja) * | 1995-02-07 | 1996-10-22 | Seiko Epson Corp | プラズマ処理装置及びその方法 |
| US5714308A (en) | 1996-02-13 | 1998-02-03 | Eastman Kodak Company | Atmospheric pressure glow discharge treatment of polymeric supports to promote adhesion for photographic applications |
| CA2205817C (en) * | 1996-05-24 | 2004-04-06 | Sekisui Chemical Co., Ltd. | Treatment method in glow-discharge plasma and apparatus thereof |
| US6110540A (en) * | 1996-07-12 | 2000-08-29 | The Boc Group, Inc. | Plasma apparatus and method |
| US5789145A (en) | 1996-07-23 | 1998-08-04 | Eastman Kodak Company | Atmospheric pressure glow discharge treatment of base material for photographic applications |
| US6423924B1 (en) * | 1998-03-10 | 2002-07-23 | Tepla Ag | Method for treating the surface of a material or an object and implementing device |
| DE69929271T2 (de) * | 1998-10-26 | 2006-09-21 | Matsushita Electric Works, Ltd., Kadoma | Apparat und Verfahren zur Plasmabehandlung |
| US6118218A (en) * | 1999-02-01 | 2000-09-12 | Sigma Technologies International, Inc. | Steady-state glow-discharge plasma at atmospheric pressure |
-
2000
- 2000-09-12 US US09/660,003 patent/US6441553B1/en not_active Expired - Lifetime
-
2001
- 2001-09-06 EP EP01973707A patent/EP1323338A4/en not_active Withdrawn
- 2001-09-06 WO PCT/US2001/042079 patent/WO2002023960A1/en not_active Ceased
- 2001-09-06 AU AU2001293260A patent/AU2001293260A1/en not_active Abandoned
- 2001-09-06 JP JP2002526807A patent/JP2004509432A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240381517A1 (en) * | 2021-09-10 | 2024-11-14 | Ushio Denki Kabushiki Kaisha | Dielectric barrier discharge plasma generator |
| US12432841B2 (en) * | 2021-09-10 | 2025-09-30 | Ushio Denki Kabushiki Kaisha | Dielectric barrier discharge plasma generator |
Also Published As
| Publication number | Publication date |
|---|---|
| US6441553B1 (en) | 2002-08-27 |
| EP1323338A1 (en) | 2003-07-02 |
| EP1323338A4 (en) | 2008-08-20 |
| AU2001293260A1 (en) | 2002-03-26 |
| WO2002023960A1 (en) | 2002-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004509432A (ja) | グロー放電プラズマ処理装置及びグロー放電プラズマ処理方法 | |
| US6118218A (en) | Steady-state glow-discharge plasma at atmospheric pressure | |
| US6774018B2 (en) | Barrier coatings produced by atmospheric glow discharge | |
| CN101802244B (zh) | 大气压等离子体 | |
| JP3206095B2 (ja) | 表面処理方法及びその装置 | |
| TWI861060B (zh) | 基材處理和/或塗覆系統 | |
| EP2345312B1 (en) | Apparatus and method for treating an object by plasma | |
| JP2837993B2 (ja) | プラズマ処理方法およびその装置 | |
| De Geyter et al. | Penetration of a dielectric barrier discharge plasma into textile structures at medium pressure | |
| US20030129107A1 (en) | Plasma generator | |
| US5215636A (en) | Pulsed discharge surface treatment apparatus and process | |
| WO2004030019A1 (en) | Method and arrangement for generating an atmospheric pressure glow discharge plasma (apg) | |
| RU2402374C2 (ru) | Способ и устройство для плазменной обработки пористого тела | |
| WO2006100030A1 (en) | Method and system for plasma treatment under high pressure | |
| Fang et al. | Polyethylene terephthalate surface modification by filamentary and homogeneous dielectric barrier discharges in air | |
| US6232723B1 (en) | Direct current energy discharge system | |
| WO2002094455A1 (en) | Process for plasma treatment and apparatus | |
| JP5008622B2 (ja) | プラズマ発生電極及びプラズマ発生方法 | |
| JPS6090225A (ja) | 基体上に重合被膜を形成する方法と装置 | |
| JP2005536635A (ja) | 大気圧グロー放電により生成された遮断被膜 | |
| JP2009505342A (ja) | プラズマ発生装置及びプラズマ発生方法 | |
| Yamamoto et al. | Synthesis of ultrafine particles by surface discharge-induced plasma chemical process (SPCP) and its application | |
| JP3511439B2 (ja) | 非導電性多孔質体の表層部表面の処理方法 | |
| JP3592872B2 (ja) | 総表面の処理方法及び総表面の処理装置 | |
| US20100062176A1 (en) | Boundary layer disruptive preconditioning in atmospheric-plasma process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060912 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061107 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070410 |