JP2004356542A - Holder, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily treat an FPC while holding the FPC by an adhesiveness when mounting electronic components on the FPC. <P>SOLUTION: In a pallet for holding an FPC when mounting electronic components on the FPC, many cylindrical holding elements 122 formed out of an adhesive material are provided on the surface of the pallet. The end of each holding element 122 is brought into a flat holding surface 1221 for adhering it to the FPC, and the holding elements 122 are molded by pressing a metal mold against the adhesive material mounted on a base plate 11. Also, at need, the adhesive extent of the holding elements to the FPC is adjusted by adjusting the ratio of the areas of the holding surfaces 1221 to a unit area. Thereby, the FPC can be peeled off easily from the pallet, and the peeling of the FPC is prevented by the deformations of the holding elements 122, even though the FPC is so heated as to generate the difference of thermal expansions between the FPC and the pallet. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for holding an object by adhesion, and is applied to, for example, a technique for holding a circuit board when electronic components are mounted on the circuit board.
[0002]
[Prior art]
2. Description of the Related Art In recent years, small-sized electronic devices such as a mobile phone, a PDA (Personal Data Assistants), and a notebook computer use a sheet-shaped flexible printed circuit board (hereinafter, referred to as “FPC”). ing. The FPC is formed by forming various wiring patterns on a sheet-like resin, and various electronic components such as an IC, a capacitor, a resistor, a coil, and a connector are mounted on the wiring pattern. By using an FPC for an electronic device, a circuit board can be flexibly arranged in the electronic device, and the size of the electronic device can be reduced.
[0003]
By the way, since FPC has flexibility, it has a disadvantage that it is difficult to handle it alone. In particular, when various electronic components are mounted on the FPC, since various processes are performed on the surface of the FPC, it is indispensable to securely hold the FPC. Therefore, in order to handle the FPC in the same manner as a normal plate-like circuit board (for example, a circuit board formed of glass epoxy resin or the like), it is necessary to fix the FPC using a metal fitting on a highly rigid plate. Is performed.
[0004]
Further, Patent Literature 1 discloses a technique in which an adhesive layer is provided on a base plate (base plate), an FPC is adhered to the adhesive layer, and the FPC is handled together with the base plate in the same manner as a normal circuit board.
[0005]
[Patent Document 1]
JP-A-2002-232197
[0006]
[Problems to be solved by the invention]
When an electronic component is mounted on an FPC by sticking the FPC on a base plate, it is important to design the shape of the adhesive region between the FPC and the base plate and the adhesive strength. For example, when an electronic component is mounted on an FPC using a solder paste, screen printing of the solder paste on the FPC, mounting of the electronic component, and reflow (heating and cooling) are usually performed. If the adhesive material having a large adhesive force is present in a region other than the region holding the FPC, the screen mask will adhere to the adhesive material during screen printing. Further, when the adhesive strength is small, the FPC cannot be adhesively held by the wind pressure due to the circulation of hot air during reflow. Conversely, when the adhesive strength is large, particularly when the contact area between the adhesive material and the FPC is large, a large force is applied to the FPC at the time of peeling, and it becomes difficult to peel normally.
[0007]
The present invention has been made in view of the above problems, and has as its object to provide a technique for easily handling an object when holding the object such as a circuit board by adhesion.
[0008]
[Means for Solving the Problems]
The invention according to claim 1 is a holder for holding a flexible object, comprising: a main body having a base surface; and a plurality of holding elements protruding from the base surface. Each of the holding elements has at its tip a planar or concave holding surface for adhering the object.
[0009]
The invention according to claim 2 is a holder for holding an object which is a circuit board, comprising: a main body having a base surface; and a plurality of holding elements protruding from the base surface. Each of the elements has at its tip a planar or concave holding surface for adhering the object.
[0010]
The invention according to claim 3 is the holder according to claim 1 or 2, wherein the portion including the base surface of the main body and the plurality of holding elements are integrally formed of an adhesive material. Have been.
[0011]
The invention according to claim 4 is the holder according to claim 3, wherein the adhesive material is silicon rubber or polyurethane rubber.
[0012]
The invention according to claim 5 is the holder according to any one of claims 1 to 4, wherein the base surface is a flat surface, and a height of each of the plurality of holding elements from the base surface is higher. Identical.
[0013]
The invention according to claim 6 is the holder according to any one of claims 1 to 4, wherein the base surface is a flat surface, and a height of each of the plurality of holding elements from the base surface is higher. , From a plurality of heights.
[0014]
The invention according to claim 7 is the holder according to any one of claims 1 to 6, wherein one of the plurality of holding elements has a shape or a size of one of the other holding surfaces. Different from the holding surface of the holding element.
[0015]
The invention according to claim 8 is the holder according to any one of claims 1 to 6, wherein each of the plurality of holding elements is cylindrical.
[0016]
A ninth aspect of the present invention is the holder according to the eighth aspect, wherein a diameter of one of the plurality of holding elements is different from a diameter of any of the other holding elements.
[0017]
According to a tenth aspect of the present invention, in the holder according to any one of the first to ninth aspects, the ratio of the area of the holding surface per unit area in the first region on the base surface is equal to the base area. It is different from the ratio of the area of the holding surface per unit area in the second region on the surface.
[0018]
An eleventh aspect of the present invention is the holder according to the tenth aspect, wherein the first area includes the second area.
[0019]
The invention according to claim 12 is the holder according to claim 10, wherein the base surface has a plurality of combinations of the first region and the second region.
[0020]
The invention according to claim 13 is the holder according to any one of claims 1 to 12, wherein the main body has a plurality of through holes into which pins are inserted.
[0021]
The invention according to claim 14 is the holder according to claim 1 or 2, wherein the width of the object is 10 mm or more and 350 mm or less, and the plurality of holding elements are formed of an adhesive material. The height of each of the plurality of holding elements is 0.1 mm or more and 5 mm or less.
[0022]
The invention according to claim 15 is the holder according to claim 1 or 2, wherein the width of the object is 10 mm or more and 350 mm or less, and the plurality of holding elements are formed of an adhesive material. Each of the plurality of holding elements has a columnar shape having a diameter of 1 mm or more and 30 mm or less.
[0023]
The invention according to claim 16 is the holder according to any one of claims 1 to 15, and is used as a pallet for transporting the object.
[0024]
The invention according to claim 17 is a method for manufacturing a holder for holding an object, wherein a) a step of mounting an adhesive material on a main body member, and b) a bottom surface of each of which is flat or convex. Pressing the mold with the plurality of holes formed therein to the adhesive material while heating, and guiding the adhesive material to the bottom surface; and c) attaching the mold to the adhesive after cooling the mold. Separating from the conductive material.
[0025]
The invention according to claim 18 is the method for manufacturing a holder according to claim 17, wherein the adhesive material is silicon rubber or polyurethane rubber.
[0026]
The invention according to claim 19 is the method for manufacturing a holder according to claim 18, wherein vulcanization is performed in the step b).
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a plan view showing a pallet 1 which is a holder for transporting an FPC according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the pallet 1 at reference numeral 10A in FIG. As shown in FIG. 2, the pallet 1 is a main body member formed of a metal such as aluminum or magnesium having high thermal conductivity (other materials having high rigidity may be used), or a resin such as glass epoxy resin. It has a structure in which an adhesive portion 12 formed of an adhesive material is adhered to a plate-shaped base plate 11 to be formed. As the adhesive material, silicon rubber is preferably used when heat resistance is required, and polyurethane rubber can be used when heat resistance is not required. Other sticky materials may be used if available.
[0028]
In FIG. 1, for convenience of illustration, the area of the adhesive portion 12 is hatched in parallel. FIG. 3 is an enlarged view showing a region indicated by reference numeral 10B in FIG. 1, and FIG. 4 is a cross-sectional view taken along reference numeral 10C in FIG. As shown in FIGS. 3 and 4, the adhesive portion 12 includes a base portion 121 adhered to the entire upper surface of the base plate 11 and a plurality of cylindrical holding elements 122 protruding from the base surface 1211 which is the upper surface of the base portion 121. And the base part 121 and the plurality of holding elements 122, which are parts including the base surface 1211, are integrally formed of an adhesive material. That is, the plurality of holding elements 122 are provided so as to protrude from the main body 110 formed by the base plate 11 and the base 121. Each holding element 122 has a flat holding surface 1221 for adhering an FPC, which is a flexible circuit board, at its tip.
[0029]
3 and 4, the holding element 122 has a diameter of 1.2 mm and a height of 1.5 mm, and the pitch of the holding element 122 is 2 mm with respect to the X direction in FIG. Is 2 mm in the Y direction between the centers of the arrays.
[0030]
As shown in FIG. 1, a through hole 30a for positioning is formed in the pallet 1, and a through hole 30b for positioning the FPC to be held is also formed. Further, as shown in FIGS. 1 and 2, a large number of through holes 31 into which protrusion pins for removing the held FPC are inserted are also formed.
[0031]
FIG. 5 is a plan view showing a state where the FPC 9 is held on the pallet 1. The back surface (the surface to be held) of the FPC 9 is flat, and the FPC 9 is securely held by the holding surfaces 1221 of the plurality of holding elements 122 having the same height from the base surface 1211 which is a flat surface. The FPC 9 is formed with a plurality of wirings of a plurality of FPC pieces 91 collectively, and each FPC piece 91 is mounted on an IC package (for mounting various ICs such as an IC bare chip, a capacitor, a resistor, a coil, and a connector). It may be a component, and is hereinafter referred to as an “electronic component”.) At four corners of the FPC 9, positioning holes 90 overlapping the FPC through holes 30 b shown in FIG. 1 are formed, and the through holes 31 for the push-up pins are located between the FPC pieces 91.
[0032]
6 and 7 are front views showing the mounting system 5 for mounting electronic components on the mounting area 91a of the FPC piece 91 while the FPC 9 is held on the pallet 1. FIG. The mounting system 5 includes, from the upstream, a loader 51 that places the FPC 9 on the pallet 1, a printing device 52 that prints solder paste on the FPC 9, a mounting device 53 that mounts electronic components on the FPC 9, and melts and solidifies the solder paste. A reflow device 54 for fixing electronic components to the FPC 9, an unloader 55 for separating the FPC 9 from the pallet 1, and a cleaning device 56 for cleaning the pallet 1 are provided. An outgoing conveyor 61 for the pallet 1 is arranged approximately at the center of each device, and a returning conveyor 62 is arranged below each device.
[0033]
In the loader 51, a plurality of trays 951 are stored in the storage device 95 in a state of being vertically stacked, and the FPC 9 is placed on each tray 951. The loader 51 includes an elevating mechanism 511 that moves the container 95 up and down, a protruding mechanism 512 that moves one tray 951 in and out of the container 95, a transfer mechanism 513 that extracts the FPC 9 from the protruded tray 951 by suction and suction, and a pallet. 1 is provided with a pallet moving mechanism 514 for moving 1 from the end point of the backward conveyor 62 to the start point of the forward conveyor 61.
[0034]
The holding surface 5131 of the transfer mechanism 513 that holds the FPC 9 is a flat surface having a large number of suction ports. After the transfer mechanism 513 takes out the FPC 9 from the tray 951 by suction and suction, the transfer mechanism 513 transfers the FPC 9 to the pallet 1 on the conveyor 61. The FPC 9 is placed. At this time, while positioning is performed with reference to the through hole 30b of the pallet 1 and the hole 90 of the FPC 9, the holding surface 5131 descends and presses the entire FPC 9 toward the pallet 1 with a predetermined pressure. As a result, the entire FPC 9 is held by the adhesive portion 12 of the pallet 1 (accurately, the holding surface 1221 of the holding element 122) by the adhesive. The pallet 1 holding the FPC 9 is transported by the conveyor 61 to the printing device 52.
[0035]
The printing device 52 positions and holds the pallet 1 with reference to the positioning through hole 30a (see FIG. 1) (that is, by inserting a pin), and pushes up and down the pallet 1 toward the upper screen mask 522. In addition, a printing mechanism 523 that reciprocates the solder paste on the screen mask 522 with a squeegee 5231 is provided. When the printing mechanism 523 reciprocates the squeegee 5231 while the FPC 9 on the pallet 1 is in contact with the screen mask 522, the solder paste adheres to the FPC 9 from the holes formed in the screen mask 522. The FPC 9 on which the solder paste is printed descends together with the pallet 1 and is conveyed to the mounting device 53 by the conveyor 61.
[0036]
The mounting device 53 includes a holding mechanism 531 that holds the pallet 1 based on the through hole 30a, and a mounting mechanism 532 that mounts electronic components on the FPC 9 on the pallet 1. The mounting mechanism 532 has a plurality of nozzles 5321 for sucking and sucking electronic components, and a nozzle moving mechanism 5322 for moving the nozzle 5321 in a horizontal plane and moving up and down, and a supply mechanism (not shown on the tape or The electronic component is received from a mechanism for arranging and preparing the electronic component on the tray), and the electronic component is mounted on the solder paste on the FPC 9. The FPC 9 on which the electronic components are mounted is transported by the conveyor 61 together with the pallet 1 to the reflow device 54 shown in FIG.
[0037]
The reflow device 54 includes a heating unit 541 for preheating and main heating the FPC 9 transported by the conveyor 61 while being held on the pallet 1, and a cooling unit 542 for cooling the FPC 9 by air. The FPC 9 is heated and cooled while being conveyed, and the solder paste is melted and solidified to fix the electronic component on the FPC 9. As shown in FIG. 5, since the entire FPC 9 is adhered to the adhesive portion 12 of the pallet 1, even when heating by hot air or cooling by cold air is performed, a part of the FPC 9 is removed from the adhesive portion 12. Peeling is prevented. After the reflow, the FPC 9 is transported to the unloader 55 together with the pallet 1.
[0038]
The unloader 55 includes a holding mechanism 551 for holding the pallet 1, a transfer mechanism 552 for receiving the FPC 9 from the pallet 1, an elevating mechanism 553 for raising and lowering a storage 96 for storing the FPC 9, and a protruding mechanism for inserting and removing a tray from the storage 96. (Not shown). A plurality of trays are vertically stacked in the container 96, and a projecting mechanism projects the tray, a transfer mechanism 552 receives the FPC 9 from the pallet 1 and places the FPC 9 on the tray, and then the projecting mechanism stores the tray. Pull into the container 96.
[0039]
FIG. 8 and FIG. 9 are diagrams for explaining the manner in which the transfer mechanism 552 receives the FPC 9 from the pallet 1. A push-up pin 641 for peeling off the FPC 9 is arranged inside the holding mechanism 551, and the push-up pin 641 is pushed up from the holding surface 5511 by raising the shaft 642. The pallet 1 is held in the holding mechanism 551 with reference to the positioning through-hole 30a (see FIG. 1) as a reference, and the push-up pin 641 and the through-hole 31 coincide (see FIGS. 1 and 2).
[0040]
A concave portion 651 for avoiding the electronic component 92 mounted on the FPC 9 is formed in the holding surface 5521 (lower surface) on the transfer mechanism 552 side, and a suction port for sucking and sucking the FPC 9 is formed in the holding surface 5521. 652 are formed, and a suction channel 653 is formed inside.
[0041]
When the transfer mechanism 552 receives the FPC 9, first, as shown in FIG. 8, the holding surface 5521 of the transfer mechanism 552 descends and contacts the FPC 9, and suction starts from the suction port 652 on the transfer mechanism 552 side. Is done. Next, the shaft 642 of the holding mechanism 551 rises, and the push-up pin 641 pushes up the FPC 9. At this time, the holding surface 5521 of the transfer mechanism 552 rises as shown in FIG. 9 in synchronization with the movement of the push-up pin 641, and the FPC 9 is completely peeled off from the adhesive portion 12 of the pallet 1 so that the transfer mechanism 552 It is attracted to the holding surface 5521.
[0042]
The pallet 1 from which the FPC 9 has been peeled off is conveyed to the cleaning device 56 by the conveyor 61 as shown in FIG. The cleaning device 56 includes a cleaning mechanism 561 that cleans the pallet 1 and a pallet moving mechanism 562 that moves from the end point of the forward conveyor 61 to the start point of the return conveyor 62. The cleaning mechanism 561 draws out the cloth from the cross roll 5611 that winds the cloth to which the cleaning liquid is applied, makes the cloth abut on the adhesive portion 12 of the pallet 1 with the roller 5612, and then winds the cloth around the shaft 5613. to recover. Thereby, dust adhering to the adhesive portion 12 is removed. The cleaned pallet 1 moves down to the conveyor 62 by the pallet moving mechanism 562, is conveyed from the cleaning device 56 to the loader 51, and moves to the conveyor 61 by the pallet moving mechanism 514 of the loader 51.
[0043]
As described above, since the pallet 1 holds substantially the entire FPC 9 by adhesion, it is possible to prevent the FPC 9 from peeling off the pallet 1 when mounting electronic components.
[0044]
Conversely, as shown in FIGS. 3 and 4, in the pallet 1, since a large number of holding elements 122 are arranged on the main body 110 with a gap provided therebetween, peeling can be easily performed. Although the exact principle of easy separation is not always clear, when the FPC 9 is separated from the pallet 1, the boundary of the separation is finely cut, and the separation from one holding surface 1221 takes a short time. (That is, the peeling is performed intermittently), the force acting on the boundary of the peeling of the lower surface of the FPC 9 is geometrically and temporally dispersed, and a large force temporarily concentrates on the FPC 9. It is considered that this is because that is suppressed.
[0045]
In addition, since the holding surface 1221 of each holding element 122 is circular, peeling can be easily started from a local portion on the holding surface 1221 regardless of the direction in which the peeling of the FPC 9 proceeds. . Thus, it can be said that the FPC 9 is easily peeled even when attention is paid to the individual holding surfaces 1221.
[0046]
Further, since the plurality of holding elements 122 projecting from the main body 110 have elasticity, as shown in FIG. Is also realized by the deformation of. As a result, the FPC 9 can be securely held by the pallet 1 during reflow. In particular, in recent years, large FPCs including a large number of FPC pieces are often handled, and the difference in thermal expansion between the FPC and the pallet when a process involving heating such as reflow is performed is large. It is important to prevent the FPC from peeling off due to deformation.
[0047]
The shape and arrangement of the holding elements 122 are appropriately changed according to the size of the held FPC and the type of processing performed on the FPC, but the width (specifically, When the vertical and horizontal widths of the circuit board are 10 mm or more and 350 mm or less, the diameter of the holding element 122 is preferably 1 mm or more and 30 mm or less, and the height is 0.1 mm or more and 5 mm or less. Is preferred. Further, when heating is performed as in a process such as reflow (particularly, when the width of the circuit board is 100 mm or more and 350 mm or less), the influence of the difference in thermal expansion between the FPC and the pallet 1 is absorbed. Therefore, it is preferable that the diameter of the holding element 122 is 1 mm or more and 3 mm or less, and the height is 0.5 mm or more and 5 mm or less. The above conditions are suitable for a rubber having an Hs hardness of 20 or more and 50 or less, and it is most preferable that the Hs hardness itself of the rubber is about 30.
[0048]
Next, a method for manufacturing the pallet 1 will be described. FIG. 11 is a view showing a flow of a manufacturing process of the pallet 1, and FIGS. 12 to 15 are views showing a state in which the pallet 1 is manufactured.
[0049]
First, as shown in FIG. 12, a mold 71 for forming the holding element 122 is prepared and attached to the press device 72. The press device 72 is provided with a heater 73, and the die 71 is heated by the heater 73 in advance (step S11).
[0050]
When the preparation of the press device 72 is completed, a release agent is applied to the mold 71 (step S12), and a primer (adhesive) is applied on the base plate 11 to place the adhesive material 12a (for example, a rubber sheet). (A liquid adhesive material may be applied). (Step S13). Note that a release agent may be applied to the adhesive material 12a after step S13.
[0051]
FIG. 13 is an enlarged sectional view showing the lower surface 71a of the mold 71 and the adhesive material 12a adjacent to the lower surface 71a. A large number of cylindrical holes 701 for forming the plurality of holding elements 122 are formed on the lower surface 71a of the mold 71, and the bottom surface 702 of each hole 701 is flat.
[0052]
Next, as shown in FIG. 14, the adhesive material 12 a is heated and pressed by the mold 71 at a predetermined temperature and force for a fixed time to form a shape corresponding to the concave / convex pattern on the lower surface 71 a of the mold 71. The surface of the adhesive material 12a is deformed (Step S14). FIG. 15 is an enlarged sectional view showing the lower portion of the mold 71 and the adhesive material 12a after being pressed. As shown in FIG. 15, the adhesive material 12 a becomes a fluid by heat, and is sufficiently guided to the bottom surface 702 while pushing out the air in each hole 701 of the mold 71. Sulfur and other additives are previously mixed in the rubber sheet as the adhesive material 12a, and vulcanization (called primary vulcanization) of the adhesive material 12a is simultaneously performed by heating at the time of pressing.
[0053]
Thereafter, when the mold 71 is cooled while the state shown in FIG. 15 is performed and the adhesive material 12a is hardened (when the adhesive material 12a returns to the elastic body), the mold 71 rises and the mold 71 is separated from the adhesive material 12a. (Step S15), a large number of cylindrical holding elements 122 shown in FIG. 4 are obtained. Since the bottom surface 702 of the hole 701 is a flat surface, the front end surface of each holding element 122 is a flat surface that accurately adheres to the FPC 9. Further, various through holes of the pallet 1 are formed as necessary.
[0054]
As described above, the large number of holding elements 122 of the pallet 1 can be easily formed in a short time only by pressing the heated mold 71 against the adhesive material 12a. Note that a mechanism for forming various through holes of the pallet 1 simultaneously with the formation of the adhesive portion 12 may be incorporated in the mold 71.
[0055]
When the cylindrical holding element 122 is formed, the shape of the hole 701 (side surface) is cylindrical, so that the hole 701 is easily and efficiently formed by using an end mill when manufacturing the mold 71. can do. Thereby, reduction of the manufacturing cost of the mold 71 is realized. Another example of a hole that can be easily formed by a tool is a hole having four rounded corners when viewed from the opening side.
[0056]
FIG. 16 is a plan view showing another example of the pallet 1. The pallet 1 differs from the one shown in FIG. 1 in the size and arrangement of the holding elements in the first holding area 21 at the peripheral edge of the adhesive section 12 and in the second holding area 22 at the center. Other configurations are the same as those of the pallet 1 of FIG. 1, and are denoted by the same reference numerals as those of FIG. In FIG. 16, differences in the size and arrangement of the holding elements are indicated by different parallel oblique lines for convenience.
[0057]
In the first holding area 21, a plurality of holding elements 122 similar to those shown in FIG. 3 are formed. On the other hand, in the second holding region 22, the holding elements are arranged at a higher density. FIG. 17 is an enlarged view of a region indicated by reference numeral 10D in FIG. As shown in FIG. 17, cylindrical holding elements 122a having a large diameter and cylindrical holding elements 122b having a relatively small diameter are alternately arranged. The holding elements 122a have a diameter of 1.5 mm and are arranged at a pitch of 2 mm. The diameter of the holding elements 122b is 1 mm and each holding element 122b is arranged between four holding elements 122a. The height of the holding elements 122, 122a, and 122b from the base surface 1211 (see FIG. 4) is the same, so that the flat FPC 9 can be reliably held.
[0058]
By arranging the holding elements in the first holding area 21 and the second holding area 22 as described above, the holding elements 122 are arranged in the first holding area 21 so that the area of the holding surface, which is the tip surface of the holding element 122, is set. In the second holding region 22, the area of the holding surface of the holding elements 122a and 122b is 63.8% of the area of the area where the holding elements 122a and 122b are arranged. As a result, the degree of adhesion can be adjusted by the ratio of the area of the holding surface per unit area, and the degree of adhesion in the second holding region 22 becomes higher than the degree of adhesion in the first holding region 21. Note that the degree of adhesion is a value corresponding to a load required for peeling after adhering an object under predetermined conditions, and is a value indicating the degree of adhesion.
[0059]
In the second holding region 22, holding elements having different diameters can easily realize a higher ratio of the area of the holding surface than in the case where holding elements having the same diameter are arranged.
[0060]
FIG. 18 is a plan view showing a state in which the same FPC 9 as in FIG. 5 is held on the pallet 1 shown in FIG. 16, and the same reference numerals as in FIG. The periphery of the FPC 9 overlaps the first holding region 21, and the second holding region 22 overlaps the center of the FPC 9. Therefore, the only area where the FPC 9 is not held is the first holding area 21 having a low adhesiveness, and the screen mask 522 is weakly adhered to the first holding area 21 when printing the solder paste in the mounting system 5 shown in FIGS. 6 and 7. . As a result, the screen mask 522 can be easily moved toward and away from the pallet 1.
[0061]
On the other hand, the central portion of the FPC 9 is strongly held by the second holding region 22, and the FPC 9 is held by the first holding region 21 up to the peripheral portion, so that the FPC 9 is prevented from peeling off due to airflow during reflow. Further, since the FPC 9 is held by a large number of holding elements arranged with a gap, the peeling can be easily performed and the difference in the thermal expansion between the FPC 9 and the pallet 1 can be increased similarly to the case of the pallet 1 in FIG. Absorbing the effects is realized.
[0062]
The method of manufacturing the pallet 1 shown in FIG. 16 is similar to that of the pallet 1 shown in FIG. 1 except that the holes of the mold are changed in accordance with the holding elements of the first holding area 21 and the second holding area 22. Same as in the case.
[0063]
FIG. 19 is a plan view showing still another example of the pallet 1. The pallet 1 holds a plurality of FPC pieces individually. The pallet 1 includes a first holding area 21 having a low adhesiveness, on which the holding elements 122 shown in FIG. 3 are formed, and holding elements 122a and 122b shown in FIG. It has a plurality of combinations of the second holding regions 22 that are formed and have relatively high adhesiveness. In FIG. 19, the surface of the base plate 11 is exposed in a region not provided with parallel oblique lines, and the adhesive portion is formed only in the first holding region 21 and the second holding region 22 provided with parallel oblique lines. Further, a plurality of through holes 31 into which the push-up pins are inserted are formed in the first holding region 21.
[0064]
FIG. 20 is a plan view showing the appearance of the FPC pieces 91 held on the pallet 1. FIG. The FPC piece 91 has a shape in which the lead portion 912 protrudes from the mounting portion 911. The mounting portion 911 includes a mounting region 91b in which an IC package is mounted and a mounting region 91c in which resistors, capacitors, and the like are mounted. Is set.
[0065]
FIG. 21 is a plan view showing a state in which a plurality of FPC pieces 91 are adhesively held on the pallet 1. As shown in FIG. 21, the mounting portion 911 of the FPC piece 91 is held in a region where the two second holding regions 22 are included in the first holding region 21, and the tip of the lead portion 912 has a small second holding region 22. Is held.
[0066]
The manner in which electronic components are mounted on the FPC pieces 91 using the pallet 1 shown in FIG. 19 is the same as the case of the pallet 1 shown in FIG. 1 except that a plurality of FPC pieces 91 are held on the pallet 1. The same is true. By using the pallet 1, almost the entire FPC piece 91 is held by adhesion, and it is possible to prevent the FPC piece 91 from peeling off the pallet 1 when mounting electronic components. In particular, since the lead portion 912 is held in the second holding region 22 having a high adhesiveness, peeling of the FPC piece 91 from the lead portion 912 is prevented. In addition, since most of the region where the FPC pieces 91 are not held do not have adhesiveness, screen printing can be easily performed.
[0067]
By the way, in the pallet 1 shown in FIG. 19, a through hole 31 for a push-up pin is provided in the first holding area 21. Thereby, when peeling the FPC piece 91 from the pallet 1, an excessive force acts on the FPC piece 91 by mechanically peeling the FPC piece 91 from the first holding area 21 having a low adhesiveness using the push-up pin. Peeling can be performed smoothly without the need. As a result, easy peeling of the FPC pieces 91 is realized while the second holding area 22 has an adhesiveness for securely holding the FPC pieces 91.
[0068]
Also, by holding the FPC 9 by a large number of holding elements arranged with a gap, the peeling can be easily performed and the difference in the thermal expansion between the FPC 9 and the pallet 1 can be increased, as in the case of the pallet 1 in FIG. Absorbing the effects is realized. Further, the mounting portion 911 of the FPC piece 91 is held in the first holding region 21 and the second holding region 22 existing in one region of the adhesive material, and the second holding region 22 is in the first holding region 21. Since it is included, the FPC piece 91 can be smoothly peeled off from the peripheral portion (the same applies to the pallet 1 in FIG. 16).
[0069]
The method of manufacturing the pallet 1 shown in FIG. 19 is the same as that of the pallet 1 shown in FIGS. 1 and 16 except that the adhesive portion is provided on a part of the surface of the base plate 11.
[0070]
FIG. 22 is a longitudinal sectional view showing a part of still another example of the pallet 1, and FIG. 23 is an enlarged view of the pallet 1 shown in FIG. The pallet 1 shown in FIG. 22 has a base plate 11 and an adhesive portion 12 similarly to the pallet 1 shown in FIG. 1, but has a columnar holding element 122c having a different height from a flat base surface 1211 as shown in FIG. , 122d project. That is, a step is substantially provided in the adhesive portion 12. In addition, as shown in FIG. 22, a through hole 31 into which a protrusion pin 641 for separation is inserted is formed as appropriate through the base plate 11 and the adhesive portion 12.
[0071]
The FPC 9 held by the pallet 1 has a reinforcing member 93 bonded to the back surface (the surface facing the pallet 1) opposite to the surface on which the electronic components 92 are mounted, as shown in FIG. And a flexible circuit board. As shown in FIG. 23, the thickness of the reinforcing member 93 is equal to the height difference between the holding element 122c and the holding element 122d, and the FPC 9 is held on the pallet 1 without being affected by the reinforcing member 93. In addition, the pallet 1 holds almost the entirety of the FPC 9 with adhesive, thereby preventing the FPC 9 from peeling off the pallet 1 when mounting electronic components.
[0072]
Also in the case of the pallet 1 shown in FIG. 22, by holding the FPC 9 with a large number of holding elements arranged with a gap, the peeling can be easily performed and the pallet 1 shown in FIG. Absorption of the effect of the difference in thermal expansion with the pallet 1 is realized.
[0073]
Note that the area ratio of the holding element 122c that adheres to the FPC 9 main body may be different from the area ratio of the holding element 122d that adheres the reinforcing member 93. For example, when it is necessary to completely prevent the FPC 9 from being peeled off during mounting, an area with a high step corresponding to the peripheral portion of the FPC 9 (that is, an area where the holding element 122c is provided) has a relatively high adhesiveness. Is done. Further, when the dent of the push-up pin 641 remains on the FPC 9 when the reinforcing member 93 is strongly adhered, the degree of adhesion is set to be low in an area with a low step (that is, an area where the holding element 122d is provided).
[0074]
Further, the height of the holding element from the base surface 1211 is not limited to two, and may be three or more. By setting the height of each holding element to be selected from a plurality of heights, accurate holding according to the shape of the circuit board is realized.
[0075]
The method of manufacturing the pallet 1 shown in FIG. 22 is the same as that of the pallet 1 shown in FIG. 1 except that holding elements having different heights are formed.
[0076]
FIG. 24 is a plan view showing a modification of the pallet 1 shown in FIG. In the pallet 1 shown in FIG. 24, the relationship between the first holding area 21 and the second holding area 22 is reversed as compared with the pallet 1 shown in FIG. And the first holding region 21 having a low adhesiveness. However, the portion of the second holding area 22 that protrudes from the FPC 9 is minimized so that the screen mask is not strongly adhered to the pallet 1 when printing the solder paste. In the pallet 1 shown in FIG. 24, the peripheral portion of the FPC 9 can be significantly prevented from peeling off from the adhesive portion 12 at the time of reflow, and the FPC 9 can be easily handled at the time of reflow. As described above, whether to increase or decrease the degree of adhesion of the holding region corresponding to the peripheral portion of the FPC 9 (more generally, how to provide a plurality of regions having different ratios of the area of the holding surface per unit area) Is appropriately determined according to the characteristics of the FPC 9 and the type of processing.
[0077]
FIG. 25 is a plan view (corresponding to FIG. 3) showing another example of the holding element. The holding element 122e shown in FIG. 25 has a prismatic shape, and the holding surface 1221 has a rectangular shape that is long in the Y direction (vertical direction on the paper) of FIG. Accordingly, each holding element 122e has a characteristic that it is easily bent in the X direction (the left-right direction on the paper surface) and hardly bent in the Y direction. As a result, for example, when holding an FPC that easily expands in the X direction, the effect of the difference in thermal expansion between the pallet and the FPC can be easily absorbed by the holding element 122e.
[0078]
FIG. 26 is a sectional view showing still another example of the holding element, and also shows a cross section of a mold 71 for forming the holding element. In the holding element 122f shown in FIG. 26, the holding surface 1221 at the tip is slightly concave. Thus, when the FPC 9 is pressed by the holding element 122f, the holding surface 1221 adsorbs the FPC 9 by the same operation as the suction cup, and the FPC 9 is more strongly held. In order to form the holding element 122f, the bottom surface 702 of the hole 701 formed in the mold 71 has a convex shape.
[0079]
FIG. 27 is a longitudinal sectional view showing still another example of the holding element. The holding element 122g in FIG. 27 has a truncated cone shape. Thereby, the area of one holding surface 1221 can be reduced as compared with the case of the holding element 122 shown in FIG. 4, and the degree of adhesion can be reduced without making the holding element excessively thin. The shape of the holding element may be arbitrarily changed as long as it can be separated from the mold after molding. For example, a shape in which thin cylinders are stacked on a thick cylinder may be used.
[0080]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0081]
For example, the pallet 1 is suitable for holding a flexible circuit board such as a polyimide film or a very thin glass epoxy resin. However, even if the held circuit board is a plate-like circuit board having high rigidity to some extent. Good. The holding of the circuit board by adhesion is not only applied to the pallet 1 for transportation, but also can be used as a holder in various aspects of handling the circuit board. Of course, the above-described adhesive holding method can be used in fields other than the mounting of electronic components using a solder paste, an anisotropic conductive resin, or the like, for example, when holding a circuit board when processing the circuit board.
[0082]
In the pallet 1 in the above embodiment, an adhesive material is provided on the base plate 11, but it is also possible to manufacture a holder by processing an adhesive member. For example, a holding element may be provided by forming a large number of holes in the base plate 11 of the pallet 1 and inserting a columnar adhesive material into these holes. Further, a rubber sheet as an adhesive material may be attached to the base plate 11 and a plurality of intersecting grooves may be formed in the rubber sheet to form a plurality of holding elements.
[0083]
In the pallet 1 shown in FIG. 16 and FIG. 19, two areas of the degree of adhesion are provided by changing the ratio of the holding surface of the holding element per unit area, but three or more areas having different degrees of adhesion are provided. Good. In other words, by making the diameter of at least one cylindrical holding element different from the diameter of any of the other holding elements, adjustment of the degree of adhesion for each region is realized. In general, since the adjustment of the degree of adhesion is realized by adjusting the ratio of the area of the holding surface per unit area, the shape or size of the holding surface of at least one holding element is set to any other value. It can be said that adjustment of the degree of adhesion is realized by making the holding surface different from the holding surface of the holding element.
[0084]
Further, the held object may be other than the circuit board. In particular, when holding a sheet-shaped or thin-plate-shaped flexible object (may be only partially flexible), by applying the above-described technique of holding with a large number of holding elements, Easy handling of the object is realized.
[0085]
In the above embodiment, the holding element is formed by vertically pressing the mold 71 against the adhesive material 12a. However, as shown in FIG. 28, the mold 71 has a roller shape in which a number of holes 701 are formed. The holding element 122 may be continuously formed on the adhesive material 12a while rotating the mold 71 and the opposing roller 71b.
[0086]
【The invention's effect】
According to the first to sixteenth aspects of the present invention, the flexible object or the circuit board can be easily handled and held by the plurality of holding elements. In particular, when a process involving heating is performed on the object, the object can be reliably held.
[0087]
According to the seventeenth to nineteenth aspects, it is possible to easily manufacture a holder having a plurality of holding elements for holding an object by adhesion.
[Brief description of the drawings]
FIG. 1 is a plan view of a pallet.
FIG. 2 is a sectional view of a pallet.
FIG. 3 is an enlarged view of a part of a pallet.
FIG. 4 is a sectional view of a part of a pallet.
FIG. 5 is a plan view showing a state in which an FPC is held on a pallet.
FIG. 6 is a front view of the mounting system.
FIG. 7 is a front view of the mounting system.
FIG. 8 is a diagram for explaining how the transfer mechanism receives FPCs from a pallet.
FIG. 9 is a diagram for explaining how the transfer mechanism receives FPCs from a pallet.
FIG. 10 shows a deformation of the holding element.
FIG. 11 is a diagram showing a flow of a pallet manufacturing process.
FIG. 12 is a diagram showing a state in which a pallet is manufactured.
FIG. 13 is an enlarged view showing a mold and an adhesive material.
FIG. 14 is a view showing a state in which a pallet is manufactured.
FIG. 15 is an enlarged view showing a mold and an adhesive material.
FIG. 16 is a plan view of another pallet.
FIG. 17 is an enlarged view of a part of a pallet.
FIG. 18 is a plan view showing a state in which an FPC is held on a pallet.
FIG. 19 is a plan view of still another pallet.
FIG. 20 is a plan view of an FPC piece.
FIG. 21 is a plan view showing a state in which FPC pieces are held on a pallet.
FIG. 22 is a sectional view of still another pallet.
FIG. 23 is a sectional view of a part of a pallet;
FIG. 24 is a plan view showing a modification of the pallet.
FIG. 25 is a plan view of another holding element.
FIG. 26 is a sectional view of still another holding element and a mold.
FIG. 27 is a sectional view of still another holding element.
FIG. 28 is a diagram showing a state in which holding elements are continuously formed.
[Explanation of symbols]
1 pallet
9 FPC
12a Adhesive material
21 1st holding area
22 Second holding area
31 Through hole
71 Mold
110 body
121 Base
122, 122a-122g Holding element
701 hole
702 bottom
1211 Base surface
1221 Holding surface
S13 to S15 Step

Claims (19)

A holder for holding a flexible object,
A main body having a base surface;
A plurality of holding elements protruding from the base surface;
With
A holder, wherein each of the plurality of holding elements has a flat or concave holding surface for adhering an object at a tip thereof. A holder for holding an object which is a circuit board,
A main body having a base surface;
A plurality of holding elements protruding from the base surface;
With
A holder, wherein each of the plurality of holding elements has a flat or concave holding surface for adhering an object at a tip thereof. It is a holder of Claim 1 or 2, Comprising:
A holding tool, wherein a portion including the base surface of the main body and the plurality of holding elements are integrally formed of an adhesive material. It is a holder of Claim 3, Comprising:
The holding tool, wherein the adhesive material is silicon rubber or polyurethane rubber. The holder according to any one of claims 1 to 4, wherein
The holder according to claim 1, wherein the base surface is a flat surface, and the plurality of holding elements have the same height from the base surface. The holder according to any one of claims 1 to 4, wherein
The holder according to claim 1, wherein the base surface is a flat surface, and a height of each of the plurality of holding elements from the base surface is selected from a plurality of heights. The holder according to any one of claims 1 to 6, wherein
A holding tool, wherein a shape or a size of one holding surface of the plurality of holding elements is different from a holding surface of any of the other holding elements. The holder according to any one of claims 1 to 6, wherein
A holder, wherein each of the plurality of holding elements is cylindrical. The holding tool according to claim 8, wherein
A holder, wherein a diameter of one of the plurality of holding elements is different from a diameter of any of the other holding elements. The holder according to any one of claims 1 to 9,
The ratio of the area of the holding surface per unit area in the first region on the base surface is different from the ratio of the area of the holding surface per unit area in the second region on the base surface. Utensils. The holder according to claim 10,
A holder, wherein the first region includes the second region. The holder according to claim 10,
The holder, wherein the base surface has a plurality of combinations of the first region and the second region. The holder according to any one of claims 1 to 12,
A holder, wherein the main body has a plurality of through holes into which pins are inserted. It is a holder of Claim 1 or 2, Comprising:
The width of the object is 10 mm or more and 350 mm or less,
The holder, wherein the plurality of holding elements are formed of an adhesive material, and each of the plurality of holding elements has a height of 0.1 mm or more and 5 mm or less. It is a holder of Claim 1 or 2, Comprising:
The width of the object is 10 mm or more and 350 mm or less,
The holding tool, wherein the plurality of holding elements are formed of an adhesive material, and each of the plurality of holding elements is a column having a diameter of 1 mm or more and 30 mm or less. The holder according to any one of claims 1 to 15, wherein
A holder used as a pallet for transporting the object. A method of manufacturing a holder for holding an object,
a) placing an adhesive material on the body member;
b) pressing the mold against the adhesive material while heating a mold having a plurality of holes each having a flat or convex bottom surface, and guiding the adhesive material to the bottom surface;
c) separating the mold from the adhesive material after cooling the mold;
A method for manufacturing a holder, comprising: It is a manufacturing method of the holder of Claim 17, Comprising:
The method for manufacturing a holder, wherein the adhesive material is silicon rubber or polyurethane rubber. It is a manufacturing method of the holder of Claim 18, Comprising:
A method for manufacturing a holder, wherein vulcanization is performed in the step b).

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