JP2004342837A - Method for manufacturing resin mold electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To finely finish a cutting face at the time of dividing a component manufactured in gang into individual components. <P>SOLUTION: A resin mold electronic component is provided with a gang circuit board 20 where a plurality of circuit boards 12 in which upper electrodes 12b are arranged on a surface side, and which electrically connect the electrodes 12b and lower electrodes formed at a rear side via through holes 12d are collectively formed; and with electronic elements. The electronic elements and the electrodes 12b are bonded in a state where the through holes 12d are closed by a blocking member 16. An outer periphery of the electronic element is molded by sealing resin. The gang circuit board 20 is divided into individual circuit boards 12 by center cutting lines 30 installed on centers of the through holes 12d, and cutting lines 32 and 34 which are parallel and orthogonal to the cutting lines 30 after molding of sealing resin. The block member 16 is constituted of a hard sheet having hardness in the same degree as a substrate material of the gang circuit board 20. The blocking member 16 is thermo-compression bonded onto the gang circuit board 20 through adhesive. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a resin mold electronic component.
[0002]
[Prior art]
2. Description of the Related Art A resin-molded electronic component in which a chip-shaped electronic element is mounted on a surface of a printed wiring board and the outer periphery of the electronic element is sealed with a resin is known. For example, as disclosed in Patent Document 1, this type of electronic component is provided with an upper surface electrode on the front surface side, and electrically connects the upper surface electrode and the lower surface electrode formed on the back surface through a through-hole. And an electronic element mounted on the circuit board, for example, a chip-shaped light emitting diode.
[0003]
In such a resin-molded electronic component, the through hole is closed with a closing member from the surface side of the circuit board to prevent the resin from entering the through hole, and the electronic element is bonded to the upper electrode by bonding. Thereafter, the electronic element is manufactured by molding the outer periphery of the electronic element with a sealing resin such as an epoxy resin.
[0004]
The resin-molded electronic component manufactured by such a method is manufactured by applying a resin mold in a state where a large number of single units are aggregated, since the size in a single state is relatively small, Thereafter, it is cut into a single part, and the cutting position at this time is usually provided on the center of the through hole, and the through hole is cut vertically.
[0005]
However, such a conventional method for manufacturing a resin-molded electronic component has the following problems.
[0006]
[Patent Document 1]
JP 10-135492 A
[Problems to be solved by the invention]
That is, in the manufacturing method disclosed in Patent Document 1, as a closing member for closing the through-hole, a thin soft member such as a dry film used as an etching resist for a printed wiring board is employed.
[0008]
However, when resin molding is performed in a state where the through hole is closed with such a soft member, there is a problem that a dry film or the like is broken due to a supply pressure of the resin and the resin flows into the through hole.
[0009]
In addition, when the assembly manufactured in the assembled state is cut into single parts, when cut on the through-hole, the appropriate cutting conditions are greatly different between the circuit board and the closing member, and usually, the circuit is harder than the closing member. Since the cutting condition is adjusted to the cutting condition of the substrate, a part of the closing member is softened and deformed due to friction or the like at the time of cutting, and the cut surface is not finished finely.
[0010]
Further, when the blocking member is softened or deformed, a part of the blocking member is covered with the through-hole, so that there is a problem in that a problem occurs when soldering to another circuit board or the like.
[0011]
The present invention has been made in view of such conventional problems, and an object of the present invention is to prevent a breakage when applying a resin mold, to provide a clean cut surface, and to achieve a through-hole hole. It is an object of the present invention to provide a method of manufacturing a resin-molded electronic component which hardly causes any trouble at the time of solder connection.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a large number of circuit boards which are provided with an upper surface electrode on a front surface side and electrically connect the upper surface electrode and a lower surface electrode formed on the back surface side through through holes. A collective circuit board, and an electronic element respectively mounted on the circuit board, wherein at least the through-hole is covered and closed with a closing member from the surface side of the collective circuit board, the electronic element and the A method of manufacturing a resin-molded electronic component in which an upper surface electrode is bonded and connected, and thereafter, an outer periphery of the electronic element is molded with a sealing resin. A center cutting line provided on the center of the hole, and a cutting line parallel and orthogonal to the center cutting line, for separating the circuit boards; Constituted by a rigid sheet having a hardness comparable to the substrate material of the circuit board, the rigid sheet, via an adhesive, and so thermocompression bonding to the collective circuit board.
[0013]
According to the method for manufacturing a resin-molded electronic component configured as described above, the closing member that closes at least the through-hole from the front surface side of the integrated circuit board is a hard thin plate having a hardness similar to the board material of the integrated circuit board. Since this hard thin plate is thermocompression-bonded to the collective circuit board via an adhesive, there is no danger of breaking even when pressure is applied when applying a resin mold. After the molding, when cutting the collective circuit board at the center cutting line provided on the center of the through hole hole, the cutting is performed under substantially the same conditions as the cutting of the board material of the collective circuit board, and a soft material such as a dry film is cut. As in the case of cutting, softening or deformation due to friction does not occur.
[0014]
The closing member may be formed by attaching an adhesive sheet to one surface, forming the same size as the collective circuit board, and punching out an uncovered portion such as the upper surface electrode to be bonded and connected as a through hole. it can.
[0015]
According to this configuration, since the closing member has the same size as the collective circuit board, if it is fitted to the outer periphery of the collective circuit board, the positioning between them can be easily performed, and the manufacturing efficiency is improved.
[0016]
The closing member may be made of the same material as the substrate material of the integrated circuit board.
[0017]
According to this configuration, since the collective circuit board and the closing member for closing the through hole are made of the same material, the cutting conditions can be made completely the same.
[0018]
Before the thermocompression bonding, the closing member may position the through-hole at a predetermined position on the collective circuit board, and may temporarily bond the through-hole to the collective circuit board with the adhesive sheet.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 to 8 show one embodiment of a method for manufacturing a resin-molded electronic component according to the present invention.
[0020]
In the manufacturing method shown in these figures, the resin-molded electronic component 10 includes a circuit board 12 and an electronic element 14 as shown in a completed state in FIG. As shown in detail in FIGS. 4 and 5, the circuit board 12 includes a substrate 12a formed in a rectangular shape, a plurality of upper surface electrodes 12b formed on the front side of the substrate 12a, and a rear surface side of the substrate 12a. And a plurality of lower surface electrodes 12c formed.
[0021]
The circuit board 12 is a copper-clad laminate made of epoxy resin with copper foil adhered to both sides, and the copper foil is removed by etching to form upper and lower electrodes 12b and 12c in a predetermined pattern. . In the case of this embodiment, the circuit board 12 has a thickness of, for example, about 0.1 to 0.9 mm, and the patterns of the electrodes 12b and 12c are plated with gold.
[0022]
Some of the upper electrodes 12b are electrically connected to the lower electrodes 12c by a plurality of through-holes 12d arranged on the side surface of the substrate 12. The through-hole 12d is formed by forming a through-hole in a copper-clad laminate and forming an inner wall surface of the through-hole with metal plating. In the electronic component 10 shown in FIG. 8, the through-hole 12d is cut at the center. ing.
[0023]
The electronic element 14 is a chip-shaped electronic component. In this embodiment, a light emitting diode 14a and a phototransistor 14b are used, and the light emitting diode 14a is located at the center of the circular electrode 120b of the upper electrode 12. The phototransistor 14b is mounted on the center of the square electrode 121b of the upper electrode 12, and these components are opposed to each other.
[0024]
Each of the light emitting diode 14a and the phototransistor 14b is provided with a bonding wire 14c for connection, and the wire 14c is bonded to another upper surface electrode 12b.
[0025]
The electronic component 14 mounted on the circuit board 12 is molded with a sealing resin 18 in a state where the through-hole 12 d is closed by the closing member 16 from the front side of the circuit board 12.
[0026]
The closing member 16 is provided in a frame shape along the outer peripheral edge of the circuit board 12. In the case of the present embodiment, for example, epoxy resin or the like is used as the sealing resin 18, and is molded into a rectangular shape along the outer peripheral shape of the circuit board 12 and at a predetermined thickness on the front surface side. I have.
[0027]
The basic structure of the above-described method for manufacturing a resin-molded electronic component is the same as that of a conventional manufacturing method of this type, but the manufacturing method of this embodiment has the following remarkable features.
[0028]
That is, in the case of the present embodiment, as shown in FIG. 1, the circuit board 12 is an aggregated circuit board 20 in which five pieces are arranged vertically and ten pieces are arranged horizontally, and a total of 50 pieces are formed.
[0029]
FIGS. 4 and 5 are diagrams in which a part of the collective circuit board 20 is extracted and enlarged. The circuit board 12 includes a substrate 12a, an upper electrode 12b and a lower electrode 12c including a circular electrode 120b and a square electrode 121b, It has a through hole 12d.
[0030]
In the case of the present embodiment, the pair of circuit boards 12 arranged in the horizontal direction are arranged in a form in which one of the circuit boards 12 is rotated by 180 degrees around the through-hole holes 12d in which eight are arranged in a line. ing.
[0031]
That is, in the case of the present embodiment, the through-holes 12d are separated by the center cutting line 30 provided on the center axis thereof as described later, so that one through-hole 12d is disposed on both sides thereof. The circuit board 12 is disposed so that the circuit board 12 can also be used.
[0032]
When such an arrangement is adopted, the substrate material can be effectively used when the collective circuit board 20 is formed. The hatched portions in FIG. 5 are the solder resists 22 provided on the back surface side of the circuit board 12, and the solder resists 22 are provided so as to cover portions of the circuit board 12 other than the lower surface electrodes 12c. ing.
[0033]
In addition, the portion shown by the phantom line in FIG. 4 covers the upper surface side of the plurality of through-hole holes 12d arranged in a line, and the arrangement position of the closing member 16 for closing the inside of the holes, and the through-hole hole 12d on the central axis. The position of the center cutting line 30 to be cut is shown.
[0034]
On the other hand, in the case of the present embodiment, the closing member 16 is made of the same material as the collective circuit board 20 (same as the circuit board 12), and is made of an epoxy resin plate. The closing member 16 is, for example, a thin hard flat plate having a thickness of about 0.1 mm, and has the same size as the collective circuit board 20 as shown in FIG.
[0035]
The closing member 16 is, for example, of the same type as the copper-clad laminate used in forming the circuit board 12, and is used if the same thickness is selected and the copper foil of the laminate is removed by etching. Can be.
[0036]
Since the surface of the laminate from which the copper foil has been removed has been subjected to a roughening treatment with an uneven surface in order to bond the copper foil, the adhesion of an adhesive sheet 24 described later becomes better, so that preferable.
[0037]
The closing member 16 need not be limited to the same material as the collective circuit board 20. For example, the closing member 16 may be a synthetic resin flat plate having the same hardness as the collective circuit board 20 and a hard thin plate having the same thickness. For example, it can be used similarly to this embodiment.
[0038]
As shown in FIG. 2, the closing member 16 has a large number of rectangular frame-shaped through holes 16a. The through holes 16a are formed by stamping by press molding. Each through hole 16a has a size such that substantially the entire area thereof is exposed except for the outer peripheral edge of the circuit board 12 of the collective circuit board 20. In order to expose a non-coated portion such as the upper surface electrode 12b.
[0039]
The narrow portion 16b sandwiched between a pair of laterally adjacent through-holes 16a is a portion that covers the upper part of the through-hole 12d indicated by the phantom line in FIG. 4, and is slightly larger than the diameter of the through-hole 12d. Has a large width.
[0040]
Before punching out the through-hole 16b, the closing member 16 having such a shape is bonded with an adhesive sheet 24 on the back surface thereof, as shown in FIG. 6, and the through-hole 16b is punched out together with the adhesive sheet 24.
[0041]
Next, as shown in FIG. 3, the closing member 16 in which the through-hole 16 b is formed is temporarily bonded to the front surface side of the collective circuit board 20 with the adhesive sheet 24. At this time, the outer shape of the closing member 16 is matched with the outer shape of the collective circuit board 20, and the plurality of positioning holes 26 provided in the closing member 16 and the collective circuit board 20 are made to coincide with each other.
[0042]
When the closing member 16 is temporarily bonded to the front surface side of the collective circuit board 20 in this manner, the upper surface electrode 12a on the front side of each circuit board 12 is exposed at the through hole 16b, and the through hole hole 12d is shown in FIG. As described above, the upper side is closed by the narrow width portion 16b, and a closed state is obtained.
[0043]
When the temporary bonding of the closing member 16 is completed, the assembled circuit board 20 to which the closing member 16 has been temporarily bonded is sandwiched by a hot press and fixed by pressure bonding (final pressure bonding). FIG. 3 is a plan view showing a state where the closing member 16 is fixed to the collective circuit board 20 by pressure bonding.
[0044]
When the press-fixing is completed, the electronic elements 14 are mounted on the circular electrodes 120b and the square electrodes 121b on the respective circuit boards 12 of the collective circuit board 20, and the respective electronic elements 14 are bonded to the upper surface electrodes 12b.
[0045]
When the bonding connection is completed, the sealing resin 18 is extruded on the front surface side of each of the collective circuit boards 20 along the outer peripheral shape of the circuit board 12 so as to have a predetermined thickness on the front surface side. Then, mold processing is performed.
[0046]
When the sealing resin 18 is cured, the molded circuit board 20 that has been subjected to the molding process is, as shown in FIG. 3, a center cutting line 30 provided on the center of the through-hole 12d, and the center cutting line 30 Each of the circuit boards 12 is separated by a parallel cutting line 32 that is parallel and an orthogonal cutting line 34 that is orthogonal to the center cutting line 30.
[0047]
For such cutting, for example, a high-speed dicing saw equipped with a diamond blade is used, and each of the cutting lines 30, 32, and 34 has, for example, a cut surface having a thickness of about 0.1 mm. At the time of cutting with such a dicing saw, cut marks are read and cut.
[0048]
In this manner, when separated for each circuit board 12, the electronic component 10 shown in FIG. 8 is obtained. Now, according to the method of manufacturing the resin molded electronic component 10 configured as described above, the closing member 16 that closes the through hole hole 12 d from the front surface side of the collective circuit board 20 is substantially the same as the board material of the collective circuit board 20. It is composed of a hard thin plate having hardness, and this hard thin plate is thermocompression-bonded to the collective circuit board 20 via an adhesive, so that when applying a resin mold, there is a possibility that the hard thin plate may be broken even if pressure is applied. In addition, when the assembly circuit board 20 is cut along the center cutting line 30 provided on the center of the through hole 12 d after molding the sealing resin 18, substantially the same conditions as those for cutting the board material of the assembly circuit board 20 are used. And softening or deformation due to friction does not occur as in the case of cutting a soft material such as a dry film.
[0049]
If the cut surface is not deformed, the cut surface itself is finely finished, and furthermore, there is no danger of hindering the solder connection of the through hole 12d.
[0050]
Further, in the present embodiment, the closing member 16 is formed by attaching the adhesive sheet 24 to one surface, and is formed in the same size as the collective circuit board 20, and has a non-closing portion such as the upper surface electrode 12b to be bonded and connected. Since the through hole 16a is formed by punching, if the through hole 16a is fitted to the outer periphery of the collective circuit board 20, the positioning between them can be easily performed, and the manufacturing efficiency is improved.
[0051]
Further, in the case of the present embodiment, the closing member 16 is made of the same material as the substrate material of the integrated circuit board 20, so that the cutting conditions can be made completely the same. Is in the same state as the cut surface of the substrate 12a.
[0052]
In addition, since the closing member 16 positions the through-hole 16a at a predetermined position on the collective circuit board 20 before the thermocompression bonding, and temporarily adheres to the collective circuit board 20 with the adhesive sheet 24, the positioning state is changed. It can be checked and corrected if inconvenient.
[0053]
In the above-described embodiment, the closing member 16 is formed so as to cover a portion other than the through-hole hole 12d of the circuit board 12, but if at least the through-hole hole 12d is covered, the covering state of the other portions is not changed. It can be set arbitrarily.
[0054]
【The invention's effect】
As described above in detail, according to the method of manufacturing a resin-molded electronic component according to the present invention, the sealing resin does not enter the through-hole, and the cut surface is finely finished. There is almost no fear that a trouble will be caused when the solder is connected.
[Brief description of the drawings]
FIG. 1 is an explanatory plan view of a first step showing one embodiment of a method for manufacturing a resin-molded electronic component according to the present invention.
FIG. 2 is an explanatory plan view of a step performed subsequently to FIG. 1;
FIG. 3 is an explanatory plan view of a step performed subsequently to FIG. 2;
FIG. 4 is an enlarged view of a main part of FIG. 1;
FIG. 5 is a rear view of FIG. 4;
FIG. 6 is an explanatory sectional view of FIG. 2;
FIG. 7 is an explanatory sectional view of FIG. 3;
FIG. 8 is a perspective view of an electronic component manufactured by the manufacturing method of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Electronic component 12 Circuit board 12a Substrate 12b Upper electrode 12c Lower electrode 12d Through hole 14 Electronic element 16 Closing member 20 Assembly board 24 Adhesive sheet 30 Center cutting line 32 Parallel cutting line 34 Orthogonal cutting line

Claims (4)

An upper surface electrode provided on a front surface side, an aggregated circuit substrate formed by assembling a large number of circuit substrates for electrically connecting the upper surface electrode and a lower surface electrode formed on the back surface through through holes, Electronic components mounted on each of the above, in a state where at least the through-hole holes are covered and closed by a closing member from the front surface side of the collective circuit board, the electronic device and the upper surface electrode are bonded and connected, and then the A method for manufacturing a resin-molded electronic component in which an outer periphery of an electronic element is molded with a sealing resin,
The assembly circuit board separates each circuit board by a center cutting line provided on the center of the through hole after cutting the sealing resin, and a cutting line parallel and orthogonal to the center cutting line. Yes,
The closing member is formed of a hard thin plate having a hardness similar to a substrate material of the integrated circuit board,
A method of manufacturing a resin-molded electronic component, wherein the closing member is thermocompression-bonded onto the collective circuit board via an adhesive. The closing member is formed by attaching an adhesive sheet to one surface and having the same size as the collective circuit board,
2. The method for manufacturing a resin-molded electronic component according to claim 1, wherein an uncoated portion such as the upper surface electrode to be bonded and connected is punched and formed as a through hole. The method for manufacturing a resin-molded electronic component according to claim 1, wherein the closing member is made of the same material as the substrate material of the integrated circuit board. The said closing member positions the through-hole in the predetermined position of the said collective circuit board before the said thermocompression bonding, and temporarily adheres to the said collective circuit board with the said adhesive sheet, The said from the Claim 1 characterized by the above-mentioned. The method for manufacturing a resin-molded electronic component according to any one of claims 3 to 7.

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