JP2004327566A5 - - Google Patents

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Publication number
JP2004327566A5
JP2004327566A5 JP2003117771A JP2003117771A JP2004327566A5 JP 2004327566 A5 JP2004327566 A5 JP 2004327566A5 JP 2003117771 A JP2003117771 A JP 2003117771A JP 2003117771 A JP2003117771 A JP 2003117771A JP 2004327566 A5 JP2004327566 A5 JP 2004327566A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003117771A
Other versions
JP2004327566A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003117771A priority Critical patent/JP2004327566A/ja
Priority claimed from JP2003117771A external-priority patent/JP2004327566A/ja
Priority to PCT/JP2004/005310 priority patent/WO2004095558A1/ja
Priority to CNB2004800106759A priority patent/CN100369212C/zh
Priority to EP04727407A priority patent/EP1617465A4/en
Priority to KR1020057013371A priority patent/KR20050118667A/ko
Priority to TW093111382A priority patent/TW200423245A/zh
Publication of JP2004327566A publication Critical patent/JP2004327566A/ja
Priority to US11/254,732 priority patent/US20060046491A1/en
Publication of JP2004327566A5 publication Critical patent/JP2004327566A5/ja
Withdrawn legal-status Critical Current

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JP2003117771A 2003-04-23 2003-04-23 Ｃｍｐ研磨方法及び半導体デバイスの製造方法 Withdrawn JP2004327566A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003117771A JP2004327566A (ja) 2003-04-23 2003-04-23 Ｃｍｐ研磨方法及び半導体デバイスの製造方法
PCT/JP2004/005310 WO2004095558A1 (ja) 2003-04-23 2004-04-14 Ｃｍｐ研磨方法及び半導体デバイスの製造方法
CNB2004800106759A CN100369212C (zh) 2003-04-23 2004-04-14 Cmp研磨方法和半导体器件制造方法
EP04727407A EP1617465A4 (en) 2003-04-23 2004-04-14 CHEMICOMECHANICAL POLISHING (CMP) PROCESS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
KR1020057013371A KR20050118667A (ko) 2003-04-23 2004-04-14 Ｃｍｐ 연마 방법 및 반도체 디바이스의 제조 방법
TW093111382A TW200423245A (en) 2003-04-23 2004-04-23 CMP polishing method and method for manufacturing semiconductor device
US11/254,732 US20060046491A1 (en) 2003-04-23 2005-10-21 CMP polishing method and method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003117771A JP2004327566A (ja) 2003-04-23 2003-04-23 Ｃｍｐ研磨方法及び半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2004327566A JP2004327566A (ja) 2004-11-18
JP2004327566A5 true JP2004327566A5 (ja) 2006-03-23

Family

ID=33308050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003117771A Withdrawn JP2004327566A (ja) 2003-04-23 2003-04-23 Ｃｍｐ研磨方法及び半導体デバイスの製造方法

Country Status (7)

Country Link
US (1) US20060046491A1 (ja)
EP (1) EP1617465A4 (ja)
JP (1) JP2004327566A (ja)
KR (1) KR20050118667A (ja)
CN (1) CN100369212C (ja)
TW (1) TW200423245A (ja)
WO (1) WO2004095558A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481198B2 (ja) * 2006-12-28 2014-04-23 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド サファイア基板の研削方法
JP2016058724A (ja) * 2014-09-11 2016-04-21 株式会社荏原製作所 処理モジュール、処理装置、及び、処理方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000000757A (ja) * 1998-06-12 2000-01-07 Nikon Corp 研磨装置及び研磨方法
US6303507B1 (en) * 1999-12-13 2001-10-16 Advanced Micro Devices, Inc. In-situ feedback system for localized CMP thickness control
US6475072B1 (en) * 2000-09-29 2002-11-05 International Business Machines Corporation Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP)
JP4507457B2 (ja) * 2001-05-30 2010-07-21 ソニー株式会社 半導体装置の製造方法
US6821881B2 (en) * 2001-07-25 2004-11-23 Applied Materials, Inc. Method for chemical mechanical polishing of semiconductor substrates
JP2003068683A (ja) * 2001-08-22 2003-03-07 Hitachi Chem Co Ltd 金属用研磨液及び研磨方法
JP2003324088A (ja) * 2002-04-30 2003-11-14 Sony Corp 研磨方法及び研磨装置
US7037174B2 (en) * 2002-10-03 2006-05-02 Applied Materials, Inc. Methods for reducing delamination during chemical mechanical polishing

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