JP2004319957A - 半導体素子のゲート電極形成方法 - Google Patents
半導体素子のゲート電極形成方法 Download PDFInfo
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- JP2004319957A JP2004319957A JP2003381579A JP2003381579A JP2004319957A JP 2004319957 A JP2004319957 A JP 2004319957A JP 2003381579 A JP2003381579 A JP 2003381579A JP 2003381579 A JP2003381579 A JP 2003381579A JP 2004319957 A JP2004319957 A JP 2004319957A
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 44
- 239000010703 silicon Substances 0.000 claims abstract description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 36
- 239000010937 tungsten Substances 0.000 claims abstract description 36
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 30
- -1 tungsten nitride Chemical class 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 15
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims abstract description 10
- 230000003647 oxidation Effects 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims abstract description 6
- 230000001737 promoting effect Effects 0.000 claims abstract description 6
- 238000005468 ion implantation Methods 0.000 claims description 18
- 150000002500 ions Chemical class 0.000 claims description 14
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 238000010405 reoxidation reaction Methods 0.000 abstract description 9
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 abstract description 2
- 239000007943 implant Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000005684 electric field Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 3
- 229910021342 tungsten silicide Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003657 tungsten Chemical class 0.000 description 1
- 238000009279 wet oxidation reaction Methods 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28061—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a metal or metal silicide formed by deposition, e.g. sputter deposition, i.e. without a silicidation reaction
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28247—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon passivation or protection of the electrode, e.g. using re-oxidation
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
- H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
- H01L29/4941—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a barrier layer between the silicon and the metal or metal silicide upper layer, e.g. Silicide/TiN/Polysilicon
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3215—Doping the layers
- H01L21/32155—Doping polycristalline - or amorphous silicon layers
Abstract
【解決手段】半導体基板上にゲート絶縁膜、ドープドシリコン膜、タングステン窒化膜、タングステン膜、及びハードマスク膜を順次形成する段階と、ハードマスク膜をパターニングする段階と、パターニングされたハードマスク膜をエッチング障壁として利用してドープドシリコン膜が露出されるようにタングステン膜とタングステン窒化膜をエッチングする段階と、露出されたドープドシリコン膜部分及びその側面に酸化を促進させることができる所定のイオンをイオン注入する段階と、露出されたドープドシリコン膜部分をエッチングする段階と、前記段階を経た基板上結果物に対して再酸化工程を遂行して、エッチングされたドープドシリコン膜の側面に再酸化膜を形成する段階とを含む。
【選択図】図6
Description
22 ゲート酸化膜
24 ドープドシリコン膜
26 タングステン窒化膜
28 タングステン膜
30 ハードマスク膜
32 レジストパターン
34 再酸化膜
40 ゲート電極
Claims (6)
- 半導体基板上にゲート絶縁膜、ドープド(doped)シリコン膜、タングステン窒化膜、タングステン膜、及びハードマスク膜を順次形成する段階と、
前記ハードマスク膜をパターニングする段階と、
前記パターニングされたハードマスク膜をエッチング障壁として利用してドープドシリコン膜が露出されるようにタングステン膜とタングステン窒化膜をエッチングする段階と、
前記露出されたドープドシリコン膜部分及びその側面に酸化を促進させることができる所定のイオンをイオン注入する段階と、
前記露出されたドープドシリコン膜部分をエッチングする段階と、
前記段階を経た基板上結果物に対して再酸化工程を遂行して、エッチングされたドープドシリコン膜の側面に再酸化膜を形成する段階とを含むことを特徴とする半導体素子のゲート電極形成方法。 - 前記酸化を促進させることができるイオンはゲルマニウム(Ge)であることを特徴とする請求項1に記載の半導体素子のゲート電極形成方法。
- 前記イオン注入は、30乃至200KeVのエネルギーで遂行することを特徴とする請求項1に記載の半導体素子のゲート電極形成方法。
- 前記イオン注入は、露出されたドープドシリコン膜部分の厚さの±500Åを投射範囲(Rp)として遂行することを特徴とする請求項1に記載の半導体素子のゲート電極形成方法。
- 前記イオン注入は、イオン注入角度を0乃至10゜として遂行することを特徴とする請求項1に記載の半導体素子のゲート電極形成方法。
- 前記再酸化工程は、1000℃以下の温度で遂行することを特徴とする請求項1に記載の半導体素子のゲート電極形成方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0023492A KR100460069B1 (ko) | 2003-04-14 | 2003-04-14 | 반도체소자의 게이트전극 형성방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004319957A true JP2004319957A (ja) | 2004-11-11 |
JP4424652B2 JP4424652B2 (ja) | 2010-03-03 |
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Application Number | Title | Priority Date | Filing Date |
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JP2003381579A Expired - Fee Related JP4424652B2 (ja) | 2003-04-14 | 2003-11-11 | 半導体素子のゲート電極形成方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6841461B2 (ja) |
JP (1) | JP4424652B2 (ja) |
KR (1) | KR100460069B1 (ja) |
TW (1) | TWI235493B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100634163B1 (ko) * | 2003-02-19 | 2006-10-16 | 삼성전자주식회사 | 금속 게이트 전극을 구비하는 반도체 소자의 형성 방법 |
US20060186491A1 (en) * | 2003-02-19 | 2006-08-24 | Park Hee-Sook | Methods of forming semiconductor devices having metal gate electrodes and related devices |
JP2005317736A (ja) * | 2004-04-28 | 2005-11-10 | Elpida Memory Inc | 半導体装置の製造方法 |
US10204960B2 (en) | 2015-09-17 | 2019-02-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming polysilicon gate structure in image sensor device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162519A (ja) | 1990-10-24 | 1992-06-08 | Sony Corp | Mos型半導体装置の製造方法 |
US5925918A (en) * | 1997-07-30 | 1999-07-20 | Micron, Technology, Inc. | Gate stack with improved sidewall integrity |
US6136678A (en) * | 1998-03-02 | 2000-10-24 | Motorola, Inc. | Method of processing a conductive layer and forming a semiconductor device |
US6355580B1 (en) * | 1998-09-03 | 2002-03-12 | Micron Technology, Inc. | Ion-assisted oxidation methods and the resulting structures |
KR100291512B1 (ko) * | 1998-11-26 | 2001-11-05 | 박종섭 | 반도체 소자의 게이트 전극 형성방법 |
KR100511897B1 (ko) * | 1999-06-24 | 2005-09-02 | 주식회사 하이닉스반도체 | 반도체 소자의 게이트 전극 형성 방법 |
US6291307B1 (en) | 1999-08-06 | 2001-09-18 | Chartered Semiconductor Manufacturing Ltd. | Method and structure to make planar analog capacitor on the top of a STI structure |
KR100374550B1 (ko) * | 2000-01-25 | 2003-03-04 | 주식회사 하이닉스반도체 | 반도체 소자 및 그 제조 방법 |
US6596598B1 (en) | 2000-02-23 | 2003-07-22 | Advanced Micro Devices, Inc. | T-shaped gate device and method for making |
US6506653B1 (en) | 2000-03-13 | 2003-01-14 | International Business Machines Corporation | Method using disposable and permanent films for diffusion and implant doping |
US6555450B2 (en) | 2000-10-04 | 2003-04-29 | Samsung Electronics Co., Ltd. | Contact forming method for semiconductor device |
JP2002170941A (ja) * | 2000-12-01 | 2002-06-14 | Nec Corp | 半導体装置及びその製造方法 |
US6465312B1 (en) | 2001-04-27 | 2002-10-15 | Advanced Micro Devices, Inc. | CMOS transistor with amorphous silicon elevated source-drain structure and method of fabrication |
JP4190791B2 (ja) * | 2002-04-12 | 2008-12-03 | エルピーダメモリ株式会社 | 半導体集積回路装置の製造方法 |
-
2003
- 2003-04-14 KR KR10-2003-0023492A patent/KR100460069B1/ko not_active IP Right Cessation
- 2003-11-04 US US10/701,327 patent/US6841461B2/en not_active Expired - Fee Related
- 2003-11-05 TW TW092130949A patent/TWI235493B/zh not_active IP Right Cessation
- 2003-11-11 JP JP2003381579A patent/JP4424652B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100460069B1 (ko) | 2004-12-04 |
TWI235493B (en) | 2005-07-01 |
JP4424652B2 (ja) | 2010-03-03 |
US20040203222A1 (en) | 2004-10-14 |
TW200421610A (en) | 2004-10-16 |
KR20040089395A (ko) | 2004-10-21 |
US6841461B2 (en) | 2005-01-11 |
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