JP2004303961A - Suction plate apparatus - Google Patents

Suction plate apparatus Download PDF

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Publication number
JP2004303961A
JP2004303961A JP2003095250A JP2003095250A JP2004303961A JP 2004303961 A JP2004303961 A JP 2004303961A JP 2003095250 A JP2003095250 A JP 2003095250A JP 2003095250 A JP2003095250 A JP 2003095250A JP 2004303961 A JP2004303961 A JP 2004303961A
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Japan
Prior art keywords
substrate
vacuum
support
plate body
plate
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JP2003095250A
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Japanese (ja)
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JP4355507B2 (en
Inventor
Nobunari Nadamoto
本 信 成 灘
Satoshi Shimizu
水 敏 清
Akira Amada
田 晶 甘
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction plate apparatus which allows a substrate to be easily separated when transferring it to another place by minimizing the electrification of the substrate and which can effectively prevent a poor outer appearance, etc., of the substrate caused by the electrification. <P>SOLUTION: Inside the plate body 11 of a cooling plate apparatus as the suction plate apparatus, a cooling mechanism is established to cool the substrate 20 placed on the placement surface 12 of the plate body 11. On the placement surface 12 of the plate body 11, a plurality of supporting projections 13 and auxiliary projections 14 are formed. The substrate 20 is supported on top end faces 13a and 14a of the supporting projections 13 and auxiliary projections 14. Each supporting projection 13 is formed with a vacuum suction hole 13b for sucking the substrate 20 by vacuum. The top end faces 13a of the supporting projections 13 which are brought into contact with the substrate 20 are smooth enough to adhere to the substrate 20 when the substrate 20 is sucked by vacuum through the vacuum suction holes 13b. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、カラーフィルター基板等を製造するための製造ラインで用いられる吸着プレート装置に係り、とりわけ、基板を真空チャック方式で保持する吸着プレート装置に関する。
【０００２】
【従来の技術】
吸着プレート装置としては例えば、基板を冷却する冷却プレート装置が知られている。このような冷却プレート装置は一般に、水冷機構等により一定の低温に保たれたプレート本体を有し、このプレート本体の表面上に基板を真空チャック方式で全面密着させることにより当該基板の冷却を行っている。
【０００３】
【発明が解決しようとする課題】
しかしながら、上述した従来の吸着プレート装置では、プレート本体の表面上に基板を全面密着させるので、プレート本体と基板との間の接触面積が大きくなり基板が帯電しやすい。このため、基板をプレート本体から取り外して次工程の別の処理装置等に移載させる際に、プレート本体から基板が剥がれにくくなり、最悪の場合には基板が割れてしまうおそれがあるという問題がある。また、基板が帯電してしまうことから、基板を次工程の別の処理装置等に移載させる際に、アーク放電等が発生し、基板の外観不良等を引き起こすおそれがあるという問題がある。
【０００４】
本発明はこのような点を考慮してなされたものであり、基板の帯電を最小限に抑えて移載時に基板が容易に剥がれるようにし、かつ帯電に起因した基板の外観不良等の発生を効果的に防止することができる、吸着プレート装置を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明は、基板が載置される載置面を有するプレート本体と、基板を支持するよう前記プレート本体の前記載置面上に形成された複数の支持突起とを備え、前記各支持突起には前記基板を真空吸着するための真空吸引孔が形成され、前記各支持突起のうち前記基板に接触する頂部端面は、前記真空吸引孔により前記基板を真空吸引した際に前記基板と密着するような平滑性を有することを特徴とする吸着プレート装置を提供する。
【０００６】
なお、本発明において、前記各支持突起の前記頂部端面は、ＪＩＳ Ｂ０６０１により規定される算術平均粗さＲａが０＜Ｒａ≦１．６μｍである表面粗さを有することが好ましい。
【０００７】
また、本発明において、前記各支持突起は、前記プレート本体の前記載置面内にて格子状に配置されていることが好ましい。
【０００８】
さらに、本発明においては、前記各支持突起とともに前記基板を支持するよう前記プレート本体の前記載置面上に形成された複数の補助突起をさらに備えることが好ましい。
【０００９】
さらにまた、本発明において、前記プレート本体は基板を冷却するものであることが好ましい。
【００１０】
本発明によれば、載置面上に形成された複数の支持突起により基板を支持するプレート本体において、各支持突起に形成された真空吸引孔により基板を真空吸着するとともに、各支持突起の頂部端面が、真空吸引孔により基板を真空吸引した際に基板と密着するような平滑性を有しているので、各支持突起の頂部端面上で基板を吸着保持した場合でも、各支持突起以外の部分に位置する載置面と基板との間の空間から空気が排気されることがなく、各支持突起により支持された基板をフラットな状態に保つことができる。このため、各支持突起以外の部分で基板が載置面に接触してしまうことを効果的に防止することができ、基板の帯電を最小限に抑えて移載時に基板が容易に剥がれるようにし、かつ帯電に起因した基板の外観不良等の発生を効果的に防止することができる。特に、本発明によれば、各支持突起により支持された基板をフラットな状態に保つことができるので、各支持突起の高さを低くしてプレート本体の載置面と基板との間の間隔を小さくすることができ、プレート本体により基板を冷却するような場合において、プレート本体の冷却効率を十分に確保することができる。
【００１１】
【発明の実施の形態】
以下、図面を参照して本発明の実施の形態について説明する。
【００１２】
まず、図１により、本発明の一実施の形態に係る吸着プレート装置の全体構成について説明する。なお、本実施の形態においては、吸着プレート装置の一例として、冷却プレート装置を例に挙げて説明する。
【００１３】
図１に示すように、冷却プレート装置１０は、冷却対象となる基板２０が載置されるプレート本体１１を備えている。
【００１４】
ここで、プレート本体１１の内部には冷却機構１５が設けられており、プレート本体１１の載置面１２上に載置される基板２０を冷却することができるようになっている。なお、冷却機構１５には温度制御装置１６が接続されており、プレート本体１１の載置面１２の温度を一定の低温に保つことができるようになっている。
【００１５】
また、プレート本体１１の載置面１２上には、図２及び図３に示すように、複数の支持突起１３及び複数の補助突起１４が形成されており、これらの各支持突起１３及び各補助突起１４の頂部端面１３ａ，１４ａにより基板２０を支持することができるようになっている。
【００１６】
ここで、図２及び図３に示すように、各支持突起１３には基板２０を真空吸着するための真空吸引孔１３ｂが形成されており、真空吸引孔１３ｂに接続された真空吸引機構１７（図１参照）により真空引きを行うことにより各支持突起１３と基板２０とを互いに密着させることができるようになっている。なお、各支持突起１３のうち基板２０に接触する頂部端面１３ａは、真空吸引孔１３ｂにより基板２０を真空吸引した際に基板２０と密着するような平滑性を有していることが好ましい。具体的には、各支持突起１３の頂部端面１３ａは、ＪＩＳ（Ｊａｐａｎｅｓｅ Ｉｎｄｕｓｔｒｉａｌ Ｓｔａｎｄａｒｄｓ） Ｂ０６０１により規定される算術平均粗さＲａが０＜Ｒａ≦１．６μｍである表面粗さを有していることが好ましい。
【００１７】
一方、各補助突起１４のうち基板２０の下面に接触する頂部端面１４ａは、各支持突起１３の真空吸引孔１３ｂにより基板２０を真空吸引した際でも基板２０と密着しないような平滑性を有していることが好ましい。
【００１８】
ここで、各支持突起１３及び各補助突起１４は、例えば図２に示すような形態で、プレート本体１１の載置面１２内にて格子状に配置されていることが好ましい。
【００１９】
なお、各支持突起１３及び各補助突起１４の配置間隔及び寸法は、基板２０を各支持突起１３及び各補助突起１４により支持した際に基板２０の自重による撓みにより基板２０の下面がプレート本体１１の載置面１２に接触しないような範囲で任意に設定することができる。具体的には例えば、載置面１２の大きさが１３００ｍｍ×１３００ｍｍであるプレート本体１１上に、１１００ｍｍ×１２５０ｍｍの大きさのカラーフィルター基板を載置する場合であれば、各支持突起１３及び各補助突起１４の間隔ａ及びｂはそれぞれ、１００ｍｍ、５０ｍｍ程度に設定することが好ましい。また、各支持突起１３は、その頂部端面１３ａの直径φ１を３ｍｍ程度、高さｈ１を５０μｍ程度に設定することが好ましい。さらに、各補助突起１４は、その頂部端面１４ａの直径φ２を２ｍｍ程度、高さｈ２を５０μｍ程度に設定することが好ましい。なお、各支持突起１３及び各補助突起１４の高さｈ１及びｈ２は等しいことが好ましい。
【００２０】
次に、このような構成からなる冷却プレート装置１０の作用について説明する。
【００２１】
まず、冷却プレート装置１０において、プレート本体１１の内部に設けられた冷却機構１５及びそれに接続された温度制御装置１６を稼働させ、プレート本体１１の載置面１２の温度を一定の低温に保つ。
【００２２】
この状態で、プレート本体１１の上方に基板２０を移動させ、プレート本体１１の載置面１２上に基板２０を載置する。このとき、基板２０は、載置面１２上に形成された複数の支持突起１３及び複数の補助突起１４により支持される。
【００２３】
その後、真空吸引機構１７を稼働させると、各支持突起１３の真空吸引孔１３ｂにより基板２０が真空吸引され、基板２０が各支持突起１３及び各補助突起１４の頂部端面１３ａ，１４ａ上で吸着保持される。このとき、各支持突起１３の頂部端面１３ａと基板２０とは互いに密着し、当該頂部端面１３ａと基板２０との間に局所的な真空吸着状態が形成される。なお、この状態では、各支持突起１３以外の部分に位置する載置面１２と基板２０との間の空間から空気が排気されることがないので、各支持突起１３により支持された基板２０はフラットな状態に保たれる。
【００２４】
この状態で、プレート本体１１により基板２０が十分に冷却された後、基板２０がプレート本体１１から取り外され、次工程の別の処理装置等に移載される。
【００２５】
このように本実施の形態によれば、載置面１２上に形成された複数の支持突起１３により基板２０を支持するプレート本体１１において、各支持突起１３に形成された真空吸引孔１３ｂにより基板２０を真空吸着するとともに、各支持突起１３の頂部端面１３ａが、真空吸引孔１３ｂにより基板２０を真空吸引した際に基板２０と密着するような平滑性を有しているので、各支持突起１３の頂部端面１３ａ上で基板２０を吸着保持した場合でも、各支持突起１３以外の部分に位置する載置面１２と基板２０との間の空間から空気が排気されることがなく、各支持突起１３により支持された基板２０をフラットな状態に保つことができる。このため、各支持突起１３以外の部分で基板２０が載置面１２に接触してしまうことを効果的に防止することができ、基板２０の帯電を最小限に抑えて移載時に基板２０が容易に剥がれるようにし、かつ帯電に起因した基板２０の外観不良等の発生を効果的に防止することができる。特に、本実施の形態によれば、各支持突起１３により支持された基板２０をフラットな状態に保つことができるので、各支持突起１３の高さｈ１を低くしてプレート本体１１の載置面１２と基板２０との間の間隔を小さくすることができ、プレート本体１１の冷却効率を十分に確保することができる。
【００２６】
また、本実施の形態によれば、各支持突起１３とともに各補助突起１４により基板２０を支持するようにしているので、基板２０の自重による撓みをより効果的に防止して、各支持突起１３以外の部分で基板２０が載置面１２に接触してしまうことをより効果的に防止することができる。このため、各支持突起１３及び各補助突起１４の高さｈ１及びｈ２を低くしてプレート本体１１の載置面１２と基板２０との間の間隔をより小さくすることができ、プレート本体１１の冷却効率をより向上させることができる。
【００２７】
さらに、本実施の形態によれば、各補助突起１４の頂部端面１４ａが、各支持突起１３の真空吸引孔１３ｂにより基板２０を真空吸引した際でも基板２０と密着しないような平滑性を有するようにすることにより、各補助突起１４に起因した基板２０の帯電を最小限に抑えて移載時に基板２０がより容易に剥がれるようにすることができる。
【００２８】
【発明の効果】
以上説明したように本発明によれば、吸着プレート装置において、基板の帯電を最小限に抑えて移載時に基板が容易に剥がれるようにし、かつ帯電に起因した基板の外観不良等の発生を効果的に防止することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態に係る冷却プレート装置（吸着プレート装置）の全体構成を示す図。
【図２】図１に示す冷却プレート装置（吸着プレート装置）のプレート本体の表面の構成を示す斜視図。
【図３】図２に示すプレート本体のＩＩＩ−ＩＩＩ線に沿った断面図。
【符号の説明】
１０ 冷却プレート装置（吸着プレート装置）
１１ プレート本体
１２ 載置面
１３ 支持突起
１３ａ 頂部端面
１３ｂ 真空吸引孔
１４ 補助突起
１４ａ 頂部端面
１５ 冷却機構
１６ 温度制御装置
１７ 真空吸引機構
２０ 基板[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a suction plate device used in a manufacturing line for manufacturing a color filter substrate or the like, and more particularly, to a suction plate device that holds a substrate by a vacuum chuck method.
[0002]
[Prior art]
As a suction plate device, for example, a cooling plate device that cools a substrate is known. Such a cooling plate device generally has a plate body kept at a constant low temperature by a water cooling mechanism or the like, and cools the substrate by bringing the substrate into full contact with the surface of the plate body by a vacuum chuck method. ing.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional suction plate device, the substrate is brought into close contact with the entire surface of the plate body, so that the contact area between the plate body and the substrate is increased, and the substrate is easily charged. For this reason, when the substrate is removed from the plate body and transferred to another processing device in the next process, the substrate is hardly peeled off from the plate body, and in the worst case, the substrate may be broken. is there. Further, since the substrate is charged, there is a problem in that when the substrate is transferred to another processing apparatus in the next step, arc discharge or the like is generated, which may cause a poor appearance of the substrate.
[0004]
The present invention has been made in view of the above points, and minimizes the charging of the substrate so that the substrate can be easily peeled off during transfer, and reduces the occurrence of poor appearance of the substrate due to the charging. An object of the present invention is to provide a suction plate device that can be effectively prevented.
[0005]
[Means for Solving the Problems]
The present invention includes a plate body having a mounting surface on which a substrate is mounted, and a plurality of support protrusions formed on the mounting surface of the plate body to support the substrate. A vacuum suction hole for vacuum suction of the substrate is formed, and a top end surface of each of the support protrusions that contacts the substrate is in close contact with the substrate when the substrate is vacuum suctioned by the vacuum suction hole. Provided is a suction plate device having excellent smoothness.
[0006]
In the present invention, the top end surface of each of the support projections preferably has a surface roughness whose arithmetic average roughness Ra defined by JIS B0601 is 0 <Ra ≦ 1.6 μm.
[0007]
Further, in the present invention, it is preferable that each of the support protrusions is arranged in a grid within the placement surface of the plate body.
[0008]
Further, in the present invention, it is preferable to further include a plurality of auxiliary protrusions formed on the mounting surface of the plate body so as to support the substrate together with the support protrusions.
[0009]
Furthermore, in the present invention, it is preferable that the plate body cools a substrate.
[0010]
According to the present invention, in a plate body that supports a substrate by a plurality of support protrusions formed on a mounting surface, the substrate is vacuum-sucked by vacuum suction holes formed in each support protrusion, and a top portion of each support protrusion is provided. Since the end surface has such smoothness that the substrate comes into close contact with the substrate when the substrate is vacuum-vacuated by the vacuum suction hole, even when the substrate is sucked and held on the top end surface of each support protrusion, other than the support protrusions Air is not exhausted from the space between the mounting surface located at the portion and the substrate, and the substrate supported by each support projection can be kept flat. For this reason, it is possible to effectively prevent the substrate from contacting the mounting surface at a portion other than the support protrusions, and to minimize the electrification of the substrate so that the substrate can be easily peeled off at the time of transfer. In addition, it is possible to effectively prevent occurrence of poor appearance of the substrate due to charging. In particular, according to the present invention, since the substrate supported by each support projection can be kept flat, the height of each support projection can be reduced to reduce the distance between the mounting surface of the plate body and the substrate. Can be reduced, and when the substrate is cooled by the plate body, the cooling efficiency of the plate body can be sufficiently ensured.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0012]
First, an overall configuration of a suction plate device according to an embodiment of the present invention will be described with reference to FIG. In the present embodiment, a cooling plate device will be described as an example of the suction plate device.
[0013]
As shown in FIG. 1, the cooling plate device 10 includes a plate body 11 on which a substrate 20 to be cooled is placed.
[0014]
Here, a cooling mechanism 15 is provided inside the plate main body 11 so that the substrate 20 mounted on the mounting surface 12 of the plate main body 11 can be cooled. Note that a temperature control device 16 is connected to the cooling mechanism 15 so that the temperature of the mounting surface 12 of the plate body 11 can be kept at a constant low temperature.
[0015]
As shown in FIGS. 2 and 3, a plurality of support protrusions 13 and a plurality of auxiliary protrusions 14 are formed on the mounting surface 12 of the plate main body 11. The substrate 20 can be supported by the top end surfaces 13 a and 14 a of the projection 14.
[0016]
Here, as shown in FIGS. 2 and 3, each support projection 13 is formed with a vacuum suction hole 13 b for vacuum-sucking the substrate 20, and the vacuum suction mechanism 17 ( By performing evacuation according to FIG. 1), each support protrusion 13 and the substrate 20 can be brought into close contact with each other. In addition, it is preferable that the top end surface 13a of each of the support protrusions 13 that comes into contact with the substrate 20 has a smoothness such that the top end surface 13a comes into close contact with the substrate 20 when the substrate 20 is evacuated by the vacuum suction holes 13b. Specifically, the top end surface 13a of each support protrusion 13 has a surface roughness whose arithmetic average roughness Ra defined by JIS (Japanese Industrial Standards) B0601 is 0 <Ra ≦ 1.6 μm. Is preferred.
[0017]
On the other hand, the top end surface 14a of each of the auxiliary protrusions 14 that comes into contact with the lower surface of the substrate 20 has a smoothness such that even when the substrate 20 is vacuum suctioned by the vacuum suction holes 13b of each of the support protrusions 13, it does not adhere to the substrate 20. Is preferred.
[0018]
Here, it is preferable that each support protrusion 13 and each auxiliary protrusion 14 are arranged in a lattice shape within the mounting surface 12 of the plate main body 11, for example, in a form as shown in FIG.
[0019]
The arrangement interval and the size of each support protrusion 13 and each auxiliary protrusion 14 are such that when the substrate 20 is supported by each support protrusion 13 and each auxiliary protrusion 14, the lower surface of the substrate 20 is bent by the weight of the substrate 20 by the plate body 11. Can be set arbitrarily within a range that does not make contact with the mounting surface 12. Specifically, for example, when a color filter substrate having a size of 1100 mm × 1250 mm is mounted on the plate body 11 having a size of the mounting surface 12 of 1300 mm × 1300 mm, each support protrusion 13 and each It is preferable that the distances a and b between the auxiliary protrusions 14 are set to about 100 mm and about 50 mm, respectively. Further, it is preferable that each support projection 13 has a diameter φ1 of the top end surface 13a set to about 3 mm and a height h1 set to about 50 μm. Further, it is preferable that the diameter φ2 of the top end surface 14a of each auxiliary projection 14 is set to about 2 mm, and the height h2 is set to about 50 μm. Preferably, the heights h1 and h2 of each support projection 13 and each auxiliary projection 14 are equal.
[0020]
Next, the operation of the cooling plate device 10 having such a configuration will be described.
[0021]
First, in the cooling plate device 10, the cooling mechanism 15 provided inside the plate main body 11 and the temperature control device 16 connected thereto are operated to keep the temperature of the mounting surface 12 of the plate main body 11 at a constant low temperature.
[0022]
In this state, the substrate 20 is moved above the plate main body 11, and the substrate 20 is mounted on the mounting surface 12 of the plate main body 11. At this time, the substrate 20 is supported by the plurality of support protrusions 13 and the plurality of auxiliary protrusions 14 formed on the mounting surface 12.
[0023]
Thereafter, when the vacuum suction mechanism 17 is operated, the substrate 20 is sucked in vacuum by the vacuum suction holes 13b of the support projections 13, and the substrate 20 is suction-held on the top end surfaces 13a, 14a of the support projections 13 and the auxiliary projections 14. Is done. At this time, the top end surface 13a of each support protrusion 13 and the substrate 20 are in close contact with each other, and a local vacuum suction state is formed between the top end surface 13a and the substrate 20. In this state, since air is not exhausted from the space between the mounting surface 12 and the substrate 20 located in a portion other than the support protrusions 13, the substrate 20 supported by the support protrusions 13 It is kept flat.
[0024]
In this state, after the substrate 20 is sufficiently cooled by the plate main body 11, the substrate 20 is removed from the plate main body 11, and is transferred to another processing apparatus or the like in the next step.
[0025]
As described above, according to the present embodiment, in plate main body 11 that supports substrate 20 by a plurality of support protrusions 13 formed on mounting surface 12, substrate suction is performed by vacuum suction holes 13 b formed in each support protrusion 13. 20 is vacuum-sucked, and the top end surface 13a of each support projection 13 has smoothness so as to be in close contact with the substrate 20 when the substrate 20 is vacuum-sucked through the vacuum suction hole 13b. Even when the substrate 20 is sucked and held on the top end surface 13a of the base member, air is not exhausted from the space between the mounting surface 12 and the substrate 20 located in a portion other than the support projections 13, and each support projection The substrate 20 supported by 13 can be kept flat. For this reason, it is possible to effectively prevent the substrate 20 from coming into contact with the mounting surface 12 at a portion other than the respective support protrusions 13, and to minimize the charging of the substrate 20 so that the substrate 20 is The substrate 20 can be easily peeled off, and occurrence of poor appearance or the like of the substrate 20 due to charging can be effectively prevented. In particular, according to the present embodiment, the substrate 20 supported by each support protrusion 13 can be kept flat, so that the height h1 of each support protrusion 13 is reduced and the mounting surface of the plate body 11 is reduced. The distance between the substrate 12 and the substrate 20 can be reduced, and the cooling efficiency of the plate body 11 can be sufficiently ensured.
[0026]
Further, according to the present embodiment, since the substrate 20 is supported by the auxiliary projections 14 together with the support projections 13, the bending of the substrate 20 due to its own weight is more effectively prevented. It is possible to more effectively prevent the substrate 20 from coming into contact with the mounting surface 12 in a portion other than the above. For this reason, the heights h1 and h2 of each support projection 13 and each auxiliary projection 14 can be reduced, and the distance between the mounting surface 12 of the plate body 11 and the substrate 20 can be further reduced. The cooling efficiency can be further improved.
[0027]
Further, according to the present embodiment, the top end surface 14a of each auxiliary projection 14 has a smoothness such that it does not adhere to the substrate 20 even when the substrate 20 is vacuum-suctioned by the vacuum suction holes 13b of each support projection 13. By doing so, it is possible to minimize the charging of the substrate 20 caused by each auxiliary projection 14 and to more easily peel off the substrate 20 during transfer.
[0028]
【The invention's effect】
As described above, according to the present invention, in a suction plate device, it is possible to minimize the charging of a substrate so that the substrate can be easily peeled off during transfer, and to reduce the occurrence of poor appearance of the substrate due to the charging. Can be prevented.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of a cooling plate device (suction plate device) according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration of a surface of a plate main body of the cooling plate device (suction plate device) shown in FIG.
FIG. 3 is a sectional view of the plate main body shown in FIG. 2 taken along the line III-III.
[Explanation of symbols]
10. Cooling plate device (suction plate device)
Reference Signs List 11 Plate main body 12 Mounting surface 13 Support protrusion 13a Top end surface 13b Vacuum suction hole 14 Auxiliary protrusion 14a Top end surface 15 Cooling mechanism 16 Temperature controller 17 Vacuum suction mechanism 20 Substrate

Claims (5)

基板が載置される載置面を有するプレート本体と、
基板を支持するよう前記プレート本体の前記載置面上に形成された複数の支持突起とを備え、
前記各支持突起には前記基板を真空吸着するための真空吸引孔が形成され、前記各支持突起のうち前記基板に接触する頂部端面は、前記真空吸引孔により前記基板を真空吸引した際に前記基板と密着するような平滑性を有することを特徴とする吸着プレート装置。A plate body having a mounting surface on which the substrate is mounted,
Comprising a plurality of support protrusions formed on the mounting surface of the plate body to support a substrate,
A vacuum suction hole for vacuum-sucking the substrate is formed in each of the support protrusions, and a top end surface of each of the support protrusions that contacts the substrate is formed when the substrate is vacuum-sucked by the vacuum suction hole. An adsorption plate device having smoothness so as to be in close contact with a substrate. 前記各支持突起の前記頂部端面は、ＪＩＳ Ｂ０６０１により規定される算術平均粗さＲａが０＜Ｒａ≦１．６μｍである表面粗さを有することを特徴とする、請求項１に記載の吸着プレート装置。2. The suction plate according to claim 1, wherein the top end surface of each of the support protrusions has a surface roughness whose arithmetic average roughness Ra defined by JIS B0601 is 0 <Ra ≦ 1.6 μm. apparatus. 前記各支持突起は、前記プレート本体の前記載置面内にて格子状に配置されていることを特徴とする、請求項１又は２に記載の吸着プレート装置。3. The suction plate device according to claim 1, wherein the support protrusions are arranged in a grid within the placement surface of the plate body. 4. 前記各支持突起とともに前記基板を支持するよう前記プレート本体の前記載置面上に形成された複数の補助突起をさらに備えたことを特徴とする、請求項１乃至３のいずれかに記載の吸着プレート装置。4. The suction device according to claim 1, further comprising a plurality of auxiliary protrusions formed on the mounting surface of the plate body so as to support the substrate together with the support protrusions. 5. Plate equipment. 前記プレート本体は基板を冷却するものであることを特徴とする、請求項１乃至４のいずれかに記載の吸着プレート装置。The suction plate device according to any one of claims 1 to 4, wherein the plate body cools a substrate.
JP2003095250A 2003-03-31 2003-03-31 Suction plate device Expired - Fee Related JP4355507B2 (en)

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JP2015050300A (en) * 2013-08-30 2015-03-16 太平洋セメント株式会社 Vacuum suction device and vacuum suction method

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