JP4355507B2 - Suction plate device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a suction plate device used in a production line for manufacturing a color filter substrate and the like, and more particularly to a suction plate device that holds a substrate in a vacuum chuck system.
[0002]
[Prior art]
As a suction plate device, for example, a cooling plate device for cooling a substrate is known. Such a cooling plate apparatus generally has a plate body maintained at a constant low temperature by a water cooling mechanism or the like, and cools the substrate by closely contacting the substrate on the surface of the plate body by a vacuum chuck method. ing.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional suction plate device, the entire surface of the substrate is brought into close contact with the surface of the plate body, so that the contact area between the plate body and the substrate becomes large and the substrate is easily charged. For this reason, when removing a board | substrate from a plate main body and transferring it to another processing apparatus etc. of the next process, it becomes difficult to peel off a board | substrate from a plate main body, and there is a possibility that a board | substrate may break in the worst case. is there. In addition, since the substrate is charged, there is a problem that when the substrate is transferred to another processing apparatus or the like in the next process, arc discharge or the like may occur, resulting in a defective appearance of the substrate.
[0004]
The present invention has been made in consideration of the above points, and minimizes the charging of the substrate so that the substrate can be easily peeled off during transfer, and causes the appearance of the substrate to be defective due to the charging. An object of the present invention is to provide a suction plate device that can be effectively prevented.
[0005]
[Means for Solving the Problems]
The present invention includes a plate body having a placement surface on which a substrate is placed, and a plurality of support protrusions formed on the placement surface of the plate body so as to support the substrate. Is formed with a vacuum suction hole for vacuum-adsorbing the substrate, and the top end surface of the support projections contacting the substrate is in close contact with the substrate when the substrate is vacuum-sucked by the vacuum suction hole. Provided is a suction plate device characterized by having smoothness.
[0006]
In the present invention, it is preferable that the top end surface of each support protrusion has a surface roughness with an arithmetic average roughness Ra defined by JIS B0601 of 0 <Ra ≦ 1.6 μm.
[0007]
Moreover, in this invention, it is preferable that each said support protrusion is arrange | positioned in the grid | lattice form within the said mounting surface of the said plate main body.
[0008]
Furthermore, in the present invention, it is preferable to further include a plurality of auxiliary protrusions formed on the mounting surface of the plate body so as to support the substrate together with the support protrusions.
[0009]
In the present invention, the plate body preferably cools the substrate.
[0010]
According to the present invention, in the plate body that supports the substrate by the plurality of support protrusions formed on the mounting surface, the substrate is vacuum-sucked by the vacuum suction holes formed in each support protrusion, and the top of each support protrusion Since the end surface has such smoothness that it adheres to the substrate when the substrate is vacuum-sucked by the vacuum suction hole, even when the substrate is sucked and held on the top end surface of each support projection, Air is not exhausted from the space between the mounting surface located in the portion and the substrate, and the substrate supported by each support protrusion can be kept flat. For this reason, it is possible to effectively prevent the substrate from coming into contact with the mounting surface at portions other than the supporting protrusions, and to minimize the charging of the substrate so that the substrate can be easily peeled off during transfer. In addition, it is possible to effectively prevent the occurrence of poor appearance of the substrate due to charging. In particular, according to the present invention, the substrate supported by each support protrusion can be kept flat, so that the height of each support protrusion can be reduced and the distance between the mounting surface of the plate body and the substrate. In the case where the substrate is cooled by the plate body, the cooling efficiency of the plate body can be sufficiently ensured.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0012]
First, the overall configuration of the suction plate device according to an embodiment of the present invention will be described with reference to FIG. In the present embodiment, a cooling plate device will be described as an example of the suction plate device.
[0013]
As shown in FIG. 1, the cooling plate device 10 includes a plate body 11 on which a substrate 20 to be cooled is placed.
[0014]
Here, a cooling mechanism 15 is provided inside the plate main body 11 so that the substrate 20 placed on the placement surface 12 of the plate main body 11 can be cooled. A temperature control device 16 is connected to the cooling mechanism 15 so that the temperature of the mounting surface 12 of the plate body 11 can be kept at a constant low temperature.
[0015]
Further, as shown in FIGS. 2 and 3, a plurality of support protrusions 13 and a plurality of auxiliary protrusions 14 are formed on the mounting surface 12 of the plate main body 11. The substrate 20 can be supported by the top end faces 13a, 14a of the protrusions 14.
[0016]
Here, as shown in FIGS. 2 and 3, each support projection 13 is formed with a vacuum suction hole 13b for vacuum suction of the substrate 20, and a vacuum suction mechanism 17 (connected to the vacuum suction hole 13b) ( Each support protrusion 13 and the substrate 20 can be brought into close contact with each other by evacuating according to FIG. In addition, it is preferable that the top part end surface 13a which contacts the board | substrate 20 among each support protrusion 13 has the smoothness which closely_contact | adheres to the board | substrate 20 when the board | substrate 20 is vacuum-sucked by the vacuum suction hole 13b. Specifically, the top end surface 13a of each support protrusion 13 has a surface roughness with an arithmetic average roughness Ra defined by JIS (Japanese Industrial Standards) B0601 of 0 <Ra ≦ 1.6 μm. Is preferred.
[0017]
On the other hand, the top end surface 14 a that contacts the lower surface of the substrate 20 among the auxiliary protrusions 14 has a smoothness that does not adhere to the substrate 20 even when the substrate 20 is vacuum-sucked by the vacuum suction holes 13 b of the support protrusions 13. It is preferable.
[0018]
Here, it is preferable that the support protrusions 13 and the auxiliary protrusions 14 are arranged in a lattice shape within the mounting surface 12 of the plate body 11 in the form shown in FIG. 2, for example.
[0019]
In addition, the arrangement | positioning space | interval and dimension of each support protrusion 13 and each auxiliary | assistant protrusion 14 are the bottom surfaces of the board | substrate 20 by the bending by the dead weight of the board | substrate 20 when the board | substrate 20 is supported by each support protrusion 13 and each auxiliary protrusion 14. It can be arbitrarily set within a range that does not come into contact with the mounting surface 12. Specifically, for example, when a color filter substrate having a size of 1100 mm × 1250 mm is placed on the plate body 11 having a size of the placement surface 12 of 1300 mm × 1300 mm, each support protrusion 13 and each The distances a and b of the auxiliary protrusions 14 are preferably set to about 100 mm and 50 mm, respectively. Each support protrusion 13 preferably has a diameter φ1 of the top end face 13a of about 3 mm and a height h1 of about 50 μm. Further, each auxiliary projection 14 preferably has a diameter φ2 of the top end face 14a of about 2 mm and a height h2 of about 50 μm. In addition, it is preferable that the heights h1 and h2 of each support protrusion 13 and each auxiliary protrusion 14 are equal.
[0020]
Next, the operation of the cooling plate device 10 having such a configuration will be described.
[0021]
First, in the cooling plate apparatus 10, the cooling mechanism 15 provided in the plate main body 11 and the temperature control apparatus 16 connected thereto are operated to keep the temperature of the mounting surface 12 of the plate main body 11 at a constant low temperature.
[0022]
In this state, the substrate 20 is moved above the plate body 11 and the substrate 20 is placed on the placement surface 12 of the plate body 11. At this time, the substrate 20 is supported by the plurality of support protrusions 13 and the plurality of auxiliary protrusions 14 formed on the placement surface 12.
[0023]
Thereafter, when the vacuum suction mechanism 17 is operated, the substrate 20 is vacuum-sucked by the vacuum suction holes 13b of the support protrusions 13, and the substrate 20 is sucked and held on the top end surfaces 13a and 14a of the support protrusions 13 and the auxiliary protrusions 14. Is done. At this time, the top end surface 13 a of each support protrusion 13 and the substrate 20 are in close contact with each other, and a local vacuum suction state is formed between the top end surface 13 a and the substrate 20. In this state, since air is not exhausted from the space between the mounting surface 12 and the substrate 20 located at portions other than the support protrusions 13, the substrate 20 supported by the support protrusions 13 is Keep flat.
[0024]
In this state, after the substrate 20 is sufficiently cooled by the plate body 11, the substrate 20 is detached from the plate body 11 and transferred to another processing apparatus or the like in the next process.
[0025]
As described above, according to the present embodiment, in the plate body 11 that supports the substrate 20 by the plurality of support protrusions 13 formed on the mounting surface 12, the substrate is formed by the vacuum suction holes 13 b formed in the support protrusions 13. 20 is vacuum-sucked, and the top end face 13a of each support projection 13 has such a smoothness that it adheres to the substrate 20 when the substrate 20 is vacuum-sucked by the vacuum suction hole 13b. Even when the substrate 20 is sucked and held on the top end surface 13a, air is not exhausted from the space between the mounting surface 12 and the substrate 20 located in a portion other than the support projections 13, and each support projection The substrate 20 supported by 13 can be kept flat. For this reason, it can prevent effectively that the board | substrate 20 contacts the mounting surface 12 in parts other than each support protrusion 13, and the board | substrate 20 carries out the transfer at the time of transfer by suppressing the charging of the board | substrate 20 to the minimum. It can be easily peeled off, and the occurrence of defects in the appearance of the substrate 20 due to charging can be effectively prevented. In particular, according to the present embodiment, the substrate 20 supported by each support protrusion 13 can be kept flat, so that the height h1 of each support protrusion 13 is lowered and the mounting surface of the plate body 11 is placed. The space between the substrate 12 and the substrate 20 can be reduced, and the cooling efficiency of the plate body 11 can be sufficiently ensured.
[0026]
In addition, according to the present embodiment, since the substrate 20 is supported by the auxiliary protrusions 14 together with the support protrusions 13, it is possible to more effectively prevent the substrate 20 from bending due to its own weight, and to support the support protrusions 13. It can prevent more effectively that the board | substrate 20 contacts the mounting surface 12 in parts other than. For this reason, the heights h1 and h2 of the support protrusions 13 and the auxiliary protrusions 14 can be reduced to reduce the distance between the mounting surface 12 of the plate body 11 and the substrate 20, and the plate body 11 The cooling efficiency can be further improved.
[0027]
Further, according to the present embodiment, the top end surface 14a of each auxiliary projection 14 has such a smoothness that it does not adhere to the substrate 20 even when the substrate 20 is vacuum-sucked by the vacuum suction hole 13b of each support projection 13. Thus, it is possible to minimize the charging of the substrate 20 caused by each auxiliary protrusion 14 and to more easily peel the substrate 20 during transfer.
[0028]
【The invention's effect】
As described above, according to the present invention, in the suction plate device, it is possible to minimize the charging of the substrate so that the substrate can be easily peeled off at the time of transfer, and to prevent the appearance of the substrate from being defective due to the charging. Can be prevented.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of a cooling plate device (suction plate device) according to an embodiment of the present invention.
2 is a perspective view showing the configuration of the surface of the plate body of the cooling plate device (suction plate device) shown in FIG. 1. FIG.
3 is a cross-sectional view taken along the line III-III of the plate body shown in FIG.
[Explanation of symbols]
10 Cooling plate device (Suction plate device)
DESCRIPTION OF SYMBOLS 11 Plate main body 12 Mounting surface 13 Support protrusion 13a Top end surface 13b Vacuum suction hole 14 Auxiliary protrusion 14a Top end surface 15 Cooling mechanism 16 Temperature control device 17 Vacuum suction mechanism 20 Substrate

Claims (2)

A plate body having a mounting surface on which a substrate is mounted;
A plurality of support protrusions formed on the mounting surface of the plate body to support the substrate and having a cylindrical shape extending upward;
A plurality of auxiliary protrusions formed on the mounting surface of the plate body so as to support the substrate together with the supporting protrusions and having a cylindrical shape extending upward;
A vacuum suction hole for vacuum-adsorbing the substrate is formed in each of the support protrusions, and a top end surface of the support protrusion that contacts the substrate is formed when the substrate is vacuum-sucked by the vacuum suction hole. It has smoothness so that it is in close contact with the substrate,
The top end surface of each auxiliary projection that contacts the substrate has a smoothness so that it does not adhere to the substrate even when the substrate is vacuum-sucked by the vacuum suction hole of each support projection,
The support protrusions and the auxiliary protrusions are arranged in a lattice pattern within the mounting surface of the plate body,
A row of support projections consisting only of the support projections and a row of auxiliary projections consisting only of the auxiliary projections are configured,
The rows of support projections and the rows of auxiliary projections are alternately arranged ,
The top end face of each of the support protrusions has a surface roughness with an arithmetic average roughness Ra defined by JIS B0601 of 0 <Ra ≦ 1.6 μm . The suction plate apparatus according to claim 1, wherein the plate body cools the substrate.

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