JP2004288825A - Member for heat dissipation and connecting structure - Google Patents
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- JP2004288825A JP2004288825A JP2003078203A JP2003078203A JP2004288825A JP 2004288825 A JP2004288825 A JP 2004288825A JP 2003078203 A JP2003078203 A JP 2003078203A JP 2003078203 A JP2003078203 A JP 2003078203A JP 2004288825 A JP2004288825 A JP 2004288825A
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【０００１】
【発明の属する技術分野】
本発明は、常温においては優れた取り扱い性を有し、発熱体と放熱体との間に介在し、高い柔軟性を有することにより発熱体及び放熱体に密着して効率よく発熱体から発生した熱を放熱体に伝導することができ、かつ、温度が上昇しても密着した状態を保つことができる放熱用部材、及び、該放熱用部材により発熱体と放熱体とを接続してなる接続構造体に関する。
【０００２】
【従来の技術】
電気・電子部品等の発熱体と放熱体の間に介在させ、発熱体から発生する熱を放散させる目的で、放熱シート等の放熱用部材が利用されている。しかし、電気・電子部品に限らず、多くの発熱体や放熱体の表面は平滑でないため放熱用部材が発熱体及び放熱体に密着できず、発熱体や放熱体と放熱用部材との間の接触面積が減少すると、発熱体から放熱体への熱伝達効率が低下し、放熱用部材が有する放熱性能が充分に発揮できない。
【０００３】
発熱体と放熱体の間の熱的な抵抗は熱抵抗と呼ばれ、熱抵抗が小さいほど、発熱体から放熱体への熱伝達が優れ、高い放熱効果が得られる。そのため熱抵抗を小さくするためには、放熱用部材に対して優れた柔軟性が要求されている。そこで、従来は、放熱用部材として熱伝導性徴粒子を含有した放熱グリース；シリコンゴムやアクリル酸エステル系樹脂等の柔軟かつ復元力のある樹脂に熱伝導性徴粒子を分散させた放熱シート等が用いられていた。
【０００４】
放熱グリースとしては、例えば、下記の特許文献１にシリコンオイルをベースとし、亜鉛華、アルミナ、窒化アルミニウム等の熱伝導性徴粒子を含有させたものが開示されている。このような放熱グリースは流動性のある粘稠な物質であるため、発熱体と放熱体の間に介在させた際に大きな接触面積が得られることから優れた熱抵抗性能を発現可能である。しかしながら、発熱体や放熱体に塗布させる際に、周辺部位の汚れなどが生じて作業性が低いことや、作業のばらつきが生じて熱抵抗性能が変化する可能性が高い等の問題があった。
【０００５】
放熱シートとしては、例えば、下記の特許文献２にアクリル酸エステル系樹脂に熱伝導性徴粒子をランダムに分散させた熱伝導テープが開示されている。このような放熱シートは定形のシートであるため、発熱体や放熱体に容易に貼り付けることができ、発熱体と放熱体の間に介在させる際に一定の間隙にすることができるため、安定した熱抵抗性能を発現することができる。しかしながら、流動性がないため、放熱グリースほどの高い柔軟性が得られず、高い熱抵抗性能を発現することが困難であった。
【０００６】
これに対し、下記の特許文献３にはアクリル系感圧性粘着成分に対し、約５０〜６０℃に融解温度を有するαオレフィン系熱可塑性成分や約６０〜７０℃の融解温度を有するパラフィン系ロウ成分等の化合物を混合した放熱用部材が開示されている。これらの放熱用部材は、電圧を印加することで発熱体の温度が上がり、混合しているαオレフィン系熱可塑性成分やパラフィン系ロウ成分の融解温度に達すると急激に軟化し、柔軟性が向上して熱抵抗性能が向上するというものである。
【０００７】
しかしながら、このような融解温度を持つ化合物は、発熱体や放熱体への貼付作業を行う２３℃付近の温度では接着性のない固体であるため、これを含有するアクリル系感圧性粘着成分の粘着性が損なわれ、貼付作業性か低下する。また、発熱体の温度が上がって融解温度を超える際に、化合物がすべて融解するまでに若干の時間がかかることから、発熱体の温度がいったんは急上昇する。そして、融解温度を有する化合物が溶けて放熱用部材の柔軟性が向上し、発熱体と放熱体の間が密着して熱伝達率が向上すると発熱体の温度は急降下する。そのため短時間ではあるが、発熱体に温度負荷がかかるという問題があった。
【０００８】
また、発熱体の温度が上がり化合物が溶けて放熱用部材の柔軟性が向上し、発熱体と放熱体の間が密着して熱伝達率が向上したとしても、更に温度がかかり続けた場合には、溶融粘度の低い溶融した化合物が放熱用部材から流れ出してしまい、その結果、密着性が損なわれ熱伝達率も悪化して、発熱体の温度が上昇してしまうことがあるという問題もあった。
【０００９】
【特許文献１】
特公平６−３９５９１号公報
【特許文献２】
特開平６−８８０６１号公報
【特許文献３】
特表２０００−５０９２０９号公報
【００１０】
【発明が解決しようとする課題】
本発明は、上記現状に鑑み、常温においては優れた取り扱い性を有し、発熱体と放熱体との間に介在し、高い柔軟性を有することにより発熱体及び放熱体に密着して効率よく発熱体から発生した熱を放熱体に伝導することができ、かつ、温度が上昇しても密着した状態を保つことができる放熱用部材、及び、該放熱用部材により発熱体と放熱体とを接続してなる接続構造体を提供することを目的とする。
【００１１】
【課題を解決するための手段】
本願発明は、熱可塑性樹脂と熱伝導性微粒子とを含有し、４０〜８０℃に融解温度を有する化合物を含有しない熱可塑性樹脂組成物からなる放熱用部材であって、２３℃においては、０．１Ｈｚ時の貯蔵弾性率が５万Ｐａ以上であり、かつ、定形を保持しており、５０〜８０℃における０．１Ｈｚ時の貯蔵弾性率が４００〜１００００Ｐａ、１００℃においては、０．１Ｈｚ時の貯蔵弾性率が５０００Ｐａ以下であり、かつ、不定形であることを特徴とする放熱用部材である。
【００１２】
以下に本発明を詳述する。
本発明の放熱部材は、２３℃においては、０．１Ｈｚ時の貯蔵弾性率が５万Ｐａ以上であり、かつ、定形を保持している。従って、発熱体や放熱体への貼付作業を行う２３℃付近の温度では定形のシート状にして用いることができ優れた貼付作業性を示す。
【００１３】
本発明では、５０〜８０℃における０．１Ｈｚ時の貯蔵弾性率が４００〜１００００Ｐａ、１００℃においては、０．１Ｈｚ時の貯蔵弾性率が５０００Ｐａ以下であり、かつ、不定形である。従って、本発明では、電圧を印加することにより発熱体の温度が上がると放熱用部材は急速に軟化し、５０℃〜８０℃の温度に達すると柔軟性が向上するため発熱体と放熱体に対する接触面積が向上し、優れた熱抵抗性能を発現するが、５０〜８０℃の温度になっても貯蔵弾性率が４００Ｐａ以上あるため、放熱用部材が流れ出して発熱体及び放熱体から離れてしまうことはない。さらに、１００℃においては貯蔵弾性率が５０００Ｐａ以下であるため、シート加工が優れている。
【００１４】
なお、貯蔵弾性率は、例えばレオメトリックス社製のダイナミック・アナライザーＲＤＡＩＩ等の動的粘弾性測定装置で測定することができる。
２３℃の温度における０．１Ｈｚ時の貯蔵弾性率が５万Ｐａ未満であると、柔らかすぎて取り扱いにくくなり、貼付作業も行いにくくなる。また、５０〜８０℃の温度における０．１Ｈｚ時の貯蔵弾性率が１万Ｐａを超えると、放熱用部材の柔軟性が低く発熱体や放熱体に密着できず、充分な熱抵抗性能が得られない。更に、５０〜８０℃の温度における０．１Ｈｚ時の貯蔵弾性率が４００Ｐａ未満であると、放熱用部材は柔らかくなりすぎて流れ出し発熱体及び放熱体から離れてしまう。また、１００℃の温度における０．１Ｈｚ時の貯蔵弾性率が５０００Ｐａを超えると、放熱用部材が硬くなり、シート加工が困難となる。
【００１５】
本発明では４０℃と６０℃との間に、相転移現象を伴わずにかかる急速な貯蔵弾性率の変化が起こることから、発熱体の温度の上昇にあわせて放熱用部材がしだいに密着していき、発熱体の温度の上昇と、放熱用部材が軟化して発熱体と放熱体に対する接触面積が向上し優れた熱抵抗性能を発現するまでの間に時間の遅れが生じないため、発熱体の温度が急上昇してしまうことがなく、発熱体に温度負荷がかかることがない。
【００１６】
また、相転移現象を伴わない熱可塑性樹脂組成物では、室温や室温よりわずかに加熱しただけで柔らかくなったり、樹脂表面に粘着性が現れたりすることがあり放熱用部材として取り扱いにくいことが多いが、低温において定形を保持することができ取扱い性にも優れる。
【００１７】
本発明に係る熱可塑性樹脂組成物では、温度が、６０℃を超えると、貯蔵弾性率の減少は緩やかになり、柔らかくなりすぎて発熱体及び放熱体から離れて流れ出てしまうことがなく、発熱体及び放熱体に密着し続け、発熱体から発生する熱を放熱体に効率よく伝え続けることができる。
【００１８】
本発明の放熱用部材は、２３℃における対アルミニウム接着力が０．５Ｎ／ｃｍ２以上であることが好ましい。これにより、発熱体及び放熱体に対して高い接着性を有することとなり、発熱体及び放熱体に放熱用部材を貼り付ける際の貼付作業性が向上する。
【００１９】
本発明の放熱用部材は、特に限定されないが、シート状に加工して用いることが好ましい。シート状にすることにより、貼付作業性が著しく向上する。
シート状にして用いる場合、シートが薄くなりすぎると取り扱い性が低下するとともに、発熱体と放熱体との間に介在させた際に、隙間を充分に埋めることが難しくなり、また、シートが厚すぎると熱抵抗性能が低下する傾向にある。したがって、本発明の放熱用部材の厚さは下限が２０μｍ、上限が４００μｍであることが好ましい。
【００２０】
本発明の放熱用部材は、熱可塑性樹脂と熱伝導性微粒子とを含有する熱可塑性樹脂組成物からなる。
上記熱可塑性樹脂としては、（メタ）アクリル酸エステル系共重合体；スチレン−ブタジエン−スチレンブロック共重合体、スチレン−イソプレン−スチレンブロック共重合体等のスチレン系ブロック共重合体；エチレン−酢酸ビニル樹脂、ブタジエン系樹脂、イソブチレン系樹脂、オレフィン系樹脂、ウレタン系樹脂、エポキシ系樹脂、酢酸ビニル系樹脂、スチレン系樹脂、ブチラ−ル系樹脂、ポリビニルアルコール系樹脂、シリコン系樹脂；これらの変性樹脂等が挙げられる。これらは単独で用いられてもよいし、２種類以上を併用してもよい。なかでも、上述の貯蔵弾性率を実現できる設計が比較的容易であることから、アクリル酸エステル系共重合体、スチレン系ブロック共重合体、ブチルゴム系樹脂が好適である。例えば、アクリル酸エステル系共重合体であれば、共重合体の重量平均分子量を２０万以下にすれば、上述の貯蔵弾性率を発現することができる。
【００２１】
また、スチレン−イソプレン−スチレンブロック共重合体の場合は、スチレン−イソプレンのジブロック比率が５０重量％以上、スチレン含有量が２５重量％以下であれば、上述の貯蔵弾性率を発現することができる。ＳＩＳであれば、これらのジブロック比率とスチレン含有量により２３℃から５０℃に至る弾性率の急激な変化の制御を行いやすい。
【００２２】
なお、上記熱可塑性樹脂はＩＣ等の電子部品等の発熱体における高温側の動作限界温度付近に融点を有する樹脂ではないことが好ましい。また、ガラス転移温度を有する樹脂の場合においても、示差熱量計を用いて測定されるガラス転移温度がＩＣ等の電子部品等の発熱体における高温側の最大適正動作温度付近にないことが好ましい。これらの樹脂の融解やガラス転移現象における潜熱吸収もまた、発熱体や放熱体と放熱用部材との間が密着するまでに時間の遅れを生じさせる原因となることがある。
【００２３】
また、上記熱可塑性樹脂として、スチレン系ブロック共重合体等の２３℃において固形状の芳香族熱可塑性樹脂を用いる場合には、更に２３℃において粘稠体であるキシレン樹脂を含有することが好ましい。このようなキシレン樹脂を添加することによって、２３℃と５０℃との間の貯蔵弾性率の挙動においてより急激な変化が生じ、更に、５０℃以上では緩やかな貯蔵弾性率の変化を実現することができる。これは、２３℃において固形状の芳香族熱可塑性樹脂と２３℃において粘稠体であるキシレン樹脂とを混合して使用すると、それぞれの芳香環同士の相互作用によって２３℃では固形状態を保つが、温度を上昇させるとしだいに相互作用が弱まり、ある温度領域で相転移現象を伴うことなく相互作用が急激に弱まり軟化し、一方、一定の温度に達しても芳香環同士の擬似架橋的な相互作用が残存していることによりそれ以上の流動化が抑えられるためであると考えられる。ただし、熱伝導性微粒子の配合量が増えると、種類によっては高温での弾性率が低下する傾向にあるので、本発明の放熱用部材の弾性率挙動は、熱可塑性樹脂、キシレン樹脂の種類及び配合量により適当に調整する必要がある。
【００２４】
また、上記キシレン樹脂は、粘着性付与剤としても働くものであることから、上記キシレン樹脂を配合することにより本発明の放熱用部材を発熱体及び放熱体に貼り付ける際の作業性が向上する。
【００２５】
上記熱可塑性樹脂組成物における上記キシレン樹脂の配合量の好ましい下限は１０体積％、上限は９０体積％である。１０体積％未満であると、放熱用部材の柔軟性が低く発熱体や放熱体に密着できず、充分な熱抵抗性能が得られない。９０体積％を超えると、２３℃で定形のシートを得ることが困難となることがある。
【００２６】
上記熱伝導性微粒子としては、例えば、窒化ホウ素、窒化アルミニウム、アルミナ、アルミニウム、炭化珪素、酸化亜鉛、銅、金属水酸化物、黒鉛、酸化マグネシウム、シリカから選ばれる少なくとも１種類以上の熱伝導性微粒子が挙げられる。上記金属水酸化物としては、例えば、水酸化マグネシウム、水酸化アルミニウム等が挙げられる。また、これらの熱伝導性微粒子は、高い配合割合で均一に混合できるように表面処理されていることが好ましい。
【００２７】
上記熱可塑性樹脂組成物における上記熱伝導性微粒子の配合量の好ましい下限は１０体積％、上限は９０体積％である。１０体積％未満であると、充分な熱伝導率が得られないことがあり、９０体積％を超えると、得られる放熱用部材の対アルミニウム接着力が低下して貼付作業性が低下することがある。
【００２８】
上記熱可塑性樹脂組成物は、所望の弾性率と対アルミニウム接着力を損なわない鞄囲であれば、必要に応じて、ハロゲン系化合物、リン酸エステル系化合物、金属水酸化物、酸化チタン等の難燃材；カーボンブラック、ホワイトカーボン等の着色剤；シラン系、チタネート系カップリング剤等の粉体表面改質剤；グリセリン脂肪酸系の分散剤；ビスフェノール系、ヒンダード・フェノール系等の酸化防止剤；クロマン樹脂、テルペンフェノール樹脂、フェノール樹脂、ロジン、テルペン樹脂、脂肪族炭化水素、脂環式炭化水素等の粘着付与剤等を含有してもよい。
【００２９】
本発明の放熱用部材の製造方法としては特に限定されず、例えば、所定量の熱可塑性樹脂と熱伝導性徴粒子とを、２本ロール、３本ロール、プラストミル、ニーダー、プラネタリーミキサー、バンバリーミキサー等を用いて混合し、それをコーティング成形、押し出し成形、プレス成形等によって所望の厚さのシート状に成形する方法等が挙げられる。
【００３０】
本発明の放熱用部材は、２３℃付近の常温においては定形であり極めて取り扱い性に優れ、効率よく発熱体と放熱体とを接続した接続構造体を作製することができる。この接続構造体の発熱体の温度を上昇させると、一定温度以上になった時点で、ガラス転移現象や融解等の潜熱吸収を伴う相転移現象を伴うことなく急速に本発明の放熱用部材が軟化して発熱体及び放熱体との接触面積が大きくなり、更にそれに伴って放熱用部材の厚みが減少して、優れた熱抵抗性能を発現することができる。しかも、かかる放熱用部材の変化は急速であり、発熱体の温度が発熱体にとって負荷となる温度に達するまで上昇してしまう前に起こることから、発熱体に温度負荷がかかることがない。更に、温度が上昇した場合であっても、本発明の放熱用部材はそれ以上流動化することなく、発熱体及び放熱体に密着し続け、発熱体に温度負荷がかかることがない。
【００３１】
このような、本発明の放熱用部材により発熱体と放熱体とを接続してなる接続構造体であって、上記放熱用部材は、発熱体の発熱により、上記発熱前よりも厚みが減少することが可能である接続構造体もまた、本発明の１つである。
【００３２】
また、本発明の放熱用部材により発熱体と放熱体とを接続してなる接続構造体であって、上記放熱用部材は、発熱体が発熱したことにより、上記発熱前よりも既に厚みが減少しているものである接続構造体もまた、本発明の１つである。
【００３３】
【実施例】
以下に実施例を掲げて本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されるものではない。
【００３４】
（実施例１）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体２０重量部、キシレン樹脂（三菱ガス化学社製、商品名「ニカノールＫＬ−０５」）８０重量部、及び、窒化アルミニウム（トクヤマ社製、商品名「グレードＦ」）１４０重量部をプラストミルで混合しスラリー状物を得た。このスラリー状物において窒化アルミニウムの体積比率は３０％であった。
【００３５】
次いで、プレス板の上に離型ＰＥＴフィルムを敷き、その上に厚みが１００μｍの金属枠を載せ、金属枠内に得られたスラリー状物を流し込んだ。次いで、離型ＰＥＴフィルムをその上に載せ上下からプレス板で挟み込み、室温下でプレス成形を行った。これにより、両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００３６】
（実施例２）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体２０重量部、キシレン樹脂（三菱ガス化学社製、商品名「ニカノールＫＬ−０５」）８０重量部、及び、窒化アルミニウム（トクヤマ社製、商品名「グレードＦ」）３３０重量部をプラストミルで混合しスラリー状物を得た。このスラリー状物において窒化アルミニウムの体積比率は５０％であった。
このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００３７】
（実施例３）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレン−スチレンブロック共重合体２０重量部、キシレン樹脂（三菱ガス化学社製、商品名「ニカノールＫＬ−０５」）４０重量部、キシレン樹脂（三菱ガス化学社製、商品名「ニカノールＬＬ」）２５重量部、液状ポリイソプレン（クラレ社製、商品名「ＬＩＲ３０」）１５重量部及び、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ２０Ｓ」）４００重量部、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ０５Ｓ」）２００重量部をプラストミルで混合し、スラリー状物を得た。このスラリー状物において窒化アルミニウムの体積比率は６０％であった。このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００３８】
（実施例４）
スチレン含量５５重量％、ジブロック比率１６重量％のスチレン−イソプレン−スチレンブロック共重合体１０重量部、スチレン含有量２２重量％、ジブロック比率６６重量％のスチレン−イソプレン−スチレンブロック共重合体１０重量部、キシレン樹脂（三菱ガス化学社製、商品名「ニカノールＫＬ−０５」）６５重量部、液状ポリイソプレン（クラレ社製、商品名「ＬＩＲ４０３」）１５重量部及び、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ２０Ｓ」）４００重量部、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ０５Ｓ」）２００重量部をプラストミルで混合し、スラリー状物を得た。このスラリー状物において窒化アルミニウムの体積比率は６０％であった。このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００３９】
（比較例１）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体３０重量部、ドデシルベンゼン７０重量部、及び、窒化アルミニウム（トクヤマ社製、商品名「グレードＦ」）７６０重量部をプラストミルで混合しスラリー状物を得た。このスラリー状物において窒化アルミニウムの体積比率は７０％であった。
このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００４０】
（比較例２）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体５０重量部、ドデシルベンゼン５０重量部、及び、窒化ホウ素（電気化学工業社製、商品名「グレードＳＧＰ」）２２６重量部をプラストミルで混合しスラリー状物を得た。このスラリー状物において窒化ホウ素の体積比率は５０％であった。このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００４１】
（比較例３）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体２０重量部の代わりにアクリル酸エステル系共重合体（根上工業社製、商品名「Ｓ−２０２２改２」：重量平均分子量２７万）１００重量部を、窒化アルミニウム（トクヤマ社製、商品名「グレードＦ」）１４０重量部の代わりに窒化ホウ素（電気化学工業社製、商品名「グレードＳＧＰ」）２２６重量部を用いたこと以外は実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００４２】
（比較例４）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体２０重量部、ドデシルベンゼン８０重量部、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ２０Ｓ」）４００重量部、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ０５Ｓ」）２００重量部、このスラリー状物において窒化アルミニウムの体積比率は６０％であった。このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００４３】
（比較例５）
スチレン含量２２重量％、ジブロック比率６６重量％のスチレン−イソプレンブロック共重合体２２重量部、スチレン含有量３０重量％、ジブロック比率３０重量％のスチレン−イソプレンブロック共重合体８重量部、キシレン樹脂（三菱ガス化学社製、商品名「ニカノールＫＬ−０５」）４５重量部、液状ポリイソプレン系ブロック共重合体（クラレ社製、商品名「ＫＬ２３０」）２５重量部及び、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ２０Ｓ」）４００重量部、アルミナ（昭和電工社製、商品名「ＣＢ−Ａ０５Ｓ」）２００重量部、このスラリー状物において窒化アルミニウムの体積比率は６０％であった。このスラリー状物を用いて、実施例１と同様にして両面に離型ＰＥＴフィルムが付いた厚さ１００μｍのシート状の放熱用部材を得た。
【００４４】
（比較例６）
市販のシリコングリースであるＤｏｗ Ｃｏｒｎｉｎｇ社製、商品名「＃３４０」を用いた。熱抵抗の評価の際には、放熱体の上に、中央を３５ｍｍ角にくり抜いた厚さ５０μｍのＰＥＴフィルムを置き、そのくり抜いた中央部にシリコングリースを流し込み、へらで余分なシリコングリースをかき落とすことにより、厚さ５０μｍのシリコングリースの層を形成した。
【００４５】
＜評 価＞
実施例１〜４及び比較例１〜６で得られた放熱用部材について、以下の方法により、熱抵抗、貯蔵弾性率及び高温流動性を評価した。
【００４６】
（熱抵抗の測定）
熱抵抗は、図１に示す測定装置により測定した。すなわち、アルミニウム製の冷却器１の上に離型ＰＥＴフィルムを剥がした放熱用部材２を貼り付け、更にその上に熱源となるＩＣを積層し、ボルト３により締め付けトルク１Ｎ・ｍで締め付けた。
【００４７】
ＩＣに電源を入れて８０Ｗ／ｈの電力を供給し、６０分後に、ＩＣの温度Ｔ１と、冷却器１の放熱用部材の近傍温度Ｔ２を測定した。なお、冷却器１は、内部に恒温水槽４から２３℃の水が供給循環されるようになっている。測定結果から熱抵抗を下記式で求めた。
【００４８】
【数１】
（貯蔵弾性率の測定）
ダイナミック・アナライザーＲＤＡＩＩ（レオメトリックス社製）を用い、０．１Ｈｚの条件で、２３℃、６０℃及び８０℃における放熱用部材の貯蔵弾性率を測定した。
【００５０】
（高温流動性の評価）
図２に示したように、アルミニウムからなる正立方体のブロックの側面に片面の離型ＰＥＴフィルムを剥がした放熱用部材を貼り付けた。このアルミニウムブロックを８０℃の恒温槽に保管し、１週間経過後に放熱用部材の流れ落ちの有無を目視にて観察した。
【００５１】
【表１】
【発明の効果】
本発明によれば、常温においては優れた取り扱い性を有し、発熱体と放熱体との間に介在し、高い柔軟性を有することにより発熱体及び放熱体に密着して効率よく発熱体から発生した熱を放熱体に伝導することができ、かつ、温度が上昇しても密着した状態を保つことができる放熱用部材、及び、該放熱用部材により発熱体と放熱体とを接続してなる接続構造体を提供できる。
【図面の簡単な説明】
【図１】放熱用部材の熱抵抗の測定に用いた測定装置を示す模式図である。
【図２】実施例における高温流動性の評価の方法を説明する模式図である。
【符号の説明】
１ 冷却器
２ 放熱用部材
３ ボルト
４ 恒温水槽
５ アルミニウムブロック[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention has excellent handleability at room temperature, is interposed between the heating element and the heat radiator, and has a high flexibility, so that it is closely adhered to the heating element and the heat radiator and efficiently generated from the heating element. A heat dissipating member that can conduct heat to the heat dissipating body and maintain a close contact state even when the temperature rises, and a connection formed by connecting the heat dissipating member and the heat dissipating member by the heat dissipating member Related to the structure.
[0002]
[Prior art]
BACKGROUND ART A heat-dissipating member such as a heat-dissipating sheet is used for the purpose of interposing between a heat-generating element such as an electric / electronic component and a heat-dissipating element and dissipating heat generated from the heat-generating element. However, not only electric and electronic parts, but also the surfaces of many heat generating elements and heat radiating elements are not smooth, so that the heat radiating element cannot be in close contact with the heat generating element and the heat radiating element. When the contact area is reduced, the heat transfer efficiency from the heat generating element to the heat radiating element is reduced, and the heat radiating performance of the heat radiating member cannot be sufficiently exhibited.
[0003]
The thermal resistance between the heating element and the heat radiator is called thermal resistance. The smaller the thermal resistance, the better the heat transfer from the heating element to the heat radiator, and the higher the heat radiation effect. Therefore, in order to reduce the thermal resistance, the heat dissipating member is required to have excellent flexibility. Therefore, conventionally, a heat-dissipating grease containing heat-conducting particles as a heat-dissipating member; a heat-dissipating sheet or the like in which the heat-conducting particles are dispersed in a flexible and resilient resin such as silicone rubber or an acrylate resin are used. Had been.
[0004]
As a heat radiation grease, for example, Patent Literature 1 listed below discloses a silicone oil-based grease containing thermally conductive particles such as zinc white, alumina, and aluminum nitride. Since such a heat radiation grease is a fluid viscous substance, a large contact area can be obtained when the heat radiation grease is interposed between the heating element and the heat radiation element, so that excellent heat resistance performance can be exhibited. However, when applied to a heating element or a heat radiating element, there is a problem that dirt or the like in a peripheral portion is generated and workability is low, and there is a high possibility that a variation in work occurs and thermal resistance performance is changed. .
[0005]
As a heat radiation sheet, for example,
[0006]
On the other hand, Patent Document 3 listed below discloses an α-olefin-based thermoplastic component having a melting temperature of about 50 to 60 ° C. and a paraffin-based wax having a melting temperature of about 60 to 70 ° C. with respect to an acrylic pressure-sensitive adhesive component. A heat dissipating member in which compounds such as components are mixed is disclosed. These heat-dissipating members increase the temperature of the heating element by applying a voltage, and when they reach the melting temperature of the mixed alpha-olefin-based thermoplastic component and paraffin-based wax component, they soften rapidly, improving their flexibility. Thus, the heat resistance performance is improved.
[0007]
However, since a compound having such a melting temperature is a solid having no adhesive property at a temperature around 23 ° C. at which the compound is attached to a heating element or a heat radiating element, the pressure of the acrylic pressure-sensitive adhesive component containing the compound is low. The workability is impaired, and the workability of application is reduced. Further, when the temperature of the heating element rises and exceeds the melting temperature, it takes some time until all the compounds are melted, so that the temperature of the heating element once rises rapidly. Then, when the compound having a melting temperature is melted and the flexibility of the heat radiating member is improved, and the heat generating body and the heat radiating body are in close contact with each other to improve the heat transfer coefficient, the temperature of the heat generating body rapidly drops. For this reason, there is a problem that the heat load is applied to the heating element for a short time.
[0008]
In addition, even if the temperature of the heating element rises and the compound melts, the flexibility of the heat dissipating member improves, and the heat transfer coefficient improves due to the close contact between the heating element and the heat dissipating element, even if the temperature continues to increase. However, there is also a problem that a molten compound having a low melt viscosity flows out of the heat radiating member, and as a result, the adhesiveness is impaired, the heat transfer coefficient is deteriorated, and the temperature of the heating element may increase. Was.
[0009]
[Patent Document 1]
Japanese Patent Publication No. 6-39591 [Patent Document 2]
JP-A-6-88061 [Patent Document 3]
Japanese Patent Publication No. 2000-509209
[Problems to be solved by the invention]
In view of the above situation, the present invention has excellent handleability at room temperature, intervenes between the heating element and the heat radiator, and has high flexibility to adhere to the heating element and the heat radiator efficiently. A heat-dissipating member that can conduct heat generated from the heat-emitting element to the heat-dissipating element and maintain a close contact state even when the temperature rises; An object of the present invention is to provide a connection structure formed by connection.
[0011]
[Means for Solving the Problems]
The present invention is a heat-dissipating member comprising a thermoplastic resin composition containing a thermoplastic resin and heat conductive fine particles, and not containing a compound having a melting temperature of 40 to 80 ° C. The storage elastic modulus at 1 Hz is 50,000 Pa or more, and the shape is maintained. The storage elastic modulus at 0.1 Hz at 50 to 80 ° C. is 400 to 10000 Pa, and at 100 ° C., 0.1 Hz. The heat radiating member has a storage elastic modulus at the time of 5000 Pa or less and is indefinite.
[0012]
Hereinafter, the present invention will be described in detail.
The heat-dissipating member of the present invention has a storage elastic modulus at 0.1 Hz of not less than 50,000 Pa at 23 ° C. and has a fixed shape. Therefore, at a temperature of around 23 ° C. at which the work of sticking to the heating element or the heat radiator is performed, the sheet can be used in the form of a fixed sheet, and excellent sticking workability is exhibited.
[0013]
In the present invention, the storage elastic modulus at 0.1 Hz at 50 to 80 ° C. is 400 to 10000 Pa, and the storage elastic modulus at 0.1 Hz at 100 ° C. is 5000 Pa or less and is amorphous. Therefore, in the present invention, when the temperature of the heating element is increased by applying a voltage, the heat dissipation member is rapidly softened, and when the temperature reaches 50 ° C. to 80 ° C., the flexibility is improved. The contact area is improved, and excellent heat resistance performance is exhibited. However, since the storage elastic modulus is 400 Pa or more even at a temperature of 50 to 80 ° C., the heat dissipation member flows out and separates from the heating element and the heat dissipation element. Never. Further, since the storage elastic modulus at 100 ° C. is 5000 Pa or less, sheet processing is excellent.
[0014]
The storage elastic modulus can be measured by a dynamic viscoelasticity measuring device such as a dynamic analyzer RDAII manufactured by Rheometrics.
If the storage elastic modulus at 0.1 Hz at a temperature of 23 ° C. is less than 50,000 Pa, it will be too soft and difficult to handle, and it will be difficult to perform the sticking operation. On the other hand, if the storage elastic modulus at 0.1 Hz at a temperature of 50 to 80 ° C. exceeds 10,000 Pa, the flexibility of the heat-radiating member is low and the heat-radiating member cannot adhere to the heat-generating body or the heat-radiating body. I can't. Further, if the storage elastic modulus at 0.1 Hz at a temperature of 50 to 80 ° C. is less than 400 Pa, the heat radiating member becomes too soft and flows out and separates from the heat generating element and the heat radiating element. If the storage elastic modulus at 0.1 Hz at a temperature of 100 ° C. exceeds 5000 Pa, the heat-dissipating member becomes hard, and sheet processing becomes difficult.
[0015]
In the present invention, since the storage elastic modulus changes rapidly between 40 ° C. and 60 ° C. without a phase transition phenomenon, the heat dissipating member gradually adheres as the temperature of the heating element rises. As the temperature of the heating element rises and the heat dissipating member softens, the contact area between the heating element and the heat dissipating body increases, and there is no time delay until the heat resistance performance is developed. There is no sudden rise in body temperature, and no temperature load is applied to the heating element.
[0016]
Further, in a thermoplastic resin composition that does not involve a phase transition phenomenon, it is often difficult to handle it as a heat-radiating member because it may be softened by heating slightly at room temperature or slightly higher than room temperature, or adhesiveness may appear on the resin surface. However, it can maintain a fixed shape at low temperature and is excellent in handleability.
[0017]
In the thermoplastic resin composition according to the present invention, when the temperature exceeds 60 ° C., the decrease in the storage elasticity becomes gentle, and the storage resin becomes too soft and does not flow away from the heat generating body and the heat radiating body. The heat generating body can be kept in close contact with the body and the heat radiating body, and the heat generated from the heating body can be efficiently transmitted to the heat radiating body.
[0018]
The heat-dissipating member of the present invention preferably has an adhesive strength to aluminum at 23 ° C. of 0.5 N / cm 2 or more. Thereby, it has high adhesiveness to the heating element and the heat radiator, and the sticking workability when attaching the heat radiating member to the heating element and the heat radiator is improved.
[0019]
The heat-dissipating member of the present invention is not particularly limited, but is preferably processed into a sheet and used. By making it into a sheet shape, the sticking workability is remarkably improved.
When used in the form of a sheet, if the sheet is too thin, the handleability will be reduced, and it will be difficult to sufficiently fill the gap when interposed between the heating element and the heat radiating element. If too large, the thermal resistance performance tends to decrease. Therefore, it is preferable that the lower limit of the thickness of the heat radiation member of the present invention is 20 μm and the upper limit is 400 μm.
[0020]
The heat dissipating member of the present invention is made of a thermoplastic resin composition containing a thermoplastic resin and heat conductive fine particles.
Examples of the thermoplastic resin include (meth) acrylate ester copolymers; styrene block copolymers such as styrene-butadiene-styrene block copolymer and styrene-isoprene-styrene block copolymer; ethylene-vinyl acetate Resin, butadiene resin, isobutylene resin, olefin resin, urethane resin, epoxy resin, vinyl acetate resin, styrene resin, butyral resin, polyvinyl alcohol resin, silicon resin; modified resins of these And the like. These may be used alone or in combination of two or more. Among them, acrylic ester-based copolymers, styrene-based block copolymers, and butyl rubber-based resins are preferable because they are relatively easy to design to realize the above storage elastic modulus. For example, in the case of an acrylate-based copolymer, if the weight average molecular weight of the copolymer is 200,000 or less, the above-mentioned storage modulus can be exhibited.
[0021]
In the case of a styrene-isoprene-styrene block copolymer, if the styrene-isoprene diblock ratio is 50% by weight or more and the styrene content is 25% by weight or less, the above-mentioned storage modulus can be exhibited. it can. With SIS, it is easy to control a sudden change in the elastic modulus from 23 ° C. to 50 ° C. based on the diblock ratio and the styrene content.
[0022]
It is preferable that the thermoplastic resin is not a resin having a melting point near the operating limit temperature on the high temperature side of a heating element such as an electronic component such as an IC. Further, even in the case of a resin having a glass transition temperature, it is preferable that the glass transition temperature measured using a differential calorimeter is not close to the maximum proper operating temperature on the high temperature side of a heating element such as an electronic component such as an IC. The melting of these resins and the latent heat absorption in the glass transition phenomenon may also cause a delay in the time until the heating element or the heat dissipating member and the heat dissipating member come into close contact with each other.
[0023]
In addition, when a solid aromatic thermoplastic resin at 23 ° C. such as a styrene-based block copolymer is used as the thermoplastic resin, it is preferable to further include a xylene resin that is a viscous body at 23 ° C. . By adding such a xylene resin, a more rapid change occurs in the behavior of the storage modulus between 23 ° C. and 50 ° C., and furthermore, a gradual change in the storage modulus above 50 ° C. is realized. Can be. This is because when an aromatic thermoplastic resin solid at 23 ° C. and a xylene resin that is viscous at 23 ° C. are mixed and used, the solid state is maintained at 23 ° C. due to the interaction between the respective aromatic rings. As the temperature rises, the interaction weakens and the interaction rapidly weakens and softens without a phase transition phenomenon in a certain temperature range, while the pseudo-crosslinking of aromatic rings occurs even when a certain temperature is reached. This is probably because the remaining interaction suppresses further fluidization. However, when the blending amount of the heat conductive fine particles increases, the elastic modulus at a high temperature tends to decrease depending on the type, the elastic modulus behavior of the heat dissipation member of the present invention, the thermoplastic resin, the type of xylene resin and It is necessary to adjust appropriately according to the compounding amount.
[0024]
In addition, since the xylene resin also functions as a tackifier, the workability when attaching the heat-dissipating member of the present invention to the heat-generating body and the heat-radiating body is improved by blending the xylene resin. .
[0025]
The preferable lower limit of the amount of the xylene resin in the thermoplastic resin composition is 10% by volume, and the upper limit is 90% by volume. If the content is less than 10% by volume, the heat-radiating member has low flexibility and cannot be adhered to the heat-generating body or the heat-radiating body, so that sufficient heat resistance cannot be obtained. If the content exceeds 90% by volume, it may be difficult to obtain a sheet having a fixed shape at 23 ° C.
[0026]
Examples of the heat conductive fine particles include, for example, at least one kind of heat conductivity selected from boron nitride, aluminum nitride, alumina, aluminum, silicon carbide, zinc oxide, copper, metal hydroxide, graphite, magnesium oxide, and silica. Fine particles. Examples of the metal hydroxide include magnesium hydroxide and aluminum hydroxide. Further, it is preferable that these heat conductive fine particles have been subjected to a surface treatment so as to be uniformly mixed at a high blending ratio.
[0027]
The preferred lower limit of the amount of the heat conductive fine particles in the thermoplastic resin composition is 10% by volume, and the upper limit is 90% by volume. If the content is less than 10% by volume, sufficient thermal conductivity may not be obtained. If the content is more than 90% by volume, the resulting heat-radiating member may have low adhesive strength to aluminum and may have poor sticking workability. is there.
[0028]
If the thermoplastic resin composition is a bag that does not impair the desired elastic modulus and adhesive strength to aluminum, if necessary, a halogen compound, a phosphate compound, a metal hydroxide, titanium oxide, etc. Flame retardants; Colorants such as carbon black and white carbon; Powder surface modifiers such as silane-based and titanate-based coupling agents; Dispersants based on glycerin fatty acids; Antioxidants based on bisphenols, hindered phenols, etc. A tackifier such as a chroman resin, a terpene phenol resin, a phenol resin, a rosin, a terpene resin, an aliphatic hydrocarbon, or an alicyclic hydrocarbon may be contained.
[0029]
The method for producing the heat-dissipating member of the present invention is not particularly limited. For example, a predetermined amount of a thermoplastic resin and thermally conductive particles are rolled in two rolls, three rolls, a plast mill, a kneader, a planetary mixer, and a banbury mixer. And the like, and forming the mixture into a sheet having a desired thickness by coating molding, extrusion molding, press molding, or the like.
[0030]
The heat-dissipating member of the present invention has a fixed shape at room temperature around 23 ° C., is extremely excellent in handleability, and can efficiently produce a connection structure in which the heat-generating element and the heat-dissipating element are connected. When the temperature of the heating element of the connection structure is increased, when the temperature reaches a certain temperature or higher, the heat-radiating member of the present invention can be rapidly cooled without a phase transition phenomenon involving latent heat absorption such as a glass transition phenomenon and melting. It softens and the contact area between the heat generating element and the heat radiating element increases, and further, the thickness of the heat radiating member decreases, thereby exhibiting excellent heat resistance performance. Moreover, such a change of the heat radiating member is rapid, and occurs before the temperature of the heating element rises until it reaches a temperature that becomes a load on the heating element, so that no temperature load is applied to the heating element. Furthermore, even when the temperature rises, the heat-dissipating member of the present invention does not flow any more and keeps in close contact with the heating element and the heat-dissipating element, so that no temperature load is applied to the heating element.
[0031]
In such a connection structure in which the heat-generating member and the heat-radiating member are connected by the heat-radiating member of the present invention, the heat-radiating member has a thickness smaller than that before the heat generation due to the heat generated by the heat-generating member. A connection structure that is capable of being also a part of the present invention.
[0032]
Further, a connection structure formed by connecting the heating element and the heat radiating body by the heat radiating member of the present invention, wherein the heat radiating member has a thickness already reduced than before the heat generation due to the heating element generating heat. The connecting structure is also one of the present invention.
[0033]
【Example】
Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
[0034]
(Example 1)
20 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, 80 parts by weight of a xylene resin (manufactured by Mitsubishi Gas Chemical Company, trade name "Nicanol KL-05"), and aluminum nitride 140 parts by weight (trade name “grade F”, manufactured by Tokuyama Corporation) were mixed with a plastmill to obtain a slurry. In this slurry, the volume ratio of aluminum nitride was 30%.
[0035]
Next, a release PET film was laid on the press plate, a metal frame having a thickness of 100 μm was placed thereon, and the obtained slurry was poured into the metal frame. Next, the release PET film was placed thereon, sandwiched by press plates from above and below, and press-formed at room temperature. As a result, a sheet-shaped heat-dissipating member having a thickness of 100 μm and having a release PET film on both sides was obtained.
[0036]
(Example 2)
20 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, 80 parts by weight of a xylene resin (manufactured by Mitsubishi Gas Chemical Company, trade name "Nicanol KL-05"), and aluminum nitride 330 parts by weight (trade name “grade F”, manufactured by Tokuyama Corporation) were mixed with a plastmill to obtain a slurry. The volume ratio of aluminum nitride in this slurry was 50%.
Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0037]
(Example 3)
20 parts by weight of a styrene-isoprene-styrene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, xylene resin (manufactured by Mitsubishi Gas Chemical Company, trade name "Nicanol KL-05") 40 parts by weight, xylene resin 25 parts by weight (manufactured by Mitsubishi Gas Chemical Company, trade name "Nicanol LL"), 15 parts by weight of liquid polyisoprene (manufactured by Kuraray, trade name "LIR30") and alumina (manufactured by Showa Denko KK, trade name "CB-A20S") )) And 200 parts by weight of alumina (trade name “CB-A05S” manufactured by Showa Denko KK) were mixed with a plast mill to obtain a slurry. In this slurry, the volume ratio of aluminum nitride was 60%. Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0038]
(Example 4)
10 parts by weight of a styrene-isoprene-styrene block copolymer having a styrene content of 55% by weight and a diblock ratio of 16% by weight, and a styrene-isoprene-styrene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight. Parts by weight, 65 parts by weight of xylene resin (manufactured by Mitsubishi Gas Chemical Company, trade name "Nicanol KL-05"), 15 parts by weight of liquid polyisoprene (manufactured by Kuraray, trade name "LIR403"), and alumina (manufactured by Showa Denko KK) CB-A20S) and 200 parts by weight of alumina (trade name: CB-A05S, manufactured by Showa Denko KK) were mixed with a plast mill to obtain a slurry. In this slurry, the volume ratio of aluminum nitride was 60%. Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0039]
(Comparative Example 1)
30 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, 70 parts by weight of dodecylbenzene, and 760 parts by weight of aluminum nitride (trade name “grade F” manufactured by Tokuyama Corporation) The mixture was mixed by a plast mill to obtain a slurry. In this slurry, the volume ratio of aluminum nitride was 70%.
Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0040]
(Comparative Example 2)
50 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, 50 parts by weight of dodecylbenzene, and 226 parts by weight of boron nitride (trade name “Grade SGP” manufactured by Denki Kagaku Kogyo Co., Ltd.) The parts were mixed with a plastmill to obtain a slurry. In this slurry, the volume ratio of boron nitride was 50%. Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0041]
(Comparative Example 3)
Instead of 20 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, an acrylate-based copolymer (manufactured by Negami Kogyo Co., Ltd., trade name "S-2022
[0042]
(Comparative Example 4)
20 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, 80 parts by weight of dodecylbenzene, 400 parts by weight of alumina (trade name "CB-A20S" manufactured by Showa Denko KK), alumina 200 parts by weight (trade name “CB-A05S” manufactured by Showa Denko KK), and the volume ratio of aluminum nitride in this slurry was 60%. Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0043]
(Comparative Example 5)
22 parts by weight of a styrene-isoprene block copolymer having a styrene content of 22% by weight and a diblock ratio of 66% by weight, 8 parts by weight of a styrene-isoprene block copolymer having a styrene content of 30% by weight and a diblock ratio of 30% by weight, xylene 45 parts by weight of resin (manufactured by Mitsubishi Gas Chemical Company, trade name "Nicanol KL-05"), 25 parts by weight of liquid polyisoprene-based block copolymer (manufactured by Kuraray, trade name "KL230"), and alumina (Showa Denko Corporation) (CB-A20S), 200 parts by weight of alumina (manufactured by Showa Denko KK, "CB-A05S"), and the volume ratio of aluminum nitride in this slurry was 60%. Using this slurry, a heat-dissipating member in the form of a sheet having a thickness of 100 μm and having a release PET film on both sides was obtained in the same manner as in Example 1.
[0044]
(Comparative Example 6)
A commercially available silicon grease manufactured by Dow Corning, trade name “# 340” was used. When evaluating the thermal resistance, place a 50-μm-thick PET film whose center is hollowed out into a 35 mm square on the radiator, pour silicone grease into the hollowed-out center, and scrape excess silicon grease with a spatula. By dropping, a layer of silicon grease having a thickness of 50 μm was formed.
[0045]
<Evaluation>
The heat-dissipating members obtained in Examples 1 to 4 and Comparative Examples 1 to 6 were evaluated for thermal resistance, storage elastic modulus, and high-temperature fluidity by the following methods.
[0046]
(Measurement of thermal resistance)
The thermal resistance was measured by the measuring device shown in FIG. That is, a heat-dissipating
[0047]
Power was supplied to the IC to supply 80 W / h, and after 60 minutes, the temperature T1 of the IC and the temperature T2 near the heat dissipating member of the cooler 1 were measured. The cooler 1 is configured such that water at 23 ° C. is supplied and circulated from the thermostatic water tank 4 inside. From the measurement results, the thermal resistance was determined by the following equation.
[0048]
(Equation 1)
(Measurement of storage modulus)
Using a dynamic analyzer RDAII (manufactured by Rheometrics), the storage elastic modulus of the heat-dissipating member at 23 ° C., 60 ° C. and 80 ° C. was measured at 0.1 Hz.
[0050]
(Evaluation of high temperature fluidity)
As shown in FIG. 2, a heat-dissipating member from which a release PET film was peeled off on one side was attached to the side surface of a cubic block made of aluminum. The aluminum block was stored in a constant temperature bath at 80 ° C., and after one week, it was visually observed whether or not the heat-dissipating member had run off.
[0051]
[Table 1]
【The invention's effect】
According to the present invention, it has excellent handleability at room temperature, intervenes between the heating element and the heat radiating body, and has high flexibility, so that it is in close contact with the heating element and the heat radiating element, and efficiently from the heating element. A heat dissipating member capable of conducting generated heat to the heat dissipating member and maintaining a close contact state even when the temperature rises, and connecting the heat dissipating member and the heat dissipating member by the heat dissipating member. Connection structure can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a measuring device used for measuring the thermal resistance of a heat radiating member.
FIG. 2 is a schematic diagram illustrating a method for evaluating high-temperature fluidity in an example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1
Claims (6)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003078203A JP4119287B2 (en) | 2003-03-20 | 2003-03-20 | Heat dissipation member and connection structure |
| US10/523,409 US20050155751A1 (en) | 2002-08-09 | 2003-08-08 | Heat-dissipating member and joined structure |
| EP03784597A EP1542281A1 (en) | 2002-08-09 | 2003-08-08 | Heat-dissipating member and joined structure |
| PCT/JP2003/010112 WO2004015768A1 (en) | 2002-08-09 | 2003-08-08 | Heat-dissipating member and joined structure |
| CNB038186071A CN100339983C (en) | 2002-08-09 | 2003-08-08 | Heat radiating member and connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003078203A JP4119287B2 (en) | 2003-03-20 | 2003-03-20 | Heat dissipation member and connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004288825A true JP2004288825A (en) | 2004-10-14 |
| JP4119287B2 JP4119287B2 (en) | 2008-07-16 |
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|---|---|---|---|
| JP2003078203A Expired - Fee Related JP4119287B2 (en) | 2002-08-09 | 2003-03-20 | Heat dissipation member and connection structure |
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| JP (1) | JP4119287B2 (en) |
Cited By (7)
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| JP2006274094A (en) * | 2005-03-30 | 2006-10-12 | Kaneka Corp | Composition for heat dissipation sheet and heat dissipation sheet obtained by curing the same |
| JP2007070595A (en) * | 2004-12-21 | 2007-03-22 | Tokai Rubber Ind Ltd | Highly damping elastomer composition and seismic-control damper obtained by the same |
| JP2012158695A (en) * | 2011-02-01 | 2012-08-23 | Hitachi Chemical Co Ltd | Heat conductive sheet and heat dissipation plate |
| WO2015151604A1 (en) * | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | Heat conductive sheet and method for producing heat conductive sheet |
| WO2020039561A1 (en) * | 2018-08-23 | 2020-02-27 | 日立化成株式会社 | Semiconductor device production method and thermally conductive sheet |
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| US11456229B2 (en) | 2017-07-24 | 2022-09-27 | Sekisui Chemical Co., Ltd. | Thermally conductive sheet |
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- 2003-03-20 JP JP2003078203A patent/JP4119287B2/en not_active Expired - Fee Related
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| JP2007070595A (en) * | 2004-12-21 | 2007-03-22 | Tokai Rubber Ind Ltd | Highly damping elastomer composition and seismic-control damper obtained by the same |
| JP2006274094A (en) * | 2005-03-30 | 2006-10-12 | Kaneka Corp | Composition for heat dissipation sheet and heat dissipation sheet obtained by curing the same |
| JP4629475B2 (en) * | 2005-03-30 | 2011-02-09 | 株式会社カネカ | Composition for heat dissipation sheet and heat dissipation sheet obtained by curing the composition |
| JP2012158695A (en) * | 2011-02-01 | 2012-08-23 | Hitachi Chemical Co Ltd | Heat conductive sheet and heat dissipation plate |
| WO2015151604A1 (en) * | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | Heat conductive sheet and method for producing heat conductive sheet |
| US11456229B2 (en) | 2017-07-24 | 2022-09-27 | Sekisui Chemical Co., Ltd. | Thermally conductive sheet |
| KR20210046672A (en) * | 2018-08-23 | 2021-04-28 | 쇼와덴코머티리얼즈가부시끼가이샤 | Semiconductor device manufacturing method and thermal conductive sheet |
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