JP2004281658A - Conductor film pattern and its forming method, wiring board, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a superior conductor film pattern by an ink jet method, whatever material a substrate is made of. <P>SOLUTION: The method of forming the conductor film pattern comprises a process of forming a first interconnection layer 20 on top of a substrate 10 for separation which is formed with a porous receptive layer 12, and a process of separating the first wiring layer 20 from the substrate 10 for separation by adhering the first wiring layer 20 to a substrate 100. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a conductive film pattern and a method for forming the same, a wiring board, and an electronic device.
[0002]
[Background Art]
For example, a lithography method is used for manufacturing wiring used for an electronic circuit or an integrated circuit. In this lithography method, a wiring is formed by forming a mask layer having a predetermined pattern on a substrate on which a conductive film is applied in advance, and etching the conductive film according to the mask layer. This lithography method requires large-scale equipment such as a vacuum apparatus and complicated processes, and has a material use efficiency of only about several percent, and almost all of the material must be discarded, resulting in high manufacturing costs.
[0003]
In recent years, a method has been developed in which a predetermined material is discharged onto a substrate by an inkjet method to form wirings, insulating layers, and the like included in various electro-optical devices in a predetermined pattern. For example, Patent Literature 1 proposes a method in which a liquid material in which conductive fine particles are dispersed is pattern-coated directly on a substrate by an inkjet method, and then heat treatment or laser irradiation is performed to convert the liquid into a conductive film pattern. According to this method, there is an advantage that the process of forming the wiring is greatly simplified, and the amount of raw materials used can be reduced.
[0004]
However, the above-described method of forming a wiring pattern by the inkjet method has the following problems. For example, in a miniaturized device, formation of fine wiring is desired, but in order to keep the line width within a desired dimension, for example, a lyophilic pattern and a lyophobic pattern are formed on a substrate, and an inkjet method is used. A method in which the droplet to be discharged is arranged only in the lyophilic portion, or a method in which the droplet is discharged onto the lyophobic substrate so that the line width is not widened, in which case the bulge called bulge does not occur As described above, a method of controlling the overlap between adjacent droplets is considered.
[0005]
[Patent Document 1]
U.S. Pat. No. 5,132,248
[0006]
[Problems to be solved by the invention]
An object of the present invention is to form a good conductive film pattern by an inkjet method regardless of the material of a substrate.
[0007]
[Means for Solving the Problems]
(1) A method for forming a conductive film pattern according to the present invention includes the steps of: forming a first conductive film pattern on a separation substrate provided with a porous receiving layer;
Separating the first conductive film pattern from the separation substrate by adhering the first conductive film pattern to the substrate.
[0008]
According to the method for forming a conductive film pattern of the present invention, instead of forming a wiring layer by directly discharging a conductive liquid on a substrate, first, a conductive liquid is formed on a separation substrate on which a receiving layer is formed. The wiring is formed by directly discharging the liquid. Next, after joining the base and the separation base, the separation base is peeled off, whereby a conductive film pattern can be easily formed on the base. Therefore, a desired conductive film pattern can be adhered to the substrate regardless of the material of the substrate. The first conductive film pattern is formed on the porous receiving layer. Therefore, for example, when a liquid material containing conductive fine particles is formed by a droplet discharge method, the liquid component is absorbed by the porous receiving layer, and the conductive fine particles can remain on the receiving layer. As a result, a conductive film pattern having a good shape can be formed even with a fine conductive film pattern, and the releasability of the conductive film pattern can be improved.
[0009]
The present invention can further take the following aspects.
[0010]
(A) In the method for forming a conductive film pattern according to the present invention, the receiving layer may be a layer containing at least one of porous silica particles, alumina, and alumina hydrate and a binder.
[0011]
(B) In the method for forming a conductive film pattern according to the present invention, the first conductive film pattern may be formed by a droplet discharging method. According to this aspect, it is not necessary to form a conductive material on the entire surface of the substrate, so that the use efficiency of the raw material can be increased and the manufacturing cost can be reduced.
[0012]
(C) In the method for forming a conductive film pattern according to the present invention, the bonding may be performed via an adhesive layer provided on the base.
[0013]
(D) In the method for forming a conductive film pattern according to the present invention, a resin layer having a function of adhering the first conductive film pattern may be used as the base. According to this aspect, for example, by using polyimide which is a thermosetting resin, a polyimide wiring substrate can be formed in a simpler process.
[0014]
(E) In the method for forming a conductive film pattern according to the present invention, further comprising: (a) forming a plug at a predetermined position on the substrate to which the first conductive film pattern is adhered;
(B) laminating the substrate and the substrate to which the second conductive film pattern is adhered. According to this aspect, a multilayer wiring layer can be formed by a simple process, and high integration can be achieved.
[0015]
(F) The method for forming a conductive film pattern of the present invention may include stacking a plurality of conductive film patterns by repeating the above (a) and (b).
[0016]
(G) In the method for forming a conductive film pattern according to the present invention, the lamination may be performed via an adhesive layer provided on the base.
[0017]
(2) The conductive film pattern of the present invention is formed by the conductive film pattern forming method of the present invention. The conductive film pattern of the present invention can be obtained by a simple forming method even when having a fine pattern, and a highly reliable conductive film pattern can be provided.
[0018]
(3) The wiring board of the present invention has the conductive film pattern of the present invention as a wiring.
[0019]
(4) In the wiring board of the present invention, the wiring board of the above invention is joined to another wiring board.
[0020]
(5) An electronic device of the present invention has the conductive film pattern according to claim 9 as a wiring.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
1. First embodiment
Hereinafter, an embodiment of a method for forming a conductive film pattern according to the present invention will be described with reference to FIGS.
[0022]
(1) As shown in FIG. 1, a receiving layer 12 is formed on a separation substrate 10. The substrate for separation 10 is not particularly limited as long as it is a substrate on which the receiving layer 12 can be formed, and a glass substrate, a resin substrate such as polyimide, or the like can be used. As a material of the receiving layer 12, a porous layer having pores is used. The receiving layer 12 is formed by applying a mixture of at least one of porous silica particles, alumina, and alumina hydrate and a binder. It is formed by applying a mixture of the silica particles and the binder, evaporating a liquid component in the mixture, performing a drying treatment, and solidifying the binder.
[0023]
Here, as the porous silica particles used, those having an average particle diameter of about 2 to 50 μm, an average pore diameter of about 8 to 50 nm, and a pore volume of about 0.8 to 2.5 cc / g are preferable. The porous silica particles may contain 20% by weight or less of boria, magnesia, zirconia, titania and the like.
[0024]
Examples of the alumina or alumina hydrate include a porous aluminum oxide having a radius of 3 to 10 nm and a sum of pore volumes of 0.2 to 1.5 cc / g, and a hydrate thereof. As a means for measuring pore properties, the distribution of pores in the dry solid content of alumina or alumina hydrate is measured by a nitrogen adsorption method (constant flow rate method) using, for example, Omnisorp 100 manufactured by Omicron Technology Co., Ltd. can do. And it is more preferable that the sum of the pore volumes having a radius of 3 to 10 nm is 0.2 to 1.5 cc / g. The amount of alumina or alumina hydrate used is preferably about 5 to 50% by weight based on the porous silica particles.
[0025]
The alumina or alumina hydrate may be either crystalline or amorphous, and may be in any form such as irregular particles or spherical particles. A gel obtained by using an alumina sol and drying it is particularly preferable. Among them, the pseudo-boehmite is preferably a pseudo-boehmite sol obtained by drying the sol.
[0026]
As the binder, mainly polyvinyl alcohol is suitably used, but in addition, various modified polyvinyl alcohols such as cation-modified, anion-modified and silanol-modified, starch derivatives and modified products thereof, cellulose derivatives, styrene-maleic acid copolymer and the like Can be used alone or in combination as appropriate.
[0027]
As a method of applying the mixture, various methods such as an air knife coater, a blade coater, a bar coater, a rod coater, a roll coater, a gravure coater, a size press, a spin coat, a droplet discharge method, and a screen printing can be adopted. .
[0028]
For the purpose of evaporating the liquid component in the mixture of the porous silica particles and / or alumina or alumina hydrate and the binder and further solidifying the binder, the following method can be used as a drying treatment. As such a drying treatment, a method of performing a heating treatment at a temperature at which the silica particles and the alumina particles are not sintered, for example, a temperature of about 50 to 130 ° C., a method of reducing the pressure, and a combination of these heating and reducing treatment It is possible to adopt a method of using them together. By performing the drying treatment in this manner, the porous silica particles or alumina or alumina hydrate constituting the receiving layer 12 becomes a porous layer in which minute pores are formed between the particles or the like. .
[0029]
Further, the receiving layer 12 formed as described above may be a plurality of layers having different materials and structures. For example, a mixture of porous silica particles and alumina hydrate and a binder is applied as described above, a drying process is performed to form a porous layer, and then a mixture of porous silica particles and alumina and a binder is applied. By performing the drying treatment, the receiving layer 12 including a plurality of layers made of different materials can be formed.
[0030]
The thickness of the receiving layer 12 used in normal inkjet printing is about 10 μm to 100 μm, but when a conductive pattern is formed, a smaller thickness is preferable. In this case, for example, when applying a mixture of at least one of alumina and alumina hydrate and a binder, the mixture is further diluted with a solvent and then applied, or spin-coated to obtain a film having a thickness of 1 μm. The following receiving layer 12 can be formed.
[0031]
Further, if necessary, in forming such a receiving layer 12, instead of coating on the entire surface of the substrate, it is also possible to selectively apply only on necessary portions. This can be performed, for example, by employing screen printing or application by a droplet discharge method. In some cases, after the receiving layer 12 is applied to the entire surface, unnecessary portions may be removed by further performing resist application, exposure, development, and etching.
[0032]
The receiving layer 12 can be formed by the above-described manufacturing method, but a commercially available hole-type receiving layer 12 can also be used.
[0033]
(2) Next, as shown in FIG. 2, a conductive film pattern 20 is formed on the separation substrate 10 on which the receiving layer 12 is formed by a droplet discharging method. Note that this droplet discharge method is sometimes called an inkjet method. In the droplet discharging method, a conductive film pattern 20 is formed by discharging a droplet (a liquid containing conductive fine particles) made of a liquid containing a film forming component to a predetermined film forming region of the receiving layer 12. You. The discharging step is performed a plurality of times so that the conductive film pattern 20 having a desired film thickness is obtained. At this time, since the liquid material containing the conductive fine particles is discharged onto the porous receiving layer 12, the liquid component is absorbed by the receiving layer 12 and the conductive fine particles remain on the receiving layer 12. It will be. As a result, the liquid component can be almost eliminated from the liquid material containing the film-forming component, and there is no need to provide a drying step between the discharging steps, so that a conductive film pattern having a desired thickness can be efficiently formed. . In particular, when forming a thick conductive film pattern, a drying step may be provided as necessary. After the conductive fine particle pattern is formed on the receiving layer 12 in this manner, heat treatment is performed and firing is performed, so that the conductive film pattern 20 is formed.
[0034]
As a liquid containing conductive fine particles, a liquid (dispersion liquid) in which conductive fine particles are dispersed in a liquid (dispersion medium) is used. The conductive fine particles used here include metal fine particles containing any of gold, silver, copper, palladium, and nickel, as well as conductive polymer and superconductor fine particles.
[0035]
(3) Next, as shown in FIG. 3, a base 100 for bonding the conductive film pattern 20 is prepared. The base 100 is not particularly limited, and for example, a synthetic resin, a thin metal, a glass substrate, a semiconductor substrate, or the like can be used. An adhesive layer 102 is formed on the substrate 100. Examples of the adhesive layer 102 include various adhesives such as a photocurable adhesive such as a reactive curable adhesive, a thermosetting adhesive, and an ultraviolet curable adhesive.
[0036]
Next, as shown in FIG. 3, the base 100 is bonded to the separation base 10 including the conductive film pattern 20 via the adhesive layer 102. By joining the separation substrate 10 and the substrate 100 in this manner, the conductive film pattern 20 is bonded to the substrate 100 via the adhesive layer 102. At this time, pressure may be applied as needed. By applying pressure, the conductive film pattern 20 can be securely adhered to the base 100.
[0037]
(4) Next, as shown in FIG. 4, the substrate 100 to which the conductive film pattern 20 is adhered is peeled off from the separation substrate 10, whereby the conductive film pattern 20 according to the present embodiment is formed. At this time, since the conductive film pattern 20 is formed on the porous receiving layer 12, the conductive film pattern 20 has excellent releasability. As a result, the conductive film pattern 20 can be easily separated from the separation substrate 10. it can. Thus, the conductive film pattern 20 having a desired pattern can be formed on the base 100.
[0038]
The advantages of the method for forming the conductive film pattern 20 of the present embodiment will be described.
[0039]
(A) In the method for forming a conductive film pattern according to the present embodiment, instead of forming a conductive film pattern 20 by directly discharging a conductive material onto the substrate 100, first, the separation method in which the receiving layer 12 is formed is performed. The wiring 20 is formed by directly discharging a liquid material of the conductive fine particles on the substrate 10 for use. After that, the conductive film pattern 20 can be formed by bonding the conductive film pattern 20 to the base 100. When a conductive film pattern having a good shape is formed by a droplet discharge method, there are restrictions on the material and properties of the substrate. However, according to this embodiment, regardless of the material and properties of the substrate, The conductive film pattern 20 formed by the droplet discharge method can be formed on the substrate. As a result, the fine conductive film pattern 20 can be formed by a simple process.
[0040]
(B) In the method for forming the conductive film pattern 20 of the present embodiment, the conductive film pattern 20 is formed on the receiving layer 12, and the receiving layer 12 is formed of a hole-type material. Therefore, when the conductive film pattern 20 is formed by the droplet discharging method, the liquid component in which the conductive fine particles are dispersed can be absorbed in the receiving layer 12. As a result, mainly the conductive fine particles can be left on the receiving layer 12. Thereby, overcoating can be performed without performing a drying process. In addition, since the conductive fine particle component is left on the receiving layer 12 to form the conductive film pattern 20, the conductive film pattern 20 can be easily separated from the separation substrate 10. As a result, the conductive film pattern 20 having a desired film thickness can be efficiently formed, and the conductive film pattern 20 having a good shape can be formed even with the fine conductive film pattern 20. .
[0041]
(C) Since the separation substrate 10 can be used repeatedly and repeatedly, resources can be effectively used, and cost can be reduced.
[0042]
(Modification)
Next, a modification of the method for forming a conductive film pattern according to the present embodiment will be described with reference to FIGS. In the above-described embodiment, the adhesive layer 102 is provided on the base 100 to bond the conductive film pattern 20. However, in a modified example, the conductive film pattern 20 is formed by using the properties of the base 100 without providing the adhesive layer 102. The case of bonding will be described.
[0043]
(1) First, as shown in FIG. 1 of the first embodiment, a conductive film pattern 20 is formed on a separation substrate 10 via a receiving layer 12. Next, as shown in FIG. 5, a coating layer constituting the base 110 is formed on the separation base 10 including the conductive film pattern 20 by using a raw material liquid containing a resin component by a coating method such as a spin coating method. I do. Examples of the substrate 110 include a thermosetting resin, a photocurable resin, and a thermoplastic resin. Next, a curing process such as heat treatment or light irradiation is performed in accordance with the properties of the raw material liquid to form a resin layer to be the base 110. As a result, the conductive film pattern 20 is bonded to the base 110 which is a resin layer.
[0044]
(2) Next, as shown in FIG. 6, the conductive film pattern 20 can be bonded to the base 110 made of a resin layer by peeling the conductive film pattern 20 together with the base 110 from the separation base 10.
[0045]
According to this aspect, the same effect as in the above-described embodiment can be obtained, and the conductive film pattern 20 formed by the droplet discharging method can be formed on the base 110 regardless of the material of the base 110. . Further, by using a resin layer as the base 110, a flexible wiring board can be formed in a simpler process.
[0046]
2. Second embodiment
Next, a second embodiment will be described with reference to FIGS. In the second embodiment, a method for forming a multilayer conductive film pattern will be described.
[0047]
(1) As shown in FIG. 7, a conductive film pattern 20 is formed on a base 100 via an adhesive layer 102 in accordance with the manufacturing method of the first embodiment. Next, a contact hole 30 for electrically connecting the first conductive film pattern 20 to another wiring layer formed in a later step is formed in a predetermined region of the base 100, and a plug 40 is formed in the contact hole 30. Fill. The formation of the contact hole 30 can be performed by a general lithography and etching technique. Further, the formation of the contact hole 30 can be performed by irradiating a laser. According to this embodiment, the contact hole 30 can be reliably formed at a desired position. The plug 40 can be formed by embedding a liquid metal material containing a conductive material in the contact hole 30. The plug 40 is formed so that its upper surface is higher than the upper surface of the adhesive layer formed later, in order to prevent the plug 40 from being covered by the adhesive layer formed on the base 100 in a later step.
[0048]
(2) Next, as shown in FIG. 8, an adhesive layer 50 is formed on the base 100 in order to laminate another conductive film pattern formed in a step described later. As the adhesive layer 50, various adhesives such as a reactive curable adhesive, a thermosetting adhesive, and a photocurable adhesive such as an ultraviolet curable adhesive can be used.
[0049]
(3) Next, as shown in FIG. 9A, a substrate 110 to which the conductive film pattern 22 is adhered via the adhesive layer 112 is formed according to the manufacturing method of the first embodiment. Then, the conductive film pattern 20 and the conductive film pattern 22 are stacked by bonding the base 100 to which the conductive film pattern 20 is bonded and the base 110 to which the conductive film pattern 22 is bonded via an adhesive layer 50. be able to. At this time, the conductive film pattern 20 and the conductive film pattern 22 are electrically connected by the plug 40. Next, the contact hole 32 is formed at a predetermined position on the base 110 similarly to the base 100, and the contact hole 32 is filled with the plug 42. Next, the base 120 to which the conductive film pattern 24 is adhered via the adhesive layer 122 is laminated. Thus, the conductive film patterns 20, 22, and 24 can be laminated. Note that an insulating layer 62 can be formed between the lower conductive film patterns 20 as needed. The formation of the insulating layer 62 can be performed, for example, by applying an insulating material by a solution coating method or the like. Further, in this embodiment, the case where a three-layer conductive film pattern is formed has been described. However, the present invention is not limited to this, and a plurality of layers may be formed. Further, as shown in FIG. 9B, when the substrate 110 on which the conductive film pattern 22 is formed is laminated on the substrate 100, the above-described adhesive is formed between the conductive film patterns 22 and then the substrate 110 is formed. 110 may be laminated on the base 100.
[0050]
(4) Next, as shown in FIG. 10, the insulating layer 60 is formed so that the upper part of the plug 44 above the base 120 in the base 120 in the uppermost layer is exposed. The insulating layer 60 can be formed by, for example, a solution coating method. Next, the terminals 70 are formed on the separation substrate 10 by applying the manufacturing method of the first embodiment. The separation substrate 10 on which the terminals 70 are formed and the substrate 120 are joined. Then, the terminal 70 can be bonded onto the plug 44 of the base 120 by peeling the separation base 10.
[0051]
According to the method for forming a conductive film pattern according to the present embodiment, the substrates 100, 110, and 120 on which the conductive film patterns 20, 22, and 24 are formed are sequentially stacked to easily realize a multilayered conductive film pattern. be able to. Therefore, high integration of the wiring layer can be achieved.
[0052]
3. Third embodiment
In the third embodiment, a substrate 100A (hereinafter, referred to as “first wiring substrate”) having the conductive film pattern according to the present embodiment as a wiring layer is replaced with another wiring substrate 200 (hereinafter, “second wiring substrate”). Will be described with reference to FIG. FIG. 12A is a plan view schematically showing the wiring board according to the present embodiment, and FIG. 12B is a cross-sectional view along the line AA in FIG.
[0053]
The wiring board according to the present embodiment includes a first wiring board 100A and a second wiring board 200, as shown in FIGS. As the second wiring board 200, for example, an existing wiring board can be used. An electronic component 202 such as a power supply IC is provided on the second wiring board 200, and the electronic component 202 and the terminal 206 are electrically connected to each other through a wiring 204 and an electrode 210a. The first wiring board 100A is provided so as to electrically connect the electronic component 202 of the second wiring board 200 and the terminal 208. Specifically, a bump 212 is formed on the first wiring substrate 100A, and is joined to the second wiring substrate 200 via an anisotropic conductive film (ACF: Anisotropic Conductive Film) 214. That is, the electrodes 210b of the electronic component 202 are electrically connected to the first wiring board 100A via the bumps 212, and similarly, the terminals 208 of the second wiring board 200 are connected to the first wiring board 100A via the bumps 212. An electrical connection will be made.
[0054]
According to the wiring board of the present embodiment, first wiring board 100A can be provided on various wiring boards as needed, and high integration can be easily achieved. In particular, when the first wiring board 100A is provided on an existing wiring board, high integration can be achieved without newly manufacturing a wiring board, and cost can be reduced.
[0055]
4. Fourth embodiment
In the fourth embodiment, an electronic device having a wiring layer including the above-described conductive film pattern will be described with reference to FIG.
[0056]
FIG. 13A is a perspective view illustrating an example of a mobile phone. In FIG. 13A, reference numeral 600 denotes a mobile phone main body, and reference numeral 601 denotes a display unit having the conductive film pattern 20.
[0057]
FIG. 13B is a perspective view illustrating an example of a portable information processing device such as a word processor or a personal computer. 13B, reference numeral 700 denotes an information processing apparatus, 701 denotes an input unit such as a keyboard, 703 denotes an information processing main body, and 702 denotes a display unit having the conductive film pattern 20.
[0058]
FIG. 13C is a perspective view illustrating an example of a wristwatch-type electronic device. In FIG. 13C, reference numeral 800 denotes a watch main body, and reference numeral 801 denotes a display unit having the conductive film pattern 20.
[0059]
Since the electronic device shown in FIGS. 13A to 13C includes the display portion having the conductive pattern 4 (conductive film pattern), the electronic device has high productivity and good quality.
[0060]
【Example】
[Example 1]
(1) Based on the manufacturing method of the first embodiment, a conductive film pattern was formed as follows. First, a separation substrate having a pore type ink receiving layer (for example, Pictoric made by Asahi Glass) formed on a glass substrate was prepared.
[0061]
Next, droplets were dropped on the receiving layer by a droplet discharge device so as to follow a desired pattern of the conductive film. A liquid to be discharged was prepared as follows. Toluene is added to a gold fine particle dispersion (trade name "Perfect Gold") in which gold fine particles having a diameter of about 10 nm are dispersed in toluene, and the mixture is diluted to have a viscosity of 3 mPa · s. The liquid was adjusted as described above. The head of a commercially available printer (trade name “PM950C”) was used as a droplet discharge head for discharging the liquid material. However, since the ink suction portion was made of plastic, the suction portion was changed to a metal jig so as not to dissolve in an organic solvent. The ejected droplets were ejected such that the amount of each droplet was 10 ng and the interval was 20 μm. The dispersion medium of the droplet dropped on the receiving layer was quickly absorbed by the receiving layer to form a fine particle deposited film. Thereafter, the substrate was heated at 300 ° C. for 30 minutes. As a result, a conductive film pattern having a wiring width of 30 μm, a thickness of 5 μm, and a wiring pitch of 60 μm could be formed.
[0062]
(2) Next, a polyimide film was prepared as a substrate. An NCP (Non Conductive Paste) was formed on the polyimide film as an adhesive layer. Then, the separation substrate on which the conductive film pattern was formed and the polyimide film were joined. Thereafter, by separating the polyimide film and the separating substrate, a wiring substrate having a wiring layer adhered to the polyimide film could be formed. The wiring thus obtained has a volume resistivity of 3.5 μΩ / cm. ² Met. Therefore, according to the method for forming a conductive film pattern of this example, it was found that a favorable wiring layer could be formed.
[0063]
[Example 2]
First, (1) of Example 1 was similarly performed, and a conductive film pattern was formed on a glass substrate (substrate for separation) on which a receiving layer was formed. Next, a thermosetting resin material solution (Pimel manufactured by Asahi Kasei Co., Ltd.) was applied on the glass substrate on which the conductive film pattern was formed by a spin coating method, and then a heat treatment at 350 ° C. was performed for 2 hours. It was cured to obtain a polyimide film (substrate). Next, an adhesive film was attached to the polyimide film. As the pressure-sensitive adhesive film, a film having a property of deteriorating the tackiness when subjected to heat treatment was used. Next, the polyimide film to which the adhesive film was attached was peeled off from the glass substrate, so that the conductive film pattern could be adhered to the polyimide film. Thereafter, by performing a heat treatment, the adhesive film attached to the polyimide film was peeled off, and a wiring substrate having a conductive film pattern formed on the polyimide film was formed.
[Brief description of the drawings]
FIG. 1 is a view showing a process of forming a conductive film pattern according to a first embodiment.
FIG. 2 is a view showing a process of forming a conductive film pattern according to the first embodiment;
FIG. 3 is a view showing a process of forming a conductive film pattern according to the first embodiment;
FIG. 4 is a view showing a process of forming a conductive film pattern according to the first embodiment.
FIG. 5 is a view showing a process of forming a conductive film pattern according to the first embodiment.
FIG. 6 is a view showing a process of forming a conductive film pattern according to the first embodiment.
FIG. 7 is a view showing a process of forming a conductive film pattern according to a second embodiment.
FIG. 8 is a view showing a process of forming a conductive film pattern according to the second embodiment.
FIG. 9 is a view showing a process of forming a conductive film pattern according to the second embodiment.
FIG. 10 is a view showing a process of forming a conductive film pattern according to the second embodiment.
FIG. 11 is a view showing a process of forming a conductive film pattern according to the second embodiment.
FIG. 12A is a plan view of a wiring board according to a third embodiment, and FIG. 12B is a cross-sectional view taken along line AA of FIG.
FIG. 13 is an exemplary view showing an electronic apparatus according to a fourth embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Separation base | substrate, 12 ... Reception layer, 20, 22, 24 ... Wiring layer, 30, 32, 34 ... Insulation layer, 40, 42, 44 ... Plug, 100, 110, 120 ... Substrate, 102, 112, 122 ... adhesive layer 100A ... first wiring board, 200 ... second wiring board, 202 ... electronic components, 204 ... wiring, 206, 208 ... terminals, 210a, b ... electrodes, 212 ... bumps, 214 ... anisotropic conductive film ,

Claims (12)

Forming a first conductive film pattern on a separation substrate provided with a porous receiving layer;
Separating the first conductive film pattern from the separating substrate by bonding the first conductive film pattern to the substrate. In claim 1,
The method for forming a conductive film pattern, wherein the receiving layer is a layer containing at least one of porous silica, alumina, and alumina hydrate and a binder. In claim 1 or 2,
The method for forming a conductive film pattern, wherein the first conductive film pattern is formed by a droplet discharging method. In any one of claims 1 to 3,
The method for forming a conductive film pattern, wherein the bonding is performed via an adhesive layer provided on the base. In any one of claims 1 to 3,
A method for forming a conductive film pattern using a resin layer as the base. In any one of claims 1 to 5,
(A) forming a plug at a predetermined position on the substrate to which the first conductive film pattern is adhered;
(B) a method of forming a conductive film pattern, comprising: laminating the base and another substrate to which a second conductive film pattern is bonded. In claim 6,
A method for forming a conductive film pattern, comprising laminating a plurality of conductive film patterns by repeatedly performing the steps (a) and (b). In claim 6 or 7,
The method for forming a conductive film pattern, wherein the lamination is performed via an adhesive layer provided on the base. A conductive film pattern formed by the method for forming a conductive film pattern according to claim 1. A wiring substrate having the conductive film pattern according to claim 9 as a wiring. A wiring board, wherein the wiring board according to claim 10 is joined to another wiring board. An electronic device having the conductive film pattern according to claim 9 as a wiring.

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