JP4386161B2 - Conductive film pattern and method for forming the same, wiring board, and electronic device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conductive film pattern, a method for forming the same, a wiring board, and an electronic device.
[0002]
[Background]
Lithography, for example, is used to manufacture wiring used for electronic circuits or integrated circuits. In this lithography method, a mask layer having a predetermined pattern is formed on a substrate on which a conductive film has been applied in advance, and wiring is formed by etching the conductive film in accordance with the mask layer. This lithography method requires large-scale equipment such as a vacuum apparatus and a complicated process, and the material use efficiency is about several percent, and most of it must be discarded, and the manufacturing cost is high.
[0003]
In recent years, a method has been developed in which a predetermined material is ejected onto a substrate by an inkjet method to form wirings, insulating layers, and the like included in various electro-optical devices in a predetermined pattern. For example, Patent Document 1 proposes a method in which a liquid material in which conductive fine particles are dispersed is directly applied to a substrate by an ink-jet method and then converted into a conductive film pattern by heat treatment or laser irradiation. According to this method, there is an advantage that the wiring forming process is greatly simplified and the amount of raw materials used can be reduced.
[0004]
However, the wiring pattern forming method using the inkjet method has the following problems. For example, in a miniaturized device, formation of fine wiring is desired, but in order to keep the line width within a desired dimension, for example, a lyophilic pattern and a liquid repellent pattern are formed on a substrate, and an ink jet method is used. A method in which the liquid droplets to be discharged are arranged only in the lyophilic portion, or a liquid droplet is discharged on the liquid-repellent substrate so that the line width is not widened. In this case, a bulge called a bulge does not occur. For example, a method for controlling the overlapping of adjacent droplets can be considered.
[0005]
[Patent Document 1]
US Pat. No. 5,132,248
[0006]
[Problems to be solved by the invention]
An object of the present invention is to form a good conductive film pattern by an inkjet method regardless of the material of the substrate.
[0007]
[Means for Solving the Problems]
  In order to achieve the above object, one method of forming a conductive film pattern according to the present invention is a first step of forming a first conductive film pattern on a separation substrate provided with a porous receiving layer. A second step of forming a resin layer serving as a base on the separation base and the first conductive film pattern; and a third step of separating the first conductive pattern and the base from the separation base. And in the second step, the first conductive pattern and the substrate are bonded by curing the material of the resin layer, and the receiving layer is made of porous silica, alumina, alumina water. It is a layer containing at least one of the Japanese products and a binder.
  In the above method for forming a conductive film pattern, the material of the resin layer is a raw material liquid containing a resin component, and the second step is performed on the separation substrate and the first conductive pattern. It is preferable to include a fourth step of forming a coating layer by applying a raw material liquid and a fifth step of curing the coating layer.
  To achieve the above objective,
(1) The method for forming a conductive film pattern of the present invention includes a step of forming a first conductive film pattern on a separation substrate provided with a porous receiving layer,
  Separating the first conductive film pattern from the separation substrate by adhering the first conductive film pattern to the substrate.
[0008]
According to the method for forming a conductive film pattern of the present invention, the conductive layer is not directly discharged onto the substrate to form the wiring layer, but first, the conductive layer is formed on the separation substrate on which the receiving layer is formed. Wiring is formed by directly discharging liquid. Then, after bonding the substrate and the separating substrate, the separating substrate is peeled off, whereby the conductive film pattern can be easily formed on the substrate. Therefore, a desired conductive film pattern can be adhered to the substrate regardless of the material of the substrate. The first conductive film pattern is formed on a porous receiving layer. Therefore, for example, when a liquid containing conductive fine particles is formed by a droplet discharge method, the liquid component is absorbed by the porous receiving layer, and the conductive fine particles can remain on the receiving layer. As a result, even with a fine conductive film pattern, a conductive film pattern with a good shape can be formed, and the peelability of the conductive film pattern can be improved.
[0009]
The present invention can further take the following aspects.
[0010]
(A) In the method for forming a conductive film pattern of the present invention, the receiving layer may be a layer containing at least one of porous silica particles, alumina, and alumina hydrate and a binder.
[0011]
(B) In the conductive film pattern forming method of the present invention, the first conductive film pattern can be formed by a droplet discharge method. According to this aspect, it is not necessary to form a conductive material on the entire surface of the substrate, so that the use efficiency of the raw material can be increased and the manufacturing cost can be reduced.
[0012]
(C) In the method for forming a conductive film pattern of the present invention, the adhesion can be performed via an adhesive layer provided on the substrate.
[0013]
(D) In the conductive film pattern forming method of the present invention, a resin layer having a function of adhering the first conductive film pattern can be used as the substrate. According to this aspect, for example, by using polyimide which is a thermosetting resin, a polyimide wiring board can be formed in a simpler process.
[0014]
(E) In the method for forming a conductive film pattern of the present invention, further, (a) a step of forming a plug at a predetermined position of the substrate to which the first conductive film pattern is bonded;
(B) The process of laminating | stacking the said base | substrate and the base | substrate with which the 2nd electrically conductive film pattern was adhere | attached can be included. According to this aspect, a multilayer wiring layer can be formed by a simple process, and high integration can be achieved.
[0015]
(F) In the method for forming a conductive film pattern of the present invention, it is possible to include stacking a plurality of conductive film patterns by repeatedly performing the steps (a) and (b).
[0016]
(G) In the method for forming a conductive film pattern of the present invention, the lamination can be performed via an adhesive layer provided on the substrate.
[0017]
(2) The conductive film pattern of the present invention is formed by the method for forming a conductive film pattern of the present invention. The conductive film pattern of the present invention can be obtained by a simple formation method even when it has a fine pattern, and a highly reliable conductive film pattern can be provided.
[0018]
(3) The wiring board of this invention has the electrically conductive film pattern of the said invention as wiring.
[0019]
(4) In the wiring board of the present invention, the wiring board of the above invention is bonded to another wiring board.
[0020]
(5) The electronic device of the present invention has the conductive film pattern according to claim 9 as a wiring.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
1. First embodiment
Hereinafter, an embodiment of a method for forming a conductive film pattern of the present invention will be described with reference to FIGS.
[0022]
(1) As shown in FIG. 1, a receiving layer 12 is formed on a separation substrate 10. The substrate 10 for separation is not particularly limited as long as it is a substrate on which the receiving layer 12 can be formed, and a glass substrate, a resin substrate such as polyimide, and the like can be used. As the material of the receiving layer 12, a porous layer having pores is used. The receiving layer 12 is formed by applying a mixture of at least one of porous silica particles, alumina, and alumina hydrate and a binder, in particular, at least one of alumina and alumina hydrate, and porous. After applying a mixture of conductive silica particles and a binder, the liquid in the mixture is evaporated, and a drying process is performed to solidify the binder.
[0023]
Here, the porous silica particles used preferably have an average particle diameter of 2 to 50 μm, an average pore diameter of 8 to 50 nm, and a pore volume of about 0.8 to 2.5 cc / g. The porous silica particles may contain 20% by weight or less of boria, magnesia, zirconia, titania and the like.
[0024]
Examples of alumina or hydrated alumina include porous aluminum oxide having a radius of 3 to 10 nm and a sum of pore volumes of 0.2 to 1.5 cc / g and hydrates thereof. As a means for measuring pore physical properties, the distribution of pores in the dry solid content of alumina or alumina hydrate is measured by a nitrogen adsorption method (constant flow method), for example, using Omni Soap 100 manufactured by Omicron Technology. can do. And it is still more preferable when the sum of the pore volume which has a radius of 3-10 nm is 0.2-1.5 cc / g. Moreover, it is preferable that the usage-amount of an alumina or an alumina hydrate shall be about 5 to 50 weight% with respect to a porous silica particle.
[0025]
These aluminas or alumina hydrates may be either crystalline or amorphous, and can be used in an appropriate form such as amorphous particles or spherical particles. A gel-like material obtained by using an alumina sol and drying it is particularly preferred. Among them, the coagulated boehmite is particularly preferably a pseudo boehmite sol obtained by drying the sol.
[0026]
As the binder, polyvinyl alcohol is mainly preferably used. In addition, various modified polyvinyl alcohols such as cation modified, anion modified, silanol modified, starch derivatives and modified products thereof, cellulose derivatives, styrene-maleic acid copolymers, etc. Can be used alone or in combination as appropriate.
[0027]
As a method for applying the mixture, various methods such as an air knife coater, a blade coater, a bar coater, a rod coater, a roll coater, a gravure coater, a size press, a spin coat, a droplet discharge method, and a screen printing can be employed. .
[0028]
For the purpose of evaporating the liquid in the porous silica particles and / or alumina or a mixture of alumina hydrate and the binder and further solidifying the binder, the following method can be performed as a drying treatment. As such drying treatment, a method of performing a heat treatment at a temperature at which silica particles or alumina particles are not sintered, for example, a temperature of about 50 to 130 ° C., a method by a decompression treatment, and further, a heat treatment and a decompression treatment are performed. A method of using it together can be adopted. By performing the drying treatment in this manner, the porous silica particles or alumina or alumina hydrate constituting the receiving layer 12 becomes a porous layer in which minute pores are formed between the particles. .
[0029]
Further, the receiving layer 12 formed as described above may be a plurality of layers having different materials and structures. For example, a porous silica particle and a mixture of alumina hydrate and a binder are applied as described above, a drying process is performed to form a porous layer, and then a porous silica particle and a mixture of alumina and a binder are applied. By performing the drying process, the receiving layer 12 composed of a plurality of layers made of different materials can be formed.
[0030]
Moreover, although the film thickness of the receiving layer 12 used by normal inkjet printing is about 10 micrometers-100 micrometers, when forming a conductive pattern, a thing with a smaller film thickness is preferable. In this case, for example, when a mixture of at least one of alumina and alumina hydrate and a binder is applied, it is further diluted with a solvent and then applied by spin coating or a film thickness of 1 μm. The following receiving layer 12 can be formed.
[0031]
Further, if necessary, in forming such a receiving layer 12, it is possible to selectively apply only to a necessary portion instead of applying to the entire surface of the substrate. This can be performed by adopting, for example, screen printing or coating by a droplet discharge method. In some cases, after the receiving layer 12 is coated on the entire surface, unnecessary portions may be removed by further resist coating, exposure, development, and etching.
[0032]
The receiving layer 12 can be formed by the above-described manufacturing method, but a commercially available hole-type receiving layer 12 can also be used.
[0033]
(2) Next, as shown in FIG. 2, a conductive film pattern 20 is formed on the separation substrate 10 on which the receiving layer 12 is formed by a droplet discharge method. This droplet discharge method is sometimes called an ink jet method. In the droplet discharge method, a conductive film pattern 20 is formed by discharging a liquid droplet containing a film forming component (a liquid material containing conductive fine particles) to a predetermined film formation region of the receiving layer 12. The The discharging process is performed a plurality of times so that the conductive film pattern 20 having a desired film thickness is obtained. At this time, since the liquid containing conductive fine particles is discharged onto the porous receiving layer 12, the liquid component is absorbed by the receiving layer 12 and the conductive fine particles remain on the receiving layer 12. It will be. As a result, almost no liquid component can be eliminated from the liquid material containing the film-forming component, and there is no need to provide a drying step between the discharge steps, and a conductive film pattern with a desired film thickness can be efficiently formed. . In particular, when a thick conductive film pattern is formed, a drying step may be provided as necessary. Thus, after forming a pattern of conductive fine particles on the receiving layer 12, heat treatment is performed and firing is performed, whereby the conductive film pattern 20 is formed.
[0034]
As the liquid containing the conductive fine particles, a liquid material (dispersion liquid) in which the conductive fine particles are dispersed in a liquid material (dispersion medium) is used. The conductive fine particles used here include fine particles of conductive polymer or superconductor, in addition to metal fine particles containing any of gold, silver, copper, palladium, and nickel.
[0035]
(3) Next, as shown in FIG. 3, a substrate 100 for bonding the conductive film pattern 20 is prepared. The substrate 100 is not particularly limited, and for example, a synthetic resin, a thin metal, a glass substrate, a semiconductor substrate, or the like can be used. An adhesive layer 102 is formed on the substrate 100. Examples of the adhesive layer 102 include various adhesives such as a reaction curable adhesive, a thermosetting adhesive, and a photocurable adhesive such as an ultraviolet curable adhesive.
[0036]
Next, as shown in FIG. 3, the substrate 100 is bonded onto the separation substrate 10 including the conductive film pattern 20 via the adhesive layer 102. In this manner, the conductive film pattern 20 is bonded to the substrate 100 side via the adhesive layer 102 by bonding the separation substrate 10 and the substrate 100 together. At this time, the conductive film pattern 20 can be securely bonded to the substrate 100 by applying pressure as necessary.
[0037]
(4) Next, as shown in FIG. 4, the substrate 100 to which the conductive film pattern 20 is bonded is peeled from the separation substrate 10, thereby forming the conductive film pattern 20 according to the present embodiment. At this time, since the conductive film pattern 20 is formed on the porous receiving layer 12, it has excellent peelability, and as a result, the conductive film pattern 20 can be easily separated from the separation substrate 10. it can. In this way, the conductive film pattern 20 having a desired pattern can be formed on the substrate 100.
[0038]
The advantages of the method for forming the conductive film pattern 20 of the present embodiment will be described.
[0039]
(A) In the method for forming a conductive film pattern of the present embodiment, the conductive material pattern 20 is not formed by directly discharging a conductive material onto the substrate 100, but first, the separation in which the receiving layer 12 is formed. The wiring 20 is formed by directly discharging a liquid material of conductive fine particles onto the substrate 10. Thereafter, the conductive film pattern 20 can be formed by adhering the conductive film pattern 20 to the substrate 100. When a conductive film pattern having a good shape is formed by the droplet discharge method, the material and properties of the substrate are limited. However, according to the present embodiment, the substrate 100 is independent of the material and properties of the substrate. A conductive film pattern 20 formed by a droplet discharge method can be formed. As a result, the fine conductive film pattern 20 can be formed by a simple process.
[0040]
(B) In the method of forming the conductive film pattern 20 of the present embodiment, the conductive film pattern 20 is formed on the receiving layer 12, and the receiving layer 12 is formed of a hole-type material. Therefore, when the conductive film pattern 20 is formed by the droplet discharge method, the liquid component in which the conductive fine particles are dispersed can be absorbed into the receiving layer 12. As a result, conductive fine particles mainly remain on the receiving layer 12. Thereby, overcoating can be performed without performing a drying process. Further, since the conductive fine particle component is left on the receiving layer 12 to form the conductive film pattern 20, the conductive film pattern 20 can be easily peeled from the separation substrate 10. As a result, the conductive film pattern 20 having a desired film thickness can be efficiently formed, and even when the conductive film pattern 20 is fine, the conductive film pattern 20 having a good shape can be formed. .
[0041]
(C) Since the substrate 10 for separation can be used repeatedly many times, resources can be used effectively, so that the cost can be reduced.
[0042]
(Modification)
Next, a modification of the method for forming a conductive film pattern of the present embodiment will be described with reference to FIGS. In the above-described embodiment, the adhesive layer 102 is provided on the substrate 100 and the conductive film pattern 20 is adhered. However, in the modification, the conductive film pattern 20 is formed using the properties of the substrate 100 without providing the adhesive layer 102. The case of bonding will be described.
[0043]
(1) First, as shown in FIG. 1 of the first embodiment, a conductive film pattern 20 is formed on a separation substrate 10 via a receiving layer 12. Next, as shown in FIG. 5, a coating layer constituting the substrate 110 is formed on the separation substrate 10 including the conductive film pattern 20 by using a raw material liquid containing a resin component by a coating method such as a spin coating method. To do. Examples of the substrate 110 include a thermosetting resin, a photocurable resin, and a thermoplastic resin. Next, a curing process such as heat treatment or light irradiation is performed according to the properties of the raw material liquid to form a resin layer that becomes the base 110. As a result, the conductive film pattern 20 is bonded to the base 110, which is a resin layer.
[0044]
(2) Next, as shown in FIG. 6, the conductive film pattern 20 can be adhered to the substrate 110 made of a resin layer by peeling the conductive film pattern 20 together with the substrate 110 from the separation substrate 10.
[0045]
According to this aspect, the conductive film pattern 20 formed by the droplet discharge method can be formed on the substrate 110 regardless of the material of the substrate 110, which has the same effect as the above-described embodiment. . In addition, by using a resin layer as the base 110, a flexible wiring board can be formed by a simpler process.
[0046]
2. Second embodiment
Next, a second embodiment will be described with reference to FIGS. In the second embodiment, a method for forming a conductive film pattern in multiple layers will be described.
[0047]
(1) As shown in FIG. 7, according to the manufacturing method of the first embodiment, a conductive film pattern 20 is formed on a substrate 100 via an adhesive layer 102. Next, a contact hole 30 for electrically connecting the first conductive film pattern 20 and another wiring layer formed in a later process is formed in a predetermined region of the substrate 100, and a plug 40 is inserted into the contact hole 30. Fill. The contact hole 30 can be formed by general lithography and etching techniques. Further, the contact hole 30 can be formed by irradiating a laser, and according to this aspect, the contact hole 30 can be reliably formed at a desired position. The plug 40 can be formed by embedding a liquid metal material containing a conductive material in the contact hole 30. In order to prevent the plug 40 from being covered with the adhesive layer formed on the base body 100 in a later step, the upper surface of the plug 40 is formed to be higher than the upper surface of the adhesive layer formed later.
[0048]
(2) Next, as shown in FIG. 8, an adhesive layer 50 is formed on the substrate 100 in order to stack another conductive film pattern formed in a process described later. As the adhesive layer 50, various adhesives such as a reactive curable adhesive, a thermosetting adhesive, and a photocurable adhesive such as an ultraviolet curable adhesive can be used.
[0049]
(3) Next, as shown in FIG. 9A, according to the manufacturing method of the first embodiment, a substrate 110 to which the conductive film pattern 22 is bonded via an adhesive layer 112 is formed. Thereafter, the conductive film pattern 20 and the conductive film pattern 22 are laminated by bonding the base body 100 to which the conductive film pattern 20 is bonded and the base body 110 to which the conductive film pattern 22 is bonded through the adhesive layer 50. be able to. At this time, the conductive film pattern 20 and the conductive film pattern 22 are electrically connected by the plug 40. Next, a contact hole 32 is formed at a predetermined location in the base 110 in the same manner as the base 100, and the contact hole 32 is filled with a plug 42. Next, the substrate 120 to which the conductive film pattern 24 is bonded via the adhesive layer 122 is laminated. In this way, the conductive film patterns 20, 22, and 24 can be stacked. An insulating layer 62 can be formed between the conductive film patterns 20 in the lower layer as necessary. The insulating layer 62 can be formed, for example, by applying an insulating material by a solution coating method or the like. In this embodiment, the case of forming a three-layer conductive film pattern has been described. However, the present invention is not limited to this, and a plurality of layers may be formed. 9B, when the base 110 on which the conductive film pattern 22 is formed is laminated on the base 100, the adhesive is formed between the conductive film patterns 22 and then the base is formed. 110 may be laminated on the substrate 100.
[0050]
(4) Next, as shown in FIG. 10, the insulating layer 60 is formed so that the upper portion of the plug 44 above the base 120 is exposed in the base 120 in the uppermost layer. The insulating layer 60 can be formed by, for example, a solution coating method. Next, the terminal 70 is formed on the separation substrate 10 by applying the manufacturing method of the first embodiment. The separation substrate 10 on which the terminals 70 are formed is bonded to the substrate 120. Then, the terminal 70 can be bonded onto the plug 44 of the base 120 by peeling off the separating base 10.
[0051]
According to the method for forming a conductive film pattern of the present embodiment, multilayering of the conductive film pattern can be easily realized by sequentially laminating the substrates 100, 110, and 120 on which the conductive film patterns 20, 22, and 24 are formed. be able to. Therefore, high integration of the wiring layer can be achieved.
[0052]
3. Third embodiment
In the third embodiment, a base body 100A (hereinafter referred to as “first wiring board”) having the conductive film pattern according to the present embodiment as a wiring layer is replaced with another wiring board 200 (hereinafter referred to as “second wiring board”). The case where it is provided in FIG. 12 will be described with reference to FIG. FIG. 12A is a plan view schematically showing the wiring board according to the present embodiment, and FIG. 12B is a cross-sectional view taken along line AA in FIG.
[0053]
As shown in FIGS. 12A and 12B, the wiring board according to the present embodiment includes a first wiring board 100A and a second wiring board 200. As the second wiring board 200, for example, an existing wiring board can be used. An electronic component 202 such as a power supply IC is provided on the second wiring board 200, and the electronic component 202 and the terminal 206 are electrically connected via the wiring 204 and the electrode 210a. 100A of 1st wiring boards are provided so that the electronic component 202 and the terminal 208 of the 2nd wiring board 200 may be electrically connected. Specifically, bumps 212 are formed on the first wiring board 100 </ b> A and bonded to the second wiring board 200 via an anisotropic conductive film (ACF) 214. That is, the electrode 210b of the electronic component 202 is electrically connected to the first wiring board 100A via the bump 212, and similarly, the terminal 208 of the second wiring board 200 is connected to the first wiring board 100A via the bump 212. Electrical connection will be made.
[0054]
According to the wiring board of the present embodiment, the first wiring board 100A can be provided on various wiring boards as necessary, and high integration can be easily achieved. In particular, when the first wiring board 100A is provided on an existing wiring board, high integration can be achieved without newly manufacturing a wiring board, and cost can be reduced.
[0055]
4). Fourth embodiment
In the fourth embodiment, an electronic device having a wiring layer composed of the above conductive film pattern will be described with reference to FIG.
[0056]
FIG. 13A is a perspective view illustrating an example of a mobile phone. In FIG. 13A, reference numeral 600 denotes a mobile phone body, and reference numeral 601 denotes a display portion having the conductive film pattern 20.
[0057]
FIG. 13B is a perspective view illustrating an example of a portable information processing device such as a word processor or a personal computer. In FIG. 13B, reference numeral 700 denotes an information processing apparatus, 701 denotes an input unit such as a keyboard, 703 denotes an information processing body, and 702 denotes a display unit having the conductive film pattern 20.
[0058]
FIG. 13C is a perspective view illustrating an example of a wristwatch-type electronic device. In FIG. 13C, reference numeral 800 denotes a watch body, and reference numeral 801 denotes a display portion having the conductive film pattern 20.
[0059]
Since the electronic apparatus shown in FIGS. 13A to 13C includes the display portion having the conductive pattern 4 (conductive film pattern), the electronic device is excellent in productivity.
[0060]
【Example】
[Example 1]
(1) Based on the manufacturing method of the first embodiment, a conductive film pattern was formed as follows. First, a separation substrate in which a hole-type ink receiving layer (for example, Asahi Glass made Pictrico) was formed on a glass substrate was prepared.
[0061]
Next, droplets were dropped on the receiving layer so as to follow a desired conductive film pattern by a droplet discharge device. A liquid material to be discharged was prepared as follows. Toluene is added to a gold fine particle dispersion (trade name “Perfect Gold”, manufactured by Vacuum Metallurgical Co., Ltd.) in which gold fine particles having a diameter of about 10 nm are dispersed in toluene, and this is diluted to a viscosity of 3 mPa · s. Thus, the liquid was prepared. Further, as a droplet discharge head for discharging the liquid material, a head of a commercially available printer (trade name “PM950C”) was used. However, since the ink suction part is made of plastic, the ink suction part is changed to a metal jig so as not to dissolve in the organic solvent. The discharged droplets were discharged so that the amount of one drop was 10 ng and the interval was 20 μm. The droplets dropped on the receiving layer quickly absorbed the dispersion medium by the receiving layer and became a fine particle deposited film. Thereafter, the substrate was heated at 300 ° C. for 30 minutes. As a result, a conductive film pattern having a wiring width of 30 μm, a thickness of 5 μm, and a wiring pitch of 60 μm could be formed.
[0062]
(2) Next, a polyimide film was prepared as a substrate. NCP (Non Conductive Paste) was formed on this polyimide film as an adhesive layer. Next, the separation base on which the conductive film pattern was formed and the polyimide film were joined. Thereafter, by separating the polyimide film and the separating substrate, a wiring substrate having a wiring layer adhered to the polyimide film could be formed. The volume resistivity of the wiring thus obtained is 3.5 μΩ / cm.²Met. Therefore, it was found that a good wiring layer can be formed according to the conductive film pattern forming method of this example.
[0063]
[Example 2]
First, (1) of Example 1 was performed in the same manner, and a conductive film pattern was formed on a glass substrate (separation substrate) on which a receiving layer was formed. Next, a thermosetting resin raw material liquid (Paimel manufactured by Asahi Kasei) was applied on the glass substrate on which the conductive film pattern was formed, and then heat treatment at 350 ° C. for 2 hours was performed. Curing was performed to obtain a polyimide film (substrate). Next, an adhesive film was attached to the polyimide film. As the pressure-sensitive adhesive film, a film having a property that the pressure-sensitive adhesiveness decreases when heat treatment is performed. Then, the conductive film pattern could be adhered to the polyimide film by peeling the polyimide film with the adhesive film attached from the glass substrate. Then, the adhesive film affixed on the polyimide film was peeled off by heat treatment, and a wiring substrate having a conductive film pattern formed on the polyimide film was formed.
[Brief description of the drawings]
FIG. 1 is a view showing a conductive film pattern forming process according to a first embodiment;
FIG. 2 is a view showing a conductive film pattern forming process according to the first embodiment.
FIG. 3 is a view showing a conductive film pattern forming process according to the first embodiment;
FIG. 4 is a view showing a conductive film pattern forming process according to the first embodiment.
FIG. 5 is a view showing a conductive film pattern forming process according to the first embodiment;
FIG. 6 is a view showing a conductive film pattern forming process according to the first embodiment.
FIG. 7 is a view showing a conductive film pattern forming process according to a second embodiment.
FIG. 8 is a view showing a conductive film pattern forming process according to the second embodiment.
FIG. 9 is a view showing a conductive film pattern forming process according to the second embodiment.
FIG. 10 is a diagram showing a process of forming a conductive film pattern according to the second embodiment.
FIG. 11 is a diagram showing a process of forming a conductive film pattern according to the second embodiment.
FIG. 12A is a plan view of a wiring board according to a third embodiment, and FIG. 12B is a cross-sectional view taken along line AA in FIG.
FIG. 13 is a view showing an electronic apparatus according to a fourth embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Separation base | substrate, 12 ... Receptive layer, 20, 22, 24 ... Wiring layer, 30, 32, 34 ... Insulating layer, 40, 42, 44 ... Plug, 100, 110, 120 ... Base | substrate, 102, 112, 122 ... Adhesive layer 100A ... First wiring board, 200 ... Second wiring board, 202 ... Electronic component, 204 ... Wiring, 206, 208 ... Terminal, 210a, b ... Electrode, 212 ... Bump, 214 ... Anisotropic conductive film ,

Claims (10)

A first step of forming a first conductive film pattern on a separation substrate provided with a porous receiving layer;
A second step of forming a resin layer serving as a substrate on the separation substrate and the first conductive film pattern;
A third step of separating the first conductive pattern and the substrate from the separation substrate,
In the second step, when the material of the resin layer is cured, the first conductive pattern and the base are bonded ,
The method for forming a conductive film pattern, wherein the receiving layer is a layer containing at least one of porous silica, alumina, and alumina hydrate and a binder. In claim 1,
The second step includes a fourth step of forming a coating layer by applying a material of the resin layer on the separation substrate and the first conductive pattern, and a fifth step of curing the coating layer. And further comprising:
The method for forming a conductive film pattern, wherein the material of the resin layer is a raw material liquid containing a resin component. In claim 1 or 2 ,
The method of forming a conductive film pattern, wherein the first conductive film pattern is formed by a droplet discharge method. In any one of Claims 1-3 ,
And (a) forming a plug at a predetermined location on the substrate to which the first conductive film pattern is bonded;
(B) A method of forming a conductive film pattern, comprising: laminating the base body and another base body to which the second conductive film pattern is bonded. In claim 4 ,
A method for forming a conductive film pattern, comprising: laminating a plurality of conductive film patterns by repeatedly performing the steps (a) and (b). In claim 4 or 5 ,
The said lamination | stacking is a formation method of a electrically conductive film pattern performed through the adhesion layer provided on the said base | substrate. The electrically conductive film pattern formed by the formation method of the electrically conductive film pattern of Claims 1-6 . A wiring board having the conductive film pattern according to claim 7 as wiring. A wiring board, wherein the wiring board according to claim 8 is bonded to another wiring board. The electronic device which has the electrically conductive film pattern of Claim 7 as wiring.

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