JP2004265628A - Image display device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device which can rapidly and stably perform the sealing works of a front surface substrate and a back surface substrate and which has proper vacuum degree, and to provide a method for manufacturing the same. <P>SOLUTION: The vacuum enclosure of the image display device includes the front surface substrate and the back surface substrate 12 disposed to face each other, a frame-like member 13 in which the peripheries of the front surface substrate and the back surface substrate are connected to each other, and a sealing material disposed between the front surface substrate or the back surface substrate and the frame-like member. The frame-like material has conductivity and also has a plurality of through holes 30 or slits 32 formed through the front surface of the substrate in a direction perpendicular to the front surface of the substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an image display device having a flat shape, and more particularly to an image display device provided with a large number of electron-emitting devices inside a vacuum envelope and a method of manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art In recent years, various flat display devices have been developed as next-generation lightweight and thin display devices that replace cathode ray tubes (hereinafter, referred to as CRTs). Such a flat display device includes a liquid crystal display (hereinafter, referred to as LCD) that controls the intensity of light by using the orientation of liquid crystal, and a plasma display panel (hereinafter, PDP) that emits a fluorescent material by ultraviolet rays of plasma discharge. ), A field emission display (hereinafter, referred to as FED) that emits a phosphor by an electron beam of a field emission type electron-emitting device, and a surface conduction electron emission display that emits a phosphor by an electron beam of a surface conduction electron-emitting device. (Hereinafter, referred to as SED).
[0003]
For example, FEDs and SEDs generally have a front substrate and a rear substrate that are opposed to each other with a predetermined gap therebetween, and these substrates are connected to each other via a rectangular frame-shaped side wall to form a vacuum. Of the envelope. The envelope is required to have a very high degree of vacuum, and a plurality of support members are arranged between the rear substrate and the front substrate in order to support an atmospheric pressure load applied to the substrates. Further, a phosphor screen is formed on the inner surface of the front substrate, and a number of electron-emitting devices are provided on the inner surface of the rear substrate as electron emission sources for exciting the phosphor to emit light.
[0004]
The potential on the back substrate side is substantially the ground potential, and an anode voltage Va is applied to the phosphor screen. Then, an image is displayed by irradiating the red, green, and blue phosphors constituting the phosphor screen with an electron beam emitted from the electron-emitting device to cause the phosphors to emit light.
[0005]
In such FEDs and SEDs, the thickness of the display device can be reduced to about several millimeters, and the weight and thickness have been reduced compared to CRTs currently used as displays for televisions and computers. Power saving can be achieved.
[0006]
In the above FED, it is necessary to make the inside of the envelope a high vacuum. Also, in the case of a PDP, it is necessary to fill the discharge gas with a vacuum once. As a means for evacuating the envelope, a method has been proposed in which the final assembly of the front substrate and the back substrate constituting the envelope is performed in a vacuum chamber.
[0007]
In this method, first, the front substrate and the rear substrate arranged in the vacuum chamber are sufficiently heated. This is to reduce the gas emission from the inner wall of the envelope, which is a main cause of deteriorating the degree of vacuum of the envelope. Next, when the front substrate and the rear substrate are cooled and the degree of vacuum in the vacuum chamber is sufficiently improved, a getter film for improving and maintaining the degree of vacuum of the envelope is formed on the phosphor screen. Thereafter, the front substrate and the rear substrate are heated again to a temperature at which the sealing material is melted, and cooled until the sealing material is solidified in a state where the front substrate and the rear substrate are combined at a predetermined position.
[0008]
The vacuum envelope created by such a method serves not only as a sealing step and a vacuum sealing step, but also does not require the time required to exhaust the inside of the envelope using an exhaust pipe, and, An extremely good degree of vacuum can be obtained.
[0009]
However, when assembling in such a vacuum, the processes performed in the sealing process include heating, positioning, cooling, and various processes, and the front substrate and the back surface are disposed for a long time during which the sealing material is melted and solidified. The substrate must be kept in place. In addition, the front substrate and the rear substrate are thermally expanded and contracted due to heating and cooling at the time of sealing, and the alignment accuracy is likely to be deteriorated.
[0010]
On the other hand, a low melting point metal sealing material such as indium, which melts at a relatively low temperature, is filled between the front substrate and the side wall, the conductive sealing material is energized, and the conductive sealing material generates heat by Joule heat. A method of dissolving and bonding the substrates (hereinafter referred to as energization heating) has been studied (for example, see Patent Document 1). According to this method, it is not necessary to spend an enormous amount of time for cooling the substrate, and it is possible to form the envelope by bonding the substrates in a short time.
[0011]
[Patent Document 1]
JP-A-2002-319346
[Problems to be solved by the invention]
However, when such a method is used, there is a problem in that the low-melting-point metal melted in the heating step before sealing flows and the abundance of the metal is uneven depending on the location, and uneven heating occurs when electric heating is performed. . In addition, when the low melting point metal is melted, there is a problem that the low melting point metal portion is disconnected due to energization.
[0013]
The present invention has been made in view of the above points, and an object thereof is to quickly and stably perform a sealing operation of a front substrate and a rear substrate, and to provide an image display device having a good degree of vacuum and the image display device. It is to provide a manufacturing method.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, an image display device according to an aspect of the present invention includes a front substrate, a rear substrate disposed opposite to the front substrate, and the front substrate disposed between peripheral portions of the front substrate and the rear substrate. A frame-shaped member having conductivity in which a substrate and a rear substrate are joined together, and a sealing material disposed between the front substrate or the rear substrate and the frame-shaped member; The member has a plurality of through holes or slits formed in a direction perpendicular to the front substrate surface.
[0015]
According to another aspect of the present invention, there is provided a method of manufacturing an image display device, comprising: a front substrate; a rear substrate disposed to face the front substrate; and the front substrate disposed between peripheral portions of the front substrate and the rear substrate. An image display device comprising an envelope having a conductive frame member joined to a substrate and a rear substrate, and a sealing material disposed between the front substrate or the rear substrate and the frame member. In the manufacturing method of
Prepare a frame-shaped member having a plurality of through holes or slits formed in a direction perpendicular to the surface of the front substrate, arrange the front substrate and the rear substrate to face each other, Between the inner peripheral portion, the frame-shaped member is arranged along the peripheral portion of the front substrate and the rear substrate, and at least one of the inner peripheral portion of the front substrate and the inner peripheral portion of the rear substrate and the frame-shaped member. A sealing material having conductivity is arranged around the entire circumference, and heat is applied to the frame-shaped member to generate heat, and the sealing material is melted or softened. The method is characterized in that pressure is applied in the approaching direction to seal the peripheral portions of the front substrate and the rear substrate.
[0016]
According to the image display device and the method of manufacturing the image display device having the above-described configuration, by providing a through-hole or a slit in the frame-shaped member, the resistance value of the frame-shaped member can be increased as compared with a frame-shaped member having no through-hole or slit. Can be. As a result, the current for heating flowing through the sealing material or the frame-shaped member is reduced to simplify the device configuration and the electrode configuration, or the width of the frame-shaped member is increased even when the current is the same as the conventional one, and the bonding is performed. The sealing reliability can be improved by increasing the area.
[0017]
Further, according to the above configuration, the elasticity of the frame-shaped member in the direction parallel to the substrate can be apparently reduced. Accordingly, stress due to a difference in thermal expansion between the frame-shaped member and the substrate or the like due to heating or a change in environmental temperature can be reduced, and the frame-shaped member can be positioned at a desired position with a small tension.
[0018]
Further, according to the above configuration, the surface area can be increased with respect to the volume of the frame-shaped member, and the retention of the sealing material can be improved. Accordingly, even when the sealing material is melted in a manufacturing state, for example, in a setting state with poor horizontality, there is an advantage that the sealing material is less likely to be localized or flow on the frame-shaped member.
Further, according to the above configuration, since the heat capacity of the frame-shaped member is reduced by the amount of the through hole or the slit, the configuration is such that heating and cooling can be easily performed in a short time during energization heating.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment in which an image display device according to the present invention is applied to an FED will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 3, the FED includes a front substrate 11 and a rear substrate 12 each made of rectangular glass as an insulating substrate, and these substrates are opposed to each other with a gap of 1 to 2 mm. I have. The front substrate 11 and the rear substrate 12 are joined to each other through a frame member 13 having a rectangular frame shape having conductivity, and a flat rectangular vacuum envelope in which the inside is maintained in a vacuum state. The container 10 is constituted.
In the present embodiment, between the joining surface located at the inner peripheral edge of front substrate 11 and frame member 13 and between the joining surface located at the inner peripheral edge of rear substrate 12 and frame member 13, It is joined by indiums 21a and 21b as a sealing material having conductivity described later. As the sealing material, a material that melts or softens at a temperature of 300 ° C. or lower is desirable, and a low melting point metal such as an indium alloy can be used in addition to indium. Note that one of the joining surfaces and the frame-shaped member 13 may be joined in advance with a low-melting-point sealing material such as frit glass.
[0020]
Further, the frame-shaped member 13 has protrusions 13a protruding outward from the respective corners, and these protrusions function as electrodes at the time of manufacturing, and at the same time, grip portions for holding and positioning the frame-shaped member. Function as However, instead of providing the protruding portion 13a, a configuration in which an independent electrode is attached may be adopted.
As shown in FIGS. 2, 3, and 5, the frame-shaped member 13 has a large number of through holes 30 arranged in a mesh pattern and a slit 32 opened on the side surface of the frame-shaped member.
The through holes 30 and the slits 32 are formed so as to penetrate along the direction perpendicular to the surfaces of the front substrate 11 and the rear substrate 12, respectively, and are provided at predetermined intervals over the entire circumference of the frame-shaped member 13. I have. Note that the frame member 13 is desirably formed of a material having a melting point of 500 ° C. or higher, and a material containing at least one of Ti, Fe, Cr, Ni, Al, and Cu can be used.
[0021]
As shown in FIGS. 2 and 3, a plurality of plate-shaped spacers 14 are provided inside the vacuum envelope 10 in order to support an atmospheric pressure load applied to the front substrate 11 and the rear substrate 12. These spacers 14 are arranged in a direction parallel to the short side of the vacuum envelope 10 and at predetermined intervals along a direction parallel to the long side. The shape of the spacer 14 is not particularly limited, and for example, a columnar spacer or the like can be used.
[0022]
As shown in FIGS. 3 and 4, on the inner surface of the front substrate 11, a phosphor having phosphor layers R, G, and B emitting red, green, and blue light and a matrix-shaped black light absorbing layer 20 is provided. A screen 16 is formed. An aluminum film 17 is deposited on the phosphor screen 16 as a metal back made of aluminum or the like, and a getter film (not shown) is formed on the metal back.
[0023]
As shown in FIG. 3, on the inner surface of the rear substrate 12, a large number of electron-emitting devices 18 are provided as electron-emitting sources that excite electrons by colliding with the phosphor layers R, G, and B. The electron-emitting device 18 is disposed at a position facing each of the phosphor layers R, G, and B one by one, and emits an electron beam toward the corresponding phosphor layer. In addition, on the inner surface of the rear substrate 12, a number of wirings 21 for supplying drive signals to the electron-emitting devices 18 are formed in a matrix, and the ends thereof are extended to the peripheral edge of the rear substrate.
[0024]
Next, a method and an apparatus for manufacturing the FED configured as described above will be described.
First, a front substrate 11 having a phosphor screen 16 formed on its inner surface is prepared, and indium, which is a sealing material, is applied in a frame shape to a bonding surface located on the inner surface of the front substrate and outside the phosphor screen. I do. Also, a rear substrate 12 having a large number of electron-emitting devices 18 formed on the inner surface is prepared, and a spacer 14 for securing a gap with the front substrate 11 is attached at the time of assembly. Indium, which is a sealing material, is applied in a frame shape on the bonding surface located on the inner surface of the back substrate 12 and on the outer peripheral portion of the electron-emitting device 18. Further, the conductive frame-shaped member 13 is arranged on the indium. Here, at four corners of the frame-shaped member 13, a projection 13 a functioning as an electrode through which a current for energizing and heating flows is formed integrally, and a frame is formed with respect to indium applied to the back substrate 12. After the alignment of the protruding members, the protrusions 13 a are fixed to the four corners of the rear substrate 12.
[0025]
Here, indium is filled in the front substrate 11 and the back substrate 12, but indium may be filled in the frame member 13 side, or the indium may be filled in the front substrate 11, the back substrate 12, and the frame member 13, respectively. May be.
[0026]
Next, as shown in FIG. 6, the rear substrate 12 and the front substrate 11 on which the frame-shaped member 13 is mounted on the indium 21b are placed at a predetermined distance with the joint surfaces facing each other. And hold it with a jig or the like in a state of facing. At this time, for example, the front substrate 11 is arranged below the rear substrate 12 with the front substrate 11 facing upward. Then, in this state, the front substrate 11 and the rear substrate 12 are put into a vacuum processing apparatus.
[0027]
As shown in FIG. 7, the vacuum processing apparatus 100 includes a load chamber 101, a baking chamber, an electron beam cleaning chamber 102, a cooling chamber 103, a getter film deposition chamber 104, an assembling chamber 105, and a cooling chamber 106 provided in this order. , And an unloading chamber 107. Each of these chambers is configured as a processing chamber capable of performing vacuum processing, and all the chambers are evacuated during the manufacture of the FED. Adjacent processing chambers are connected by a gate valve or the like.
[0028]
The front substrate 11 and the rear substrate 12 are loaded into the load chamber 101, and the inside of the load chamber 101 is evacuated, and then sent to the baking and electron beam cleaning chamber 102. In the baking and electron beam cleaning chamber 102, when the high vacuum degree of about 10 ⁻⁵ Pa is reached, the front substrate 11 and the rear substrate 12 are sufficiently degassed by heating. The heating temperature is appropriately set at about 200 ° C. to 500 ° C. This is to reduce the rate of gas release from the inner wall, which deteriorates the degree of vacuum after the vacuum envelope is formed, and to prevent characteristic deterioration due to residual gas.
[0029]
In the baking / electron beam cleaning chamber 102, simultaneously with heating, an electron beam generator (not shown) attached to the baking / electron beam cleaning chamber 102 transmits the phosphor screen surface of the front substrate side assembly and the back substrate. Twelve electron-emitting device surfaces are irradiated with an electron beam. Since this electron beam is deflected and scanned by a deflecting device mounted outside the electron beam generator, it is possible to clean the entire surface of the phosphor screen surface and the electron emission element surface with the electron beam.
[0030]
After the heating and the electron beam cleaning, the front substrate side assembly and the rear substrate 12 are sent to the cooling chamber 103 and cooled to a temperature of about 100 ° C., for example. Subsequently, the front substrate 11 and the rear substrate 12 are sent to a getter film deposition chamber 104, where a Ba film is deposited as a getter film on the phosphor screen and the metal back. The surface of the Ba film is prevented from being contaminated with oxygen, carbon, or the like, and can maintain an active state.
[0031]
Next, in the assembly chamber 105, the front substrate 11 and the rear substrate 12 are positioned with high accuracy so that the phosphor screen 16 and the electron-emitting device 18 face each other and are superposed. At this time, the frame member 13 is sandwiched between the indium 21a provided on the peripheral portion of the front substrate 11 and the indium 21b provided on the peripheral portion of the rear substrate 12, and the protrusions protruding from the four corners of the frame member 13 are provided. 13a is brought into contact with the device-side electrode.
[0032]
In this state, a predetermined current is applied to the frame member 13 and the indiums 21a and 21b through the protruding portions 13a to heat and melt the indium and to press the front substrate 11 and the rear substrate 12 in directions approaching each other. In this heating by energization, mainly only the frame member 13 and the indiums 21a and 21b are heated, so that heating can be performed in a short time and unnecessary thermal expansion of the front substrate 11 or the rear substrate 12 hardly occurs. Thereafter, when the energization is stopped, the heat of the frame-shaped member 13 and the indiums 21a and 21b rapidly diffuses into the front substrate 11 or the rear substrate 12, and the indium is cooled and solidified in a short time, thereby completing the sealing.
The vacuum envelope 10 thus formed is cooled to room temperature in the cooling chamber 106 and then taken out of the unloading chamber 107. Through the above steps, the FED is completed.
[0033]
According to the FED configured as described above, the frame-shaped member 13 has the through holes 30 and the slits 32 provided in a mesh shape. Therefore, the resistance of the frame-shaped member 13 can be increased as compared with a frame-shaped member in which the through-hole 30 and the slit 32 are not provided. Therefore, it is not necessary to limit the width to a small value so that the resistance of the frame-shaped member 13 does not become too low. As a result, the frame width can be increased and the sealing reliability can be improved. At the same time, when sealing by energizing heating through the frame member 13, the current required for energizing heating can be reduced, and thermal expansion of the frame member during heating can be suppressed.
[0034]
Since the elasticity of the frame-shaped member 13 along the longitudinal direction of each side, that is, the elasticity in the direction parallel to the substrate surface is greatly softer than the case where the through-hole 30 and the slit 32 are not provided, The disadvantage that the frame-shaped member 13 is sometimes thermally expanded and twisted can be eliminated. At the same time, with respect to thermal changes such as environmental temperature, the effect of relaxing the stress of the frame-shaped member 13 is obtained, and the sealing reliability is improved. Further, even when the indiums 21a and 21b are melted, the indium holding property is improved, the outflow and bias of the indium can be prevented, and the sealing can be performed uniformly over the entire circumference of the frame-shaped member 13. It becomes possible.
From the above, the sealing operation of the front substrate and the rear substrate can be performed quickly and stably, and an FED having a good degree of vacuum can be obtained.
[0035]
Hereinafter, a plurality of embodiments to which the present invention is applied will be described.
(Example 1)
An embodiment in which the configuration shown in FIGS. 1 to 5 is applied to a 30-inch FED display device for a TV will be described. The main configuration is the same as that described in the above embodiment.
[0036]
Both front substrate 11 and rear substrate 12 are made of a glass material having a thickness of 2.8 mm. Indiums 21a and 21b each having a thickness of 0.2 mm and a width of 3 mm are arranged on the periphery of the front substrate 11 and the rear substrate 12, respectively. As shown in FIGS. 2 and 5, the frame-shaped member 13 includes a nickel alloy having a width of 5 mm and a thickness of 2 mm, a mesh-shaped through-hole 30 having an oval diameter of φ2 to 3 mm, and a slit 32 having a substantially semicircular cross section. It is empty.
As a result, the resistance of the frame-shaped member 13 is approximately twice as large as that of the frame-shaped member 13 having no holes and slits, and the weight is reduced to about １ ／. Projections 13 a are formed at the four corners of the frame-shaped member 13, and serve as electrodes for passing a current and fixing portions to the rear substrate 12. With this fixing portion, the frame-shaped member 13 is arranged so as to overlap with the indium 21b at the peripheral edge of the back substrate 12.
[0037]
Then, the front substrate 11 and the rear substrate 12 are put into a vacuum chamber, and after degassing and forming a getter film in the vacuum chamber, when the substrate temperature reaches 120 ° C., the front substrate 11 and the rear substrate 12 are brought into a predetermined state. According to the position, the frame-shaped member 13 was sandwiched between the indiums 21a and 21b at the peripheral edges, and pressure was applied with a load of about 20 kgf.
[0038]
In this state, 300 A was applied to the protruding portion 13a of the frame-shaped member 13 for 30 seconds. At this time, the indiums 21a and 21b were heated to about 160 ° C. and melted. When the energization was completed, the heat of the frame member 13 and the indiums 21a and 21b quickly diffused into the substrate and the like, and the indium was cooled and solidified. After about 300 seconds, the front substrate 11 and the rear substrate 12 were taken out, whereby an FED was obtained.
[0039]
By providing the mesh-shaped holes and slits in the frame-shaped member 13 in this manner, the magnitude of the heating current can be reduced to a level that does not cause a practical problem, and the frame width can be increased to improve the sealing reliability. Was. In addition, since the network structure absorbs the thermal expansion of the frame-shaped member 13, twisting of the frame-shaped member at the time of electric heating can be prevented.
[0040]
(Example 2)
The main configuration of the second embodiment is the same as that of the first embodiment.
In Example 2, as shown in FIG. 8, at the time of manufacturing, both sides of the frame member 13 were filled with indiums 21a and 21b, and the front substrate 11 and the rear substrate 12 were free of indium. Then, the front substrate 11, the rear substrate 12, and the frame-shaped member 13 were all put into a vacuum assembling tank in a vertically standing state. Thereafter, an FED was formed by the same steps as in the above-described embodiment.
[0041]
By adopting the vertical conveyance as described above, a vacuum assembling apparatus excellent in space and maintainability can be realized. However, conventionally, there has been a problem that indium flows due to heating in the degassing step. However, in the present embodiment, indium is filled in the frame-shaped member 13 having the through-holes 30 and the slits 32 in a mesh shape, so that the indium is localized in the through-holes 30, and even if heated in the vertical conveyance, the indium is removed. It could be held on the frame member without flowing.
[0042]
(Example 3)
The main configuration of the third embodiment is the same as that of the first embodiment.
In Example 3, as shown in FIG. 9, a large number of linear slits 32 were provided in the frame member 13, and the frame member 13 was formed substantially in a bellows shape as a whole. Each slit 32 is formed in a direction perpendicular to the surface of the front substrate and the rear substrate, and is formed so as to extend alternately from both side surfaces of the frame-shaped member 13. Even when such a slit 32 is provided, the same effect as in the case where the through-holes 30 of Examples 1 and 2 are provided can be obtained.
[0043]
(Example 4)
The main configuration of the fourth embodiment is the same as that of the first embodiment.
In Example 4, as shown in FIG. 10, the formation density of the through holes 30 and the slits 32 provided in the frame member 13 was changed depending on the location of the frame member. Thereby, the resistance of the frame-shaped member 13 can be partially changed. Therefore, it is possible to control the energization and heat generation at a desired location by a local resistance change of the frame-shaped member 13, and to seal a specific location such as a corner which is difficult to be melted by heat radiation at the same timing as other portions. The material can be melted. Thereby, the peripheral portions of the front substrate and the rear substrate can be uniformly and stably sealed over the entire periphery.
[0044]
(Example 5)
The main configuration of the fifth embodiment is the same as that of the first embodiment.
In this embodiment, as shown in FIG. 11, substantially semicircular slits 32 are alternately provided in the frame-shaped member 13, and the frame-shaped member 13 is formed in a substantially bellows shape as a whole. Even when such a slit 32 is provided, the same effect as in the case where the through-holes 30 of Examples 1 and 2 are provided can be obtained.
[0045]
The present invention is not limited to the above-described embodiments and examples, and can be variously modified within the scope of the present invention. For example, in the embodiment described above, the frame-shaped member is provided with both the through-hole and the slit, but may be provided with only one of the through-hole and the slit.
[0046]
Further, in the above-described embodiment, the field emission type electron emission element is used as the electron emission element. However, the present invention is not limited to this, and other electron emission elements such as a pn type cold cathode element or a surface conduction type electron emission element may be used. An element may be used. Further, the present invention is not limited to a display device requiring a vacuum envelope such as an FED or an SED, but is also applicable to other image display devices such as a PDP in which a vacuum is applied once and a discharge gas is injected. It is valid.
[0047]
【The invention's effect】
As described above, according to the present invention, when the peripheral portions of the front substrate and the rear substrate are sealed by arranging conductive frame members by energizing heating, the current required for energizing heating can be reduced. The thermal expansion of the frame-shaped member can be suppressed. Thereby, the sealing operation of the front substrate and the rear substrate can be performed quickly and stably, and an image display device having a good degree of vacuum and a method of manufacturing the same can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view showing the appearance of an FED according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration on the rear substrate side of the FED in FIG. 1;
FIG. 3 is a sectional view of the FED taken along a line AA in FIG. 1;
FIG. 4 is an enlarged plan view showing a part of a phosphor screen formed on a front substrate of the FED.
FIG. 5 is an enlarged plan view showing a part of a frame member in the FED.
FIG. 6 is a cross-sectional view showing a state in which a front substrate and a rear substrate are arranged to face each other in the manufacturing process of the FED.
FIG. 7 is a view schematically showing a vacuum processing apparatus used for manufacturing the FED.
FIG. 8 is a plan view showing a frame-shaped member according to a second embodiment of the present invention.
FIG. 9 is a plan view showing a frame-shaped member according to a third embodiment of the present invention.
FIG. 10 is a plan view showing a frame-shaped member according to a fourth embodiment of the present invention.
FIG. 11 is a plan view showing a frame-shaped member according to a fifth embodiment of the present invention.
[Explanation of symbols]
10: vacuum envelope, 11: front substrate, 12: rear substrate,
13: frame member, 14: support member, 16: phosphor screen,
18: electron-emitting device, 21a, 21b: indium,
30: through hole, 32: slit

Claims (11)

A front substrate, a rear substrate opposed to the front substrate, a conductive frame-shaped member disposed between peripheral edges of the front substrate and the rear substrate, and joined to the front substrate and the rear substrate; A sealing material disposed between the substrate or the back substrate and the frame-shaped member, comprising an envelope,
The image display device, wherein the frame-shaped member has a plurality of through holes or slits formed in a direction perpendicular to the surface of the front substrate. The image display device according to claim 1, wherein the through holes or the slits are formed at different densities depending on locations on the entire circumference of the frame-shaped member. The image display device according to claim 1, wherein the through holes or the slits are provided in a bellows shape. The image display device according to claim 1, wherein the through holes or the slits are provided in a mesh pattern. The image display device according to any one of claims 1 to 4, wherein the sealing material contains In or an alloy containing In. The image display device according to claim 1, wherein the sealing material is a material that melts or softens at a temperature of 300 ° C. or less. The image display device according to claim 1, wherein the frame-shaped member is formed of a material containing at least one of Ti, Fe, Cr, Ni, Al, and Cu. . The image display device according to claim 1, wherein the frame-shaped member is formed of a material having a melting point of 500 ° C. or higher. 10. A phosphor according to claim 1, wherein a phosphor and an electron source for exciting the phosphor are provided inside the envelope, and the interior of the envelope is maintained in a vacuum. Item 2. The image display device according to item 1. A front substrate, a rear substrate opposed to the front substrate, a conductive frame member disposed between peripheral edges of the front substrate and the rear substrate, and joined to the front substrate and the rear substrate, In a method for manufacturing an image display device including an envelope having a substrate or a back substrate and a sealing material disposed between the frame-shaped member,
Prepare a frame-shaped member having a plurality of through holes or slits formed in a direction perpendicular to the surface of the front substrate,
The front substrate and the rear substrate are arranged facing each other,
Between the inner peripheral edge of the front substrate and the rear substrate, the frame-shaped member is arranged along the peripheral edge of the front substrate and the rear substrate, and at least the inner peripheral edge of the front substrate and the inner peripheral edge of the rear substrate. Place a sealing material having conductivity between one and the frame-shaped member over the entire circumference,
Electricity is applied to the frame-shaped member to generate heat, and the sealing material is melted or softened, and the front substrate and the rear substrate are pressed in a direction approaching each other to seal the peripheral portions of the front substrate and the rear substrate. A method for manufacturing an image display device, comprising: The method according to claim 10, wherein the sealing material is melted or softened by energizing the frame-shaped member in a vacuum atmosphere.

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