WO2005020271A1

WO2005020271A1 - Image display device

Info

Publication number: WO2005020271A1
Application number: PCT/JP2004/011620
Authority: WO
Inventors: Sachiko Hirahara; Masaru Nikaido
Original assignee: Kabushiki Kaisha Toshiba
Priority date: 2003-08-21
Filing date: 2004-08-12
Publication date: 2005-03-03
Also published as: TW200511354A; JP2005071705A

Abstract

Spacers are stood in recesses formed in at least one surface of a grid structuring a spacer structure body in order to constrain exudation of a spacer forming material of a image display device and improve withstand voltage characteristics and display quality. The spacer structure body has a plate-like grid and spacers. The plate-like grid faces a first substrate on which a fluorescent surface is provided and a second substrate on which electron discharge sources are provided and has electron beam passing holes each facing an electron discharge source. The spacers are stood on at least one surface of the grid. The grid has recesses formed in at least one surface of the grid, and the spacers are individually stood in the recesses.

Description

Specification

Image display device

Technical field

[0001] The present invention relates to an image display device including a substrate disposed to face and a spacer structure disposed between the substrates.

Background art

[0002] In recent years, various flat-panel image display devices have been attracting attention as next-generation lightweight and thin display devices replacing cathode ray tubes (hereinafter, referred to as CRTs). For example, as a kind of field 'emission' device (hereinafter, referred to as FED) that functions as a flat panel display, the development of a surface conduction electron-emitting device (hereinafter, referred to as SED) is underway.

[0003] The SED includes a first substrate and a second substrate that are opposed to each other at a predetermined interval, and these substrates are joined to each other via rectangular side walls to form a vacuum envelope. Is composed. On the inner surface of the first substrate, phosphor layers of three colors are formed, and on the inner surface of the second substrate, a large number of electron-emitting devices corresponding to each pixel are arranged as an electron source for exciting the phosphor. I have. Each electron-emitting device includes an electron-emitting portion, a pair of electrodes for applying a voltage to the electron-emitting portion, and the like.

In the SED, it is important that the space between the first substrate and the second substrate, that is, the inside of the vacuum envelope is maintained at a high degree of vacuum. When the degree of vacuum is low, the life of the electron-emitting device and, consequently, the life of the device are reduced. In order to support the atmospheric load acting between the first substrate and the second substrate and maintain the gap between the substrates, a number of plate-like or columnar spacers are arranged between the two substrates. RU

[0005] In order to dispose the spacer over the entire surface of the first substrate and the second substrate, it is necessary to use an extremely thin plate so as not to contact the phosphor of the first substrate and the electron-emitting device of the second substrate. Or a very thin columnar spacer is required. Since these spacers must be installed very close to the electron-emitting device, an insulator material must be used as the spacer. At the same time, when considering thinning of the first and second substrates, more spacers are required, and the production becomes more difficult. [0006] Regarding the alignment of the spacers between the phosphors on the first substrate and between the electron-emitting devices on the second substrate, there is a method of directly attaching the spacers between the phosphors or between the electron-emitting devices. Proposed. Japanese Patent Application Laid-Open No. 2001-272927 discloses that a large number of spacers are formed with high accuracy and positional accuracy on a metal plate in which holes through which electrons pass are formed in advance, and the spacer formed on this metal plate is formed. There has been proposed a method of aligning the substrate with the first substrate or the second substrate.

[0007] In the latter case, two molds each having a number of holes corresponding to the spacer shape are brought into close contact with the front and back surfaces of the metal plate, and the spacer is formed by the metal plate and the two molds. Specified through-holes. In this state, each through hole is filled with a paste-like spacer forming material. The protrusion of the spacer forming material is removed by scraping the surface of the mold with a squeegee or the like. Then, after the filled spacer forming material is cured inside the mold, two molds are removed from the metal plate to obtain a columnar spacer formed on the metal plate. And so on.

Disclosure of the invention

[0008] In the above method, if the metal plate and the mold are not strictly adhered to each other, the spacer forming material enters between the metal plate and the mold. In this case, not only a spacer having a normal shape cannot be formed, but also an electron passage hole formed in the metal plate in advance may be blocked by the spacer forming material. The spacer-forming material and the adhesive component that have oozed out onto the metal plate have an irregular oozing shape and are likely to be a source of discharge. When the bleeding portion of the spacer forming material is charged, the electron beam emitted from the electron-emitting device is attracted to the bleeding portion and deviates from the original orbit. As a result, there is a problem in that mislanding of the electron beam occurs with respect to the phosphor layer, and the color purity of the displayed image is deteriorated.

The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device that suppresses bleeding of a spacer forming material and has improved withstand voltage characteristics and display quality. .

[0010] In order to achieve the above object, an image display device according to an aspect of the present invention includes a first substrate on which a fluorescent screen is formed, and a first substrate on which the fluorescent screen is formed, which is opposed to the first substrate with a predetermined gap therebetween. A second substrate provided with a plurality of electron emission sources for exciting the phosphor screen, and a space provided between the first and second substrates and supporting an atmospheric load acting on the first and second substrates. A spacer structure, wherein the spacer structure faces the first and second substrates, and has a plurality of electron beam passage holes respectively facing the electron emission source. And a plurality of spacers erected on at least one surface of the grid, wherein the grid has a plurality of recesses formed on the at least one surface. The spacer is erected in the recess.

[0011] An image display device according to another aspect of the present invention is configured such that a first substrate on which a phosphor screen is formed is opposed to the first substrate with a predetermined gap therebetween, and the phosphor screen is excited. A second substrate provided with a plurality of electron emission sources, and a spacer structure provided between the first and second substrates for supporting an atmospheric load acting on the first and second substrates. And a plate-like grid facing the first and second substrates, and having a plurality of electron beam passage holes respectively facing the electron emission source. A plurality of spacers erected on at least one surface of the grid, wherein the grid is formed on the at least one surface and is located around the grid-side end of each spacer. It has a plurality of grooves.

Brief Description of Drawings

FIG. 1 is a perspective view showing an SED according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the SED, taken along line II-II in FIG. 1.

FIG. 3 is an enlarged sectional view showing the SED.

FIG. 4 is an enlarged perspective view showing a part of the spacer structure.

FIG. 5 is a cross-sectional view along the line V—V in FIG.

FIG. 6 is a cross-sectional view showing a process of manufacturing the spacer structure.

FIG. 7 is a cross-sectional view showing an assembly in which a mold and a grid are brought into close contact.

FIG. 8 is a cross-sectional view showing a process of manufacturing the spacer structure.

FIG. 9 is a cross-sectional view showing a state where the mold is opened.

FIG. 10 is an enlarged perspective view showing a part of a spacer structure of an SED according to a second embodiment of the present invention. FIG. 11 is a sectional view taken along lines XI-XI in FIG.

BEST MODE FOR CARRYING OUT THE INVENTION

[0013] A first embodiment in which the present invention is applied to a surface conduction electron-emitting device (hereinafter, referred to as SED), which is a type of FED, as a planar image display device will be described in detail with reference to the drawings. explain.

As shown in FIGS. 1 to 3, the SED includes a first substrate 10 and a second substrate 12 each formed of a rectangular glass plate, and these substrates are separated by a gap of about 1.0 to 2.0 mm. Corresponding is located. The first substrate 10 and the second substrate 12 are joined to each other via a rectangular frame-shaped side wall 14 made of glass to form a flat vacuum envelope 15 whose inside is maintained in a vacuum. .

A phosphor screen 16 functioning as a phosphor screen is formed on an inner surface of the first substrate 10. This phosphor screen 16 is configured by arranging phosphor layers R, G, and B that emit red, blue, and green light, and a light shielding layer 11, and these phosphor layers are formed in a stripe shape, a dot shape, or a rectangular shape. Have been. On the phosphor screen 16, a metal back 17 made of aluminum or the like and a getter film 19 are sequentially formed.

[0015] On the inner surface of the second substrate 12, as an electron source for exciting the phosphor layers R, G, and B of the phosphor screen 16, a large number of surface conduction electron-emitting devices 18 each emitting an electron beam are provided. Have been. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each electron-emitting device 18 includes an electron-emitting portion (not shown), a pair of device electrodes for applying a voltage to the electron-emitting portion, and the like. On the inner surface of the second substrate 12, a large number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix shape, and the ends thereof are drawn out of the vacuum envelope 15 to extend.

[0016] The side wall 14 functioning as a joining member is sealed to the peripheral portion of the first substrate 10 and the peripheral portion of the second substrate 12 by a sealing material 20 such as a low melting point glass or a low melting point metal. Substrates are joined together.

As shown in FIGS. 2 to 5, the SED includes a spacer structure 22 provided between the first substrate 10 and the second substrate 12. In the present embodiment, the spacer structure 22 is composed of a grid 24 made of a rectangular metal plate and a large number of And a columnar spacer.

More specifically, the grid 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, and is arranged in parallel with these substrates. ing . A large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like. The electron beam passage holes 26 are arranged to face the electron-emitting devices 18, respectively, and transmit the electron beams emitted from the electron-emitting devices. A plurality of recesses 27 are respectively formed on the first and second surfaces 24a and 24b of the grid 24 by half etching or the like. These recesses 27 are formed in a region where the spacer is erected, that is, between two adjacent electron beam passage holes 26, and are arranged at a predetermined pitch.

The grid 24 is formed of, for example, an iron-nickel-based metal plate with a thickness of 0.1-0.3 mm. On the surface of the grid 24, an oxide film made of an element constituting the metal plate, for example, Fe

Three

O, NiFe O The oxide film which also becomes O power is formed. Also, the surfaces 24a, 24b,

4 2 4

In addition, the wall surface of each electron beam passage hole 26 is covered with a high resistance film having a discharge current limiting effect. The high-resistance film is formed in a high-resistance material consisting mainly of glass, til have 1 10 ⁸ -1 10 ¹⁵ resistance of 0 / b.

On the first surface 24 a of the grid 24, a first spacer 30 a is physically erected so as to overlap with each recess 27, and is located between the adjacent electron beam passage holes 26. The tip of the first spacer 30a is in contact with the inner surface of the first substrate 10 via the getter film 19, the metal back 17, and the light shielding layer 11 of the phosphor screen 16. On the second surface 24b of the grid 24, a second spacer 30b is erected on each of the recesses 27, and is located between adjacent electron beam passage holes 26. The tip of the second spacer 30b is in contact with the inner surface of the second substrate 12. Here, the tip of each second spacer 30 b is located on the wiring 21 provided on the inner surface of the second substrate 12. The first and second spacers 30a and 30b are located in alignment with each other, and are formed integrally with the grid 24 with the double-sided force sandwiching the grid 24 therebetween.

As shown in FIG. 5, each of the first and second spacers 30a and 30b is formed in a tapered shape having a smaller diameter from the grid 24 side toward the extending end. For example, each of the first spacers 30a has a substantially elliptical cross-sectional shape, and the base end located on the grid 24 side has a diameter of about 0.3 mm X 2 mm, and the extension end has a diameter of about 0.2 mm X 2mm, height about 0.6mm It is. Each of the second spacers 30b has a substantially elliptical cross-sectional shape, and has a diameter of about 0.3 mm X 2 mm at a base end located on the grid 24 side and a diameter of about 0.2 mm X 2 mm at an extension end. , And the height is about 0.8 mm.

As shown in FIGS. 4 and 5, each recess 27 is formed in an elliptical shape corresponding to the base end of the first or second spacer 30a, 30b, and the base end of the spacer is formed. It is formed with a larger diameter and larger area. A gap G is formed between the base edge of each of the first and second spacers 30a and 30b and the edge of the recess 27 so as to extend over the entire circumference of the spacer base end. . When the space between adjacent electron beam passage holes 26 of the grid 24 is D, the gap G is formed at 5 to 30% of the space D. In the present embodiment, the gap G is formed to be, for example, 0.1 mm. The depth d of each recess 27 is formed at 5 to 30% of the interval D. The gap G may not necessarily be provided over the entire circumference of the base end of the first and second spacers, or the gap may not be uniform over the entire circumference.

The spacer structure 22 configured as described above is provided between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b contact the inner surfaces of the first substrate 10 and the second substrate 12 to support an atmospheric pressure load acting on these substrates and to set a predetermined distance between the substrates. To maintain.

The SED includes a voltage supply unit (not shown) for applying a voltage to the grid 24 and the metal back 17 of the first substrate 10. The voltage supply unit is connected to the grid 24 and the metal back 17, respectively, and applies, for example, a voltage of 12 kV to the grid 24 and a voltage of 10 kV to the metal back 17. When an image is displayed on the SED, an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron-emitting device 18 is accelerated by the anode voltage to collide with the phosphor screen 16. As a result, the phosphor layer of the phosphor screen 16 is excited to emit light, and an image is displayed.

Next, a method of manufacturing the SED configured as described above will be described. First, a description will be given of a method of manufacturing the chassis 22.

As shown in FIG. 6, when manufacturing the spacer structure 22, first, a grid 24 having a predetermined size and an upper die 36a and a lower die 36b having a rectangular plate shape having substantially the same dimensions as the grid are prepared. The In this case, a 0.15 mm thick metal plate made of Fe—50% Ni is degreased, washed, and dried, and then the electron beam passage hole 26 is formed by etching to form the grid 24. A plurality of recesses 27 are formed by half-etching both surfaces of the grid 24. Then, after oxidizing the entire grid 24, an insulating film is formed on the grid surface including the inner surface of the electron beam passage hole 26. Further, a coating liquid containing glass as a main component is applied on the insulating film, dried, and fired to form a high-resistance film.

The upper mold 36a and the lower mold 36b as molding dies are formed in a flat plate shape using a transparent material that transmits ultraviolet light, for example, transparent silicon, transparent polyethylene terephthalate, or the like. The upper die 36a has a flat contact surface 41a that is in contact with the grid 24, and a number of bottomed spacer forming holes 40a for forming the first spacer 30a. The spacer forming holes 40a are respectively opened in the contact surface 41a of the upper die 36a, and are arranged at predetermined intervals. Similarly, the lower die 36b has a flat contact surface 41b and a number of bottomed spacer forming holes 40b for forming the second spacer 30b. The spacer forming holes 40b are respectively opened in the contact surface 41b of the lower die 36b, and are arranged at predetermined intervals.

Thereafter, a spacer forming material 46 is filled in the spacer forming holes 40a of the upper mold 36a and the spacer forming holes 40b of the lower mold 26b. As the spacer forming material 46, a glass paste containing at least a UV-curable binder (organic component) and a glass filler is used. The specific gravity and viscosity of the glass paste are appropriately selected.

Subsequently, as shown in FIG. 7, the upper die 36 a is positioned and abutted so that the spacer forming hole 40 a filled with the spacer forming material 46 is located between the electron beam passage holes 26. The surface 41a is brought into close contact with the first surface 24a of the grid 24. Similarly, the lower die 36b is positioned so that each spacer forming hole 40b is located between the electron beam passage holes 26, and the contact surface 41b is brought into close contact with the second surface 24b of the grid 24. Note that an adhesive is applied in advance to the spacer standing position of the grid 24, that is, each recess 27 by a dispenser or printing. Thus, an assembly 42 including the grid 24, the upper mold 36a, and the lower mold 36b is formed. In the assembly 42, the spacer forming holes 40a of the upper die 36a and the spacer forming holes 40b of the lower die 36b are arranged to face each other with the dalid 24 therebetween. Next, as shown in FIG. 8, the assembly 42 is placed in a flat vacuum vessel 50, and the upper die 36a and the lower die 36b are brought into close contact with the grid 24 using the atmospheric pressure. Here, the vacuum container 50 will be described in detail.

The vacuum vessel 50 has a first main wall 52 and a second main wall 54 each formed in a rectangular plate shape, and the first and second main walls are arranged to face each other with a gap. A rectangular frame-shaped side wall 55 is provided between the peripheral portions of the first and second main walls 52 and 54. The side wall 55 is air-tightly fixed to the inner peripheral edge of the first main wall 52 and stands substantially perpendicularly to the first main wall. The free end, here the upper end, of the side wall 55 is in airtight contact with the inner peripheral edge of the second main wall 54 via the o-ring 56. The inside of the vacuum vessel 50 thus configured is connected to a vacuum pump 58 via an exhaust valve 57 provided on a peripheral portion of the second main wall 54.

[0030] The first and second main walls 52, 54 are formed to have a larger planar dimension than the grid 24.

The first and second main walls 52 and 54 are formed of a material that can be elastically deformed and transmit ultraviolet light, for example, transparent silicon, transparent polyethylene terephthalate, glass, or the like. As will be described later, the inner surfaces of the first and second main walls 52 and 54 are provided with an uneven portion over substantially the entire surface so that the entire assembly 42 is uniformly pressed.

When the assembly 42 is sandwiched by using the vacuum vessel 50 configured as described above, first, with the second main wall 54 removed, the pressure diffusion plate 60a is placed on the inner surface of the first main wall 52. Lay. The assembly 42 is placed on the pressure diffusion plate 60a, and the lower die 36b is opposed to the first main wall 52, for example.

Next, the pressure diffusion plate 60b is disposed on the assembly 42, and the second main wall 54 is further disposed on the assembly 42 so as to face the upper die 36a of the assembly 42 and the O-ring 56 Overlaid. The pressure diffusion plates 60a and 60b are formed of an ultraviolet transmitting material.

In this state, the vacuum pump 58 as an exhaust means is operated to evacuate the vacuum container 50 to a predetermined degree of vacuum, and then the exhaust valve 57 is closed to maintain a vacuum in the vacuum container. When the inside of the vacuum vessel 50 is evacuated, atmospheric pressure acts on the first and second main walls 52 and 54 of the vacuum vessel. Therefore, the first and second main walls 52 and 54 press the assembled body 42 arranged inside from both sides, and bring the upper mold 36a and the lower mold 36b into close contact with the grid 24.

At this time, as described above, the first and second main walls 52 and 54 of the vacuum vessel 50 can be elastically deformed. Since it is formed of a suitable material, it is elastically deformed along the assembly 42 and comes into close contact with the upper mold 36a and the lower mold 36b. The inner surfaces of the first and second main walls 52, 54 are formed with irregularities. Therefore, the atmospheric pressure uniformly acts on the entire surface of the upper die 36a and the lower die 36b via the pressure diffusion plates 60a and 60b, respectively. Therefore, the grid 24, the upper mold 36a and the lower mold 36b are maintained in a very good contact state.

[0035] With the grid 24, the upper mold 36a and the lower mold 36b being in close contact with each other using the atmospheric pressure as described above, the first and second ultraviolet lamps 62a and 62b arranged outside the vacuum vessel 50 are used. The main walls 52 and 54 are irradiated with ultraviolet light (UV). Here, the first and second main walls 52 and 54 of the vacuum vessel 50, the pressure diffusion plates 60a and 60b, the upper mold 36a and the lower mold 36b are each formed of an ultraviolet transmitting material. Therefore, the ultraviolet rays emitted from the ultraviolet lamps 62a and 62b pass through the first and second main walls 52 and 54 of the vacuum vessel 50, the pressure diffusion plates 60a and 60b, the upper mold 36a and the lower mold 36b, and are filled. The spacer forming material 46 is irradiated. Thus, the spacer forming material 46 can be cured by ultraviolet rays while maintaining the extremely good adhesion of the assembly 42.

Subsequently, the vacuum in the vacuum vessel 50 is released, and the assembly 42 is taken out of the vacuum vessel. At this time, since the second main wall 54 is only in contact with the o-ring, the vacuum container can be easily opened by releasing the vacuum. Thereafter, as shown in FIG. 9, the upper die 36a and the lower die 36b are separated from the grid 24 so that the hardened spacer forming material 46 is left on the grid 24. Next, the grid 24 on which the spacer forming material 46 is provided is heat-treated in a heating furnace, and after the spacer forming material internal force binder is blown off, the grid 24 is heated at about 500-550 ° C for 30 minutes and 1 hour. The spacer forming material is fully fired. As a result, a spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.

On the other hand, in the manufacture of the SED, the first substrate 10 on which the phosphor screen 16 and the metal back 17 are provided, the electron-emitting device 18 and the wiring 21 are provided, and the side wall 14 is joined in advance. The second substrate 12 is prepared.

Subsequently, the spacer structure 22 obtained as described above is positioned and arranged on the second substrate 12. In this state, the first substrate 10, the second substrate 12, and the spacer assembly 22 are placed in a vacuum chamber, and the inside of the vacuum chamber is evacuated. Join to the substrate. As a result, an SED having the spacer structure 22 is manufactured.

[0039] According to the SED configured as described above, by providing the recess 27 at the spacer standing position on the surface of the grid 24, the spacer on the grid surface is manufactured when the spacer structure is manufactured. The bleeding of the forming material can be suppressed within the range of the recess. As a result, the width of the spread of the spacer-forming material that has spread on the grid surface from the base end of each spacer is reduced by the range of the gap G between the edge of the spacer base end and the end of the recess 27. Therefore, it is possible to greatly reduce compared to the conventional method. Therefore, it is possible to prevent the occurrence of discharge due to bleeding of the spacer forming material, and to improve the withstand voltage characteristics of the SED. At the same time, it is possible to prevent the orbital deviation of the electron beam due to the charging of the bleeding portion, thereby improving the landing characteristics of the electron beam and improving the luminance. Further, there is no danger that the electron beam passage hole 26 will be blocked by the spacer forming material. As a result, an SED with improved display quality can be obtained.

Next, an SED according to a second embodiment of the present invention will be described. According to the present embodiment, as shown in FIGS. 10 and 11, on the first and second surfaces 24a and 24b of the grid 24, each spacer standing position is replaced by the recess described above. An annular groove 28 is provided. That is, each groove 28 extends along the entire periphery of the grid-side edge of the first or second spacer 30a, 30b, and is formed so as to surround the periphery of the grid-side end. Each groove 28 is formed by etching or the like, and its width W and depth d are each formed at 5 to 30% of the interval D between the adjacent electron beam passage holes 26.

In the second embodiment, other configurations are the same as those of the above-described first embodiment, and the same portions are denoted by the same reference characters and detailed description thereof will not be repeated.

[0041] Also in the second embodiment configured as described above, by providing the groove 28 surrounding the spacer standing position on the surface of the grid 24, when manufacturing a spacer structure, The bleeding of the spacer forming material can be suppressed by the groove. Therefore, also in the second embodiment, the same operation and effect as in the first embodiment can be obtained.

[0042] The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention at the stage of implementation. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiment. Wear. For example, some components may be deleted from all the components shown in the embodiment. Further, components of different embodiments may be appropriately combined.

In the above-described embodiment, the spacer structure has a structure in which the first and second spacers and the dalid are integrally provided, but the second spacer is provided on the second substrate 12. It can be formed as a structure. The spacer structure may include only the grid and the second spacer, and the grid may be in contact with the first substrate.

In addition, the diameter and height of the spacer, the dimensions and materials of the other components, and the like can be appropriately selected as required without being limited to the above-described embodiment. Various filling conditions of the spacer forming material can be selected as needed. The present invention is not limited to the one using a surface conduction electron-emitting device as an electron source, but is also applicable to an image display device using another electron source such as a field emission type or a carbon nanotube.

Industrial applicability

According to the present invention, bleeding of the spacer forming material on the grid can be suppressed, generation of electric discharge due to bleeding of the spacer forming material, adverse effects on the electron beam can be suppressed, and resistance to electron beams can be reduced. An image display device with improved voltage characteristics and display quality can be provided.

Claims

The scope of the claims

[1] a first substrate on which a phosphor screen is formed,

A second substrate provided with a plurality of electron emission sources that are opposed to the first substrate with a predetermined gap and that excites the phosphor screen;

A spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates,

The spacer structure faces the first and second substrates, and has a plate-like grid having a plurality of electron beam passage holes facing the electron emission sources, and at least one of the grids. A plurality of spacers erected on the surface of the surface, wherein the grid has a plurality of recesses formed on at least one of the surfaces, and each spacer is provided in the recess. An image display device standing upright.

[2] Each of the recesses has a larger area than a grid-side end of each of the spacers, and a gap is provided between an edge of a grid-side end of each of the spacers and an edge of the recess. The image display device according to claim 1, wherein the image display device is formed.

[3] The gap between the edge of the grid-side end of each spacer and the edge of the recess extends over the entire circumference of the grid-side end of each spacer. 3. The image display device according to 1.

[4] The spacers and the recesses are provided between adjacent electron beam passage holes of the grid, and are provided between an edge of a grid side end of each spacer and an edge of the recess. 4. The image display device according to claim 2, wherein the gap is formed at 5 to 30% of the interval between the adjacent electron beams.

[5] The spacers and the recesses are provided between adjacent electron beam passage holes of the grid, and the depth of each recess is 5 to 5 times the interval between the adjacent electron beam passage holes. 3. The image display device according to claim 1, wherein the image display device is formed at 30%.

[6] The grid includes a first surface facing the first substrate, a second surface facing the second substrate, and a plurality of recesses respectively formed on the first and second surfaces. A plurality of first spacers erected in the recess on the first surface, and a plurality of first spacers erected in the recess on the second surface. 2. The image display device according to claim 1, comprising two spacers.

[7] a first substrate having a phosphor screen formed thereon,

The spacer structure faces the first and second substrates, and has a plate-like grid having a plurality of electron beam passage holes facing the electron emission sources, and at least one of the grids. A plurality of spacers erected on the surface of the grid, and the grid has a plurality of grooves formed on the at least one surface and positioned around the grid side end of each spacer. Image display device.

[8] Each of the spacers is provided between adjacent electron beam passage holes of the grid, and the width of each groove is formed to be 5 to 30 Q / o of the interval between the adjacent electron beams. Claims

8. The image display device according to 7.

[9] Each of the spacers is provided between adjacent electron beam passage holes of the grid, and a depth of each groove is formed to be 5 to 30% of a distance between the adjacent electron beams. The image display device according to claim 7.

[10] The grid includes a first surface facing the first substrate, a second surface facing the second substrate, and a plurality of the grooves formed on the first and second surfaces, respectively. Wherein the spacer includes a plurality of first spacers erected on the first surface and a plurality of second spacers erected on the second surface. 8. The image display device according to claim 7, wherein