JP2004273253A - Image display device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress discharge to an electron source side, and improve reliability and display quality. <P>SOLUTION: An image display device is provided with a first substrate 10 having a fluorescent screen, and a second substrate arranged in opposition and with a gap to the first substrate and equipped with a plurality of electron sources 18 to excite the fluorescent screen. Between these first and second substrates, a plurality of spacers 30a, 30b to support an atmospheric pressure load to act on a plate type grid 24 and the substrates are installed. The grid is formed by laminating a plurality of metal plates 28a, 28b respectively covered by high-resistance films, and has a plurality of electron beam passing holes corresponding to the electron sources respectively. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an image display device including a substrate disposed to face and a plurality of spacers disposed between the substrates, and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art In recent years, there has been a demand for a high-definition image display device for high-definition broadcasting or a high-resolution image display device associated therewith. In order to achieve these demands, it is necessary to flatten the screen surface and increase the resolution, and at the same time, reduce the weight and thickness.
[0003]
As an image display device that satisfies the above demands, for example, a flat display device such as a field emission display (hereinafter, referred to as FED) has attracted attention. This FED has a first substrate and a second substrate which are opposed to each other with a predetermined gap therebetween, and these substrates are joined to each other at their peripheral edges directly or via a rectangular frame-shaped side wall, and are connected to a vacuum chamber. Constructs an enclosure. A phosphor layer is formed on the inner surface of the first substrate, and a plurality of electron-emitting devices are provided on the inner surface of the second substrate as electron sources that excite the phosphor layer to emit light.
[0004]
In the above FED, when displaying an image, an anode voltage is applied to the phosphor layer, and the electron beam emitted from the electron-emitting device is accelerated by the anode voltage to collide with the phosphor layer, so that the phosphor emits light. To display the image.
[0005]
In the FED having such a configuration, the size of the electron-emitting device is on the order of micrometers, and the distance between the first substrate and the second substrate can be set on the order of millimeters. Therefore, it is possible to achieve higher resolution, lighter weight, and thinner image display device as compared with a cathode ray tube (CRT) currently used as a display of a television or a computer.
[0006]
On the other hand, in the image display device having the above-described configuration, a plurality of spacers are provided as a support member between these substrates in order to support the atmospheric pressure load applied to the first substrate and the second substrate. For example, Patent Document 1 discloses a configuration in which a plate-like grid is provided between a first and a second substrate, and a spacer is provided on the grid.
[0007]
[Patent Document 1]
JP 2001-272926 A
[Problems to be solved by the invention]
In the image display device as described above, in order to obtain practical display characteristics, it is necessary to use a phosphor similar to a normal cathode ray tube and set the anode voltage to several kV or more, preferably 10 kV or more. . The gap between the first substrate and the second substrate cannot be made so large from the viewpoint of resolution, characteristics of the support member, manufacturability, and the like, and needs to be set to about 1 to 2 mm. Further, when electrons having a high accelerating voltage collide with the phosphor screen, secondary electrons and reflected electrons are generated on the phosphor screen.
[0009]
When the space between the first substrate and the second substrate is narrow as described above, the secondary electrons and reflected electrons generated on the phosphor screen collide with the spacer provided between the substrates, and as a result, the spacer is Be charged. At the accelerating voltage in the FED, the spacer is generally positively charged. In this case, the electron beam emitted from the electron-emitting device is attracted to the spacer and deviates from the original orbit. As a result, there is a problem that mislanding of the electron beam occurs with respect to the phosphor layer, and the color purity of the displayed image is degraded. In addition, the charged charges of the spacer are discharged to the second substrate, and the electron-emitting devices provided on the second substrate may be damaged or deteriorated, and the display quality may be degraded.
[0010]
The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device which suppresses discharge to the electron source side and has improved reliability and display quality, and a method of manufacturing the same.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, an image display device according to an aspect of the present invention is arranged such that a first substrate having a phosphor screen is opposed to the first substrate with a gap therebetween, and emits electrons to form the first substrate. A second substrate provided with a plurality of electron sources for exciting the phosphor screen, a plurality of metal plates each covered with an insulating film, and a plurality of electron beams respectively corresponding to the electron sources; A plate-like grid having a through hole and provided between the first and second substrates facing the first and second substrates, and a large grid provided on the grid and acting on the first and second substrates; And a plurality of spacers for supporting an atmospheric pressure load.
[0012]
According to another aspect of the present invention, there is provided a method of manufacturing an image display device, comprising: a first substrate having a phosphor screen; a first substrate having a gap between the first substrate and a first substrate; A second substrate provided with a plurality of electron sources for exciting the surface, a plurality of metal plates each covered with an insulating film are formed by lamination, and a plurality of electron beam passages corresponding to the respective electron sources are formed. A plate-like grid having holes and provided between the first and second substrates facing the first and second substrates, and an atmospheric pressure acting on the first and second substrates provided on the grid A plurality of spacers for supporting a load, and a method for manufacturing an image display device comprising:
A plurality of metal plates on which a plurality of electron beam passage holes are formed are prepared, and a high-resistance material mainly composed of glass is applied to each of the metal plates to cover the metal plate, and the high-resistance material is applied. After laminating a plurality of metal plates, firing was performed to vitrify the high-resistance substance, form a grid covered with a high-resistance film, form a spacer on the surface of the grid, and form the spacer. The first substrate and the second substrate are joined to each other in a state where the grid is arranged at a predetermined position between the first substrate and the second substrate.
[0013]
According to the image display device and the manufacturing method thereof configured as described above, a grid is formed by laminating a plurality of metal plates covered with a high-resistance film, thereby forming a thick grid, and, correspondingly, a spacer. The height of the spacer can be reduced, and the size of the spacer can be reduced. As the spacers are reduced in size, the charge amount of each spacer, that is, the charge amount, can be reduced, and discharge to the electron source and suction of the electron beam can be suppressed.
In addition, the spacer is required to have sufficient strength because it receives compressive stress of atmospheric pressure from the first and second substrates and various forces are applied during handling. According to the above configuration, since the height of the spacer is reduced, it is difficult for the spacer to fall down or be broken, and the destruction of each spacer can be prevented. Furthermore, it is possible to increase the volume ratio of the high resistance film of the grid to the space between the first and second substrates to a value that does not cause dielectric breakdown.
As a result, it is possible to obtain an image display device in which the discharge breakdown of the electron source is reduced, the withstand voltage against discharge and the image quality are improved, and a method of manufacturing the same.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment in which the present invention is applied to a surface conduction electron-emitting device (hereinafter, referred to as an SED), which is a type of FED, as a flat image display device will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 3, the SED includes a first substrate 10 and a second substrate 12 each formed of a rectangular glass plate as a transparent insulating substrate. They are arranged facing each other with a gap of 0 mm. The second substrate 12 is formed to have a slightly larger dimension than the first substrate 10. Then, the first substrate 10 and the second substrate 12 are joined to each other via a rectangular frame-shaped side wall 14 made of glass, and a flat rectangular vacuum envelope 15 whose inside is maintained at a high vacuum. Is composed.
[0015]
On the inner surface of the first substrate 10, a phosphor screen 16 is formed as a phosphor screen. The phosphor screen 16 is configured by arranging phosphor layers R, G, B that emit red, blue, and green light by collision of electrons, and the light-shielding layer 11. These phosphor layers R, G, and B are formed in stripes or dots. A metal back 17 made of aluminum or the like and a getter film 19 are sequentially formed on the phosphor screen 16. Note that a transparent conductive film or a color filter film made of, for example, ITO may be provided between the first substrate 10 and the phosphor screen 16.
[0016]
On the inner surface of the second substrate 12, a large number of surface conduction electron-emitting devices 18 each emitting an electron beam are provided as electron sources for exciting the phosphor layer of the phosphor screen 16. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each of the electron-emitting devices 18 includes an electron-emitting portion (not shown), a pair of device electrodes for applying a voltage to the electron-emitting portion, and the like. In addition, on the inner surface of the second substrate 12, a number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix, and the ends of the wirings 21 are led out to the peripheral portion of the vacuum envelope 15.
[0017]
The side wall 14 functioning as a bonding member is sealed to the peripheral portion of the first substrate 10 and the peripheral portion of the second substrate 12 by a sealing material 20 such as low-melting glass, low-melting metal, or the like. The second substrates are joined together.
[0018]
As shown in FIGS. 2 and 3, the SED includes a spacer assembly 22 disposed between the first substrate 10 and the second substrate 12. In the present embodiment, the spacer assembly 22 includes a plate-shaped grid 24 and a plurality of columnar spacers integrally provided on both sides of the grid.
[0019]
More specifically, the grid 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, and is arranged in parallel with these substrates. A large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like. The electron beam passage holes 26 are arranged to face the electron-emitting devices 18, respectively, and transmit the electron beams emitted from the electron-emitting devices. The electron beam passage hole 26 is formed in a rectangular shape of, for example, 0.15 to 0.25 mm × 0.15 to 0.25 mm.
[0020]
The grid 24 is configured by laminating a plurality of metal plates each covered with a high-resistance film. In the present embodiment, the grid 24 has two metal plates 28a and 28b, and each metal plate is formed of, for example, a Fe-Ni-based metal to a plate thickness of 0.12 mm. A large number of electron beam passage holes 26 are formed in each of the metal plates 28a and 28b by etching. The surfaces of the metal plates 28a and 28b and the wall surfaces of the electron beam passage holes 26 are covered with a high-resistance film 40 having a discharge current limiting effect. The high-resistance film 40 is formed of a high-resistance material whose main component is glass, and has a resistance value of 1 × 10 ¹² to 1 × 10 ¹⁵ Ω / □. The first and second metal plates 28a and 28b covered with the high-resistance film 40 are stacked and integrated with the electron beam passage holes 26 aligned. The first metal plate 28a of the grid 24 is located on the first substrate 10 side, and the second metal plate 28b is located on the second substrate 12 side.
[0021]
The high-resistance film 40 is formed such that the film thickness at the peripheral portion of each electron beam passage hole 26 is smaller than the film thickness in other regions by adjusting the formation conditions, and the average film thickness is 20 to 40 μm. Has become. Here, the periphery of the electron beam passage hole 26 refers to the periphery of the opening on the first surface 24a side of the grid 24 and the periphery of the opening on the second surface 24b side of the electron beam passage hole. By making the high-resistance film 40 have the above-described thickness distribution, the high-resistance film can be rounded at each peripheral portion 27 of each electron beam passage hole 26, and a corner portion where charging is likely to occur is eliminated. be able to.
[0022]
A plurality of first spacers 30a are erected integrally on the first surface 24a of the grid 24, and their extending ends are interposed via the getter film 19, the metal back 17, and the light shielding layer 11 of the phosphor screen 16. It is in contact with the first substrate 10. In the present embodiment, a plurality of second spacers 30 b are integrally erected on the second surface 24 b of the grid 24, and the extending ends thereof are connected to the wiring 21 provided on the inner surface of the second substrate 12. Is in contact with The first and second spacers 30a and 30b are provided between two adjacent electron beam passage holes 26 and extend in alignment with each other. Thus, the first and second spacers 30a, 30b are formed integrally with the grid 24 with the grid 24 sandwiched from both sides.
[0023]
Each of the first and second spacers 30a and 30b fixed to the grid 24 is formed in a tapered tapered shape whose diameter decreases from the grid 24 side toward the extending end. The height of the first spacer 30a is formed lower than the height of the second spacer 30b. For example, the height of the first spacer 30a is 0.4 mm, and the height of the second spacer 30b is 0.6 mm. The first and second spacers 30a and 30b are formed of a spacer material containing glass as a main component, and the softening point of the glass is set to be equal to or lower than the softening point of the glass constituting the high-resistance film 40 described above. I have. The surface resistance of the first and second spacers 30a and 30b is 5 × 10 ¹³ Ω or more.
[0024]
The spacer assembly 22 configured as described above is disposed between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b contact the inner surfaces of the first substrate 10 and the second substrate 12 to support the atmospheric load acting on these substrates, and to set the distance between the substrates to a predetermined value. Has been maintained.
[0025]
The SED includes a first potential applying unit 42 that applies a potential to the first and second metal plates 28a and 28b of the grid 24, and a second potential applying unit 43 that applies a voltage to the metal back 17 of the first substrate 10. ing. The first potential applying unit 42 applies a higher potential than the second metal plate 28b to the first metal plate 28a. For example, the first potential applying unit 42 applies a potential of 7 kV to the first metal plate 28 a and a potential of 5 kV to the second metal plate 28 b, and the second potential applying unit 43 applies a voltage of 10 kV to the metal back 17.
[0026]
In the SED having the above configuration, when displaying an image, an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron-emitting device 18 is accelerated by the anode voltage to collide with the phosphor screen 16. Let it. Thereby, the phosphor layer of the phosphor screen 16 is excited to emit light, and an image is displayed.
[0027]
Next, a method of manufacturing the SED configured as described above will be described. When manufacturing the spacer assembly 22, first, a grid 24 having a predetermined size is formed. In this case, as shown in FIG. 4A, for example, two metal plates 28a and 28b each made of Fe-50% Ni and having a thickness of 0.12 mm are prepared, and these metal plates are degreased, washed, and dried. . Thereafter, a resist film is formed on both surfaces of each metal plate, and is exposed, developed, and dried to form a resist pattern. By etching this metal plate, a large number of electron beam passage holes 26 are formed. Subsequently, a coating liquid 41 containing low-melting glass as a main component is applied to the entire surfaces of the metal plates 28a and 28b, and dried at about 90 ° C. for about 15 minutes. Note that a spray may be used to apply the coating liquid 41.
[0028]
Next, as shown in FIG. 4B, after the two metal plates 28a and 28b are aligned and bonded via the applied coating liquid 41, the coating liquid is fired at about 550 ° C. Become Thus, as shown in FIG. 4C, a high-resistance film 40 covering the surfaces of the two metal plates 28a and 28b and the wall surface of each electron beam passage hole 26 is formed, and the high-resistance film is formed. The two metal plates are integrated with each other to form the grid 24.
[0029]
Subsequently, a number of spacers are integrally formed on the surface of the grid 24. In this case, the spacer can be formed using, for example, a mold as described below. First, first and second rectangular plate-shaped dies (not shown) having substantially the same dimensions as the grid 24 are prepared. Each of the first and second dies has a large number of through holes for forming a spacer. Then, a release material that is thermally decomposed by heat treatment is applied to at least the inner surfaces of the through holes of the first mold and the second mold. Subsequently, the first mold is brought into close contact with the first surface 24a of the grid in a state where each through hole is positioned so as to face a predetermined position of the grid 24. Similarly, the second mold is brought into close contact with the second surface 24b of the grid in a state where each through hole is positioned so as to face a predetermined position of the grid 24. Then, the first mold, the grid 24, and the second mold are fixed to each other using a clamper (not shown) or the like.
[0030]
Thereafter, the through hole of the first mold and the through hole of the second mold are filled with a paste-like spacer forming material. As a spacer forming material, a glass paste containing at least a UV-curable binder (organic component) and a glass filler is used.
[0031]
Subsequently, the filled spacer material is irradiated with ultraviolet rays (UV) as radiation from the outer surfaces of the first and second molds, and the spacer material is cured by UV. Thereafter, heat curing may be performed as necessary. Next, the release agent applied to each of the through holes of the first and second molds is thermally decomposed at about 280 ° C. by heat treatment to create a gap between the spacer forming material and the mold, and the first and second molds are formed. The mold is separated from the grid 24. As a result, the spacer forming material formed in a predetermined shape is erected on the first and second surfaces 24a and 24b of the grid 24.
[0032]
Subsequently, the grid 24 provided with the spacer forming material is subjected to a heat treatment in a heating furnace to remove the binder from the spacer forming material, and then to a temperature of about 520 to 530 ° C. lower than the softening point of the glass constituting the high resistance film 40. The spacer-forming material is finally baked and vitrified at a temperature for 30 minutes to 1 hour. At this time, by setting the softening point of the glass constituting the spacer material to be equal to or lower than the softening point of the glass constituting the high-resistance film 40, it is possible to vitrify the spacer-forming material without changing the film quality of the high-resistance film. Can be. In addition, the base ends of the first and second spacers 30a and 30b are fused with the high-resistance film 40 on the surface of the grid 24, and are joined to the grid 24 integrally with the high-resistance film. Thus, the spacer assembly 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is completed. The height of the first spacer 30a on the phosphor screen side was 0.4 mm, and the height of the second spacer 30b on the back side was 0.6 mm.
[0033]
On the other hand, a first substrate 10 on which a phosphor screen 16 and a metal back 17 are formed in advance, and a second substrate 12 on which an electron-emitting device 18, wirings 21, and the like are provided and a side wall 14 is joined are prepared. Keep it.
[0034]
Next, the spacer assembly 22 configured as described above is positioned and arranged on the second substrate 12. At this time, the spacer assembly 22 is positioned so that the extending ends of the second spacers 30b are respectively located on the wirings 21. In this state, the first substrate 10, the second substrate 12, and the spacer assembly 22 are arranged in a vacuum chamber, and after evacuating the vacuum chamber, the first substrate is joined to the second substrate via the side wall 14. . Thus, an SED including the spacer assembly 22 is manufactured.
[0035]
According to the SED and the manufacturing method thereof configured as described above, the grid 24 is provided between the first and second substrates 10 and 12, and the voltage applied to this grid is made higher than the voltage applied to the first substrate. Thus, even when a discharge occurs, the discharge occurs between the grid 24 and the second substrate 12, and does not directly discharge between the first substrate 10 and the second substrate 12. In addition, since the surface of the grid 24 is covered with the high-resistance film 40, even if a discharge occurs, a generated discharge current can be significantly reduced. Further, according to the present embodiment, of the metal plates constituting the grid 24, the potential of the first metal plate 28a close to the first substrate 10 is higher than the potential of the second metal plate 28b close to the second substrate 12. By doing so, it is possible to more reliably suppress discharge from the grid to the second substrate.
[0036]
According to the SED and the method for manufacturing the same, a plurality of metal plates coated with a high-resistance film are prepared and stacked to form a grid. For this reason, it is possible to form the grid thicker than in the related art, and to reduce the height of the spacer by that amount, thereby reducing the size of the spacer. Then, with the downsizing of the spacers, the amount of charge of each spacer, that is, the amount of charge of each spacer can be reduced, and discharge to the electron source and suction of the electron beam can be suppressed. Conventionally, while the electron beam was attracted to the spacer side and displaced by 120 μm, according to the present embodiment, the displacement could be reduced to 20 μm or less. The amount of displacement of the electron beam by the charged spacer decreases almost in proportion to the reduction in the height of the spacer.
[0037]
Further, the spacer is required to have sufficient strength because it is subjected to compressive stress of atmospheric pressure from the first and second substrates and various forces are applied during handling. According to the present embodiment, since the height of the spacer can be reduced, it is difficult for the spacer to fall down or break, and breakage of each spacer can be prevented. Further, the volume ratio of the high resistance film 40 of the grid 24 to the space between the first and second substrates can be increased to an amount that does not cause dielectric breakdown.
As a result, a discharge breakdown of the electron-emitting device 18 is reduced, and an SED with improved withstand voltage against discharge and image quality and a method for manufacturing the same are obtained. At the same time, a withstand voltage structure or a discharge current reduction structure for the electron-emitting device can be unnecessary or simplified, and the manufacturing cost can be reduced.
[0038]
Further, according to the present embodiment, after laminating a plurality of metal plates each coated with a high-resistance substance mainly composed of glass, they are fired at a predetermined temperature to vitrify the high-resistance substance. By doing so, it is possible to form metal plates each covered with a high-resistance film, and at the same time, it is possible to join and integrate a plurality of metal plates with each other. Therefore, even when the number of metal plates constituting the grid 24 is increased, the spacer assembly can be easily manufactured without increasing the number of manufacturing steps.
[0039]
Further, according to the present embodiment, the first and second spacers 30a and 30b are fused with the high-resistance film 40 on the surface of the grid 24, and are joined to the grid 24 integrally with the high-resistance film. Therefore, the strength of the first and second spacers in the horizontal and vertical directions increases, and as a result, the pressure strength of the entire vacuum envelope 15 can be improved. As compared with the SED in which the high-resistance film of the grid and the spacer are not integrated, the SED according to the present embodiment has an 80% improvement in the pressing strength.
[0040]
The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, as shown in FIG. 5, a plurality of spacer openings 32 may be provided in the grid 24, and the first and second spacers 30a and 30b may be provided so as to overlap the spacer openings. More specifically, the spacer openings 32 are located between the electron beam passage holes 26 and are arranged at a predetermined pitch. The high-resistance film 40 is formed on the surface of the grid 24, the wall surface of the electron beam passage hole 26, and the wall surface of the spacer opening 32.
[0041]
The first spacer 30a is integrally erected on the first surface 24a of the grid 24 so as to overlap with the spacer opening 32, and the second spacer 30b is overlapped with the second surface of the grid 24 so as to overlap with the spacer opening 32. It is erected integrally on 24b. Thus, each of the spacer openings 32 and the first and second spacers 30a and 30b are aligned with each other, and the first and second spacers are connected to each other through the spacer openings 32. Therefore, the first and second spacers 30a and 30b are formed integrally with the grid 24 with the grid 24 sandwiched from both sides.
[0042]
Other configurations are the same as those of the above-described embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. According to the embodiment shown in FIG. 5, it is possible to obtain the same operation and effect as in the above-described embodiment, and it is possible to further improve the pressure resistance of the spacer and the entire vacuum envelope. .
[0043]
In the above-described embodiment, the grid has a configuration in which two metal plates are stacked. However, the configuration is not limited thereto, and a grid may be configured by stacking three or more metal plates. The second spacer is not limited to being formed on the grid, but may be formed on the second substrate. In the present invention, the diameter and height of the spacer, the dimensions and materials of other components, and the like can be appropriately selected as needed. The electron source is not limited to the surface conduction type electron-emitting device, but can be variously selected from a field emission type, a carbon nanotube, and the like. The present invention is not limited to the SED but can be applied to other FEDs. It is.
[0044]
【The invention's effect】
As described in detail above, according to the present invention, it is possible to provide an image display device that suppresses discharge to the electron source side, improves reliability and display quality, and a method of manufacturing the same.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an SED according to an embodiment of the present invention.
FIG. 2 is a perspective view of the SED taken along a line AA in FIG. 1;
FIG. 3 is a sectional view showing the SED.
FIG. 4 is a sectional view showing a manufacturing process of the grid in the SED.
FIG. 5 is an enlarged cross-sectional view showing a main part of an SED according to another embodiment of the present invention.
[Explanation of symbols]
10: first substrate, 12: second substrate, 14: side wall,
15: vacuum envelope, 16: phosphor screen, 18: electron-emitting device,
22: spacer assembly, 24: grid,
26: electron beam passage hole, 28a: first metal plate, 28b: second metal plate,
30a: first spacer, 30b: second spacer, 40: high resistance film

Claims (8)

A first substrate having a phosphor screen,
A second substrate provided with a plurality of electron sources that are opposed to the first substrate with a gap therebetween and emit electrons to excite the phosphor screen;
It is formed by laminating a plurality of metal plates each covered with a high resistance film, and has a plurality of electron beam passage holes respectively corresponding to the electron sources, and is opposed to the first and second substrates. A plate-like grid provided between the first and second substrates;
An image display device comprising: a plurality of spacers provided on the grid to support an atmospheric load acting on the first and second substrates. The grid has a first metal plate located on the first substrate side, and a second metal plate located on the second substrate side,
2. The image display device according to claim 1, further comprising a potential applying unit that applies a potential to the second metal plate and applies a higher potential to the first metal plate than the second metal plate. The image display device according to claim 1, wherein the high resistance film is a high resistance film containing glass as a main component. The image display device according to claim 3, wherein the spacer is formed of a material mainly composed of glass. The grid has a first surface facing the first substrate and a second surface facing the second substrate, and the spacer is erected on the first surface and the first A plurality of first spacers contacting the substrate, and a plurality of second spacers standing on the second surface and contacting the second substrate. Item 5. The image display device according to any one of Items 1 to 4. Each of the first spacers is erected on the first surface of the grid between the electron beam passage holes, and each of the second spacers is on the second surface of the grid between the electron beam passage holes. The image display device according to claim 5, wherein the image display device is provided upright and aligned with the first spacer. A first substrate having a phosphor screen, a second substrate provided with a plurality of electron sources that are opposed to the first substrate with a gap therebetween and emit electrons to excite the phosphor screen, It is formed by laminating a plurality of metal plates each covered with an insulating film, has a plurality of electron beam passage holes respectively corresponding to the electron sources, and has a plurality of electron beam passage holes corresponding to the first and second substrates. Manufacturing of an image display device comprising: a plate-shaped grid provided between first and second substrates; and a plurality of spacers provided on the grid and supporting an atmospheric pressure load acting on the first and second substrates. In the method,
Prepare a plurality of metal plates with a plurality of electron beam passage holes formed,
Each metal plate is coated with a high-resistance substance mainly composed of glass to cover the metal plate,
After laminating a plurality of metal plates coated with the high-resistance substance, firing to vitrify the high-resistance substance, forming a grid coated with a high-resistance film,
Forming a spacer on the surface of the grid,
A method for manufacturing an image display device, wherein the first substrate and the second substrate are joined to each other with the grid on which the spacers are formed being arranged at predetermined positions between the first substrate and the second substrate. A plurality of spacers formed in a predetermined shape by a spacer forming material containing glass as a main component are arranged on the grid, and the plurality of spacers are baked to vitrify to form a spacer integral with the grid. The method for manufacturing an image display device according to claim 7.

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