JP2004260155A - リードレスリードフレーム電子パッケージ及びこれを組み込んだセンサモジュール - Google Patents

リードレスリードフレーム電子パッケージ及びこれを組み込んだセンサモジュール Download PDF

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Publication number
JP2004260155A
JP2004260155A JP2004030647A JP2004030647A JP2004260155A JP 2004260155 A JP2004260155 A JP 2004260155A JP 2004030647 A JP2004030647 A JP 2004030647A JP 2004030647 A JP2004030647 A JP 2004030647A JP 2004260155 A JP2004260155 A JP 2004260155A
Authority
JP
Japan
Prior art keywords
lead frame
flat surface
die
electronic package
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004030647A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004260155A5 (enExample
Inventor
Lee Sai Mun
サイ ミュン リー
Gurbir Singh
シン グルビール
Chin Yee Loong
イー ルーン チン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2004260155A publication Critical patent/JP2004260155A/ja
Publication of JP2004260155A5 publication Critical patent/JP2004260155A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Studio Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2004030647A 2003-02-24 2004-02-06 リードレスリードフレーム電子パッケージ及びこれを組み込んだセンサモジュール Pending JP2004260155A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/372,908 US7095621B2 (en) 2003-02-24 2003-02-24 Leadless leadframe electronic package and sensor module incorporating same

Publications (2)

Publication Number Publication Date
JP2004260155A true JP2004260155A (ja) 2004-09-16
JP2004260155A5 JP2004260155A5 (enExample) 2007-03-22

Family

ID=32850465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004030647A Pending JP2004260155A (ja) 2003-02-24 2004-02-06 リードレスリードフレーム電子パッケージ及びこれを組み込んだセンサモジュール

Country Status (3)

Country Link
US (2) US7095621B2 (enExample)
JP (1) JP2004260155A (enExample)
DE (1) DE10346292B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025182312A1 (ja) * 2024-03-01 2025-09-04 ソニーセミコンダクタソリューションズ株式会社 光学パッケージ、光学パッケージの製造方法及び電子機器

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050099659A1 (en) * 2003-11-10 2005-05-12 Jichen Wu Image sensor module
WO2006001163A1 (ja) * 2004-06-24 2006-01-05 Kabushiki Kaisha Yaskawa Denki モータ制御装置
US7521719B2 (en) * 2004-08-13 2009-04-21 Paul Steven Schranz Light emitting and image sensing device and apparatus
CN100483655C (zh) * 2005-09-09 2009-04-29 鸿富锦精密工业（深圳）有限公司 数码相机模组的制程
CN100531308C (zh) * 2005-12-02 2009-08-19 鸿富锦精密工业（深圳）有限公司 数码相机模组
US20090046201A1 (en) * 2007-08-14 2009-02-19 Shoppertrak Rct Corporation Holding apparatus for a camera lens
CN101442061B (zh) * 2007-11-20 2011-11-09 鸿富锦精密工业（深圳）有限公司 相机组件
US7915717B2 (en) * 2008-08-18 2011-03-29 Eastman Kodak Company Plastic image sensor packaging for image sensors
DE102011050246B4 (de) * 2011-05-10 2015-10-15 Jena-Optronik Gmbh Raumflugkörper mit einer optischen Aufnahmeeinrichtung
JP5261548B2 (ja) 2011-07-29 2013-08-14 シャープ株式会社 カメラモジュール
JP5998962B2 (ja) * 2013-01-31 2016-09-28 三菱電機株式会社 半導体光装置
USD937340S1 (en) * 2018-04-03 2021-11-30 Flir Systems, Inc. Sensor module
CN119511470A (zh) * 2024-10-30 2025-02-25 北京七一八友晟电子有限公司 光通讯器件的封装外壳及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927687A (en) * 1984-10-01 1990-05-22 Biotek, Inc. Sustained release transdermal drug delivery composition
IT1186165B (it) * 1985-12-20 1987-11-18 Sgs Microelettronica Spa Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione
GB8727926D0 (en) 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
US5729038A (en) * 1995-12-15 1998-03-17 Harris Corporation Silicon-glass bonded wafers
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6331451B1 (en) * 1999-11-05 2001-12-18 Amkor Technology, Inc. Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
US6526653B1 (en) * 1999-12-08 2003-03-04 Amkor Technology, Inc. Method of assembling a snap lid image sensor package
US6266197B1 (en) * 1999-12-08 2001-07-24 Amkor Technology, Inc. Molded window array for image sensor packages
US6372539B1 (en) * 2000-03-20 2002-04-16 National Semiconductor Corporation Leadless packaging process using a conductive substrate
US6525405B1 (en) * 2000-03-30 2003-02-25 Alphatec Holding Company Limited Leadless semiconductor product packaging apparatus having a window lid and method for packaging
US6355502B1 (en) * 2000-04-25 2002-03-12 National Science Council Semiconductor package and method for making the same
US6400004B1 (en) * 2000-08-17 2002-06-04 Advanced Semiconductor Engineering, Inc. Leadless semiconductor package
US6448107B1 (en) * 2000-11-28 2002-09-10 National Semiconductor Corporation Pin indicator for leadless leadframe packages
TW473951B (en) * 2001-01-17 2002-01-21 Siliconware Precision Industries Co Ltd Non-leaded quad flat image sensor package
US6524886B2 (en) * 2001-05-24 2003-02-25 Advanced Semiconductor Engineering Inc. Method of making leadless semiconductor package
US6759266B1 (en) * 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
JP3704304B2 (ja) * 2001-10-26 2005-10-12 新光電気工業株式会社 リードフレーム及びその製造方法並びに該リードフレームを用いた半導体装置の製造方法
TW567598B (en) * 2002-11-13 2003-12-21 Advanced Semiconductor Eng Flip chip semiconductor package
US6930377B1 (en) * 2002-12-04 2005-08-16 National Semiconductor Corporation Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025182312A1 (ja) * 2024-03-01 2025-09-04 ソニーセミコンダクタソリューションズ株式会社 光学パッケージ、光学パッケージの製造方法及び電子機器

Also Published As

Publication number Publication date
DE10346292B4 (de) 2010-10-28
DE10346292A1 (de) 2004-09-09
US7095621B2 (en) 2006-08-22
US20040165356A1 (en) 2004-08-26
US20060244113A1 (en) 2006-11-02

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