USD937340S1 - Sensor module - Google Patents
Sensor module Download PDFInfo
- Publication number
- USD937340S1 USD937340S1 US29/642,973 US201829642973F USD937340S US D937340 S1 USD937340 S1 US D937340S1 US 201829642973 F US201829642973 F US 201829642973F US D937340 S USD937340 S US D937340S
- Authority
- US
- United States
- Prior art keywords
- sensor module
- view
- broken lines
- dot
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines in the drawings illustrate portions of the sensor module and form no part of the claimed design. The dot-dash-dot broken lines in the drawings define the bounds of the claim and form no part thereof.
Claims (1)
- The ornamental design for a sensor module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/642,973 USD937340S1 (en) | 2018-04-03 | 2018-04-03 | Sensor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/642,973 USD937340S1 (en) | 2018-04-03 | 2018-04-03 | Sensor module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD937340S1 true USD937340S1 (en) | 2021-11-30 |
Family
ID=78704108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/642,973 Active USD937340S1 (en) | 2018-04-03 | 2018-04-03 | Sensor module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD937340S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD959537S1 (en) * | 2019-03-13 | 2022-08-02 | Teledyne Flir Commercial Systems, Inc. | Camera |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD426844S (en) * | 1999-03-12 | 2000-06-20 | Cbc Kabushiki Kaisha | Video camera for monitoring |
US20040114919A1 (en) * | 2002-12-17 | 2004-06-17 | Raytheon Company | Modular thermal security camera system |
US20040165356A1 (en) * | 2003-02-24 | 2004-08-26 | Mun Lee Sai | Leadless leadframe electronic package and sensor module incorporating same |
USD496382S1 (en) * | 2003-09-30 | 2004-09-21 | Mitsumi Electric Co., Ltd. | Camera module |
USD529528S1 (en) * | 2004-05-21 | 2006-10-03 | Trophy Tech, Inc. | Housing for bow mounted camera |
US20070047952A1 (en) * | 2005-08-24 | 2007-03-01 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module, method of manufacturing the same, and camera module using the same |
US20070223915A1 (en) * | 2006-03-27 | 2007-09-27 | Samsung Electronics Co., Ltd. | External camera and image photographing apparatus |
USD583846S1 (en) * | 2006-02-28 | 2008-12-30 | Elmo Co., Ltd. | Camera head for a video recorder |
US20120175508A1 (en) * | 2011-01-11 | 2012-07-12 | Smk Corporation | Sensor module |
US20140118612A1 (en) * | 2011-06-14 | 2014-05-01 | Kyocera Corporation | Imaging module |
US20150373239A1 (en) * | 2014-06-24 | 2015-12-24 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module and camera module including the same |
US20160065848A1 (en) * | 2014-08-28 | 2016-03-03 | Seek Thermal, Inc. | Thermography for a thermal imaging camera |
US20160205294A1 (en) * | 2015-01-12 | 2016-07-14 | Lg Innotek Co., Ltd. | Camera module and a camera for a vehicle |
US20160253561A1 (en) * | 2014-08-04 | 2016-09-01 | Bae Systems Information And Electronic Systems Integration Inc. | Face mounted extreme environment thermal sensor |
USD774584S1 (en) * | 2014-01-06 | 2016-12-20 | Flir Systems, Inc. | Camera module |
US20170102606A1 (en) * | 2016-12-21 | 2017-04-13 | Mohawk Innovations Limited | Modular Sensing Device |
USD809046S1 (en) * | 2017-03-20 | 2018-01-30 | Taser International, Inc. | Camera |
US20180309912A1 (en) * | 2015-10-21 | 2018-10-25 | Lg Innotek Co., Ltd. | Camera module |
US20180374885A1 (en) * | 2017-06-21 | 2018-12-27 | Robert Bosch Gmbh | Image-sensor module |
US20190028620A1 (en) * | 2016-01-12 | 2019-01-24 | Lg Innotek Co., Ltd. | Camera module |
US20190077334A1 (en) * | 2017-06-26 | 2019-03-14 | Stavros Tsantzalis | Thermal vision imaging device and system |
US20190132954A1 (en) * | 2016-04-14 | 2019-05-02 | Lg Innotek Co., Ltd. | Device for fixing camera module circuit board, and camera module |
US20190178775A1 (en) * | 2017-12-11 | 2019-06-13 | Honeywell International Inc. | Miniature optical particulate matter sensor module |
US20190212549A1 (en) * | 2016-08-11 | 2019-07-11 | Lg Innotek Co., Ltd. | Camera module |
USD868873S1 (en) * | 2018-04-03 | 2019-12-03 | Flir Systems, Inc. | Sensor module holder |
USD870796S1 (en) * | 2018-06-15 | 2019-12-24 | Hangzhou Hikvision Digital Technology Co., Ltd. | Thermal imager for temperature measurement |
US20200076993A1 (en) * | 2018-09-05 | 2020-03-05 | Canon Kabushiki Kaisha | Imaging device and imaging system |
USD886176S1 (en) * | 2018-11-14 | 2020-06-02 | Guangzhou Sat Infrared Technology Co. Ltd | Thermal imaging camera |
USD894991S1 (en) * | 2018-07-24 | 2020-09-01 | Hanwha Techwin Co., Ltd. | Camera |
USD908154S1 (en) * | 2018-09-04 | 2021-01-19 | Canon Kabushiki Kaisha | Body of an industrial camera for machine vision |
-
2018
- 2018-04-03 US US29/642,973 patent/USD937340S1/en active Active
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD426844S (en) * | 1999-03-12 | 2000-06-20 | Cbc Kabushiki Kaisha | Video camera for monitoring |
US20040114919A1 (en) * | 2002-12-17 | 2004-06-17 | Raytheon Company | Modular thermal security camera system |
US20040165356A1 (en) * | 2003-02-24 | 2004-08-26 | Mun Lee Sai | Leadless leadframe electronic package and sensor module incorporating same |
USD496382S1 (en) * | 2003-09-30 | 2004-09-21 | Mitsumi Electric Co., Ltd. | Camera module |
USD529528S1 (en) * | 2004-05-21 | 2006-10-03 | Trophy Tech, Inc. | Housing for bow mounted camera |
US20070047952A1 (en) * | 2005-08-24 | 2007-03-01 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module, method of manufacturing the same, and camera module using the same |
USD583846S1 (en) * | 2006-02-28 | 2008-12-30 | Elmo Co., Ltd. | Camera head for a video recorder |
US20070223915A1 (en) * | 2006-03-27 | 2007-09-27 | Samsung Electronics Co., Ltd. | External camera and image photographing apparatus |
US20120175508A1 (en) * | 2011-01-11 | 2012-07-12 | Smk Corporation | Sensor module |
US20140118612A1 (en) * | 2011-06-14 | 2014-05-01 | Kyocera Corporation | Imaging module |
USD774584S1 (en) * | 2014-01-06 | 2016-12-20 | Flir Systems, Inc. | Camera module |
US20150373239A1 (en) * | 2014-06-24 | 2015-12-24 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module and camera module including the same |
US20160253561A1 (en) * | 2014-08-04 | 2016-09-01 | Bae Systems Information And Electronic Systems Integration Inc. | Face mounted extreme environment thermal sensor |
US20160065848A1 (en) * | 2014-08-28 | 2016-03-03 | Seek Thermal, Inc. | Thermography for a thermal imaging camera |
US20160205294A1 (en) * | 2015-01-12 | 2016-07-14 | Lg Innotek Co., Ltd. | Camera module and a camera for a vehicle |
US20180309912A1 (en) * | 2015-10-21 | 2018-10-25 | Lg Innotek Co., Ltd. | Camera module |
US20190028620A1 (en) * | 2016-01-12 | 2019-01-24 | Lg Innotek Co., Ltd. | Camera module |
US20190132954A1 (en) * | 2016-04-14 | 2019-05-02 | Lg Innotek Co., Ltd. | Device for fixing camera module circuit board, and camera module |
US20190212549A1 (en) * | 2016-08-11 | 2019-07-11 | Lg Innotek Co., Ltd. | Camera module |
US20170102606A1 (en) * | 2016-12-21 | 2017-04-13 | Mohawk Innovations Limited | Modular Sensing Device |
USD809046S1 (en) * | 2017-03-20 | 2018-01-30 | Taser International, Inc. | Camera |
US20180374885A1 (en) * | 2017-06-21 | 2018-12-27 | Robert Bosch Gmbh | Image-sensor module |
US20190077334A1 (en) * | 2017-06-26 | 2019-03-14 | Stavros Tsantzalis | Thermal vision imaging device and system |
US20190178775A1 (en) * | 2017-12-11 | 2019-06-13 | Honeywell International Inc. | Miniature optical particulate matter sensor module |
USD868873S1 (en) * | 2018-04-03 | 2019-12-03 | Flir Systems, Inc. | Sensor module holder |
USD870796S1 (en) * | 2018-06-15 | 2019-12-24 | Hangzhou Hikvision Digital Technology Co., Ltd. | Thermal imager for temperature measurement |
USD894991S1 (en) * | 2018-07-24 | 2020-09-01 | Hanwha Techwin Co., Ltd. | Camera |
USD908154S1 (en) * | 2018-09-04 | 2021-01-19 | Canon Kabushiki Kaisha | Body of an industrial camera for machine vision |
US20200076993A1 (en) * | 2018-09-05 | 2020-03-05 | Canon Kabushiki Kaisha | Imaging device and imaging system |
USD886176S1 (en) * | 2018-11-14 | 2020-06-02 | Guangzhou Sat Infrared Technology Co. Ltd | Thermal imaging camera |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD959537S1 (en) * | 2019-03-13 | 2022-08-02 | Teledyne Flir Commercial Systems, Inc. | Camera |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD906569S1 (en) | Sensor light | |
USD898602S1 (en) | Dial | |
USD902836S1 (en) | Roof bar | |
USD906568S1 (en) | Sensor light | |
USD868609S1 (en) | Contact sensor | |
USD867876S1 (en) | Container | |
USD874284S1 (en) | Container | |
USD905546S1 (en) | Fastener | |
USD838372S1 (en) | Wearable biometric sensor | |
USD924081S1 (en) | Infrared thermometer | |
USD887259S1 (en) | Fastening device | |
USD838190S1 (en) | Sensor module | |
USD912553S1 (en) | Optoelectronic sensor | |
USD944667S1 (en) | Sensor housing | |
USD931121S1 (en) | Thermometer | |
USD969630S1 (en) | Lidar sensor assembly | |
USD898597S1 (en) | Wearable sensor | |
USD995331S1 (en) | Motion sensor | |
USD947697S1 (en) | Sensor housing | |
USD845800S1 (en) | Scale | |
USD961425S1 (en) | Optical sensor | |
USD922892S1 (en) | Dial | |
USD888278S1 (en) | Vial rack | |
USD904909S1 (en) | Sensor housing | |
USD1015882S1 (en) | Bottle |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |