JP2004207690A - 樹脂材製ヒートシンク - Google Patents

樹脂材製ヒートシンク Download PDF

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Publication number
JP2004207690A
JP2004207690A JP2003377024A JP2003377024A JP2004207690A JP 2004207690 A JP2004207690 A JP 2004207690A JP 2003377024 A JP2003377024 A JP 2003377024A JP 2003377024 A JP2003377024 A JP 2003377024A JP 2004207690 A JP2004207690 A JP 2004207690A
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JP
Japan
Prior art keywords
heat
heat sink
resin
resin material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003377024A
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English (en)
Japanese (ja)
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JP2004207690A5 (enExample
Inventor
Masayoshi Usui
正佳 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Usui Kokusai Sangyo Kaisha Ltd
Original Assignee
Usui Kokusai Sangyo Kaisha Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Usui Kokusai Sangyo Kaisha Ltd filed Critical Usui Kokusai Sangyo Kaisha Ltd
Priority to JP2003377024A priority Critical patent/JP2004207690A/ja
Publication of JP2004207690A publication Critical patent/JP2004207690A/ja
Publication of JP2004207690A5 publication Critical patent/JP2004207690A5/ja
Withdrawn legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2003377024A 2002-12-13 2003-11-06 樹脂材製ヒートシンク Withdrawn JP2004207690A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003377024A JP2004207690A (ja) 2002-12-13 2003-11-06 樹脂材製ヒートシンク

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002362259 2002-12-13
JP2003377024A JP2004207690A (ja) 2002-12-13 2003-11-06 樹脂材製ヒートシンク

Publications (2)

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JP2004207690A true JP2004207690A (ja) 2004-07-22
JP2004207690A5 JP2004207690A5 (enExample) 2006-12-21

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Family Applications (1)

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JP2003377024A Withdrawn JP2004207690A (ja) 2002-12-13 2003-11-06 樹脂材製ヒートシンク

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JP (1) JP2004207690A (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086471A (ja) * 2004-09-17 2006-03-30 Yaskawa Electric Corp 放熱フィンおよびその製造方法
JP2007208000A (ja) * 2006-02-01 2007-08-16 Furukawa Electric Co Ltd:The 電子部品冷却用ヒートシンク及びその製造方法
WO2009005029A1 (ja) * 2007-07-02 2009-01-08 Starlite Co., Ltd. 樹脂製ヒートシンク
JP2009289725A (ja) * 2008-05-28 2009-12-10 Taida Electronic Ind Co Ltd 照明装置及びその放熱機構
JP2009290185A (ja) * 2008-05-30 2009-12-10 Samsung Electro Mech Co Ltd 放熱ピン及びこの放熱ピンを含むパッケージ基板、並びにその製造方法
JP2013036720A (ja) * 2011-08-11 2013-02-21 Sharp Corp 空気調和機
JP2013524439A (ja) * 2010-04-02 2013-06-17 ジーイー ライティング ソリューションズ エルエルシー 軽量ヒートシンク及びそれを使用するｌｅｄランプ
US8743546B2 (en) 2007-10-22 2014-06-03 Fujitsu Limited Sheet structure and method of manufacturing the same
JP2015053490A (ja) * 2010-03-24 2015-03-19 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP2015228297A (ja) * 2014-05-30 2015-12-17 ダイキョーニシカワ株式会社 電池モジュール
JP2017149131A (ja) * 2015-11-23 2017-08-31 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 複合部品の加熱の制御
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
KR101869190B1 (ko) * 2017-02-23 2018-06-25 한국광기술원 수송기기용 led 조명장치의 히트싱크 구조 및 그 제조방법
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
CN111834309A (zh) * 2020-07-21 2020-10-27 西安科技大学 混合润湿性微纳复合强化换热结构及该结构的制备方法

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
JP2006086471A (ja) * 2004-09-17 2006-03-30 Yaskawa Electric Corp 放熱フィンおよびその製造方法
JP2007208000A (ja) * 2006-02-01 2007-08-16 Furukawa Electric Co Ltd:The 電子部品冷却用ヒートシンク及びその製造方法
WO2009005029A1 (ja) * 2007-07-02 2009-01-08 Starlite Co., Ltd. 樹脂製ヒートシンク
US8743546B2 (en) 2007-10-22 2014-06-03 Fujitsu Limited Sheet structure and method of manufacturing the same
JP2009289725A (ja) * 2008-05-28 2009-12-10 Taida Electronic Ind Co Ltd 照明装置及びその放熱機構
JP2009290185A (ja) * 2008-05-30 2009-12-10 Samsung Electro Mech Co Ltd 放熱ピン及びこの放熱ピンを含むパッケージ基板、並びにその製造方法
US8377748B2 (en) 2008-05-30 2013-02-19 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing cooling fin and package substrate with cooling fin
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
JP2015053490A (ja) * 2010-03-24 2015-03-19 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP2013524439A (ja) * 2010-04-02 2013-06-17 ジーイー ライティング ソリューションズ エルエルシー 軽量ヒートシンク及びそれを使用するｌｅｄランプ
JP2013036720A (ja) * 2011-08-11 2013-02-21 Sharp Corp 空気調和機
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof
JP2015228297A (ja) * 2014-05-30 2015-12-17 ダイキョーニシカワ株式会社 電池モジュール
JP2017149131A (ja) * 2015-11-23 2017-08-31 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 複合部品の加熱の制御
KR101869190B1 (ko) * 2017-02-23 2018-06-25 한국광기술원 수송기기용 led 조명장치의 히트싱크 구조 및 그 제조방법
CN111834309A (zh) * 2020-07-21 2020-10-27 西安科技大学 混合润湿性微纳复合强化换热结构及该结构的制备方法
CN111834309B (zh) * 2020-07-21 2021-10-01 西安科技大学 混合润湿性微纳复合强化换热结构及该结构的制备方法

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