JP2004207690A - 樹脂材製ヒートシンク - Google Patents

樹脂材製ヒートシンク Download PDF

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Publication number
JP2004207690A
JP2004207690A JP2003377024A JP2003377024A JP2004207690A JP 2004207690 A JP2004207690 A JP 2004207690A JP 2003377024 A JP2003377024 A JP 2003377024A JP 2003377024 A JP2003377024 A JP 2003377024A JP 2004207690 A JP2004207690 A JP 2004207690A
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JP
Japan
Prior art keywords
heat
heat sink
resin material
resin
substrate
Prior art date
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Withdrawn
Application number
JP2003377024A
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English (en)
Japanese (ja)
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JP2004207690A5 (enrdf_load_stackoverflow
Inventor
Masayoshi Usui
正佳 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Usui Kokusai Sangyo Kaisha Ltd
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Usui Kokusai Sangyo Kaisha Ltd
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Application filed by Usui Kokusai Sangyo Kaisha Ltd filed Critical Usui Kokusai Sangyo Kaisha Ltd
Priority to JP2003377024A priority Critical patent/JP2004207690A/ja
Publication of JP2004207690A publication Critical patent/JP2004207690A/ja
Publication of JP2004207690A5 publication Critical patent/JP2004207690A5/ja
Withdrawn legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003377024A 2002-12-13 2003-11-06 樹脂材製ヒートシンク Withdrawn JP2004207690A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003377024A JP2004207690A (ja) 2002-12-13 2003-11-06 樹脂材製ヒートシンク

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002362259 2002-12-13
JP2003377024A JP2004207690A (ja) 2002-12-13 2003-11-06 樹脂材製ヒートシンク

Publications (2)

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JP2004207690A true JP2004207690A (ja) 2004-07-22
JP2004207690A5 JP2004207690A5 (enrdf_load_stackoverflow) 2006-12-21

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ID=32828644

Family Applications (1)

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JP2003377024A Withdrawn JP2004207690A (ja) 2002-12-13 2003-11-06 樹脂材製ヒートシンク

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JP (1) JP2004207690A (enrdf_load_stackoverflow)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086471A (ja) * 2004-09-17 2006-03-30 Yaskawa Electric Corp 放熱フィンおよびその製造方法
JP2007208000A (ja) * 2006-02-01 2007-08-16 Furukawa Electric Co Ltd:The 電子部品冷却用ヒートシンク及びその製造方法
WO2009005029A1 (ja) * 2007-07-02 2009-01-08 Starlite Co., Ltd. 樹脂製ヒートシンク
JP2009289725A (ja) * 2008-05-28 2009-12-10 Taida Electronic Ind Co Ltd 照明装置及びその放熱機構
JP2009290185A (ja) * 2008-05-30 2009-12-10 Samsung Electro Mech Co Ltd 放熱ピン及びこの放熱ピンを含むパッケージ基板、並びにその製造方法
JP2013036720A (ja) * 2011-08-11 2013-02-21 Sharp Corp 空気調和機
JP2013524439A (ja) * 2010-04-02 2013-06-17 ジーイー ライティング ソリューションズ エルエルシー 軽量ヒートシンク及びそれを使用するｌｅｄランプ
US8743546B2 (en) 2007-10-22 2014-06-03 Fujitsu Limited Sheet structure and method of manufacturing the same
JP2015053490A (ja) * 2010-03-24 2015-03-19 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP2015228297A (ja) * 2014-05-30 2015-12-17 ダイキョーニシカワ株式会社 電池モジュール
JP2017149131A (ja) * 2015-11-23 2017-08-31 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 複合部品の加熱の制御
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
KR101869190B1 (ko) * 2017-02-23 2018-06-25 한국광기술원 수송기기용 led 조명장치의 히트싱크 구조 및 그 제조방법
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
CN111834309A (zh) * 2020-07-21 2020-10-27 西安科技大学 混合润湿性微纳复合强化换热结构及该结构的制备方法

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
JP2006086471A (ja) * 2004-09-17 2006-03-30 Yaskawa Electric Corp 放熱フィンおよびその製造方法
JP2007208000A (ja) * 2006-02-01 2007-08-16 Furukawa Electric Co Ltd:The 電子部品冷却用ヒートシンク及びその製造方法
WO2009005029A1 (ja) * 2007-07-02 2009-01-08 Starlite Co., Ltd. 樹脂製ヒートシンク
US8743546B2 (en) 2007-10-22 2014-06-03 Fujitsu Limited Sheet structure and method of manufacturing the same
JP2009289725A (ja) * 2008-05-28 2009-12-10 Taida Electronic Ind Co Ltd 照明装置及びその放熱機構
JP2009290185A (ja) * 2008-05-30 2009-12-10 Samsung Electro Mech Co Ltd 放熱ピン及びこの放熱ピンを含むパッケージ基板、並びにその製造方法
US8377748B2 (en) 2008-05-30 2013-02-19 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing cooling fin and package substrate with cooling fin
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
JP2015053490A (ja) * 2010-03-24 2015-03-19 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP2013524439A (ja) * 2010-04-02 2013-06-17 ジーイー ライティング ソリューションズ エルエルシー 軽量ヒートシンク及びそれを使用するｌｅｄランプ
JP2013036720A (ja) * 2011-08-11 2013-02-21 Sharp Corp 空気調和機
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof
JP2015228297A (ja) * 2014-05-30 2015-12-17 ダイキョーニシカワ株式会社 電池モジュール
JP2017149131A (ja) * 2015-11-23 2017-08-31 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 複合部品の加熱の制御
KR101869190B1 (ko) * 2017-02-23 2018-06-25 한국광기술원 수송기기용 led 조명장치의 히트싱크 구조 및 그 제조방법
CN111834309A (zh) * 2020-07-21 2020-10-27 西安科技大学 混合润湿性微纳复合强化换热结构及该结构的制备方法
CN111834309B (zh) * 2020-07-21 2021-10-01 西安科技大学 混合润湿性微纳复合强化换热结构及该结构的制备方法

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