JP2004207690A5 - - Google Patents
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- Publication number
- JP2004207690A5 JP2004207690A5 JP2003377024A JP2003377024A JP2004207690A5 JP 2004207690 A5 JP2004207690 A5 JP 2004207690A5 JP 2003377024 A JP2003377024 A JP 2003377024A JP 2003377024 A JP2003377024 A JP 2003377024A JP 2004207690 A5 JP2004207690 A5 JP 2004207690A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003377024A JP2004207690A (ja) | 2002-12-13 | 2003-11-06 | 樹脂材製ヒートシンク |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002362259 | 2002-12-13 | ||
| JP2003377024A JP2004207690A (ja) | 2002-12-13 | 2003-11-06 | 樹脂材製ヒートシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004207690A JP2004207690A (ja) | 2004-07-22 |
| JP2004207690A5 true JP2004207690A5 (enrdf_load_stackoverflow) | 2006-12-21 |
Family
ID=32828644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003377024A Withdrawn JP2004207690A (ja) | 2002-12-13 | 2003-11-06 | 樹脂材製ヒートシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004207690A (enrdf_load_stackoverflow) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| JP4666203B2 (ja) * | 2004-09-17 | 2011-04-06 | 株式会社安川電機 | 放熱フィンおよびその製造方法 |
| JP2007208000A (ja) * | 2006-02-01 | 2007-08-16 | Furukawa Electric Co Ltd:The | 電子部品冷却用ヒートシンク及びその製造方法 |
| JP4631877B2 (ja) * | 2007-07-02 | 2011-02-16 | スターライト工業株式会社 | 樹脂製ヒートシンク |
| JP5104688B2 (ja) | 2007-10-22 | 2012-12-19 | 富士通株式会社 | シート状構造体及びその製造方法並びに電子機器 |
| TWI363850B (en) * | 2008-05-28 | 2012-05-11 | Delta Electronics Inc | Illuminating device and heat-dissipating structure thereof |
| KR101022954B1 (ko) | 2008-05-30 | 2011-03-16 | 삼성전기주식회사 | 방열핀과 이 방열핀을 포함하는 패키지 기판 및 그제조방법 |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| JP5712697B2 (ja) * | 2010-03-24 | 2015-05-07 | 三菱エンジニアリングプラスチックス株式会社 | 放熱部材及び発熱体の放熱構造 |
| JP2013524439A (ja) * | 2010-04-02 | 2013-06-17 | ジーイー ライティング ソリューションズ エルエルシー | 軽量ヒートシンク及びそれを使用するｌｅｄランプ |
| JP2013036720A (ja) * | 2011-08-11 | 2013-02-21 | Sharp Corp | 空気調和機 |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| JP6242296B2 (ja) * | 2014-05-30 | 2017-12-06 | ダイキョーニシカワ株式会社 | 電池モジュール |
| US10022896B2 (en) * | 2015-11-23 | 2018-07-17 | The Boeing Company | Controlling the heating of a composite part |
| KR101869190B1 (ko) * | 2017-02-23 | 2018-06-25 | 한국광기술원 | 수송기기용 led 조명장치의 히트싱크 구조 및 그 제조방법 |
| CN111834309B (zh) * | 2020-07-21 | 2021-10-01 | 西安科技大学 | 混合润湿性微纳复合强化换热结构及该结构的制备方法 |
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2003
- 2003-11-06 JP JP2003377024A patent/JP2004207690A/ja not_active Withdrawn