JP2004200719A5 - - Google Patents

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Publication number
JP2004200719A5
JP2004200719A5 JP2004072518A JP2004072518A JP2004200719A5 JP 2004200719 A5 JP2004200719 A5 JP 2004200719A5 JP 2004072518 A JP2004072518 A JP 2004072518A JP 2004072518 A JP2004072518 A JP 2004072518A JP 2004200719 A5 JP2004200719 A5 JP 2004200719A5
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor chip
tab
inner lead
lead portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004072518A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004200719A (ja
JP4764608B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004072518A priority Critical patent/JP4764608B2/ja
Priority claimed from JP2004072518A external-priority patent/JP4764608B2/ja
Publication of JP2004200719A publication Critical patent/JP2004200719A/ja
Publication of JP2004200719A5 publication Critical patent/JP2004200719A5/ja
Application granted granted Critical
Publication of JP4764608B2 publication Critical patent/JP4764608B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2004072518A 1999-06-30 2004-03-15 半導体装置 Expired - Lifetime JP4764608B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004072518A JP4764608B2 (ja) 1999-06-30 2004-03-15 半導体装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP1999184739 1999-06-30
JP18473999 1999-06-30
JP2000105251 2000-04-06
JP2000105251 2000-04-06
JP2004072518A JP4764608B2 (ja) 1999-06-30 2004-03-15 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001508498A Division JP3839321B2 (ja) 1999-06-30 2000-06-30 半導体装置およびその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2008262404A Division JP4388586B2 (ja) 1999-06-30 2008-10-09 半導体装置
JP2010225542A Division JP5564392B2 (ja) 1999-06-30 2010-10-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2004200719A JP2004200719A (ja) 2004-07-15
JP2004200719A5 true JP2004200719A5 (https=) 2009-03-26
JP4764608B2 JP4764608B2 (ja) 2011-09-07

Family

ID=32776660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004072518A Expired - Lifetime JP4764608B2 (ja) 1999-06-30 2004-03-15 半導体装置

Country Status (1)

Country Link
JP (1) JP4764608B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012195454A (ja) * 2011-03-16 2012-10-11 Ricoh Co Ltd 半導体装置
JP2014099534A (ja) * 2012-11-15 2014-05-29 Dainippon Printing Co Ltd リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
CN120308912B (zh) * 2025-06-13 2025-09-05 山西富亨迪新材料股份有限公司 一种镁沉积储氢材料的智能化生产工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1093004A (ja) * 1996-09-11 1998-04-10 Matsushita Electron Corp 電子部品およびその製造方法
JPH10229152A (ja) * 1996-12-10 1998-08-25 Furukawa Electric Co Ltd:The 電子部品用リード材、それを用いたリードおよび半導体装置
JP3493113B2 (ja) * 1997-03-21 2004-02-03 株式会社ルネサステクノロジ 半導体装置の製造方法およびリードフレーム
US6157074A (en) * 1997-07-16 2000-12-05 Hyundai Electronics Industries Co., Ltd. Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same

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