JP2004179256A - Collet and method for transferring and manufacturing component unit using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide technology for suppressing dispersion of thickness of a bonding material layer even if external force operates on a substrate and electronic components in a state where a bonding material is not solidified. <P>SOLUTION: A collet 10 is used for sucking and holding the substrate 34 by substrate suction holes 12 made in a substrate abutting part 16, sucking and holding a bare chip 30 by a bare chip suction hole 14 made in a bare chip abutting part 24 and bonding the substrate 34 and the bare chip 30. A distance between the substrate abutting part 16 and the bare chip abutting part 24 becomes a value obtained by adding a design value of thickness of a solder 32 and a size of a thickness direction of the bare chip 10. The substrate abutting part 16 and the bare chip abutting part 24 are adjusted so that confronted faces of the substrate 34 sucked by the substrate abutting part 16 and the bare chip 30 sucked by the bare chip abutting part 24 become parallel. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet for joining a second component (for example, an electronic component such as a bare chip or a chip component) to a first component (for example, a substrate or the like). The present invention relates to a method of transporting used component units and a method of manufacturing the same.
[0002]
2. Description of the Related Art A collet is used as a jig for joining an electronic component such as a bare chip to a substrate or the like (for example, Patent Documents 1 to 3). A conventional collet includes a contact portion that contacts an electronic component, and the contact portion has a suction hole. The electronic component is held by the collet by being sucked into the suction hole. The collet holding the electronic component moves to a predetermined position on the substrate. When the electronic component moves to a predetermined position on the substrate, a bonding material (for example, solder or the like) in a molten state is supplied between the electronic component and the substrate. When the bonding material in a molten state is supplied, the collet releases suction of the electronic component. Therefore, the electronic component and the collet are separated from each other, and the electronic component is mounted on the substrate via the bonding material. The bonding material in the molten state is then cooled and solidified. The substrate and the electronic component are joined by solidifying the joining material from the molten state. Thus, a component unit including the board and the electronic component is manufactured.
[0003]
[Patent Document 1]
JP-A-8-88239 [Patent Document 2]
JP-A-11-297716 [Patent Document 3]
JP 2001-246588 A
As described above, the bonding between the substrate and the electronic component is performed by the solidification of the bonding material in a molten state. Therefore, the bonding between the substrate and the electronic component is not completed until the bonding material solidifies.
However, an external force may act on the substrate or the electronic component before the bonding material solidifies. For example, when the electronic component and the substrate are transported to another place (for example, a cooling zone) while the bonding material is in an unsolidified state, the vibration of the transport device that transports the electronic component and the substrate causes the substrate or the electronic component to vibrate. Is transmitted to.
Here, the conventional collet sucks and holds only the electronic component, and separates from the electronic component after the electronic component is conveyed onto the substrate. Therefore, until the bonding material solidifies, the relative positional relationship between the substrate and the electronic component is not restricted, and when an external force acts on the substrate or the electronic component, the electronic component moves with respect to the substrate. As a result, there is a problem that the thickness of the bonding material layer between the board and the electronic component varies between the component units.
[0005]
The present invention has been made to solve the above problems, and an object thereof is to provide a bonding material layer between component units even when an external force acts on a substrate or an electronic component in a state where the bonding material is not solidified. Provided is a technique capable of suppressing the occurrence of variations in the thickness of a sheet.
[0006]
In order to achieve the above object, an invention according to a first aspect is a collet for joining a second component on a first component, comprising: A first contact portion that contacts the first component, and a second contact portion that contacts the second component. The first contact portion and the second contact portion each have a suction hole. Is provided.
The collet sucks and holds a first component (for example, a board or the like) in a first contact portion, and sucks and holds a second component (for example, an electronic component or the like) in a second contact portion. Can be held. Therefore, by holding the first component and the second component by the collet until the joining material solidifies, the positional relationship between the first component and the second component can be maintained even when an external force acts on the first component and the second component. it can. For this reason, it is possible to suppress the thickness of the bonding material layer for bonding the first component and the second component from varying between the component units.
[0007]
In the above collet, when the first contact portion is in contact with the first component as in the invention according to claim 2, the joint surface of the second component sucked by the second contact portion And the joining surface of the first component are preferably parallel to each other.
According to such a configuration, while the joining material solidifies, the joining surface of the first component and the joining surface of the second component can be kept parallel. For this reason, the thickness of the bonding material layer can be made uniform.
[0008]
When joining the second component on the first component using the collet, the first component and the second component may be cooled until the joining material solidifies on the spot without transporting the first component and the second component. Alternatively, the first component and the second component can be transported to another location (for example, on a cooling device) while the bonding material remains unsolidified. When the bonding material is transported in an unsolidified state, it is preferable to transport the bonding material by the method described below.
That is, a transport method according to claim 3 is a method of transporting a component unit on which a second component is mounted on a first component via a bonding material, wherein the collet according to claim 1 or 2 is provided. The first part is sucked into the first contact part and the second part is sucked into the second contact part, and the first part and the second part are transported together with the collet.
According to this method, the first part and the second part are transported together with the collet in a state where the first part and the second part are sucked (held) by the respective contact portions of the collet. Therefore, even if an external force acts on the first component or the second component during transport, the relative positional relationship between them is maintained, and the occurrence of variation in the thickness of the bonding material layer between component units is suppressed. be able to.
[0009]
Further, by using the collet, it is possible to suitably manufacture a component unit including the first component and the second component die-bonded on the first component.
That is, a manufacturing method according to a fourth aspect is a method of manufacturing a component unit including a first component and a second component bonded on the first component, and is a method according to the first or second aspect. Suctioning the second part to the second contact part of the collet, and applying the second part sucked to the second contact part by applying the first contact part of the collet to the first part Conveying onto the first component, supplying a bonding material in a molten state between the first component and the second component, sucking the first component into the first contact portion, and Solidifying the bonding material in a molten state with the second component sucked into the second contact portion.
According to this method, the positional relationship between the first component and the second component is maintained until the bonding material solidifies. For this reason, in the component units manufactured by the present method, the thickness of the bonding material layer varies from component unit to component unit.
Note that various methods can be adopted as a method for supplying the bonding material in a molten state between the first component and the second component. For example, a method in which a bonding material in a solid state is previously arranged on a first component and then heated and melted after the second component is conveyed (for example, reflow soldering or the like), or directly bonded on the second component A method of applying a material (for example, die bonding) or a method of supplying a bonding material in a molten state after the second component is conveyed onto the first component can be used.
[0010]
According to a fifth aspect of the present invention, there is provided a method of manufacturing a component unit including a first component and a second component bonded on the first component, wherein the second component is sucked into the collet. Performing the step of: transporting the sucked second component onto the first component; supplying a bonding material in a molten state between the first component and the second component; Suctioning the collet and solidifying the molten bonding material in a state where the positional relationship between the first component and the second component is regulated.
According to this manufacturing method, the same effect as in claim 4 can be obtained, and variation in the thickness of the bonding material layer between the component units can be suppressed.
[0011]
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention described in each of the above-mentioned claims can be suitably implemented in the following forms.
(Feature 1) The collet has a first contact surface that contacts the first component and a second contact surface that contacts the second component. Each contact surface is provided with a suction hole.
(Mode 2) An inverted concave portion is provided on the bottom surface of the collet. The portion of the collet bottom surface where the inverted recess is not provided contacts the first component. A contact surface for contacting the second component is provided in the inverted concave portion on the bottom surface of the collet.
(Mode 3) The collet is attached to the tip of the robot arm. When the second component is sucked by the collet, the robot arm is driven such that the first contact portion of the collet contacts a predetermined position of the first component. The first contact portion contacts the first component and sucks the first component. A bonding material in a molten state is supplied between the first component and the second component. The robot arm is driven in a state where the first part is sucked into the first contact part and the second part is sucked into the second contact part. Thereby, the first component and the second component are transported together with the collet from the heating step (heating zone) to the cooling step (cooling zone). When the bonding material solidifies in the cooling step, the suction of the first component and the second component into the collet is released.
(Mode 4) The first component is a substrate, and the second component is an electronic component.
(Mode 5) The first component is a heat sink, and the second component is a board.
[0012]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings. The collet of this embodiment is used by being attached to the tip of a robot arm (not shown) of the electronic component mounting apparatus. The collet moves with the movement of the robot arm. The movement of the robot arm transfers the substrate as the first component and the bare chip as the second component from the heating step to the cooling step.
[0013]
<First Embodiment> FIG. 1 is a sectional view of a collet according to a first embodiment of the present invention. In FIG. 1, reference numeral 10 denotes a collet, 30 denotes a bare chip, 32 denotes a solder (joining material), and 34 denotes a substrate.
As shown in FIG. 1, the collet 10 is provided with a substrate contact portion 16 that contacts the substrate 34 and a bare chip contact portion 24 that contacts the bare chip 30. The substrate contact portion 16 is provided on the bottom surface (flat surface) of the lower end of the main body of the collet 10, and sucks and holds the substrate 34 at the bottom surface. On the other hand, the bare chip contact portion 24 is an upper flat surface of the inverted concave portion 20 provided on the bottom surface of the collet main body 10, and holds the bare chip 30 on the upper flat surface. As shown in FIG. 1, the side wall surface 22 of the inverted recess 20 is provided at a position that does not interfere with the solder 32. The distance between the substrate contact portion 16 and the bare chip contact portion 24 is adjusted so that the thickness of the solder 32 becomes a designed thickness. That is, the distance between the board contact portion 16 and the bare chip contact portion 24 is a value obtained by adding the design value of the thickness of the solder 32 and the dimension of the bare chip 10 in the thickness direction. In addition, the substrate contact portion 16 and the bare chip contact portion 24 are formed such that both opposing surfaces (that is, joining surfaces) of the substrate 34 sucked by the substrate contact portion 16 and the bare chip 30 sucked by the bare chip contact portion 24 are parallel. It has been adjusted to be.
As shown in FIG. 1, the substrate contact portion 16 is provided with a substrate suction hole 12 for sucking the substrate 34, and the bare chip contact portion 24 is provided with a bare chip suction hole 14 for sucking the bare chip 30. The opening 12 a of the substrate suction hole 12 is in close contact with the substrate 34, and the opening 14 a of the bare chip suction hole 14 is in close contact with the bare chip 30.
[0014]
Hereinafter, a procedure for bonding the bare chip 30 to the substrate 34 using the above-described collet 10 and manufacturing a component unit will be described. FIG. 2 is a cross-sectional view showing a state in which a bare chip is mounted on a substrate by a collet in a solder supply zone in a heating process. FIG. 3 is a diagram illustrating a state in which a substrate and a bare chip mounted on a substrate via solder are simultaneously subjected to a cooling process. It is sectional drawing which shows a mode that it conveys. In the figure, 40 is a heating / reducing zone provided in the heating process, 50 is a solder supply zone provided at the end of the heating process, 60 is a heating device, and 70 is a cooling device.
The substrate 34 is transported from the heating / reducing zone 40 on the left to the solder supply zone 50 on the right by a transport rod (not shown). The heating / reducing zone 40 has a reducing atmosphere, and the substrate 34 is heated by the heating device 60 in the reducing atmosphere. When the substrate 34 is transported to the solder supply zone 50, the bare chip 30 is placed on the substrate 34.
[0015]
Specifically, as shown in FIG. 2A, when the substrate 34 is transported to the solder supply zone 50 in the heating step, first, the door 51 (indicated by a broken line, the door is open) is opened. . When the door 51 opens, the collet 10 attached to the tip of a robot arm (not shown) descends from the opening into the solder supply zone 50. The bare chip 30 is suction-held by the bare chip suction hole 14 in the bare chip contact portion 24 of the collet 10.
[0016]
As shown in FIG. 2B, the collet 10 descends in the solder supply zone 50 to a position where the substrate contact portion 16 contacts the substrate 34 while holding the bare chip 30 by suction. When the board contact portion 16 contacts the board 34, the bare chip 30 is positioned at a predetermined position on the board 34 (that is, a bare chip mounting position). When the bare chip 30 is positioned, the solder 32 is supplied to the bare chip mounting position from a solder supply port 36 provided facing the reverse recess 20 of the collet 10.
[0017]
When the solder 32 is supplied, the substrate 34 is sucked by the substrate suction hole 12 into the substrate contact portion 16 of the collet 10 while the bare chip 30 is sucked by the bare chip contact portion 24 of the collet 10. Next, as shown in FIG. 3A, the collet 10 rises in the solder supply zone 50 while maintaining the horizontal state while sucking and holding the substrate 34 and the bare chip 30, and exits from the heating step.
[0018]
After the heating step, as shown in FIG. 3B, the collet 10 holding the substrate 34 and the bare chip 30 by suction moves toward the cooling device 70 while maintaining the horizontal state. When the collet 10 moves to a predetermined position on the cooling device 70, the collet 10 descends to the surface of the cooling device 70 while maintaining the horizontal state. When the substrate 34 is lowered to a position where it comes into contact with the cooling device 70, the suction between the substrate 34 and the bare chip 30 is released, and the substrate 34 and the bare chip 30 are placed on the cooling device 70.
[0019]
As is clear from the above description, in the state shown in FIGS. 3A and 3B (that is, while being conveyed from the heating device 60 to the cooling device 70), the solder 32 remains in a molten state. However, since the substrate 34 and the bare chip 30 are suction-held by the collet 10, even if an external force acts on the substrate 34 or the bare chip 30, the positional relationship between the two can be kept constant. In addition, while the substrate 34 and the bare chip 30 are being transported, the collet 10 (that is, the substrate 34 and the bare chip 30) moves while maintaining a horizontal state, so that unsolidified solder is prevented from being biased by gravity. Therefore, it is possible to prevent the thickness of the solder 32 between the substrate 34 and the bare chip 30 from varying between the component units.
In addition, since the board contact portion 16 is in contact with the board 34, even if the positioning accuracy of the electronic component mounting apparatus is low, the distance between the bare chip 32 and the board 34 (the thickness of the solder layer) can be accurately controlled. Can be. Therefore, the mounting accuracy of the bare chip can be improved regardless of the positioning accuracy of the electronic component mounting apparatus. In particular, since the board contact portion 16 and the bare chip contact portion 24 are flat surfaces parallel to each other and are accurately processed at an interval therebetween, the thickness of the solder layer can be made uniform. Therefore, the occurrence of cracks due to the local thinning of the solder layer and the deterioration of heat dissipation due to the local thickening of the solder layer are prevented.
[0020]
(Modification) FIG. 4 is a sectional view of a collet showing a modification of the first embodiment described above. The collet of this modified example is for joining a bare chip to a substrate via solder similarly to the collet shown in FIG. 1 described above, and its basic structure is the same as that shown in FIG. Here, the same portions are denoted by the same reference numerals. Although the solder supply port 36 is omitted in FIG. 4, if the collet 10 is appropriately set, solder can be supplied between the substrate and the bare chip as in the first embodiment.
As shown in FIG. 4, in the present modification, two inverted recesses 20 having the same size / shape are provided in the collet 10 in response to mounting two identical bare chips 30 on the substrate 34. . The upper flat surface of the inverted concave portion 20 is a bare chip contact portion 24, and the bare chip contact portion 24 is provided with a bare chip suction hole 14 for sucking and holding the bare chip 30. The two bare chip suction holes 14 and the substrate suction hole 12 communicate with a suction hole 13 provided in an upper part of the collet body. Therefore, when the suction starts at the bare chip suction hole 14, the suction also starts at the substrate suction hole 12. Since the substrate suction hole 12 and the bare chip suction hole 14 communicate with the upper suction hole 13 in this manner, only one vacuum tube is connected to the collet 10, so that the structure of the electronic component bonding apparatus is complicated. Can be avoided.
[0021]
As mentioned above, although the specific example of this invention was demonstrated in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and alterations of the specific examples illustrated above.
In the embodiment, the example in which the collet is used in the mounting process of bonding the bare chip 30 to the substrate 34 has been described. However, the present invention can also be applied to the case where the bare chip is bonded to a lead frame or the substrate on which the bare chip or the like is mounted. It can be applied to various mounting processes such as bonding to a heat sink.
In the embodiment, the solder is supplied from the solder supply port 36. However, in the present invention, in addition to this, the solid-state solder is disposed on the substrate 34 in advance, and is heated and melted after the bare chip 30 is transported. A method or a method of applying solder directly on the substrate 34 can be used.
In the embodiment, the cross-section of the substrate suction hole 12 and the bare chip suction hole 14 is circular, but the cross-sectional shape of the suction hole is not limited to a circle, and any shape can be used as long as vacuum suction can be performed. It doesn't matter. The cross-sectional area may be any area as long as a desired suction force can be obtained. Further, the position of the opening 12a of the substrate suction hole 12 may be provided at any position except the bare chip holding portion 20 as long as the substrate 34 can be sucked, and is not limited to the position shown in the embodiment. The position of the opening 14 a of the bare chip suction hole 14 may be provided at any position of the bare chip holding unit 20 as long as the bare chip 30 can be sucked. Further, a plurality of substrate suction holes 12 and bare chip suction holes 14 may be provided.
In the modified example of the first embodiment, the case where two identical bare chips are sucked and held is shown. However, when bare chips having different sizes / shapes are sucked and held, the bare chip contact portions corresponding to the respective bare chips are used. 20 can be provided by changing the width and depth. It is also possible to adopt a configuration in which three or more bare chips are sucked and held. In this case, the bare chip contact portions 20 can be provided by the number of bare chips to be sucked and held.
In the first embodiment and the modified example, the width of the substrate 34 is wider than the width of the collet 10, but the width of the substrate is such that the opening of the suction hole 12 is in contact with the plane of the substrate 34. Any size is acceptable as long as it is possible.
Further, the technical elements described in the present specification or the drawings exhibit technical utility singly or in various combinations, and are not limited to the combinations described in the claims at the time of filing. The technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.
[Brief description of the drawings]
FIG. 1 is a sectional view of a collet showing a first embodiment.
FIG. 2 is a sectional view showing that a bare chip is mounted on a substrate by a collet in a solder supply zone in a heating step.
FIG. 3 is a cross-sectional view of a process of simultaneously transferring a substrate and a bare chip mounted on the substrate via solder to a cooling step.
FIG. 4 is a sectional view of a collet showing a modification of the first embodiment.
[Explanation of symbols]
10: Collet,
12: substrate suction hole,
14: bare chip suction hole,
16: substrate contact portion,
20: inverted recess,
22: side wall surface,
24: bare chip contact part,
30: bare chip,
32: Solder,
34: Substrate

Claims (5)

A collet for joining a second component to a first component, comprising: a first contact portion that contacts the first component; and a second contact portion that contacts the second component. A collet comprising: a first contact portion and a second contact portion each provided with a suction hole. In a state where the first contact portion is in contact with the first component, the joining surface of the second component and the joining surface of the first component sucked by the second contact portion are parallel to each other. The collet according to claim 1, wherein the collet is configured. A method of transporting a component unit on which a second component is mounted on a first component via a bonding material,
The first part of the collet according to claim 1 or 2, wherein the first part is sucked into the first contact part, and the second part is sucked by the second contact part. A method of transporting a part unit, wherein the collet is transported together. A method for manufacturing a component unit including a first component and a second component joined on the first component, comprising:
A step of sucking the second part into the second contact part of the collet according to claim 1 or 2,
A step of applying the first contact portion of the collet to the first component and transporting the second component sucked to the second contact portion onto the first component;
Supplying a bonding material in a molten state between the first component and the second component;
A step of solidifying the bonding material in a molten state in a state where the first component is sucked into the first contact portion and the second component is sucked into the second contact portion;
A method for manufacturing a component unit having: A method for manufacturing a component unit including a first component and a second component joined on the first component, comprising:
Suctioning the second part into the collet;
Transporting the sucked second component onto the first component;
Supplying a bonding material in a molten state between the first component and the second component;
A step of sucking the second component into the collet and solidifying the molten joining material in a state where the positional relationship between the first component and the second component is regulated;
A method for manufacturing a component unit having:

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