JP2006510224A5
(cg-RX-API-DMAC7.html )
2009-11-05
JP2010009594A5
(cg-RX-API-DMAC7.html )
2011-09-01
JP2002335094A5
(cg-RX-API-DMAC7.html )
2005-09-02
EP1545175A3
(en )
2007-05-30
Method of providing printed circuit board with conductive holes and board resulting therefrom
RU2006128834A
(ru )
2008-02-20
Водонепроницаемый биоэлектрод
EP1577942A3
(en )
2011-09-14
Device with through-hole interconnection and method for manufacturing the same
JP2007536741A5
(cg-RX-API-DMAC7.html )
2008-05-15
ATE549750T1
(de )
2012-03-15
Piezoelektrischer aktuator
EP2461656A3
(en )
2012-08-01
Circuit board and connection substrate
JP2013247225A5
(cg-RX-API-DMAC7.html )
2015-07-09
JP2004170189A5
(cg-RX-API-DMAC7.html )
2005-09-29
WO2009050843A1
(ja )
2009-04-23
電子デバイス
DE602005021779D1
(de )
2010-07-22
Biegsame druckkopfleiterplatte
JP2008078677A5
(cg-RX-API-DMAC7.html )
2008-12-18
JPH11298094A
(ja )
1999-10-29
フレキシブルプリント配線板
JP2022518492A5
(cg-RX-API-DMAC7.html )
2022-12-22
EP1722616A3
(en )
2008-06-18
Technique for defining a wettable solder joint area for an electronic assembly substrate
US11229390B2
(en )
2022-01-25
Electrode device
WO2005045997A3
(en )
2006-12-21
An electrical circuit assembly with improved shock resistance
KR102435703B1
(ko )
2022-08-29
소프트 센서 내장형 장갑 및 이의 제조 방법
JPH0251506U
(cg-RX-API-DMAC7.html )
1990-04-11
JPH0421354B2
(cg-RX-API-DMAC7.html )
1992-04-09
JPS5824455Y2
(ja )
1983-05-25
半導体発光素子の実装装置
CN107113966B
(zh )
2019-07-16
具有部分接地路径的柔性电路
JP2014063857A
(ja )
2014-04-10
電子部品及び電子部品の製造方法