JP2004140366A - Method for connecting electrode - Google Patents

Method for connecting electrode Download PDF

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Publication number
JP2004140366A
JP2004140366A JP2003354972A JP2003354972A JP2004140366A JP 2004140366 A JP2004140366 A JP 2004140366A JP 2003354972 A JP2003354972 A JP 2003354972A JP 2003354972 A JP2003354972 A JP 2003354972A JP 2004140366 A JP2004140366 A JP 2004140366A
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Japan
Prior art keywords
electrodes
connection
adhesive
connecting member
heating
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JP2003354972A
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Japanese (ja)
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JP3856233B2 (en
Inventor
Isao Tsukagoshi
塚越　功
Hiroshi Matsuoka
松岡　寛
Nobukazu Koide
小出　遵一
Koji Kobayashi
小林　宏治
Katsuyuki Ueno
上野　勝幸
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Priority to JP2003354972A priority Critical patent/JP3856233B2/en
Publication of JP2004140366A publication Critical patent/JP2004140366A/en
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Publication of JP3856233B2 publication Critical patent/JP3856233B2/en
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for connecting an electrode realizing an alignment with high accuracy without slipping off of an electrode. <P>SOLUTION: Both mutually facing electrodes can be connected by heating and pressing by interposing a connecting member comprising a curable adhesive between the electrodes in the method for connecting the electrodes. Both electrodes are aligned, the reaction of the connecting member is promoted by the irradiation of light with intensity distribution, and the connecting member is heated and pressed at a temperature higher than the activation temperature of the connecting member. In the method for connecting the electrodes, both electrodes are aligned, the reaction of the connecting member is promoted by the irradiation of light with intensity distribution and the connecting member is semi-cured while an electric-conduction inspection is conducted, and the connecting member is heated and pressed at the temperature higher than the activation temperature of the connecting member. <P>COPYRIGHT: (C)2004,JPO

Description

　本発明は、電子部品と回路基板や、回路基板同士を接着固定すると共に、両者の電極同士を電気的に接続する電極の接続方法に関する。 {Circle over (1)} The present invention relates to a method for connecting an electrode to an electronic component and a circuit board, or to bond and fix the circuit boards to each other and to electrically connect both electrodes.

　近年、電子部品の小型薄型化に伴い、これらに用いる回路は高密度、高精細化しており、このような電子部品と微細電極の接続は、従来のハンダやゴムコネクタなどでは対応が困難であることから、最近では分解能に優れた接着剤や膜状物（以下接続部材）が多用されている。この接続部材としては、絶縁性の接着剤を用いて両電極の直接接触により導電性を得ることや、加圧により厚み方向のみに導電性の得られる程度の導電粒子を含有してなる異方導電性の接着剤を用いて、両電極間に導電粒子を介在させる導電粒子などの導電材料を所定量含有した接着剤からなるものが知られている。これら接続部材の使用法は、接続部材を電子部品と電極や回路との間に介在させ、加圧または加熱加圧手段を講じることによって、両者の電極同士が電気的に接続されると共に、電極に隣接して形成されている電極同士には絶縁性を付与して、電子部品と回路とが接着固定されるものである。上記接続部材の中で、導電粒子を含有する接続部材を高分解能化するための基本的な考えは、導電粒子の粒径を隣接電極間の絶縁部分よりも小さくすることで隣接電極間における絶縁性を確保し、併せて導電粒子の含有量をこの粒子同士が接触しない程度とし、かつ電極上に確実に存在させることにより接続部分における導電性を得ることである。このような微細電極の接続レベルは、最近では回路ピッチが５０μｍ以下も検討されており、接続装置の位置合わせ精度も３μｍ以下が実用化の域にある。 In recent years, as electronic components have become smaller and thinner, circuits used for them have become denser and more precise, and it is difficult to connect such electronic components to fine electrodes with conventional solders or rubber connectors. Therefore, recently, an adhesive or a film (hereinafter, referred to as a connecting member) having excellent resolution has been frequently used. The connection member may be made of an electrically conductive material by direct contact between the two electrodes using an insulating adhesive, or may be made of an anisotropic material containing conductive particles capable of obtaining conductivity only in the thickness direction by applying pressure. 2. Description of the Related Art There has been known an adhesive made of a conductive adhesive and containing a predetermined amount of a conductive material such as conductive particles for interposing conductive particles between both electrodes. These connecting members are used by interposing the connecting member between an electronic component and an electrode or a circuit, and applying pressure or heating / pressing means, whereby both electrodes are electrically connected to each other, and the electrodes are electrically connected. The electrodes formed adjacent to each other are provided with insulation so that the electronic component and the circuit are bonded and fixed. Among the above connection members, the basic idea for improving the resolution of the connection member containing the conductive particles is to make the particle size of the conductive particles smaller than the insulating portion between the adjacent electrodes so that the insulation between the adjacent electrodes is reduced. In addition, the conductivity of the connection portion is obtained by ensuring the conductivity, making the content of the conductive particles such that the particles do not come into contact with each other, and ensuring that the particles are present on the electrodes. With regard to the connection level of such fine electrodes, recently, a circuit pitch of 50 μm or less has been studied, and a positioning accuracy of the connection device of 3 μm or less is in a practical range.

特開平２−８２６３３号公報JP-A-2-82633 特開平５−３４３４７３号公報JP-A-5-343473

　上記従来の方法は、個別の材料すなわち、電極・接続部材・接続装置の個々には高レベルの微細な製品が開発されつつあるものの、これらを組み合わせて実際の接続体を得る時の接続方法に問題があった。すなわち、これらの接続部材は加熱加圧手段を講じることによって、両者の電極同士の電気的に接続を得る方式であるため、加熱時に電極間の接続部材の接着剤が溶融流動し、せっかく高精度に位置合わせした電極がずれてしまう欠点があることである。さらに接続電極のリペアが行いにくい欠点もあった。これは接続電極の微小化に対応させるために、接着剤の架橋度が向上しており、そのため接続後に剥離しにくく、また接着剤を除去しにくいことによる。また、導電粒子含有の接続部材の場合、電極面積や隣接電極間（スペース）の微細化により電極上の導電粒子が接続時の加圧または加熱加圧により接着剤と共に隣接電極間に流出してしまい、接続部材の高分解能化の妨げとなっていた。この時、接続部材の接着剤の流出を抑制するために、接着剤を高粘度とすると電極と導電粒子の接触が不十分となり、相対峙する電極の接続が不可能となる。一方、接着剤を低粘度とすると導電粒子の流出に加えてスペース部に気泡を含みやすく、接続信頼性、特に耐湿性が低下してしまう欠点がある。本発明は上記欠点に鑑みなされたもので、電極のずれがなく高精度の位置合わせが可能で、加えてリペア性に優れ、また導電粒子の電極上からの流出が少なく保持可能で、さらに接続部に気泡を含み難いことから長期接続信頼性に優れた、電極の接続方法に関する。 Although the above-mentioned conventional method is developing a high-level fine product individually for each of the individual materials, that is, the electrodes, the connection members, and the connection devices, the connection method for obtaining an actual connection body by combining them is described. There was a problem. That is, since these connecting members are of a type in which both electrodes are electrically connected by applying heating and pressing means, the adhesive of the connecting members between the electrodes melts and flows at the time of heating, so that high precision is achieved. There is a disadvantage that the electrode positioned in the above-mentioned position shifts. Further, there is a disadvantage that repair of the connection electrode is difficult. This is because the degree of crosslinking of the adhesive is improved in order to cope with the miniaturization of the connection electrode, so that it is difficult for the adhesive to peel off after the connection and to remove the adhesive. In the case of a conductive particle-containing connection member, the conductive particles on the electrodes flow out between the adjacent electrodes together with the adhesive by pressurization or heating during connection due to miniaturization of the electrode area and the space between adjacent electrodes (space). As a result, the resolution of the connecting member has been hindered. At this time, if the viscosity of the adhesive is set high in order to suppress the outflow of the adhesive from the connection member, the contact between the electrode and the conductive particles becomes insufficient, and the connection of the electrodes facing each other becomes impossible. On the other hand, if the adhesive has a low viscosity, air bubbles tend to be included in the space in addition to the outflow of the conductive particles, and there is a disadvantage that the connection reliability, particularly the moisture resistance, is reduced. The present invention has been made in view of the above-mentioned disadvantages, and enables high-accuracy alignment without electrode displacement, excellent repairability, and low retention of conductive particles from the electrodes, and further connection. The present invention relates to a method for connecting an electrode, which is excellent in long-term connection reliability because a portion hardly contains air bubbles.

　請求項１に記載の発明は、相対峙する電極間に硬化性接着剤を含む接続部材を介在させ加熱加圧により両電極の接続を得る方法であって、両電極の位置合わせを行い、次いで強弱を設けた光の照射により接続部材の反応を進行せしめ、その後接続部材の活性化温度以上の温度で加熱加圧することを特徴とする電極の接続方法に関する。
　請求項２に記載の発明は、相対峙する電極間に硬化性接着剤を含む接続部材を介在させ加熱加圧により両電極の接続を得る方法であって、両電極の位置合わせを行い、次いで強弱を設けた光の照射により接続部材の反応を進行せしめ半硬化させるとともに通電検査を行い、その後接続部材の活性化温度以上の温度で加熱加圧することを特徴とする電極の接続方法に関する。
　請求項３に記載の発明は、強弱を設けた光の照射が、接続部の中央側が光の弱くなるような照射である請求項１または２記載の電極の接続方法に関する。
　請求項４に記載の発明は、接続が、接続装置として、上下動可能な加圧ヘッドと、受け台を有し、前記受け台の少なくとも一部が光の透過が可能な材質であり、前記受け台の下にはエネルギー線源を有するものである請求項１、２又は３記載の電極の接続方法に関する。
　請求項５に記載の発明は、受け台の下部に設けたマスクにより強弱を設ける請求項４記載の電極の接続方法に関する。 The invention according to claim 1 is a method of obtaining a connection between both electrodes by heating and pressing with a connecting member including a curable adhesive interposed between opposed electrodes, and performing positioning of both electrodes, The present invention relates to a method for connecting electrodes, wherein a reaction of a connecting member is advanced by irradiation of light having different intensities, and then heating and pressurizing are performed at a temperature equal to or higher than an activation temperature of the connecting member.
The invention according to claim 2 is a method for obtaining a connection between both electrodes by applying heat and pressure by interposing a connection member containing a curable adhesive between electrodes facing each other, performing positioning of both electrodes, The present invention relates to a method for connecting an electrode, characterized in that a reaction of a connecting member is advanced by irradiation of light having different intensities to make the connection member semi-cured, an electric conduction test is performed, and then heating and pressing are performed at a temperature equal to or higher than an activation temperature of the connecting member.
The invention according to claim 3 relates to the electrode connection method according to claim 1 or 2, wherein the irradiation of the light having the intensity is such that the light is weakened at the center of the connection portion.
The invention according to claim 4, wherein the connection includes, as a connection device, a pressure head that can move up and down, and a pedestal, and at least a part of the pedestal is made of a material capable of transmitting light, 4. The method for connecting electrodes according to claim 1, further comprising an energy beam source below the cradle.
The invention according to claim 5 relates to the electrode connection method according to claim 4, wherein the strength is provided by a mask provided below the receiving table.

　本発明によれば、電極のずれがなく高精度の位置合わせが可能である。また接着剤架橋度の低い状態で電気検査を行えるので、リペアが容易である。また電極上の導電粒子が接続時の加圧または加熱加圧により接着剤と共に隣接電極間に流出し難く、スペース部に気泡を含まないので接続信頼性、特に耐湿性が向上する。本発明では、接続部の周囲の硬化が進行しており周辺への接着剤の流出を防止でき、上記効果に優れる。従って高精度な微細電極の接続を提供できる。 According to the present invention, high-accuracy alignment without electrode displacement is possible. In addition, since the electrical inspection can be performed in a state where the degree of crosslinking of the adhesive is low, repair is easy. In addition, the conductive particles on the electrodes are less likely to flow out between the adjacent electrodes together with the adhesive by pressurization or heating and pressurization at the time of connection, and since the spaces do not contain air bubbles, the connection reliability, particularly the moisture resistance, is improved. According to the present invention, the hardening of the periphery of the connection portion is progressing, and the outflow of the adhesive to the periphery can be prevented, and the above effect is excellent. Therefore, it is possible to provide a highly accurate connection of the fine electrodes.

　本発明を図面を参照しながら説明する。図１は、本発明の一実施例を説明する電極の接続方法を示す断面模式図である。本発明は、相対峙する電極４、５間に接続部材８を介在させ、加熱加圧により両電極の接続を得る方法であって、両電極４、５の位置合わせを行い、次いで強弱を設けた光の照射により接続部材の反応を進行せしめ半硬化させ（第１次接続）、あるいは前記強弱を設けた光の照射後に必要により通電検査を行い、次いで接続部材８に配合された硬化剤の活性化温度以上の温度で加熱加圧（第２次接続）することを特徴とする。第一次接続の反応の進行は、反応率や粘度の上昇の他、両電極の仮固定が可能な状態に達することを目安にできる。なお第１次接続は活性化温度以下で行うことが、第２次接続迄の保存性を確保する点から好ましい。 The present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a method of connecting electrodes for explaining one embodiment of the present invention. The present invention is a method in which a connection member 8 is interposed between electrodes 4 and 5 facing each other, and a connection between the electrodes is obtained by heating and pressing. The irradiation of the light causes the reaction of the connecting member to proceed to semi-curing (primary connection), or, if necessary, an irradiation test is performed after the irradiation of the light having the above-mentioned intensity, and then the curing agent mixed in the connecting member 8 It is characterized in that heating and pressurization (secondary connection) are performed at a temperature equal to or higher than the activation temperature. The progress of the reaction of the primary connection can be based on an increase in the reaction rate and viscosity, as well as on reaching a state where both electrodes can be temporarily fixed. Note that it is preferable that the primary connection be performed at an activation temperature or lower from the viewpoint of ensuring the storage stability up to the secondary connection.

　接続装置は、上下動可能な加熱ヘッド１と受け台２を有する。受け台２の少なくとも一部は、光の透過が可能な材質、例えば石英やガラス類とする。受け台２の下にはエネルギー線源を有する。活性エネルギー線３としては、赤外線、紫外線、電子線などがある。エネルギー線３は必要に応じて受け台２の下面側を走査できる。またエネルギー線と併用して電熱などの他の電熱手段を使用できる。接続すべき電極４、５は、これを保持する基板６、７に形成されてなるものが一般的である。基板６、７としては、ポリイミドやポリエステルなどのプラスチックフィルム、ガラスエポキシなどの複合体、シリコーンなどの半導体、ガラスやセラミックスなどの無機物などを例示できる。受け台２側の基板６、７としてはエネルギー線３が透過し易いほど好ましく、液晶用基板として多用されるガラスやプラスチックフィルム等の透明性材料が特に好適である。電極４、５としては各種回路類や端子類があり、半導体チップのような電子部品のバンプやパッド類を含むことができる。これらはそれぞれ任意に組み合わせて適用できる。 The connection device has a heating head 1 and a pedestal 2 that can move up and down. At least a part of the pedestal 2 is made of a material capable of transmitting light, for example, quartz or glass. Below the cradle 2, there is an energy source. The active energy rays 3 include infrared rays, ultraviolet rays, and electron beams. The energy beam 3 can scan the lower surface of the cradle 2 as needed. Further, other electric heating means such as electric heating can be used in combination with the energy ray. The electrodes 4 and 5 to be connected are generally formed on substrates 6 and 7 that hold the electrodes. Examples of the substrates 6 and 7 include plastic films such as polyimide and polyester, composites such as glass epoxy, semiconductors such as silicone, and inorganic substances such as glass and ceramics. As the substrates 6 and 7 on the pedestal 2 side, it is preferable that the energy rays 3 easily pass therethrough, and a transparent material such as glass or a plastic film that is frequently used as a liquid crystal substrate is particularly preferable. The electrodes 4 and 5 include various circuits and terminals, and can include bumps and pads of an electronic component such as a semiconductor chip. These can be applied in any combination.

　接続部材８は、絶縁性接着剤９のみ（図２ａ）でも、導電材料１０と絶縁性接着剤９とよりなる（図２ｂ）加圧方向に導電性を有する異方導電性接着剤でもよい。また絶縁性接着剤と異方導電性接着剤を積層した機能分離構成でも良い。異方導電性接着剤は含有する導電材料により、電極４、５の凹凸や高さのばらつきに対応し易く好ましい。これらはフィルム状であると一定厚みの連続状で得られることから好ましく、これらの表面には不要な粘着性やゴミなどの付着防止のために、図示していないが剥離可能なセパレータが必要に応じて存在して良い。接続部材８の導電材料１０としては、加圧または加熱加圧手段を講じることで接着剤の厚み減少によって導電性を得る、すなわち、接着剤の厚み以下の小粒径のものが接着剤により保持されるので取扱い時に導電材料の脱落防止が可能で好ましい。これはまた、接着剤の厚みに対して一層程度で存在できると、本発明の第１次接続のような甘い接続条件下でも導電性が得やすいので好ましい。接着剤に対する導電材料の割合は、２０体積％以下が導電異方性が得やすく好ましい。また厚み方向の導電性を得易くするため、接続部材の厚さは膜形成の可能な範囲で薄い方が好ましく、３０μｍ以下、より好ましくは２０μｍ以下である。 The connection member 8 may be an insulating adhesive 9 alone (FIG. 2a) or an anisotropic conductive adhesive made of a conductive material 10 and an insulating adhesive 9 (FIG. 2b) having conductivity in a pressing direction. Further, a function separation structure in which an insulating adhesive and an anisotropic conductive adhesive are laminated may be used. The anisotropic conductive adhesive is preferable because it can easily cope with unevenness and unevenness of the electrodes 4 and 5 depending on the conductive material contained. These are preferable because they can be obtained in a continuous form having a constant thickness when they are in the form of a film.A separator (not shown) that can be peeled off (not shown) is required on these surfaces in order to prevent unnecessary adhesion and adhesion of dust and the like. May exist depending on. As the conductive material 10 of the connecting member 8, conductivity is obtained by reducing the thickness of the adhesive by applying a pressure or a heating and pressing means, that is, a material having a small particle size equal to or less than the thickness of the adhesive is held by the adhesive. Therefore, it is possible to prevent the conductive material from falling off during handling, which is preferable. In addition, it is preferable that the conductive layer can be present in a degree to the thickness of the adhesive, because conductivity can be easily obtained even under a weak connection condition such as the primary connection of the present invention. The ratio of the conductive material to the adhesive is preferably 20% by volume or less because conductive anisotropy can be easily obtained. In addition, in order to easily obtain conductivity in the thickness direction, the thickness of the connection member is preferably as thin as possible within a range where a film can be formed, and is preferably 30 μm or less, more preferably 20 μm or less.

　導電材料である導電粒子としては、Ａｕ、Ａｇ、Ｐｔ、Ｎｉ、Ｃｕ、Ｗ、Ｓｂ、Ｓｎ、はんだ等の金属粒子やカーボン等があり、また、これら導電粒子を核材とするか、あるいは非導電性のガラス、セラミックス、プラスチック等の高分子などからなる核材に前記したような材質からなる導電層を被覆形成したものでも良い。さらに導電材料を絶縁層で被覆してなる絶縁被覆粒子や導電粒子と絶縁粒子の併用なども適用可能である。粒径の上限は微小な電極上に１個以上、好ましくは５個以上と多くの粒子数を確保するには小粒径粒子が好適であり、１５μｍ以下、より好ましくは８μｍ以下である。粒径の上限は粒子の凝集性や、電極面の凹凸に対応可能とするために、０．５μｍ以上、好ましくは１μｍ以上である。これら導電粒子の中では、はんだ等の熱溶融金属やプラスチック等の高分子核材に導電層を形成したものが、加熱加圧もしくは加圧により変形性を有し、積層時に回路との接触面積が増加し信頼性が向上するので好ましい。特に高分子類を核とした場合、はんだのように融点を示さないので軟化の状態を接続温度で広く抑制でき、電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるので特に好ましい。 Examples of the conductive particles that are the conductive material include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, and carbon, and these conductive particles are used as a core material or non-conductive. A core material made of a polymer such as conductive glass, ceramics or plastic may be coated with a conductive layer made of the above-mentioned material. Further, insulating coated particles obtained by coating a conductive material with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. The upper limit of the particle size is preferably 15 μm or less, more preferably 8 μm or less, in order to secure a large number of particles of 1 or more, preferably 5 or more on a fine electrode. The upper limit of the particle size is 0.5 μm or more, preferably 1 μm or more in order to be able to cope with the cohesiveness of the particles and the unevenness of the electrode surface. Among these conductive particles, those formed by forming a conductive layer on a hot-melt metal such as solder or a polymer nucleus material such as plastic have a deformability by heating or pressing, and the contact area with the circuit at the time of lamination And reliability is improved. Particularly when a polymer is used as a core, a softening state can be suppressed widely at a connection temperature because it does not show a melting point like solder, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is particularly preferable. .

　また、例えば、ＮｉやＷ等の硬質金属粒子や、表面に多数の突起を有する粒子の場合、導電粒子が電極や配線パターンに突刺さるので、酸化膜や汚染層の存在する場合にも低い接続抵抗が得られ、信頼性が向上するので好ましい。これら導電粒子は、粒径の分布の狭い均一粒径の球状粒子が好ましい。粒径の分布が狭いと電極接続時の加圧により電極間で保持されて流出が少ない。粒径の分布幅としては、電極表面の凹凸を考慮して最大粒径の１／２以下とすることが好ましい。例えば、高分子核材に導電層を被覆形成した変形性粒子の場合、中心径±０．２μｍ以内といった高精度の粒子もあり、特に好ましく適用できる。また硬質金属粒子の場合、電極に突刺さるので粒径の分布幅は最大粒径の１／２以下と比較的広くても良い。導電粒子１０と併用して絶縁粒子１１を用いる（図２ｃ）ことも可能である。絶縁粒子を併用した場合、隣接電極との絶縁性の向上や接続電極のギャップ調節の作用がある。ギャップ調節の場合、好ましくは絶縁粒子の粒径を変形性の導電粒子より小さくし、導電粒子に比べ硬質とすると良好な結果が期待できる。絶縁粒子１１としては、ガラス、シリカ、セラミックスなどの無機物やポリスチレン、エポキシ、ベンゾグアナミンなどの有機物があり、これらは、球状、繊維状などの形状でも良い。これらは単独または複合して用いることができる。 Further, for example, in the case of hard metal particles such as Ni and W, or particles having a large number of protrusions on the surface, the conductive particles pierce the electrodes and wiring patterns, so that a low connection even in the presence of an oxide film or a contamination layer. This is preferable because resistance is obtained and reliability is improved. These conductive particles are preferably spherical particles having a uniform particle size with a narrow particle size distribution. If the particle size distribution is narrow, it is held between the electrodes by pressurization at the time of connecting the electrodes, and the outflow is small. It is preferable that the distribution width of the particle diameter is not more than の of the maximum particle diameter in consideration of the unevenness of the electrode surface. For example, in the case of deformable particles in which a conductive layer is formed by coating a polymer core material, there are high-precision particles having a center diameter of ± 0.2 μm or less, which is particularly preferable. Further, in the case of hard metal particles, the distribution width of the particle size may be relatively wide as 以下 or less of the maximum particle size since the hard metal particles pierce the electrode. It is also possible to use the insulating particles 11 in combination with the conductive particles 10 (FIG. 2c). When the insulating particles are used in combination, there is an effect of improving the insulating property with the adjacent electrode and adjusting the gap of the connection electrode. In the case of adjusting the gap, good results can be expected if the diameter of the insulating particles is preferably made smaller than that of the deformable conductive particles and harder than the conductive particles. Examples of the insulating particles 11 include inorganic substances such as glass, silica, and ceramics, and organic substances such as polystyrene, epoxy, and benzoguanamine. These may be spherical or fibrous. These can be used alone or in combination.

　接続部材８の接着剤は、反応性接着剤であって異なる条件下で活性化する硬化剤を含有してなるものや、Ｂステージ状態で安定なものが好ましい。異なる条件下とは、熱、光、湿気などがあり、これらで活性化する硬化剤としては、熱分解型のアミンイミド、光分解型の芳香族ジアゾニウム塩、湿気硬化型のケチミンなどの組み合わせがある。また、例えばルイス酸系などのカチオン触媒やベンゾフェノン／ミヒラーケトンなどの紫外線硬化剤と各種アミン類などの熱硬化剤との複合系や、熱硬化剤同士の場合での活性温度の異なる硬化剤との複合系などがある。またＢステージ状態で安定なものとしては、芳香族ポリアミン類やマイクロカプセル等の潜在性硬化剤類を例示できる。接着剤の活性化温度は、反応性樹脂と潜在性硬化剤との共存混合試料３ｍｇをＤＳＣ（Differential Scanning Calorimeter 指差走査型熱量計）を用い、１０℃／分で常温（３０℃）から２５０℃迄上昇させた時の発熱量の最大を示すピーク温度とする。これらの中でエポキシ系接着剤は、短時間硬化が可能で接続作業性が良く、分子構造上接着性に優れる等の特徴から好ましく適用できる。エポキシ系接着剤は、例えば高分子量のエポキシ、固形エポキシと液状エポキシ、ウレタンやポリエステル、アクリルゴム、ＮＢＲ、ナイロン等で変性したエポキシを主成分とし、硬化剤や触媒、カップリング剤、充填剤などを添加してなるものが一般的である。 接着 The adhesive of the connection member 8 is preferably a reactive adhesive containing a curing agent that is activated under different conditions, or an adhesive that is stable in the B-stage state. The different conditions include heat, light, moisture and the like, and as the curing agent activated by these, there are combinations such as a thermally decomposable amine imide, a photodecomposable aromatic diazonium salt, and a moisture curable ketimine. . Also, for example, a complex system of a cationic catalyst such as a Lewis acid system or an ultraviolet curing agent such as benzophenone / Michler's ketone and a thermosetting agent such as various amines, or a curing agent having a different activation temperature between the thermosetting agents. There are complex systems. In addition, examples of a stable agent in the B-stage state include latent curing agents such as aromatic polyamines and microcapsules. The activation temperature of the adhesive is set at 250 ° C. from room temperature (30 ° C.) at 10 ° C./min by using a DSC (Differential Scanning Calorimeter) with 3 mg of a mixed sample of a reactive resin and a latent curing agent. The peak temperature indicates the maximum amount of heat generated when the temperature is raised to ° C. Among these, epoxy adhesives can be preferably applied because they can be cured in a short time, have good connection workability, and have excellent adhesiveness in terms of molecular structure. Epoxy adhesives are mainly composed of high molecular weight epoxy, solid epoxy and liquid epoxy, epoxy modified with urethane, polyester, acrylic rubber, NBR, nylon, etc., curing agent, catalyst, coupling agent, filler, etc. Is generally added.

　本発明によれば、両電極の位置合わせを行い、少なくとも強弱を設けた光の照射により接続部材の反応を進行せしめ（第１次接続）、次いで接続部材の活性化温度以上の温度で加熱加圧（第２次接続）する。すなわち第１次接続は第２次接続に比べて低温度で行うので両電極および基板の熱膨張に基づく変位が少なく、また接続部材の増粘により両電極の仮固定がされているので、電極のずれがなく高精度の位置合わせが可能である。接続部材は第２次接続の高温下でも通常状態に比べ増粘しており、両電極が仮固定され、ずれが少ない。第２次接続では、接着剤の溶融粘度が第２次接続による反応の進行による増粘により高いので、電極上の導電粒子が接続時の加圧または加熱加圧により接着剤と共に隣接電極間に流出し難く、またスペース部に気泡を含まないので接続信頼性、特に耐湿性が向上する。加えて、エネルギー線照射により接続部材が低粘度化して両電極および／または導電材料の加圧接触により第１次接続において両電極の導通が得られるので、この状態で導通などの電気検査を行い、不良が見つかれば剥離して再度接続（リペア）をやり直しても良い。この場合、接着剤の反応が不十分な状態で行えるので、不良部の剥離や洗浄が極めて簡単に行える利点がある。電気検査は接着剤の増粘による凝集力で無加圧でも可能であるが、必要により加圧を併用できる。 According to the present invention, both electrodes are aligned, and the reaction of the connecting member is advanced by irradiating light having at least strength (primary connection), and then heating is performed at a temperature equal to or higher than the activation temperature of the connecting member. Pressure (secondary connection). That is, since the primary connection is performed at a lower temperature than the secondary connection, the displacement due to the thermal expansion of both electrodes and the substrate is small, and the two electrodes are temporarily fixed by thickening the connection member. There is no misalignment and high-accuracy alignment is possible. The connection member is thickened even under the high temperature of the secondary connection as compared with the normal state, and both electrodes are temporarily fixed, and the displacement is small. In the secondary connection, since the melt viscosity of the adhesive is higher due to the increase in viscosity due to the progress of the reaction by the secondary connection, the conductive particles on the electrodes are pressed between the adjacent electrodes together with the adhesive by pressurization or heating and pressurization during connection. Since it does not easily flow out and does not contain air bubbles in the space, the connection reliability, particularly the moisture resistance, is improved. In addition, since the connection member is made to have a low viscosity by the irradiation of the energy beam and the electrodes are electrically connected to each other in the primary connection by pressurized contact between the electrodes and / or the conductive material, an electrical test such as continuity is performed in this state. If a defect is found, it may be peeled off and the connection (repair) may be performed again. In this case, since the reaction of the adhesive can be performed in an insufficient state, there is an advantage that peeling and cleaning of the defective portion can be performed extremely easily. The electrical inspection can be performed without pressure by the cohesive force due to the thickening of the adhesive, but pressure can be used together if necessary.

　以下実施例でさらに詳細に説明するが、本発明はこれに限定されない。
実施例１
（１）異方導電フィルム
　高分子量エポキシ樹脂と液状エポキシ樹脂（エポキシ当量１８５）の比率を２０／８０とし、芳香族ジアゾニウム塩系の硬化剤を５部含有した酢酸エチルの３０％溶液を得た。この溶液に、粒径５±０．２μｍのポリスチレン系粒子にＮｉ／Ａｕの厚さ０．２／０．０２μｍの金属被覆を形成した導電性粒子を３体積％添加し、混合分散した。この分散液をセパレータ（シリコーン処理ポリエチレンテレフタレートフィルム、厚み４０μｍ）にロールコータで塗布し、１１０℃、２０分乾燥し厚み１５μｍの異方導電フィルム（活性化温度は１３０℃）を得た。
（２）接続回路
　ポリイミドフィルム上に高さ１８μｍの銅の回路を有する２層ＦＰＣ回路板（回路ピッチは７０μｍ、電極幅３０μｍの平行回路の電極）と、ガラス１．１ｍｍ上に酸化インジウム厚み０．２μｍ（ＩＴＯ、表面抵抗２０Ω／□）の薄膜回路を有する平面電極との接続を行った。まず平面電極側に導電性接着層がくるようにした。前記接続部材を１．５ｍｍ幅で載置し、貼り付けた。この後セパレータを剥離し、他の回路板と上下回路を位置合わせした。
（３）接続
　図１の接続装置のエネルギー線として紫外線を照射（１．５Ｊ／ｃｍ２）した。この際、第１次の接続工程の紫外線照射にマスクを用いて強弱を設けた。すなわち、接続部の中央側に紫外線の弱くなるように厚み１００μｍの不織布マスクを受け台の下部に貼り付けた。図３のように接続部材の中央部１２に比べ接続部の周囲の硬化が進行した部分１３を形成した。接続部の異方導電フィルムの温度は１００℃以下であった。この状態で接着剤の反応率が１０％に進行し、両電極の保持が可能であった。ここに反応率は、前記活性化温度の測定と同じであるが、反応前後の熱量比から求めた。その後で、１７０℃、２０ｋｇｆ／ｍｍ２、１５秒で第２次接続した。
　この場合も最大ずれ量を測定したところ、５μｍ以下であり、ほとんどずれがなかった。本実施例では第２次接続の際、接続部の周囲の硬化が進行しており周辺への接着剤の流出を防止できた。
（４）評価
　両電極を顕微鏡下で透視し、電極間の最大ずれ量を測定したところ５μｍ以下であり、ほとんどずれがなかった。相対峙する電極間を接続抵抗、隣接する電極間を絶縁抵抗として評価したところ、接続抵抗は２Ω以下、絶縁抵抗は１０８Ω以上であり、これらは８５℃、８５％ＲＨ１０００時間処理後の耐湿信頼性も変化がほとんどなく良好な長期信頼性を示した。芳香族ジアゾニウム塩系の硬化剤は、いわゆるカチオン硬化剤であり、紫外線などの光と熱硬化性とを合わせて持つので、本実施例のような接続が可能である。本実施例では第２次接続の際、接続部の周囲の硬化が進行しており周辺への接着剤の流出を防止できた。 Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.
Example 1
(1) Anisotropic Conductive Film A 30% solution of ethyl acetate containing 5 parts of an aromatic diazonium salt-based curing agent was obtained at a ratio of high molecular weight epoxy resin to liquid epoxy resin (epoxy equivalent: 185) of 20/80. . To this solution, 3% by volume of conductive particles obtained by forming a metal coating of Ni / Au with a thickness of 0.2 / 0.02 μm on polystyrene particles having a particle size of 5 ± 0.2 μm were added and mixed and dispersed. This dispersion was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) using a roll coater and dried at 110 ° C. for 20 minutes to obtain a 15 μm-thick anisotropic conductive film (activation temperature: 130 ° C.).
(2) Connection circuit A two-layer FPC circuit board having a 18 μm high copper circuit on a polyimide film (parallel circuit electrodes with a circuit pitch of 70 μm and an electrode width of 30 μm), and a thickness of indium oxide of 0. A connection was made with a flat electrode having a thin film circuit of 0.2 μm (ITO, surface resistance 20 Ω / □). First, a conductive adhesive layer was provided on the flat electrode side. The connection member was placed with a width of 1.5 mm and attached. Thereafter, the separator was peeled off, and another circuit board and the upper and lower circuits were aligned.
(3) Connection The connection device of FIG. 1 was irradiated with ultraviolet rays (1.5 J / cm 2 ) as energy rays. At this time, the intensity was provided by using a mask for the ultraviolet irradiation in the first connection step. That is, a nonwoven fabric mask having a thickness of 100 μm was attached to the lower portion of the receiving table so that the ultraviolet rays became weaker at the center of the connection portion. As shown in FIG. 3, a hardened portion 13 around the connection portion was formed as compared with the center portion 12 of the connection member. The temperature of the anisotropic conductive film at the connection was 100 ° C. or less. In this state, the reaction rate of the adhesive progressed to 10%, and both electrodes could be held. Here, the reaction rate was the same as the measurement of the activation temperature, but was determined from the calorific ratio before and after the reaction. Thereafter, the secondary connection was performed at 170 ° C., 20 kgf / mm 2 and 15 seconds.
Also in this case, when the maximum shift amount was measured, it was 5 μm or less, and there was almost no shift. In the present embodiment, at the time of the secondary connection, the hardening of the periphery of the connection portion is progressing, and the outflow of the adhesive to the periphery can be prevented.
(4) Evaluation Both electrodes were viewed under a microscope, and the maximum displacement between the electrodes was measured. The maximum displacement was 5 μm or less, and there was almost no displacement. The connection resistance between the opposing electrodes was evaluated as the connection resistance, and the insulation resistance between the adjacent electrodes was evaluated. The connection resistance was 2 Ω or less and the insulation resistance was 10 8 Ω or more. These were moisture resistance after treatment at 85 ° C. and 85% RH for 1000 hours. The reliability showed almost no change and showed good long-term reliability. The aromatic diazonium salt-based curing agent is a so-called cationic curing agent, and has both thermosetting properties and light such as ultraviolet rays, so that connection as in this embodiment is possible. In the present embodiment, at the time of the secondary connection, the hardening of the periphery of the connection portion is progressing, and the outflow of the adhesive to the periphery can be prevented.

比較例１
　実施例１と同様であるが、紫外線照射工程を設けずに、いきなり１７０℃、２０ｋｇｆ／ｍｍ２、１５秒で接続（反応率８２％）した。電極間の最大ずれ量を測定したところ２５μｍであり、ずれが大きいために電極間スペースが減少し絶縁性がなくなった。 Comparative Example 1
As in Example 1, but without an ultraviolet irradiation step, connection was made immediately at 170 ° C., 20 kgf / mm 2 , for 15 seconds (reaction rate: 82%). When the maximum deviation between the electrodes was measured, it was 25 μm. Since the deviation was large, the space between the electrodes was reduced and the insulating property was lost.

　参考例１および比較例２
　実施例１において、第１次の接続工程の紫外線照射にマスクを用いて強弱を設けることなく、紫外線を照射（１．５Ｊ／ｃｍ２）した。および、比較例１と同様であるが、第１次の接続工程の紫外線照射後に通電検査を行った後で、ＦＰＣを剥離したところ極めて簡単に剥離できた。その部分をアセトンで軽く洗浄し再接続したところ良好な接続を得た（参考例１）。一方、比較例１の接続体は剥離が困難であり剥離部に残った接着剤はアセトンで除去しにくく、再接続後の接続抵抗も比較例１に比べ高かった（比較例２）。 Reference Example 1 and Comparative Example 2
In Example 1, ultraviolet irradiation (1.5 J / cm 2 ) was performed without providing strength using a mask for ultraviolet irradiation in the first connection step. And it is the same as Comparative Example 1, but after conducting the conduction test after the irradiation of the ultraviolet rays in the first connection step, the FPC was peeled off very easily. The part was washed lightly with acetone and reconnected to obtain a good connection (Reference Example 1). On the other hand, the connection body of Comparative Example 1 was difficult to peel off, the adhesive remaining on the peeled portion was difficult to remove with acetone, and the connection resistance after reconnection was higher than that of Comparative Example 1 (Comparative Example 2).

本発明の一実施例を示す電極の接続方法を示す断面模式図である。FIG. 3 is a schematic cross-sectional view illustrating a method of connecting electrodes according to an embodiment of the present invention. 本発明の一実施例を示す接続部材の断面模式図である。FIG. 2 is a schematic cross-sectional view of a connection member showing one embodiment of the present invention. 本発明の一実施例を示す接続部材の平面模式図である。FIG. 2 is a schematic plan view of a connection member showing one embodiment of the present invention.

符号の説明Explanation of reference numerals

　１　加熱ヘッド　　　　　　　　　２　受け台
　２　エネルギー線　　　　　　　　４　電極
　５　電極　　　　　　　　　　　　６　基板
　７　基板　　　　　　　　　　　　８　接続部材
　９　絶縁性接着剤　　　　　　　１０　導電材料
１１　絶縁粒子　　　　　　　　　１２　中央部
１３　端部
DESCRIPTION OF SYMBOLS 1 Heating head 2 Receiving stand 2 Energy beam 4 Electrode 5 Electrode 6 Substrate 7 Substrate 8 Connecting member 9 Insulating adhesive 10 Conductive material 11 Insulating particles 12 Central part 13 End part

Claims (5)

相対峙する電極間に硬化性接着剤を含む接続部材を介在させ加熱加圧により両電極の接続を得る方法であって、両電極の位置合わせを行い、次いで強弱を設けた光の照射により接続部材の反応を進行せしめ、その後接続部材の活性化温度以上の温度で加熱加圧することを特徴とする電極の接続方法。 A method in which a connection member containing a curable adhesive is interposed between electrodes facing each other to obtain a connection between the two electrodes by heating and pressurizing. The two electrodes are aligned, and then connected by irradiating light with strength. A method for connecting electrodes, wherein the reaction of the member is advanced, and then heating and pressing are performed at a temperature equal to or higher than the activation temperature of the connecting member. 相対峙する電極間に硬化性接着剤を含む接続部材を介在させ加熱加圧により両電極の接続を得る方法であって、両電極の位置合わせを行い、次いで強弱を設けた光の照射により接続部材の反応を進行せしめ半硬化させるとともに通電検査を行い、その後接続部材の活性化温度以上の温度で加熱加圧することを特徴とする電極の接続方法。 A method in which a connection member containing a curable adhesive is interposed between electrodes facing each other to obtain a connection between the two electrodes by heating and pressurizing. The two electrodes are aligned, and then connected by irradiating light with strength. A method of connecting electrodes, wherein a reaction of a member is advanced to make it semi-cured, an electric conduction test is performed, and then heating and pressing are performed at a temperature equal to or higher than an activation temperature of the connecting member. 強弱を設けた光の照射が、接続部の中央側が光の弱くなるような照射である請求項１または２記載の電極の接続方法。 The method for connecting electrodes according to claim 1 or 2, wherein the irradiation of the light having different intensities is such that the central side of the connecting portion becomes weaker in light. 接続が、接続装置として、上下動可能な加圧ヘッドと、受け台を有し、前記受け台の少なくとも一部が光の透過が可能な材質であり、前記受け台の下にはエネルギー線源を有するものである請求項１、２又は３記載の電極の接続方法。 The connection has a pressure head that can move up and down as a connection device, and a pedestal, at least a part of the pedestal is made of a material capable of transmitting light, and an energy ray source is provided below the pedestal. The electrode connection method according to claim 1, wherein the electrode connection method comprises: 受け台の下部に設けたマスクにより強弱を設ける請求項４記載の電極の接続方法。
5. The method for connecting electrodes according to claim 4, wherein the strength is provided by a mask provided below the pedestal.
JP2003354972A 2003-10-15 2003-10-15 Electrode connection method Expired - Lifetime JP3856233B2 (en)

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