JP2004140106A - Package for housing semiconductor element and semiconductor device using it - Google Patents

Package for housing semiconductor element and semiconductor device using it Download PDF

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Publication number
JP2004140106A
JP2004140106A JP2002302178A JP2002302178A JP2004140106A JP 2004140106 A JP2004140106 A JP 2004140106A JP 2002302178 A JP2002302178 A JP 2002302178A JP 2002302178 A JP2002302178 A JP 2002302178A JP 2004140106 A JP2004140106 A JP 2004140106A
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Prior art keywords
wiring conductor
wire
semiconductor element
connector
wiring conductors
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JP2002302178A
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JP3780514B2 (en
Inventor
Tetsuo Hirakawa
平川　哲生
Shin Matsuda
松田　伸
Yoshinobu Sawa
澤　義信
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Waveguide Connection Structure (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing semiconductor device that is improved in transmission characteristic by effectively preventing the reflection etc., of high-frequency electric signals at the connections between second wiring conductors and the wires of a connector, and to provide a semiconductor device. <P>SOLUTION: This package for housing semiconductor element comprises a substrate 1 having a mounting section 1a for mounting a semiconductor element 6, pluralities of grounding wiring conductors 2b and first wiring conductors 2a formed on the substrate 1, and grounding pads 3b and input-output pads 3a electrically connected to the wiring conductors 2b and 2a. This package also comprises second wiring conductors 4 formed on the substrate 1 and a connector which is composed of conductive wires and an insulating enclosing body and in which parts of the conductive wires are connected to parts of the second wiring conductors 4 in overlapping states. The longitudinal cross-sectional areas S<SB>1</SB>and S<SB>2</SB>of the connecting areas and nonconnecting areas of the second wiring conductors 4 with the conductive wires and the longitudinal cross-sectional areas S<SB>3</SB>and S<SB>4</SB>of the conductive wires with the second wiring conductors 4 are adjusted to meet the inequalities of S<SB>1</SB><S<SB>2</SB>, S<SB>3</SB><S<SB>4</SB>, 0.3≤S<SB>2</SB>/S<SB>4</SB>≤1.2, and 0.8≤S<SB>2</SB>/(S<SB>1</SB>+S<SB>3</SB>)≤1.2. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は高周波の電気信号を送受信する半導体素子を収納する半導体素子収納用パッケージ、およびその半導体素子収納用パッケージを用いて成る半導体装置に関するものである。
【０００２】
【従来の技術】
従来、電気信号を送受信する半導体素子を収容するための半導体素子収納用パッケージは、一般に、酸化アルミニウム質焼結体、ムライト質焼結体、ガラスセラミックス、窒化アルミニウム質焼結体等の電気絶縁材料から成り、上面に半導体素子の搭載部が形成された基体と、タングステン、モリブデン、マンガン、銅、銀等の金属材料から成り、基体の半導体素子搭載部から下面にかけて被着導出された複数の電気信号の入出力用およびグランド用の配線導体と、この配線導体と電気的に接続するようにして基体の下面に形成された複数個のグランド用パッドおよび入出力用パッドと、基体の搭載部より上面もしくは側面にかけて導出されている出入力用の配線導体と、導電性の線材と絶縁性の外囲体とから成り、線材の一端が出入力用配線導体に接続され、他端が外部に導出されているコネクターとにより構成されている。
【０００３】
かかる半導体素子収納用パッケージは、その搭載部に電気信号を送受信する半導体素子がＡｕ−Ｓｎろう材あるいは半田等の接合材を介して接着固定されるとともに、半導体素子の電極が入出力配線導体、グランド用配線導体および出入力配線導体にボンディングワイヤや接続用リボン、半田等の導電性接続材を介して接続され、その後、必要に応じて蓋体等で半導体素子を封止することによって半導体装置となる。
【０００４】
また前記半導体装置は基体の下面に形成されているグランド用パッドおよび入出力用パッドを外部電気回路基板の回路導体に半田バンプ等を介し接続させることによって内部に収容する半導体素子が外部電気回路に接続され、同時にコネクターに同軸ケーブル等を介し外部の通信装置等の外部機器を接続させることによって半導体素子と外部機器とが接続するようになっている。
【０００５】
なお、前記半導体装置に使用されている半導体素子は複数の電気信号を合成して一つの電気信号に変換する、或いは一つの電気信号を分離して複数の電気信号に変換する機能を有しており、第１配線導体を介して入力される複数の周波数帯域が低い電気信号は半導体素子で合成されて一つの周波数帯域が高い電気信号となり、この周波数帯域の高い電気信号は第２配線導体を介してコネクターに伝送されるとともにコネクターより外部の通信装置等の外部機器に伝送され、またコネクターを介して外部機器より伝送された周波数帯域の高い電気信号は半導体素子で複数の周波数帯域が低い電気信号に変換され、各々の周波数帯域の低い電気信号は第１配線導体を介して外部電気回路に伝送されることとなる。
【０００６】
また前記コネクターは鉄−ニッケル−コバルト合金等の金属の線材の周囲をガラス等の絶縁性材料から成る外囲体で取り囲んだ構造を有しており、コネクターの線材と第２配線導体とは、通常、２ｍｍ（２０００μｍ）以上の長さにわたって接続されている。
【０００７】
【特許文献１】
特開平９−７４１５２号公報
【０００８】
【発明が解決しようとする課題】
しかしながら、この従来の半導体素子収納用パッケージおよび半導体装置においては、第２配線導体にコネクターの線材を２ｍｍ以上の長さにわたって重畳接続しており、両者の接続部におけるインピーダンスは第２配線導体とコネクターの線材との合計となって他よりも低い低インピーダンスになるとともにその低インピーダンスの領域が２ｍｍ以上のものとなっている。そのため、この第２配線導体とコネクターの線材との間に４０ＧＨｚ〜８０ＧＨｚの高周波の電気信号を伝送させた場合、高周波の電気信号は前記インピーダンスが低い領域（第２配線導体とコネクターの線材とが２０ｍｍ以上にわたって重畳接続されている領域）で反射等を起こし、伝送特性が大きく劣化するという欠点を有していた。
【０００９】
本発明は上記欠点に鑑み案出されたもので、その目的は第２配線導体とコネクターの線材との接続部での高周波電気信号の反射等を有効に防止し伝送特性の優れた半導体素子収納用パッケージおよび半導体装置を提供することにある。
【００１０】
【課題を解決するための手段】
本発明の半導体素子収納用パッケージは、４０ＧＨｚ〜８０ＧＨｚの電気信号を送受信する半導体素子が搭載される搭載部を有する基体と、該基体の前記搭載部より下面にかけて導出されている複数個のグランド配線導体および第１配線導体と、前記基体の下面に形成され、前記グランド配線導体および第１配線導体に電気的に接続している複数個のグランド用パッドおよび入出力用パッドと、前記基体の搭載部より上面もしくは側面にかけて導出されている第２配線導体と、導電性の線材と絶縁性の外囲体とから成り、線材の一部が前記第２配線導体の一部に重畳接続されているコネクターとで形成され、前記第２配線導体の線材との接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材の第２配線導体との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．３≦Ｓ２／Ｓ４≦１．２、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２であることを特徴とするものである。
【００１１】
また本発明の半導体装置は、上記構成の半導体素子収納用パッケージと、４０ＧＨｚ〜８０ＧＨｚの電気信号を送受信する半導体素子とから成り、前記パッケージの搭載部に半導体素子を搭載固定するとともに該半導体素子の各電極を第１配線導体および第２配線導体に電気的に接続したことを特徴とするものである。
【００１２】
本発明の半導体素子収納用パッケージおよび半導体装置によれば、第２配線導体の線材との接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材の第２配線導体との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．３≦Ｓ２／Ｓ４≦１．２、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２としたことから第２配線導体のインピーダンスとコネクターの線材のインピーダンスとを整合させるとともに第２配線導体とコネクターの線材との接続部において低インピーダンス領域が形成されるのを有効に防止し、これによって第２配線導体とコネクターの線材に４０ＧＨｚ〜８０ＧＨｚの高周波の電気信号を伝送させたとしてもインピーダンスの不整合による大きな反射等を起こすことはなく、伝送特性を優れたものとなすことができる。
【００１３】
【発明の実施の形態】
次に、本発明を添付図面に基づき詳細に説明する。
【００１４】
図１は本発明の半導体素子収納用パッケージの一実施例を示し、１は基体、２ａは第１配線導体、２ｂはグランド配線導体、３ａは入出力用パッド、３ｂはグランド用パッド、４は第２配線導体、５はコネクターである。これら基体１、第１配線導体２ａ、グランド配線導体２ｂ、入出力用パッド３ａ、グランド用パッド３ｂ、第２配線導体４およびコネクター５により半導体素子６を収納するための半導体素子収納用パッケージ７が基本的に構成される。
【００１５】
前記基体１は酸化アルミニウム質焼結体、ムライト質焼結体、ガラスセラミックス、窒化アルミニウム質焼結体等の電気絶縁材料から成り、例えば、酸化アルミニウム質焼結体から成る場合、酸化アルミニウム、酸化ケイ素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機溶剤、溶媒、可塑剤、分散剤を添加混合して泥漿物を作り、この泥漿物を従来周知のドクターブレード法やカレンダーロール法等のシート形成法を採用しシート状に形成してセラミックグリーンシート（セラミック生シート）を得、しかる後、それらセラミックグリーンシートに適当な打ち抜き加工を施すとともにこれを必要に応じて複数枚積層し、約１６００℃の高温で焼成することによって製作される。
【００１６】
また前記基体１は、半導体素子の搭載部１ａから下面にかけて複数個の第１配線導体２ａおよびグランド用配線導体２ｂが形成されており、該各配線導体２ａ、２ｂは半導体素子の電気信号入出力用、接地用の各電極を、入出力用パッド３ａやグランド用パッド３ｂに接続するための導電路として作用し、搭載部１ａ側の一端には半導体素子６の電気信号入出力用、接地用の各電極が導電性接続材を介して電気的に接続される。
【００１７】
前記第１配線導体２ａおよびグランド用配線導体２ｂ、入出力用パッド３ａおよびグランド用パッド３ｂは、銅、銀、金、パラジウム、タングステン、モリブデン、マンガン等の金属材料から成り、例えば銅から成る場合であれば、銅粉末に有機溶剤等を添加して成る金属ペーストを基体１となるセラミックグリーンシートの表面に所定パターンに印刷しておくことにより形成される。
【００１８】
この第１配線導体２ａおよびグランド用配線導体２ｂの基体１下面側の一端は、それぞれ対応する入出力用パッド３ａおよびグランド用パッド３ｂと電気的に接続しており、これらの入出力用パッド３ａ、グランド用パッド３ｂを外部電気回路の所定の信号用や接地用等の回路導体に接続することにより、半導体素子６の電気信号入出力用、接地用の各電極が外部電気回路と電気的に接続される。
【００１９】
また前記基体１は、半導体素子の搭載部１ａから上面や側面等にかけて第２配線導体４が形成されており、該第２配線導体４は半導体素子６の電極をコネクター５の線材５ａに接続するための導電路として作用し、搭載部１ａ側の一端には半導体素子６の電極が導電性接続材８を介して電気的に接続される。
【００２０】
前記第２配線導体４は、上述の第１配線導体２ａ等と同様に、銅、銀、金、パラジウム、タングステン、モリブデン、マンガン等の金属材料から成り、例えば銅から成る場合であれば、銅粉末に有機溶剤等を添加して成る金属ペーストを基体１となるセラミックグリーンシートの表面に所定パターンに印刷しておくことにより形成される。
【００２１】
この第２配線導体４の基体１外表面側の一端はコネクター５の線材５ａと電気的に接続しており、このコネクター５を同軸ケーブル等を介して通信装置等の外部機器に接続することにより半導体素子６と外部機器との間で高周波信号の送受信が行われる。
【００２２】
前記コネクター５は、半導体素子収納用パッケージ７の第２配線導体４を同軸ケーブル等を介して外部機器に接続するための接続体として作用し、例えば、鉄−ニッケル−コバルト合金のリード線等の金属の線材５ａの周囲を、ホウ珪酸系ガラス等の絶縁性の外囲体５ｂで取り囲んだ構造である。
【００２３】
前記線材５ａと外囲体５ｂとから成るコネクター５は、例えば、鉄−ニッケル−コバルト合金から成る線材５ａを、鉄−ニッケル−コバルト合金等の金属から成る円筒状の容器の中央にセットし、容器内にホウ珪酸ガラス等のガラス粉末を充填した後、ガラス粉末を加熱溶融させて線材５ａの周囲に被着させることによって製作される。
【００２４】
かくして上述の半導体素子収納用パッケージによれば、基体１の搭載部１ａに半導体素子６を搭載するとともにガラス、樹脂、ロウ材等の接着材を介して固定し、しかる後、半導体素子６の各電極を第１配線導体２ａおよびグランド用配線導体２ｂに、例えば、ボンディングワイヤ８を介して接続し、最後に蓋体１０を基体１の上面に封止材を介して接合させ、半導体素子６を気密に封入することによって半導体装置１１となる。
【００２５】
この半導体装置１１は基体１下面の入出力用パッド３ａおよびグランド用パッド３ｂが外部電気回路基板の所定の信号用や接地用等の回路導体に半田バンプ等の外部端子を介して接続され、これによって半導体素子６の信号用、接地用の各電極は外部電気回路と電気的に接続される。
【００２６】
また、この半導体装置１１に取着されているコネクター５の線材５ａに同軸ケーブル等の外部接続用の導線を接続することにより、半導体素子６の電極が通信装置等の外部機器に接続される。
【００２７】
そしてかかる半導体装置１１は、外部電気回路から供給される複数の周波数帯域が低い（５〜１０ＧＨｚ）電気信号を第１配線導体２ａを介して半導体素子６に入力させ、半導体素子６でこれら入力された電気信号を合成して、一つの周波数帯域が高い（４０〜８０ＧＨｚ）電気信号とするとともにこれを第２配線導体４を介してコネクター５に出力し、該コネクター５の線材５ａを介して外部の通信装置等の外部機器に伝送する、或いは、外部の通信装置等の外部機器から伝送された一つの周波数帯域が高い（４０〜８０ＧＨｚ）電気信号をコネクター５の線材５ａ及び第２配線導体４を介して半導体素子６に入力し、半導体素子６で入力された周波数帯域が高い（４０〜８０ＧＨｚ）電気信号を複数の周波数帯域が低い（５〜１０ＧＨｚ）電気信号に変換するとともにこれらの個々の周波数帯域が低い電気信号を第１配線導体２ａを介して外部電気回路に供給することとなる。
【００２８】
本発明の半導体素子収納用パッケージおよびこれを用いた半導体装置においては、図２に示すように、第２配線導体４の線材５ａとの接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材５ａの第２配線導体４との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．３≦Ｓ２／Ｓ４≦１．２、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２としておくことが重要である。
【００２９】
前記第２配線導体４の線材５ａとの接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材５ａの第２配線導体４との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．３≦Ｓ２／Ｓ４≦１．２、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２としておくと、第２配線導体４とコネクター５の線材５ａの縦断面積の相違（第２配線導体４とコネクター５の線材５ａとの太さの相違）によるインピーダンスの不整合、第２配線導体４とコネクター５の線材５ａとの接続部における低インピーダンス領域の形成がなくなり、これによって第２配線導体４とコネクター５の線材５ａに４０ＧＨｚ〜８０ＧＨｚの高周波の電気信号を伝送させたとしても低インピーダンス領域がほとんどなく、かつ第２配線導体４とコネクター５の線材５ａのインピーダンスがほぼ整合していることから電気信号に大きな反射を起こすことはなく伝送特性を優れたものとなすことができる。
【００３０】
なお、前記第２配線導体４およびコネクター５の線材５ａは、第２配線導体４の線材５ａとの接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材５ａの第２配線導体４との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ２／Ｓ４＞１．２、Ｓ２／Ｓ４＜０．３となると第２配線導体４のインピーダンスとコネクター５の線材５ａのインピーダンスが大きく相違し、伝送する高周波の電気信号に反射等を招来して伝送特性が大きく劣化してしまう。従って、前記第２配線導体４およびコネクター５の線材５ａは、第２配線導体４の線材５ａとの接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材５ａの第２配線導体４との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、０．３≦Ｓ２／Ｓ４≦１．２の範囲に特定される。
【００３１】
また、前記第２配線導体４およびコネクター５の線材５ａは、第２配線導体４の線材５ａとの接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材５ａの第２配線導体４との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＞Ｓ２、Ｓ３＞Ｓ４、となってＳ２／（Ｓ１＋Ｓ３）＞１．２、Ｓ２／（Ｓ１＋Ｓ３）＜０．８となると第２配線導体４とコネクター５の線材５ａとの接続領域における縦断面積が第２配線導体４や線材５ａの非接続領域における縦断面積よりも大きくなって低インピーダンスとなり、その結果、第２配線導体４とコネクター５の線材５ａとの接続領域におけるインピーダンスと、第２配線導体４および線材５ａの非接続領域におけるインピーダンスとの間に大きな相違が生じ、第２配線導体４とコネクター５の線材５ａに４０ＧＨｚ〜８０ＧＨｚの高周波の電気信号を伝送させた場合、伝送する電気信号に反射等が招来して伝送特性が大きく劣化してしまう。従って、前記第２配線導体４およびコネクター５の線材５ａは、第２配線導体４の線材５ａとの接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材５ａの第２配線導体４との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２の範囲に特定される。
【００３２】
前記第２配線導体４のコネクター５の線材５ａとの接続は、第２配線導体４の先端の断面積が小さくなるようにして形成した領域の上面に、線材５ａの先端の断面積が小さくなるようにして形成した領域の下面を位置決めするとともに治具等で仮固定し、半田等の導電性接続材で接続することによって行なわれる。なお、第２配線導体の、線材５ａとの接合領域の断面積を小さくするには、例えば、第２配線導体４となる金属ペースト基体１となるセラミックグリーンシートの表面に所定パターンに印刷しておくことにより形成する際、印刷を２回に分けて行い、断面積を小さくしようとする領域のみ印刷を１回とし、他の領域を２回印刷するようにして第２配線導体４の厚みを調節すること等の手段を用いることができる。また、線材５ａの、第２配線導体４と接続される領域の断面積を小さくするには、例えば、線材５ａの第２配線導体と接続される領域に対して研磨加工を施すこと等の手段を用いることができる。
【００３３】
なお、本発明は上述の実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。
【００３４】
【発明の効果】
本発明の半導体素子収納用パッケージおよび半導体装置によれば、第２配線導体の線材との接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材の第２配線導体との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．３≦Ｓ２／Ｓ４≦１．２、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２としたことから第２配線導体のインピーダンスとコネクターの線材のインピーダンスとを整合させるとともに第２配線導体とコネクターの線材との接続部において低インピーダンス領域が形成されるのを有効に防止し、これによって第２配線導体とコネクターの線材に４０ＧＨｚ〜８０ＧＨｚの高周波の電気信号を伝送させたとしてもインピーダンスの不整合による大きな反射等を起こすことはなく、伝送特性を優れたものとなすことができる。
【図面の簡単な説明】
【図１】本発明の半導体素子収納用パッケージおよびこの半導体素子収納用パッケージを用いた半導体装置の一実施例を示す断面図である。
【図２】図１に示す半導体素子収納用パッケージおよび半導体装置の要部拡大断面図である。
【符号の説明】
１・・・・・基体
１ａ・・・・搭載部
２ａ・・・・第１配線導体
２ｂ・・・・グランド配線導体
３ａ・・・・入出力用パッド
３ｂ・・・・グランド用パッド
４・・・・・第２配線導体
５・・・・・コネクター
５ａ・・・・線材
５ｂ・・・・外囲体
６・・・・・半導体素子
７・・・・・半導体素子収納用パッケージ
８・・・・・ボンディングワイヤ
１０・・・・蓋体
１１・・・・半導体装置[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor element housing package for housing a semiconductor element for transmitting and receiving high-frequency electrical signals, and a semiconductor device using the semiconductor element housing package.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, semiconductor element housing packages for housing semiconductor elements for transmitting and receiving electric signals generally include electrically insulating materials such as aluminum oxide sintered bodies, mullite sintered bodies, glass ceramics, and aluminum nitride sintered bodies. And a plurality of electrical conductors made of a metal material such as tungsten, molybdenum, manganese, copper, silver, etc., which are attached and derived from the semiconductor element mounting portion of the base to the lower surface. A wiring conductor for signal input / output and ground; a plurality of ground pads and input / output pads formed on the lower surface of the base so as to be electrically connected to the wiring conductor; It consists of an input / output wiring conductor led out to the top or side, a conductive wire and an insulating envelope, and one end of the wire is used for input / output. Is connected to the conductor, the other end is constituted by a connector that is led to the outside.
[0003]
In such a package for housing a semiconductor element, a semiconductor element for transmitting and receiving an electric signal is bonded and fixed to a mounting portion thereof via a bonding material such as an Au-Sn brazing material or solder, and electrodes of the semiconductor element are connected to an input / output wiring conductor, The semiconductor device is connected to the ground wiring conductor and the input / output wiring conductor via a bonding wire, a connection ribbon, a conductive connecting material such as solder, and then, if necessary, sealing the semiconductor element with a lid or the like. It becomes.
[0004]
Further, the semiconductor device accommodated inside the semiconductor device by connecting the ground pad and the input / output pad formed on the lower surface of the base to the circuit conductor of the external electric circuit board via a solder bump or the like, so that the semiconductor element accommodated therein is connected to the external electric circuit. The semiconductor device and the external device are connected by connecting the external device such as an external communication device to the connector via a coaxial cable or the like at the same time.
[0005]
The semiconductor element used in the semiconductor device has a function of synthesizing a plurality of electric signals and converting it into one electric signal, or separating one electric signal and converting it into a plurality of electric signals. An electric signal having a plurality of low frequency bands input through the first wiring conductor is synthesized by the semiconductor element to become an electric signal having one frequency band, and the electric signal having a high frequency band is transmitted through the second wiring conductor. The high frequency band electric signal transmitted to the external device such as a communication device outside from the connector through the connector through the connector, and transmitted from the external device through the connector is a semiconductor device having a plurality of low frequency band electric signals. The electric signal converted into a signal and having a low frequency band is transmitted to an external electric circuit via the first wiring conductor.
[0006]
Further, the connector has a structure in which a metal wire such as an iron-nickel-cobalt alloy is surrounded by an outer enclosure made of an insulating material such as glass. Usually, they are connected over a length of 2 mm (2000 μm) or more.
[0007]
[Patent Document 1]
JP-A-9-74152
[Problems to be solved by the invention]
However, in this conventional package for housing a semiconductor element and a semiconductor device, the wire of the connector is connected to the second wiring conductor in a superimposed manner over a length of 2 mm or more, and the impedance at the connection part between the second wiring conductor and the connector is And the lower impedance becomes lower than the others, and the low impedance region is 2 mm or more. Therefore, when a high-frequency electric signal of 40 GHz to 80 GHz is transmitted between the second wiring conductor and the wire of the connector, the high-frequency electric signal is in a region where the impedance is low (when the second wiring conductor and the wire of the connector are connected to each other). However, there is a drawback that reflection occurs in a region where the connection is superimposed over 20 mm or more, and transmission characteristics are greatly deteriorated.
[0009]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described drawbacks, and has as its object to effectively prevent reflection of a high-frequency electric signal at a connection portion between a second wiring conductor and a wire of a connector, and to accommodate a semiconductor element having excellent transmission characteristics. And a semiconductor device.
[0010]
[Means for Solving the Problems]
The package for housing a semiconductor element of the present invention includes a base having a mounting portion on which a semiconductor element for transmitting and receiving an electric signal of 40 GHz to 80 GHz is mounted, and a plurality of ground wirings extending from the mounting portion of the base to a lower surface. A conductor and a first wiring conductor, a plurality of ground pads and input / output pads formed on the lower surface of the base and electrically connected to the ground wiring conductor and the first wiring conductor; and mounting the base. A second wiring conductor extending from the portion to the upper surface or the side surface, a conductive wire and an insulating envelope, and a part of the wire is overlapped and connected to a part of the second wiring conductor. The vertical cross-sectional areas of the connection area and the non-connection area of the second wiring conductor with the wire are S 1 and S 2 , the connection area of the wire with the second wiring conductor and the non-connection area. Assuming that the vertical cross-sectional area of the region is S 3 , S 4 , S 1 <S 2 , S 3 <S 4 , 0.3 ≦ S 2 / S 4 ≦ 1.2, 0.8 ≦ S 2 / (S 1 + S 3 ) ≦ 1.2.
[0011]
Further, a semiconductor device of the present invention comprises a semiconductor element storage package having the above configuration, and a semiconductor element for transmitting and receiving an electric signal of 40 GHz to 80 GHz. The semiconductor element is mounted and fixed on a mounting portion of the package, and Each electrode is electrically connected to a first wiring conductor and a second wiring conductor.
[0012]
According to the semiconductor element housing package and the semiconductor device of the present invention, the vertical cross-sectional areas of the connection area and the non-connection area of the second wiring conductor with the wire are S 1 and S 2 , the connection area of the wire with the second wiring conductor, and Assuming that the vertical cross-sectional areas of the non-connection regions are S 3 and S 4 , S 1 <S 2 , S 3 <S 4 , 0.3 ≦ S 2 / S 4 ≦ 1.2, 0.8 ≦ S 2 / ( Since S 1 + S 3 ) ≦ 1.2, the impedance of the second wiring conductor is matched with the impedance of the wire of the connector, and a low-impedance region is formed at the connection between the second wiring conductor and the wire of the connector. Therefore, even if a high-frequency electric signal of 40 GHz to 80 GHz is transmitted to the wire of the second wiring conductor and the connector, a large reflection or the like due to impedance mismatching can be prevented. And excellent transmission characteristics can be obtained.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, the present invention will be described in detail with reference to the accompanying drawings.
[0014]
FIG. 1 shows an embodiment of a package for housing a semiconductor element according to the present invention, wherein 1 is a base, 2a is a first wiring conductor, 2b is a ground wiring conductor, 3a is an input / output pad, 3b is a ground pad, and 4 is The second wiring conductor 5 is a connector. A semiconductor element housing package 7 for housing the semiconductor element 6 by the base 1, the first wiring conductor 2a, the ground wiring conductor 2b, the input / output pad 3a, the ground pad 3b, the second wiring conductor 4 and the connector 5 is provided. Basically configured.
[0015]
The base 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, a glass ceramic, an aluminum nitride sintered body. A suitable organic solvent, solvent, plasticizer, and dispersant are added to and mixed with raw material powders such as silicon, magnesium oxide, and calcium oxide to form a slurry, and the slurry is formed by a conventionally known doctor blade method, calender roll method, or the like. A ceramic green sheet (ceramic green sheet) is obtained by forming a sheet by adopting a sheet forming method. Thereafter, the ceramic green sheet is subjected to an appropriate punching process, and a plurality of the green sheets are laminated as necessary. It is manufactured by firing at a high temperature of 1600 ° C.
[0016]
The base 1 is formed with a plurality of first wiring conductors 2a and ground wiring conductors 2b from the mounting portion 1a of the semiconductor element to the lower surface, and each of the wiring conductors 2a and 2b is connected to an electric signal input / output of the semiconductor element. Of the semiconductor element 6 at one end on the side of the mounting portion 1a, and serves as a conductive path for connecting each electrode for grounding and grounding to the input / output pad 3a and the grounding pad 3b. Are electrically connected via a conductive connecting material.
[0017]
The first wiring conductor 2a and the ground wiring conductor 2b, the input / output pad 3a and the ground pad 3b are made of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, or manganese. In this case, the metal paste is formed by printing a metal paste formed by adding an organic solvent or the like to copper powder on a surface of a ceramic green sheet serving as the substrate 1 in a predetermined pattern.
[0018]
One ends of the first wiring conductor 2a and the ground wiring conductor 2b on the lower surface side of the base 1 are electrically connected to corresponding input / output pads 3a and ground pads 3b, respectively. By connecting the ground pad 3b to a predetermined signal conductor or a circuit conductor for grounding of the external electric circuit, the electric signal input / output and ground electrodes of the semiconductor element 6 are electrically connected to the external electric circuit. Connected.
[0019]
The base 1 has a second wiring conductor 4 formed from the mounting portion 1a of the semiconductor element to the upper surface, the side surface, and the like. The second wiring conductor 4 connects the electrode of the semiconductor element 6 to the wire 5a of the connector 5. And an electrode of the semiconductor element 6 is electrically connected to one end of the mounting portion 1a via a conductive connecting material 8.
[0020]
The second wiring conductor 4 is made of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, or manganese, like the first wiring conductor 2a described above. It is formed by printing a metal paste obtained by adding an organic solvent or the like to the powder in a predetermined pattern on the surface of the ceramic green sheet serving as the base 1.
[0021]
One end of the second wiring conductor 4 on the outer surface side of the base 1 is electrically connected to a wire 5a of a connector 5, and the connector 5 is connected to an external device such as a communication device via a coaxial cable or the like. Transmission and reception of high-frequency signals are performed between the semiconductor element 6 and an external device.
[0022]
The connector 5 serves as a connector for connecting the second wiring conductor 4 of the semiconductor element housing package 7 to an external device via a coaxial cable or the like. For example, the connector 5 may be a lead wire of an iron-nickel-cobalt alloy. In this structure, a metal wire 5a is surrounded by an insulating outer body 5b such as borosilicate glass.
[0023]
For the connector 5 composed of the wire 5a and the outer body 5b, for example, a wire 5a made of an iron-nickel-cobalt alloy is set at the center of a cylindrical container made of a metal such as an iron-nickel-cobalt alloy, After the glass powder such as borosilicate glass is filled in the container, the glass powder is heated and melted and adhered around the wire 5a.
[0024]
Thus, according to the above-described semiconductor element storage package, the semiconductor element 6 is mounted on the mounting portion 1a of the base 1 and fixed via an adhesive such as glass, resin, brazing material, and the like. The electrodes are connected to the first wiring conductor 2a and the ground wiring conductor 2b via, for example, bonding wires 8, and finally the lid 10 is joined to the upper surface of the base 1 via a sealing material, and the semiconductor element 6 is connected. The semiconductor device 11 is obtained by hermetically sealing.
[0025]
In the semiconductor device 11, input / output pads 3a and ground pads 3b on the lower surface of the base 1 are connected to predetermined signal and ground circuit conductors of an external electric circuit board via external terminals such as solder bumps. Accordingly, the signal and ground electrodes of the semiconductor element 6 are electrically connected to an external electric circuit.
[0026]
In addition, by connecting a conductor for external connection such as a coaxial cable to the wire 5a of the connector 5 attached to the semiconductor device 11, the electrode of the semiconductor element 6 is connected to an external device such as a communication device.
[0027]
The semiconductor device 11 causes a plurality of low-frequency band (5 to 10 GHz) electric signals supplied from an external electric circuit to be input to the semiconductor element 6 via the first wiring conductor 2a, and the semiconductor element 6 inputs these electric signals. The electric signals are combined into one electric signal having a high frequency band (40 to 80 GHz), and the electric signal is output to the connector 5 via the second wiring conductor 4 and externally connected via the wire 5a of the connector 5. Or a single high frequency band (40 to 80 GHz) electric signal transmitted from an external device such as an external communication device or the like to the external device such as a communication device. To the semiconductor element 6 via the semiconductor element 6, and the electric signal having a high frequency band (40 to 80 GHz) input by the semiconductor element 6 is converted into a plurality of low frequency bands (5 to 10 GHz). The supplying to the external electrical circuit through the first wiring conductor 2a of these individual frequency band lower electrical signals and converts into an electrical signal.
[0028]
In the semiconductor element housing package and the semiconductor device using the same according to the present invention, as shown in FIG. 2, the vertical cross-sectional areas of the connection region and the non-connection region of the second wiring conductor 4 with the wire 5a are S 1 and S 2. , S 1 <S 2 , S 3 <S 4 , 0.3 ≦ S 2 / S, where the vertical cross-sectional areas of the connection region and the non-connection region of the wire 5 a with the second wiring conductor 4 are S 3 and S 4. 4 ≦ 1.2,0.8 ≦ S 2 / ( S 1 + S 3) it is important to the ≦ 1.2.
[0029]
The vertical cross-sectional areas of the connection area and the non-connection area of the second wiring conductor 4 with the wire 5a are S 1 and S 2 , and the vertical cross-sectional areas of the connection area and the non-connection area of the wire 5a with the second wiring conductor 4 are S 3 . when the S 4, as S 1 <S 2, S 3 <S 4, 0.3 ≦ S 2 / S 4 ≦ 1.2,0.8 ≦ S 2 / (S 1 + S 3) ≦ 1.2 In other words, impedance mismatch due to a difference in vertical cross-sectional area between the second wiring conductor 4 and the wire 5a of the connector 5 (a difference in thickness between the second wiring conductor 4 and the wire 5a of the connector 5). The formation of the low-impedance region in the connection portion between the connector 5 and the wire 5a is eliminated, so that even if a high-frequency electric signal of 40 GHz to 80 GHz is transmitted to the second wiring conductor 4 and the wire 5a of the connector 5, the low-impedance region is reduced. Hardly any Since the impedance of the second wiring conductor 4 and the wire 5a of the connector 5 are almost matched, the transmission characteristics can be improved without causing large reflection of the electric signal.
[0030]
The second wiring conductor 4 and the wire 5a of the connector 5 have a vertical cross-sectional area S 1 , S 2 of a connection area and a non-connection area with the wire 5a of the second wiring conductor 4, and the second wiring conductor 4 of the wire 5a. When the vertical cross-sectional areas of the connection region and the non-connection region with S are S 3 and S 4 , if S 2 / S 4 > 1.2 and S 2 / S 4 <0.3, the impedance of the second wiring conductor 4 is reduced. The impedance of the wire 5a of the connector 5 is greatly different, causing reflection or the like of a high-frequency electric signal to be transmitted, thereby greatly deteriorating transmission characteristics. Therefore, the second wiring conductor 4 and the wire 5a of the connector 5 have the vertical cross-sectional areas S 1 and S 2 of the connection area and the non-connection area with the wire 5a of the second wiring conductor 4, and the second wiring conductor 4 of the wire 5a. When the vertical cross-sectional areas of the connection region and the non-connection region with S are S 3 and S 4 , the range is specified in the range of 0.3 ≦ S 2 / S 4 ≦ 1.2.
[0031]
The second wiring conductor 4 and the wire 5a of the connector 5 have a vertical cross-sectional area S 1 , S 2 of a connection area and a non-connection area with the wire 5a of the second wiring conductor 4, and the second wiring conductor 4 of the wire 5a. When the vertical cross-sectional areas of the connection region and the non-connection region with S are S 3 and S 4 , S 1 > S 2 , S 3 > S 4 , and S 2 / (S 1 + S 3 )> 1.2, When S 2 / (S 1 + S 3 ) <0.8, the vertical cross-sectional area in the connection region between the second wiring conductor 4 and the wire 5a of the connector 5 is larger than the vertical cross-sectional area in the non-connection region of the second wiring conductor 4 and the wire 5a. As a result, the impedance in the connection region between the second wiring conductor 4 and the wire 5a of the connector 5 is greatly different from the impedance in the non-connection region between the second wiring conductor 4 and the wire 5a. Occurs If allowed to transmit a high-frequency electrical signals 40GHz~80GHz the wire 5a of the second wiring conductor 4 and the connector 5, the transmission characteristics and Shorai is reflected like the electrical signal transmitted is deteriorated greatly. Therefore, the second wiring conductor 4 and the wire 5a of the connector 5 have the vertical cross-sectional areas S 1 and S 2 of the connection area and the non-connection area with the wire 5a of the second wiring conductor 4, and the second wiring conductor 4 of the wire 5a. when the S 3, S 4 a longitudinal area of the connection region and the non-connection region and, S 1 <S 2, S 3 <S 4, 0.8 ≦ S 2 / (S 1 + S 3) ≦ 1.2 Is specified in the range.
[0032]
The connection of the second wiring conductor 4 with the wire 5a of the connector 5 is such that the cross-sectional area of the tip of the wire 5a is reduced on the upper surface of the region formed so that the cross-sectional area of the tip of the second wiring conductor 4 is reduced. The positioning is performed by positioning the lower surface of the region formed as described above, temporarily fixing the region with a jig or the like, and connecting with a conductive connecting material such as solder. In order to reduce the cross-sectional area of the joining region between the second wiring conductor and the wire 5a, for example, a predetermined pattern is printed on the surface of the ceramic green sheet that is to be the metal paste base 1 that is to be the second wiring conductor 4. When forming, the printing is performed in two parts, the printing is performed only once in the area where the cross-sectional area is to be reduced, and the thickness of the second wiring conductor 4 is reduced by printing the other area twice. Means such as adjusting can be used. Further, in order to reduce the cross-sectional area of the region of the wire 5a connected to the second wiring conductor 4, for example, means for polishing the region of the wire 5a connected to the second wiring conductor may be used. Can be used.
[0033]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
[0034]
【The invention's effect】
According to the semiconductor element housing package and the semiconductor device of the present invention, the vertical cross-sectional areas of the connection area and the non-connection area of the second wiring conductor with the wire are S 1 and S 2 , the connection area of the wire with the second wiring conductor, and Assuming that the vertical cross-sectional areas of the non-connection regions are S 3 and S 4 , S 1 <S 2 , S 3 <S 4 , 0.3 ≦ S 2 / S 4 ≦ 1.2, 0.8 ≦ S 2 / ( Since S 1 + S 3 ) ≦ 1.2, the impedance of the second wiring conductor is matched with the impedance of the wire of the connector, and a low-impedance region is formed at the connection between the second wiring conductor and the wire of the connector. Therefore, even if a high-frequency electric signal of 40 GHz to 80 GHz is transmitted to the wire of the second wiring conductor and the connector, a large reflection or the like due to impedance mismatching can be prevented. And excellent transmission characteristics can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing one embodiment of a package for housing a semiconductor element of the present invention and a semiconductor device using the package for housing a semiconductor element.
FIG. 2 is an enlarged sectional view of a main part of the semiconductor element housing package and the semiconductor device shown in FIG. 1;
[Explanation of symbols]
1 Base 1a Mounting part 2a First wiring conductor 2b Ground wiring conductor 3a Input / output pad 3b Ground pad 4 ································································································································································· ..... Bonding wire 10 ... Lid 11 ... Semiconductor device

Claims (2)

４０ＧＨｚ〜８０ＧＨｚの電気信号を送受信する半導体素子が搭載される搭載部を有する基体と、該基体の前記搭載部より下面にかけて導出されている複数個のグランド配線導体および第１配線導体と、前記基体の下面に形成され、前記グランド配線導体および第１配線導体に電気的に接続している複数個のグランド用パッドおよび入出力用パッドと、前記基体の搭載部より上面もしくは側面にかけて導出されている第２配線導体と、導電性の線材と絶縁性の外囲体とから成り、線材の一部が前記第２配線導体の一部に重畳接続されているコネクターとで形成され、前記第２配線導体の線材との接続領域および非接続領域の縦断面積をＳ１、Ｓ２、線材の第２配線導体との接続領域および非接続領域の縦断面積をＳ３、Ｓ４とした時、Ｓ１＜Ｓ２、Ｓ３＜Ｓ４、０．３≦Ｓ２／Ｓ４≦１．２、０．８≦Ｓ２／（Ｓ１＋Ｓ３）≦１．２であることを特徴とする半導体素子収納用パッケージ。A base having a mounting portion on which a semiconductor element for transmitting and receiving electric signals of 40 GHz to 80 GHz is mounted, a plurality of ground wiring conductors and first wiring conductors extending from the mounting portion of the base to a lower surface; And a plurality of ground pads and input / output pads electrically connected to the ground wiring conductor and the first wiring conductor, and are led out from the mounting portion of the base to the upper surface or the side surface. A second wiring conductor, a connector formed of a conductive wire and an insulating envelope, wherein a part of the wire is formed by being overlapped with a part of the second wiring conductor; When the vertical cross-sectional areas of the connection area and the non-connection area of the conductor with the wire are S 1 and S 2 , and the vertical cross-sectional areas of the connection area and the non-connection area of the wire with the second wiring conductor are S 3 and S 4 , 1 <S 2 , S 3 <S 4 , 0.3 ≦ S 2 / S 4 ≦ 1.2, 0.8 ≦ S 2 / (S 1 + S 3 ) ≦ 1.2 Semiconductor Device storage package. 請求項１に記載の半導体素子収納用パッケージと４０ＧＨｚ〜８０ＧＨｚの電気信号を送受信する半導体素子とから成り、前記パッケージの搭載部に半導体素子を搭載固定するとともに該半導体素子の各電極を第１配線導体および第２配線導体に電気的に接続したことを特徴とする半導体装置。2. A semiconductor element storage package according to claim 1, comprising: a semiconductor element for transmitting and receiving an electric signal of 40 GHz to 80 GHz. A semiconductor device electrically connected to a conductor and a second wiring conductor.
JP2002302178A 2002-10-16 2002-10-16 Semiconductor element storage package and semiconductor device using the same Expired - Fee Related JP3780514B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004153179A (en) * 2002-10-31 2004-05-27 Hitachi Ltd Semiconductor device and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004153179A (en) * 2002-10-31 2004-05-27 Hitachi Ltd Semiconductor device and electronic device

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