JP2004132556A - Water-cooled conductor and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water cooled conductor manufacturable at low cost and having high reliability even in the case of a long size water cooled conductor having a large vertical/lateral ratio of a cross section or in the case of a cooled water conductor having a pipe projecting from an end thereof. <P>SOLUTION: This water cooled conductor is formed of a cooling pipe 13 forming a flow passage when the cooling water flows and a pair of conductor parts 11 respectively formed from a rectangular conductive body and formed with a U-shape groove 12 having a nearly semicircular cross section, to which the cooling pipe 13 is to be inserted, on a surface of one of the conductors. The cooling pipe 13 is pinched between the U-shape grooves of the pair of conductors 11, while inserting the cooling pipe 13. An abutment surface of each of the members is bonded for integration by a bonding means such as soldering, brazing, eutectic bonding and diffused bonding. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a water-cooled conductor in which cooling water flows to cool a conductor portion, and a method for manufacturing the same.
[0002]
[Prior art]
In water turbine generators, thermal power generators, and the like, large-capacity water-cooled conductors made of metal having a small electric resistance such as copper, copper alloy, aluminum, and aluminum alloy are used.
[0003]
In recent years, more and more water-cooled conductors with similar structures have been used for purposes other than electric conductors. For example, they are used as heat removal equipment for high heat load equipment by being in close contact with the outer wall of heat-resistant material of a plasma containment vessel in a fusion device. Have been.
[0004]
Such a water-cooled conductor 50 has a square cross section as shown in FIGS. 8A and 8B, and a water-cooled conductor having a round cross section as shown in FIG. 8C. There are various structures such as a water-cooled conductor 50 having a flat cross section as shown in FIG.
[0005]
In FIG. 8, reference numeral 51 denotes a conductor, and reference numeral 52 denotes a cooling water passage.
[0006]
Since the water-cooled conductor 50 as shown in FIG. 8 has a simple shape, it can be easily manufactured by drawing or extrusion, and most of the cost is due to the cost of the mold used for drawing or extrusion. I have.
[0007]
Therefore, the cost becomes lower as the required amount of the water-cooled conductor 50 is larger, but a wire maker or the like that manufactures such a water-cooled conductor 50 manufactures a few hundred kilograms as a minimum rod, so that a non-standard product is required. In such a case where there is no stock, even if the required amount is several tens of kilograms, it is inevitable to purchase several hundred kilograms of the water-cooled conductor 50.
[0008]
Therefore, even if an attempt is made to test the water-cooled conductor 50 having slightly different external dimensions to verify the shape suitable for the purpose, it is necessary to manufacture a new die, which takes time and costs for manufacturing the die. There was an inconvenience of becoming high.
[0009]
Further, in order to manufacture the water-cooled conductor 50 having a shape in which a pipe protrudes from the end as shown in FIG. 9, a hatched portion S of the water-cooled conductor 50 as shown in FIG. However, there is a disadvantage that the cost is increased in the removal processing, etc.
[0010]
Therefore, in manufacturing the water-cooled conductor 50 having a shape as shown in FIG. 9, as shown in FIG. 11, a U-groove 54 is previously formed in the conductor portion 51, and a cooling pipe 55 is attached to the U-groove 54 with a torch braze. A method of integration has been proposed.
[0011]
However, in this method, as shown in FIG. 11 (b), since the brazing material swells on the surface of the conductor portion 51 (portion indicated by reference numeral 56), it takes a lot of time to remove the brazing material, and the brazing is also performed. There was a problem that many defects peculiar to torch brazing, such as pinholes, occurred in portions.
[0012]
FIG. 11A is a diagram showing a state in which the cooling pipe 55 is inserted into the conductor portion 51 in which the U groove 54 is formed in advance, and FIG. FIG. FIG. 11C is a cross-sectional view of the completed water-cooled conductor in which the brazing material swelling on the surface of the conductor portion 51 has been removed by cutting or the like, and FIG. 11D is a longitudinal side view thereof.
[0013]
By the way, in the water-cooled conductor 50 by the method as shown in FIGS. 8 to 11, it was difficult to manufacture the water-cooled conductor 50 having a large aspect ratio in cross section.
[0014]
Therefore, Japanese Patent Application Laid-Open No. 6-234079 discloses an invention in which cooling holes of a copper product with a cooling hole used as a cooling plate or an electrode can be easily formed into an arbitrary shape and easily.
[0015]
In the invention according to this publication, a pair of copper plates having a groove formed on at least one copper plate surface is prepared, an austenitic stainless steel pipe is embedded in the groove, and the other copper plate is brought into contact with the pipe, These are integrated by diffusion bonding with a hot isostatic pressing device, and then immersed in a sulfuric acid solution to melt and remove the stainless steel pipe to form cooling holes.
[0016]
[Problems to be solved by the invention]
However, in the above-described method, since no brazing material or the like is used, inconveniences such as the rise of the brazing material do not occur as shown in FIG. Although it can be easily manufactured, it is difficult to manufacture a long water-cooled conductor 50 having a length of more than 1 m, and there is a problem that a water-cooled conductor 50 having a protruding pipe shape as shown in FIG. 9 cannot be manufactured. Was.
[0017]
Therefore, in order to manufacture the water-cooled conductor 50 having a protruding pipe shape as shown in FIG. 9, it is necessary to fix the pipe separately by welding or the like, which causes an increase in cost and also maintains the airtightness at the fixing point. Therefore, there is a problem that requires advanced technology.
[0018]
Therefore, the present invention can be easily manufactured inexpensively and easily, even if it is a long water-cooled conductor having a large aspect ratio in cross-sectional shape, or even a water-cooled conductor having a configuration in which a pipe is protruded at an end. It is another object of the present invention to provide a highly reliable water-cooled conductor and a method for manufacturing the same.
[0019]
[Means for Solving the Problems]
In order to solve the above problems, the invention according to claim 1 includes a flow path through which cooling water flows inside a conductive conductor such as copper, copper alloy, aluminum, and aluminum alloy, and the cooling water flows therein. In a water-cooled conductor having a flowing channel, a cooling pipe that forms a channel when the cooling water flows, and a cross section in which a rectangular conductive conductor is used as a material, and the cooling pipe is inserted into the surface of one of the cooling pipes It consists of a pair of conductors in which a substantially semicircular U-groove is formed, sandwiches a cooling pipe in the U-groove of the pair of conductors while inserting and fitting, and soldering, brazing, Even if it is a long water-cooled conductor with a large cross-sectional aspect ratio that is joined and integrated by joining means such as eutectic bonding, diffusion bonding, etc., a water-cooled conductor with a pipe protruding at the end Even though it is inexpensive, easy to manufacture, and has increased reliability And wherein the door.
[0020]
The invention according to claim 2 is characterized in that the cooling pipe contains stainless steel or titanium as a material.
[0021]
The invention according to claim 3 is characterized in that at least one of the joining surfaces of the conductor portion or the cooling pipe is coated with a thin film of silver or tin and subjected to a joining process.
[0022]
The invention according to claim 4 includes a flow path through which cooling water flows inside a conductive conductor such as copper, copper alloy, aluminum, and aluminum alloy, and comprises a flow path through which cooling water flows. In the water-cooled conductor, a cooling pipe that forms a flow path when the cooling water flows, and a U-shaped groove having a substantially semicircular cross section into which the cooling pipe is inserted and fitted on a surface of a rectangular conductive conductor. Formed of a pair of conductors, and assembled by inserting a cooling pipe into the U-grooves of the pair of conductors while assembling them, then drawing, extruding, cold rolling, hot rolling, pressing It is characterized by being integrated and joined by a working method such as working and hot isostatic pressing.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a water-cooled conductor 10 applied to the description of the first embodiment. FIG. 1A is a cross-sectional view of the water-cooled conductor 10, and FIG. 1B is a diagram illustrating a method of manufacturing the same.
[0024]
In the water-cooled conductor 10, a semicircular U-shaped groove 12 is formed in a conductor portion 11 which is a pair of conductive members such as copper, and a cooling pipe 13 made of copper or the like is inserted into the U-shaped groove 12 and integrated. Configuration.
[0025]
Such a conductor portion 11 has, for example, a plate thickness of 8 mm and a plate width of 30 mm, and the cooling pipe 13 has a size of about 6 mm in diameter and 1 mm in wall thickness.
[0026]
The U groove 12 has a size corresponding to the diameter of the cooling pipe 13, and the U groove 12 is preferably slightly larger than the cooling pipe 13.
[0027]
This is because when joining the conductor portion 11 and the cooling pipe 13 as described later, a joining material such as solder is made to penetrate the joining surface K, and a penetration channel at that time is secured.
[0028]
It should be noted that the joint surface K is a contact surface between the conductor portions 11 and a contact surface between the U groove 12 of the conductor portion 11 and the cooling pipe 13 for the sake of clarity.
[0029]
Next, a method of manufacturing the water-cooled conductor 10 by assembling the conductor portion 11 and the cooling pipe 13 will be described.
[0030]
First, the surfaces of the conductor 11, the U-groove 12, and the cooling pipe 13 are polished, cleaned, and the like to increase cleanliness. Next, the cooling pipe 13 is inserted into the U-shaped groove 12 formed in one conductor portion 11 to address the other conductor portion 11.
[0031]
Then, using a heating device such as a soldering iron (not shown), the conductor portion 11 and the cooling pipe 13 are heated to a temperature equal to or higher than the melting point of the joining material, and the joining material is melted in the vicinity of the joining surface K. By infiltrating the material into the joint surface K, the cooling pipe 13 is joined to the conductor 11 and the two conductors 11 are joined.
[0032]
Since the conductor portion 11 and the cooling pipe 13 are heated to a temperature equal to or higher than the melting point of the joining material, the molten joining material penetrates into details due to capillary action and the like, so that no voids or entrainment of impurities occur, and the conductor portion 11 is removed. It becomes possible to cool efficiently.
[0033]
Moreover, since the joining surface K is joined by the permeation of the molten joining material, the surplus joining material does not protrude from the joining surface K between the conductor portions 11, and the removal process or the like when it protrudes is unnecessary. There are advantages.
[0034]
Further, since the bonding material is permeated by capillary action or the like, even the water-cooled conductor 10 having a small size can be easily manufactured.
[0035]
By the way, in the above description, the case where the cooling pipe 13 and the conductor portion 11 are joined by melting the joining material in the vicinity of the joining surface K and infiltrating the fused joining material into the joining surface K has been described. The present invention is not limited to this. As shown in FIG. 2, the joining surface K is previously coated with a joining material 14 by a plating method, and after these are assembled, they are joined by heating. May be.
[0036]
By coating the bonding surface K with the bonding material in advance in this way, the bonding can be performed only by raising the cooling pipe 13 and the conductor portion 11 to the melting point or higher, so that there is an advantage that the bonding operation is facilitated.
[0037]
As a method for heating the conductor portion 11 and the cooling pipe 13, in addition to the method using the soldering iron described above, it is also possible to heat with a burner such as propane gas. In the case of heating with a burner such as propane gas, the heating power is so strong that it can be heated to the melting point of the bonding material in a short time, and the entire members to be bonded of the conductor portion 11 and the cooling pipe 13 are simultaneously and uniformly. Since heating can be performed, it is easy to form a uniform bonding surface K.
[0038]
In addition, although solder has been described as an example of a joining material, the present invention is not limited to this, and it goes without saying that a brazing material such as silver brazing may be used. High frequency brazing by heating or the like can be used.
[0039]
Further, since soldering and brazing are generally performed in the air, oxidation of the surface of the conductor portion 11 and the joint surface K is feared. In such a case, the heating can be performed in an atmosphere of argon gas or nitrogen gas. In addition, a heating process is performed while flowing several liters of hydrogen gas in an atmosphere of about several tens of pascals. It is also possible to perform brazing or the like.
[0040]
In particular, in a gas atmosphere brazing represented by a hydrogen brazing or a vacuum brazing performed in a vacuum, an oxide film cannot be formed on the surface of the water-cooled conductor 10 and the inner surface of the cooling pipe 13, so that cleaning and finishing after brazing are required. It is unnecessary, and furthermore, the productivity is extremely high because of the batch processing performed in the electric furnace of the carbon heater or the metal heater, and the reliability of the joining is excellent.
[0041]
Also, in the method of manufacturing the structure of the water-cooled conductor 10 shown in FIGS. 1 and 2, soldering, brazing, or another method is used to apply the appropriate pressure to the joining surface K so as to bring the joining surface K into close contact with each other. A diffusion bonding method in which bonding is performed using mutual diffusion of molecules and atoms on the surface K, a liquid phase diffusion bonding method in which a liquid phase is generated and bonded through the liquid phase may be used.
[0042]
In addition, in the diffusion bonding method or the liquid phase diffusion bonding method, an insert metal such as silver or gold, or an insert metal such as titanium having a composition that actively generates a liquid phase is inserted into the bonding surface K in order to facilitate bonding. It is also useful to perform coating or coating 14.
[0043]
Next, a second embodiment of the present invention will be described with reference to the drawings. Note that the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
[0044]
In the present embodiment, a stainless pipe or a titanium pipe is used for the cooling pipe 13.
[0045]
Generally, when the conductor 11 is made of aluminum or copper and the cooling pipe 13 is made of stainless steel or titanium, it is difficult to directly join them together. Particularly, in the case of a combination of aluminum and stainless steel or aluminum and titanium, brazing or diffusion is difficult. Difficult to join.
[0046]
Therefore, in the present invention, the surface of the aluminum conductor portion 11 or the surface of the stainless steel pipe or the titanium pipe is coated with nickel or silver by plating or the like to perform the joining.
[0047]
By coating with such nickel or silver, soldering, brazing and diffusion bonding of aluminum conductors or stainless steel pipes or titanium pipes become possible, and a highly reliable water-cooled conductor 10 having excellent corrosion resistance and strength is manufactured. It becomes possible to do.
[0048]
As an example of such a case, a case will be described in which a silver-plated stainless steel cooling pipe 13 is reactively joined to a water-cooled conductor 10 using a silver-plated copper conductor portion 11.
[0049]
In the reaction bonding, silver having a thickness of several microns to several tens of microns is plated on the copper conductor portion 11 and the stainless steel cooling pipe 13. Then, it is placed in a vacuum furnace 20 as shown in FIG.
[0050]
The vacuum furnace 20 is provided with a mounting table 21 made of carbon, and the mounting table 21 is formed with a conductor groove 22 in which the conductor 11 is stored.
[0051]
When the dimensions of the conductor 11 are 5 mm in thickness and 30 mm in width, the dimensions of the conductor groove 22 are 8 to 9 mm in depth and 32 mm in width. Therefore, when a pair of conductors 11 in which the cooling pipe 13 is fitted are inserted into the conductor groove 22, the upper portion of the conductor 1 to 2 mm protrudes from the mounting table 21.
[0052]
Then, a weight 23 of 10 to 50 g / cm2 is placed on the protruding portion, and the vacuum is drawn to a degree of vacuum of 10.1 Pa or less by a vacuum pump 24, and the resultant is heated to about 800C.
[0053]
Then, as can be seen from the standard phase diagram of the binary alloy of silver and copper shown in FIG. 4, a eutectic reaction occurs between copper and silver due to a diffusion reaction, and the eutectic composition is 71.9 wt% of silver and 28.1 wt% of copper. % In the region where the interdiffusion has progressed to about%.
[0054]
The temperature at which this liquid phase is formed (eutectic temperature) is 779.4 ° C. as can be seen from the standard phase diagram of the binary alloy of silver and copper, and the melting point of copper is 1083 ° C. and the melting point of silver is 960.5. C., it is possible to join at a temperature several hundred degrees lower than these melting points.
[0055]
Therefore, since the unreacted silver is not melted, the silver does not ooze out from the joint surfaces K of the upper and lower conductors 11, and there is no need to remove the oozed silver by cutting or the like. There are advantages.
[0056]
Although not shown in the figure, even in the case of a combination of titanium and copper, there is a eutectic temperature of about 900 ° C., and reactive bonding utilizing silver and copper eutectic is possible.
[0057]
As described above, the cooling pipe 13 made of stainless steel or titanium, which is stronger and more resistant to corrosion than copper or aluminum, can be joined to the aluminum or copper conductor portion 11 that cannot be directly joined at a temperature lower than the melting point of the base material. And the amount of cooling water flowing through the cooling pipe 13 can be increased, and the cooling efficiency can be improved.
[0058]
In the above description, as a method of coating the conductor portion 11 and the cooling pipe 13 with nickel or silver, a method by plating has been described. However, the present invention is not limited to such a coating method. Coating may be performed by a method such as sputtering.
[0059]
In particular, in the method of coating by a dry method such as arc ion plating or sputtering, the inside of coated silver or the like has less defects than in a wet method such as plating, and adherence to the conductor portion 11 and the cooling pipe 13. Since the strength is high, there is a characteristic that the joining property is also high, and it is possible to manufacture a high quality water-cooled conductor 10.
[0060]
Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the same components as those in the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted as appropriate.
[0061]
In the invention according to the present embodiment, tin is applied to the joint surface K of the conductor portion 11 and the cooling pipe 13 so that the joining temperature between the copper or aluminum conductor portion 11 and the copper cooling pipe 13 can be relatively low. It relates to the case of coating and joining.
[0062]
In the binary alloy phase diagram of copper and tin, as shown in FIG. 5, the melting point of copper is 1083 ° C. and the melting point of tin is 232 ° C.
[0063]
Then, both or one surface of the copper conductor 11 or the copper cooling pipe 13 is coated with tin with a thickness of several microns to several tens of microns, and these are placed in a vacuum furnace 20 and heated.
[0064]
By heating, tin begins to melt at 232 ° C., but at low temperatures, diffusion into copper and the reaction rate are slow, but interdiffusion of copper and tin becomes active as the heating temperature increases.
[0065]
When the composition ratio (concentration) of copper and tin is 50%, a liquid phase is generated at a joining surface K between the conductor portion 11 and the cooling pipe 13 at about 700 ° C., and the liquid phase is formed through the liquid phase. The conductor 11 and the cooling pipe 13 can be joined.
[0066]
Bonding through such a liquid phase has better adhesion at the bonding portion than the soldering, brazing, and solid-phase (diffusion) bonding described above, and gaps and voids can be easily formed by an extremely small pressing force. There is an advantage that can be eliminated.
[0067]
In addition, since the bonding operation is performed through the liquid phase, the diffusion rate between the metal atoms of copper and tin is larger than that in the case of solid-phase bonding, so that bonding can be performed in a short time. During the operation, it is possible to suppress the crystal grains of copper in the conductor portion 11 and the cooling pipe 13 from being coarsened and sometimes from being broken at the grain boundaries, thereby improving the reliability.
[0068]
In addition, when at least one of the conductor portion 11 and the cooling pipe 13 is formed of aluminum, the temperature at which these are coated with tin and joined is such that the melting temperature of aluminum is about 550 to 600 ° C. It is preferable to set the temperature to 500 ° C. or lower.
[0069]
Next, a fourth embodiment of the present invention will be described with reference to the drawings. In addition, about the same structure as 1st-3rd embodiment, the same code | symbol is used and description is abbreviate | omitted suitably.
[0070]
In each of the embodiments described so far, the connection between the conductor portion 11 and the cooling pipe 13 is performed by solid-phase diffusion such as soldering or brazing, and silver, tin, nickel, or the like is coated and liquid-phase diffused. The configuration to be performed has been described.
[0071]
On the other hand, in the present embodiment, as shown in FIG. 6, a cooling pipe 13 is sandwiched between U grooves 12 formed in a conductor portion 11 such as copper or a copper alloy, and in this state, a molding machine such as a rolling machine is used. By rolling and molding with rolls 31 arranged vertically or horizontally and vertically, these are pressed and integrated.
[0072]
In this case, it is preferable to remove impurities such as an oxide film, dust, and the like by brushing or chemical treatment at least on the surface to be bonded by pressing.
[0073]
In addition, when the temperature at the time of pressure bonding is higher than room temperature, such as warmer than room temperature or hotter than warm, better bonding can be obtained.
[0074]
At such a high temperature, the bonding surface K and the like may be oxidized during the pressure bonding operation. Therefore, this operation is performed in a non-oxidizing gas atmosphere, or the bonding surface K and the like are oxidized in advance. In addition, it is preferable to perform anti-oxidation sealing in a non-oxidizing atmosphere or the like at an inconvenient location.
[0075]
In the case where such an oxidation-resistant seal is performed, heat and pressure bonding (to a temperature that the oxidation-resistant seal can withstand) can be performed in an air atmosphere, so that there is also an advantage that the working efficiency is improved.
[0076]
Further, as shown in FIG. 7, a portion where such an oxidizing agent infiltrates (a portion of the joining surface K that can be seen from the outside) is seal-welded so that an oxidizing agent such as air does not enter the bonding surface K which is particularly difficult to oxidize. 32 or the like.
[0077]
Of course, if there is air that has already entered the joint surface K when performing the seal welding 32, an oxide film may be formed on the joint surface K, or the air may lose air escape, so that airtight crimping may not be performed. Therefore, when performing the seal welding 32, it is preferable to perform vacuum welding to remove air and the like.
[0078]
In this way, after the seal welding 32 is performed so as to close the joining surface K visible from the outside, the heating and pressurizing treatment is performed in a high-temperature and high-pressure atmosphere by a hot isostatic pressing (abbreviated as HIP: HotISOstatic Pressing) device or the like. Do.
[0079]
When the conductor 11 is made of copper and the cooling pipe 13 is made of stainless steel, by holding the material at about 800 ° C. and about 98 Mpa for about 2 hours, for example, the respective metals are mutually diffused and can be strongly bonded. Become like
[0080]
Arrows (arrows such as ↓ →) in FIG. 7B indicate high-temperature and high-pressure gas pressures. Since the pressures are basically hydrostatic pressures, the same pressure acts from the inside of the cooling pipe 13. There is an advantage that the product can be mass-produced, and the deformation of the cooling pipe 13 that occurs in the case of the pressure bonding method by rolling as shown in FIG. 6 does not occur.
[0081]
By the way, the largest HIP device in Japan is φ1.2m, height 3m, and when such a HIP device joins 3m long water-cooled conductor 10, it can process several thousand pieces per batch. In addition to exhibiting high productivity, the production cost can be greatly reduced because it can be produced in large quantities.
[0082]
【The invention's effect】
As described above, according to the present invention, a cooling pipe that forms a flow path when cooling water flows, and a cross section in which a rectangular conductive conductor is used as a material and the cooling pipe is inserted and fitted on one surface thereof It consists of a pair of conductors in which a substantially semicircular U-groove is formed, sandwiches a cooling pipe in the U-groove of the pair of conductors while inserting and fitting, and soldering, brazing, Even if it is a long water-cooled conductor that has a large cross-sectional shape with a large aspect ratio, the water-cooled conductor has a configuration with a pipe protruding at the end even if it is joined and integrated by joining means such as eutectic bonding and diffusion bonding. Even so, it is possible to manufacture easily at low cost and to increase the reliability.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a water-cooled conductor applied to the description of a first embodiment.
FIG. 2 is a configuration diagram when a water-cooled conductor is formed by coating with tin or the like.
FIG. 3 is a diagram showing a state in which joining is performed in a vacuum furnace applied to the description of a second embodiment.
FIG. 4 is a standard phase diagram of a silver-copper binary alloy.
FIG. 5 is a binary alloy phase diagram of copper and tin applied to the description of the third embodiment.
FIG. 6 is a diagram illustrating a method of manufacturing a water-cooled conductor using a rolling machine or the like, which is applied to the description of the fourth embodiment.
FIG. 7 is a diagram showing a method for producing a water-cooled conductor by hot isostatic pressing.
FIG. 8 is a diagram showing a structure of a general water-cooled conductor applied to the description of the conventional technique.
FIG. 9 is a diagram showing a structure of a water-cooled conductor with a pipe protruding from an end.
FIG. 10 is a diagram illustrating a method of manufacturing a water-cooled conductor with a pipe protruding at an end.
FIG. 11 is a view showing a state in which a water-cooled conductor is manufactured by embedding a cooling pipe with a torch brazing.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Water-cooled conductor 11 Conductor part 12 U groove 13 Cooling pipe

Claims (4)

Copper, copper alloy, aluminum, including a flow path through which cooling water flows inside a conductive conductor such as an aluminum alloy, comprising a water cooling conductor having a flow path through which cooling water flows,
A cooling pipe that forms a flow path when the cooling water flows,
The rectangular conductive material is made of a material, and a pair of conductor portions each having a U-shaped groove having a substantially semicircular cross section to be inserted into the cooling pipe on one surface thereof,
The cooling pipe is inserted into the U-grooves of the pair of conductors while being inserted therein, and the contact surfaces of the members are joined and joined by joining means such as soldering, brazing, eutectic joining, diffusion joining, or the like. A water-cooled conductor comprising: The water-cooled conductor according to claim 1, wherein the cooling pipe includes stainless steel or titanium as a material. The water-cooled conductor according to claim 1, wherein at least one of the joining surfaces of the conductor portion and the cooling pipe is coated with a thin film of silver or tin and subjected to a joining process. Copper, copper alloy, aluminum, including a flow path through which cooling water flows inside a conductive conductor such as an aluminum alloy, comprising a water cooling conductor having a flow path through which cooling water flows,
A cooling pipe that forms a flow path when the cooling water flows,
The rectangular conductive material is made of a material, and a pair of conductor portions each having a U-shaped groove having a substantially semicircular cross section to be inserted into the cooling pipe on one surface thereof,
The cooling pipe is inserted into the U-grooves of the pair of conductors while being inserted into the U-groove, and then assembled, followed by drawing, extrusion, cold rolling, hot rolling, pressing, hot isostatic pressing. A method for producing a water-cooled conductor, wherein the water-cooled conductor is integrated and joined by a processing method such as the above.

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