JP3602582B2 - Manufacturing method of electrode for resistance welding - Google Patents
Manufacturing method of electrode for resistance welding Download PDFInfo
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- JP3602582B2 JP3602582B2 JP27527294A JP27527294A JP3602582B2 JP 3602582 B2 JP3602582 B2 JP 3602582B2 JP 27527294 A JP27527294 A JP 27527294A JP 27527294 A JP27527294 A JP 27527294A JP 3602582 B2 JP3602582 B2 JP 3602582B2
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- Prior art keywords
- electrode
- current
- carrying member
- carrying
- electrode tip
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Description
【0001】
【産業上の利用分野】
本発明は、金属線や金属線束の熱カシメあるいは溶接に好適に用いられる抵抗溶接用電極に関する。
【0002】
【従来の技術】
従来、この種の抵抗溶接用電極として、電気伝導度と熱伝導度が高く、しかも、機械的強度に優れている耐熱合金を電極材とし、これにアルミナ分散Cu、Cu−Re、Cr−Cu合金等からなる通電部材をロー付けしたもの、さらには、電極チップと通電部材とを同一材料にして一体化させたものも知られている。
【0003】
さらに、この抵抗溶接用電極として、電極チップと通電部材との接合を強化するために、電極チップを通電部材中に完全に埋設したものが特開平4−4984号公報に開示されている。
【0004】
ところが、金属線束を型中で加圧し通電しながら熱カシメしたり、溶接するための電極が具備すべき条件として、電極チップが通電部材から脱落しないこと、電極チップが溶接相手側と溶着しないことと共に、電極チップが熱変形しないという条件がある。この条件から見て、完全に電極チップが通電部材中に埋設された型の電極は、通電部材が通常軟らかな金属のために全体が熱変形しやすい或いは通電部材と溶接相手が溶着するという不都合が生じ易い。
【0005】
この電極チップを完全に通電部材に埋め込まないで、電極チップと通電部材との接合を強化するための手段として、接点部材ではあるが、タングステンスケルトンを使用し、これに通電材としてのCuを溶浸せしめて直接接合した構造のものが特開平1−120718号公報に開示されており、この溶浸法による接合を熱カシメのための抵抗溶接用電極における電極チップと通電部材との接合に適用することも考えられるが、電極チップ材料として強度上の不安があり、抵抗溶接用電極としてはより耐熱性に優れ接合面を強化したものが要求される。
【0006】
【発明が解決しようとする課題】
本発明の目的は、金属線束の熱カシメに適用に際して外力が加えられても、電極チップが通電部材から脱落しない程の接合力を有し、しかも電極チップが熱変形せず、さらには、金属線束と電極チップとが溶着することのない抵抗溶接用電極の製造法を提供することにある。
【0007】
【課題を解決するための手段】
本発明は、耐熱性の鋳込治具容器内に、電極チップを通電部材内への埋没深さに相当する部分をその底面からの空間内に入れ込んだ状態で設置し、この空間域に通電部を形成する量の通電部材を装入し、その通電部材を非酸化性雰囲気中で加熱溶融して電極チップの埋没面と溶融通電部とを直接接合することを特徴とする抵抗溶接用電極の製造法である。
【0008】
この電極チップの溶融埋没の程度は、電極の長さにして、1/5以上の長さの基部部分が埋没していることが、接合面の接合強度及び通電面積を大きくすることが熱変形対策の点から好ましい。
【0009】
電極チップとしては、W又はMo又はそれらの複合物のような高融点金属が使用でき、通電部材としては、Cu単体金属あるいはCu−Crのような通電性と電極材として充分な強度を有する金属材が使用できる。
【0010】
本発明に基づいて、通電部材とぬれ性のよくない、黒鉛、あるいはセラミックス製のような耐熱性の鋳込治具容器内に、電極チップを通電部材内への埋没深さに相当する部分をその底面からの空間内に入り込んだ状態で設置し、この空間域に通電部を形成する量の通電部材を装入し、その通電部材を非酸化性雰囲気中で加熱溶融することによって、電極チップの埋没面と溶融通電部とが強固に密着して接合した抵抗溶接用電極が得られる。
【0011】
また、少なくとも電極チップの埋設部分の一部にNiあるいはNi−Pの鉄族金属を塗布又はメッキ等の手段を用いて介在させることによって、通電部材の溶融時に拡散反応を生じさせて通電部材と電極チップとの間に一層強固な接合面を形成できる。
【0012】
【作用】
本発明は、通電部材を電極チップの基部に鋳ぐるみに際して、電極チップの加熱状態から冷却に際しての熱収縮量よりも通電部材の溶融状態から固化状態、さらに固化後の熱収縮量が大きいために、電極チップへの通電部の食い込み力が大きく、また、固溶は生じなくても電極部材と通電部材とが非常に接近して原子間に引力が働き、強固な接合力を得ることができる。Ni等が存在すれば、当然固溶現象により強固な接合力が得られるが、電気抵抗の増加という好ましくない現象を生じるので、Ni等は少ない方が望ましい。
【0013】
【実施例】
本発明をCu線束の熱カシメ用電極に適用した例について説明する。
【0014】
実施例1
図1は本発明に係る熱カシメ用電極10の外観を示し、図2はその断面構造を示す。図中、通電部1が電極チップ2の埋没部22の全埋没面を取り囲み、その作働部21が通電部1から開放された構造となっている。通電部1は20mm径で高さが20mmの円柱状のCuからなり、電極チップ2は厚みが3mm、巾が12mm、長さが22mmのW製であって、電極チップ2の全長さの2/5が通電部1に埋没している。
【0015】
図3はその製造方法を示す。同図において、3は黒鉛あるいはセラミックスからなる鋳込治具容器を示す。そして、この鋳込治具容器3は、図1と図2に示す通電部材1の形状、大きさに相当する空間を形成した一体容器を示しているが、割型構造とすることもできる。その鋳込治具容器3の底部の中央には凹部4が形成され、その凹部4にW製電極チップ2を装入し、次に鋳込治具容器3の空間にCu粉あるいはCu片5を充填し、鋳込治具容器3全体を窒素ガス雰囲気中で、1300℃に加熱し、充填Cuを溶融しW製電極チップ2と一体化した通電部1を形成する。これを鋳込治具容器3から取り外せば図1と図2に示す電極10が得られる。
【0016】
図4は、こうして得た抵抗溶接用電極10をCu線束の熱カシメに適用する状態を示す。同図に示すように、細線径の線材複数本を束にしたCu線束7とCu板6をセットして、その両側から電極10を、両側から機械的に加圧して押し付けて熱カシメを行い、Cu線束の端部とCu板が一体化したものを得た。
【0017】
比較のため、電極チップを通電部材にロー付けした電極と、電極チップの全体を通電部に埋設した構造の電極を用いて、同様の条件で線束を熱カシメを行った結果、ロウ付型はロウ付部分の剥離が生じるものもあり、その寿命は平均、本発明と比べて2割減程度であった。また、全埋設型は電極チップの側面がCu材であるため、発熱により側面のCuが軟化し、Cu線束を加圧することができなかった。
【0018】
実施例2
図5および図6は、上記実施例1の図1と図2において、通電部1内の埋没面の1面が開放された電極20の外観とその電極チップ2の埋没状態を示すもので、その埋没部21は、一面のみが開放され、他の3面は通電材1内に埋没している。この実施例の場合は、実施例1の場合と比較して、実施例1の方が構造上結合強度の点で優れたものである。同図に示す電極20は、W製電極チップ2の全長さの基部1/2を、その3面がCu製の通電部1に埋没した構造を有し、その製造に際しては、電極チップ2の埋没面にあらかじめNi−Pメッキを施しておく。これによって、通電部材の溶融時に拡散反応を生じ、その接合面9の強度を向上することができた。この電極20を用いて、実施例1の場合と同様のCu線束の熱カシメを行ったところ実施例1の場合と同様の結果を得た。
【0019】
ただし、通電率は実施例1よりも温度が高くなった。これはNi−PとCuとWとの合金が結合界面に形成され、界面の電気抵抗が高くなったためである。
【0020】
もちろん、この実施例2において、Ni−Pメッキをしなくても十分な性能を有する電極が得られる。
【0021】
【発明の効果】
本発明によって以下の効果を奏する。
【0022】
(1)電極チップと通電材との接合状態と通電能に優れた電極を得ることができる。
【0023】
(2)とくに、金属線束の熱カシメに優れており、そのカシメ部を一体の金属として取扱いができ程の熱カシメに適用できる。
【0024】
(3)ロウ付型と比較して、接合面の電気抵抗は小さく、しかもそのバラツキもなく、安定した溶接ができる。
【図面の簡単な説明】
【図1】本発明の第1の実施例に係る電極の外観を示す。
【図2】図1に示す電極の断面構造を示す。
【図3】本発明の電極の製造方法を示す。
【図4】本発明の電極の適用例を示す。
【図5】本発明の第2の実施例に係る電極の外観を示す。
【図6】図5に示す電極の断面構造を示す。
【符号の説明】
10,20 本発明の電極 1 通電部 2 電極チップ
3 鋳込治具容器 4 鋳込治具容器の凹部 5 溶融Cu材
6 ガイド 7 線束[0001]
[Industrial applications]
The present invention relates to a resistance welding electrode suitably used for thermal caulking or welding of a metal wire or a metal wire bundle.
[0002]
[Prior art]
Conventionally, as an electrode for this type of resistance welding, a heat-resistant alloy having high electric conductivity and heat conductivity and excellent mechanical strength has been used as an electrode material, and alumina-dispersed Cu, Cu-Re, Cr-Cu There are also known those in which a current-carrying member made of an alloy or the like is brazed, and those in which the electrode tip and the current-carrying member are made of the same material and integrated.
[0003]
Further, Japanese Patent Application Laid-Open No. 4-4984 discloses a resistance welding electrode in which an electrode tip is completely embedded in a current-carrying member in order to strengthen the joint between the electrode tip and the current-carrying member.
[0004]
However, the conditions for the electrode to be welded or to be caulked while the metal wire bundle is pressurized in the mold and energized, and that the electrode for welding should have conditions such that the electrode tip does not fall off the current-carrying member and the electrode tip does not weld to the welding partner side In addition, there is a condition that the electrode tip does not thermally deform. In view of this condition, an electrode of a type in which the electrode tip is completely embedded in the current-carrying member is disadvantageous in that the current-carrying member is usually soft metal and thus is easily thermally deformed as a whole, or the current-carrying member and the welding partner are welded to each other. Tends to occur.
[0005]
As a means for strengthening the joint between the electrode tip and the current-carrying member without completely embedding the electrode tip in the current-carrying member, a tungsten skeleton, which is a contact member, is used as a contact member, and Cu as a current-carrying material is dissolved therein. Japanese Patent Application Laid-Open No. 1-120718 discloses a structure in which the electrodes are immersed and directly joined, and the joining by the infiltration method is applied to the joining between an electrode tip and a current-carrying member in a resistance welding electrode for thermal caulking. However, there is concern about strength as an electrode tip material, and a resistance welding electrode having higher heat resistance and a strengthened joint surface is required.
[0006]
[Problems to be solved by the invention]
An object of the present invention is to have a bonding force such that the electrode tip does not fall off from the current-carrying member even when an external force is applied when applying heat caulking of the metal wire bundle, and furthermore, the electrode tip does not thermally deform, and An object of the present invention is to provide a method of manufacturing an electrode for resistance welding in which a wire bundle and an electrode tip are not welded.
[0007]
[Means for Solving the Problems]
The present invention provides a heat-resistant casting jig container, in which a portion corresponding to the burial depth of an electrode tip in a current-carrying member is inserted into a space from the bottom surface thereof, and is installed in this space area. For resistance welding, a current-carrying member is inserted in an amount to form a current-carrying portion, and the current-carrying member is heated and melted in a non-oxidizing atmosphere to directly join the buried surface of the electrode tip and the fused current-carrying portion. This is a method for manufacturing an electrode.
[0008]
The degree of melting and burial of the electrode tip is the length of the electrode, and the base part with a length of 1/5 or more is buried, which increases the bonding strength and energizing area of the bonding surface. It is preferable from the point of measures.
[0009]
As the electrode tip, a high melting point metal such as W or Mo or a composite thereof can be used. As the current-carrying member, a metal having sufficient electric conductivity and sufficient strength as an electrode material, such as Cu simple metal or Cu-Cr. Materials can be used.
[0010]
According to the present invention, a portion corresponding to the burial depth of the electrode tip in the current-carrying member is placed in a heat-resistant casting jig container such as a graphite or ceramic material having poor wettability with the current-carrying member. The electrode chip is installed in such a way that it enters the space from the bottom surface, and an amount of current-carrying members is formed in this space to form a current-carrying part, and the current-carrying members are heated and melted in a non-oxidizing atmosphere. The electrode for resistance welding is obtained in which the buried surface and the current-carrying portion are firmly adhered and joined .
[0011]
In addition, Ni or Ni-P iron group metal is interposed at least in part of the buried portion of the electrode chip by means of coating or plating, thereby causing a diffusion reaction when the current-carrying member is melted and causing the current-carrying member to be in contact with the current-carrying member. A stronger bonding surface can be formed with the electrode tip.
[0012]
[Action]
In the present invention, when the current-carrying member is inserted into the base of the electrode tip, since the current-carrying member is solidified from the molten state to the heat-shrinkage amount during the cooling from the heating state of the electrode tip, the heat shrinkage after the solidification is large. In addition, even if no solid solution occurs, the electrode member and the current-carrying member are very close to each other, and an attractive force acts between atoms, so that a strong bonding force can be obtained even if solid solution does not occur. . If Ni or the like is present, a strong bonding force can be naturally obtained by the solid solution phenomenon, but an undesired phenomenon such as an increase in electric resistance occurs. Therefore, it is desirable that Ni or the like is small.
[0013]
【Example】
An example in which the present invention is applied to an electrode for heat caulking of a Cu wire bundle will be described.
[0014]
Example 1
FIG. 1 shows the appearance of an
[0015]
FIG. 3 shows the manufacturing method. In the drawing,
[0016]
FIG. 4 shows a state in which the
[0017]
For comparison, a wire bundle was thermally caulked under the same conditions using an electrode in which the electrode tip was brazed to the current-carrying member and an electrode having a structure in which the entire electrode tip was embedded in the current-carrying part. In some cases, the brazed portion was peeled off, and the life thereof was reduced by about 20% as compared with the present invention on average. Further, in the all-buried type, since the side surface of the electrode chip is made of Cu material, heat generated softened Cu on the side surface and could not pressurize the Cu wire bundle.
[0018]
Example 2
FIGS. 5 and 6 show the appearance of the
[0019]
However, the temperature of the duty ratio was higher than that of Example 1. This is because an alloy of Ni-P, Cu and W was formed at the bonding interface, and the electrical resistance at the interface was increased.
[0020]
Of course, in Example 2, an electrode having sufficient performance can be obtained without performing Ni-P plating.
[0021]
【The invention's effect】
The following effects are obtained by the present invention.
[0022]
(1) It is possible to obtain an electrode that is excellent in the bonding state between the electrode tip and the current-carrying material and the current-carrying ability.
[0023]
(2) In particular, it is excellent in thermal caulking of a metal wire bundle, and the caulked portion can be handled as an integral metal and can be applied to thermal caulking that can be handled as a single piece.
[0024]
(3) Compared to the brazed type, the electric resistance of the joint surface is small, and there is no variation, and stable welding can be performed.
[Brief description of the drawings]
FIG. 1 shows the appearance of an electrode according to a first embodiment of the present invention.
FIG. 2 shows a sectional structure of the electrode shown in FIG.
FIG. 3 shows a method for manufacturing an electrode of the present invention.
FIG. 4 shows an application example of the electrode of the present invention.
FIG. 5 shows an appearance of an electrode according to a second embodiment of the present invention.
FIG. 6 shows a cross-sectional structure of the electrode shown in FIG.
[Explanation of symbols]
10, 20 Electrode of the
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP27527294A JP3602582B2 (en) | 1994-11-09 | 1994-11-09 | Manufacturing method of electrode for resistance welding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP27527294A JP3602582B2 (en) | 1994-11-09 | 1994-11-09 | Manufacturing method of electrode for resistance welding |
Publications (2)
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JPH08132255A JPH08132255A (en) | 1996-05-28 |
JP3602582B2 true JP3602582B2 (en) | 2004-12-15 |
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JP27527294A Expired - Fee Related JP3602582B2 (en) | 1994-11-09 | 1994-11-09 | Manufacturing method of electrode for resistance welding |
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JP5091377B2 (en) * | 2001-07-13 | 2012-12-05 | パナソニック株式会社 | Resistance welding electrode for alkaline battery and method for producing aggregate battery |
JP6298247B2 (en) * | 2013-06-25 | 2018-03-20 | 日本タングステン株式会社 | Resistance welding electrode |
JP2015069826A (en) * | 2013-09-28 | 2015-04-13 | 日本タングステン株式会社 | Plasma generation electrode and manufacturing method therefor |
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