CN107470795A - Active solder and its welding application method for SiC ceramic low temperature brazing - Google Patents
Active solder and its welding application method for SiC ceramic low temperature brazing Download PDFInfo
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- CN107470795A CN107470795A CN201710715363.7A CN201710715363A CN107470795A CN 107470795 A CN107470795 A CN 107470795A CN 201710715363 A CN201710715363 A CN 201710715363A CN 107470795 A CN107470795 A CN 107470795A
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- Prior art keywords
- low
- temperature brazing
- brazing filler
- filler metal
- sic ceramic
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The present invention relates to the active solder for SiC ceramic low temperature brazing and its welding application method, active solder wherein for SiC ceramic low temperature brazing is sequentially overlapped and formed by one layer of part B low-temperature brazing filler metal, one layer of part A low-temperature brazing filler metal, one layer of part B low-temperature brazing filler metal, and each layer low-temperature brazing filler metal volume is equal.Active solder for SiC ceramic low temperature brazing welds application method：By uniform layer overlay nano-silver thread on the joint face of SiC ceramic during welding, then part A low-temperature brazing filler metal and part B low-temperature brazing filler metal are placed sequentially among two joint faces of SiC ceramic according to BAB order, apply 0.2 ~ 2MPa simultaneously, it is heated to 50 ~ 90 DEG C, 10min is incubated after brazing filler metal melts, cooling, complete the low temperature brazing connection of SiC ceramic.The solder fusing point of the present invention is low（≤40℃）, realize the residualinternal stress that soldered fitting in 50 ~ 90 DEG C of connections to SiC ceramic, can be effectively reduced.
Description
Technical field
The present invention relates to the low-temperature brazing filler metal suitable for SiC ceramic, and in particular to the active pricker for SiC ceramic low temperature brazing
Material and its welding application method.
Background technology
SiC ceramic is due to stable chemical performance, thermal conductivity factor is high, thermal coefficient of expansion is small, density is small, anti-wear performance is good, hard
Degree is big, high mechanical strength, it is resistant to chemical etching the features such as, be widely used in the fields such as oil, chemical industry, steel, atomic energy.System
The sintering technology of standby SiC ceramic material has also tended to be ripe, but the big component yield rate of complexity of SiC ceramic is still very low, therefore
Industrially usually using the method for welding and form big component the SiC ceramic of small size.Wherein necessarily involve SiC potteries
The welding of porcelain and SiC ceramic and SiC ceramic and metal material, and it is liquid metal that SiC ceramic, which welds two faced hang-ups,
Wetting of the solder to SiC ceramic combines problem and the residual stress problems of SiC ceramic/metal interface.
It is that can SiC ceramic be soaked by liquid metal to influence the essential problem that SiC ceramic is connected with metal material, and shape
Into metallurgical binding.From the point of view of current welding method, soldering is to realize that SiC ceramic material connects one of most potential technology,
And it is extensively studied.Generally require higher temperature conditionss and the liquid solder wetting combination good to SiC ceramic just can be achieved,
And it is required for completing in vacuum or inert protective atmosphere.There are three kinds of thinkings to solve the problem at present：First, in solder
Adding active element promotes SiC to be combined with liquid metal.For SiC ceramic, Ti, Ta, Cr etc. can be used as active element.
Second, by adding some elements in brazing filler metal alloy（Such as Si, Ni, Cu, Fe, Co, Ag etc.）It may be such that brazing filler metal alloy to SiC
Angle of wetting diminish, good wetting can be produced to SiC and combined.Third, vacuum environment, welding pressure are replaced using external energy
Power, high-temperature heating and chemical reagent etc. carry out soldering.Above-mentioned several method can be very good to realize SiC ceramic and metal material
Wetting combines, but SiC ceramic and the residual stress problems of metal interface still can not solve.
Because the physical and chemical performance of SiC ceramic and metal material, lattice structure, difference of linear expansion are all very big,
SiC ceramic/metal dissimilar welding joint stress state can be directly affected after the completion of welding, and remnants are formed about in joint interface
Stress.Welding temperature more high residual stress is bigger, such as welds at low temperature, residual stress also can accordingly reduce.Now ripe
Low temperature business solder is based on Sn base solders, such as the nearly eutectic solder of Sn-Bi eutectic solders, Sn-Bi and Sn-In series solders melt
Below 180 DEG C of point, but these Sn bases solders are again relatively poor with SiC ceramic wetability, are hardly formed metallurgical binding.
The content of the invention
It is this low for SiC ceramic it is an object of the present invention to provide the active solder for SiC ceramic low temperature brazing
The active solder of warm soldering is used for solving the residual stress problems caused by high temperature during SiC ceramic connection；The present invention's is another
Individual purpose is to provide this active solder for SiC ceramic low temperature brazing and welds application method.
The technical solution adopted for the present invention to solve the technical problems is：This activity for SiC ceramic low temperature brazing
Solder is sequentially overlapped and formed by one layer of part B low-temperature brazing filler metal, one layer of part A low-temperature brazing filler metal, one layer of part B low-temperature brazing filler metal, each layer
Low-temperature brazing filler metal volume is equal；
Part A low-temperature brazing filler metal preparation method is completed according to the following steps：
First, 3% ~ 8% pure titanium valve of 30 ~ 80 μm of 15% ~ 30% fine silver powder of 10 ~ 30 μm of granularity and granularity is mixed by mass percentage
Close, obtain mixed metal powder.
2nd, the mixed metal powder that Ceramic Balls abrading-ball and step 1 obtain is fitted into ball grinder, argon gas is poured after vacuumizing,
Then ball milling is carried out, Ball-milling Time is 6 ~ 24h, and rotating speed is 250 ~ 350r/min, and ratio of grinding media to material is 6 ~ 15:1；
3rd, 56% ~ 83% liquid simple metal gallium is heated to 120 ~ 200 DEG C by mass percentage, the gold for then obtaining step 2
Category powder is slowly uniformly sprinkled into, and stirring makes metal powder fully and liquid mixing, after being incubated 10 ~ 20min, is cooled to room temperature, liquid
State alloy graining is solid alloy；
4th, brazing filler metal alloy block is cut into width as 10 ~ 30mm, thickness by the solid alloy for obtaining step 3 by wire cutting method
For 2 ~ 3mm alloy strip, part A low-temperature brazing filler metal is obtained；
Part B low-temperature brazing filler metal preparation method is completed according to the following steps：
（One）, by mass percentage by 10% ~ 30% copper powder of 20 ~ 50 μm of granularity and 0.1% ~ 10% nickel powder of 20 ~ 80 μm of granularity with
And 1% ~ 5% nano-silver thread uniformly mixes, and obtains metal dust；
（Two）, by Ceramic Balls abrading-ball and step（One）Obtained metal dust is fitted into ball grinder, pours argon gas after vacuumizing, connects
Carry out ball milling, Ball-milling Time is 0.5 ~ 2h, and rotating speed is 50 ~ 300r/min, and ratio of grinding media to material is 5 ~ 10:1；
（Three）, by mass percentage 45% ~ 78% liquid simple metal indium is heated to 160 ~ 200 DEG C, then by step（Two）Obtain
Metal powder be slowly uniformly sprinkled into, and stir make metal powder fully and liquid mixing, insulation 5 ~ 15min after, be cooled to room temperature,
Liquid alloy is solidified as solid alloy；
（Four）, by step（Three）Obtained solid alloy by wire cutting method by brazing filler metal alloy block be cut into width for 10 ~ 30mm,
Thickness is 2 ~ 3mm alloy strip, produces part B low-temperature brazing filler metal.
The above-mentioned active solder for SiC ceramic low temperature brazing welds application method：
By uniform layer overlay nano-silver thread on the joint face of SiC ceramic during welding, then part A low-temperature brazing filler metal and part B
Low-temperature brazing filler metal is placed sequentially among two joint faces of SiC ceramic according to BAB order, while applies 0.2 ~ 2MPa, is heated to
50 ~ 90 DEG C, 10min is incubated after brazing filler metal melts, then furnace cooling, completes the low temperature brazing connection of SiC ceramic.
The invention has the advantages that：
First, solder fusing point of the invention is low（≤40℃）, realize in low-down temperature（50~90℃）Under to SiC ceramic
Connection, therefore the residualinternal stress of soldered fitting can be effectively reduced；The low-temperature brazing filler metal of the present invention and SiC ceramic wetability
It is good.Welding SiC ceramic is carried out using the low-temperature brazing filler metal of the present invention, welding temperature can significantly reduce, SiC ceramic and metal material it
Between residual stress can significantly reduce.
2nd, solder of the invention overcomes SiC ceramic welding point and carries out high-temperature soldering using high-temp solder and bring
Stress problem, form a kind of simple and easy connected mode.
3rd, generation fragility gold in SiC ceramic welding point interface when the preparation method of solder of the present invention solves high temperature brazing
Interface embrittlement issue caused by compound between category.
4th, process equipment needed for the preparation method of solder of the present invention is simple to operation, easily realizes low-temperature brazing filler metal high-volume
Preparation.
5th, part A solder of the present invention can generate solid-state gallium-indium alloy after fully being contacted with part B solder, and its intensity is high, matter
Measure, meet requirement, a kind of solder, which is used alone, can not then realize this function.
6th, SiC ceramic can be effectively improved containing nano-silver thread in part B solder of the present invention to be combined with the wetting of low-temperature brazing filler metal
Ability.
Brief description of the drawings
Fig. 1 is the assembling schematic diagram that soldering SiC ceramic is carried out using low-temperature brazing filler metal of the present invention.
In figure：1st, part A low-temperature brazing filler metal 2, part B low-temperature brazing filler metal 3, SiC ceramic 4, nano-silver thread.
Embodiment
The present invention is further illustrated below in conjunction with the accompanying drawings：
This active solder for SiC ceramic low temperature brazing by one layer of part B low-temperature brazing filler metal, 2, one layers of part A low-temperature brazing filler metal 1,
One layer of part B low-temperature brazing filler metal 2 is sequentially overlapped composition, and each layer low-temperature brazing filler metal volume is equal；
Part A low-temperature brazing filler metal preparation method is completed according to the following steps：
First, 3% ~ 8% pure titanium valve of 30 ~ 80 μm of 15% ~ 30% fine silver powder of 10 ~ 30 μm of granularity and granularity is mixed by mass percentage
Close, obtain mixed metal powder.
2nd, the mixed metal powder that Ceramic Balls abrading-ball and step 1 obtain is fitted into ball grinder, argon gas is poured after vacuumizing,
Then ball milling is carried out, Ball-milling Time is 6 ~ 24h, and rotating speed is 250 ~ 350r/min, and ratio of grinding media to material is 6 ~ 15:1；
3rd, 56% ~ 83% liquid simple metal gallium is heated to 120 ~ 200 DEG C by mass percentage, the gold for then obtaining step 2
Category powder is slowly uniformly sprinkled into, and stirring makes metal powder fully and liquid mixing, after being incubated 10 ~ 20min, is cooled to room temperature, liquid
State alloy graining is solid alloy；
4th, brazing filler metal alloy block is cut into width as 10 ~ 30mm, thickness by the solid alloy for obtaining step 3 by wire cutting method
For 2 ~ 3mm alloy strip, part A low-temperature brazing filler metal is produced；
Part B low-temperature brazing filler metal preparation method is completed according to the following steps：
（One）, by mass percentage by 10% ~ 30% copper powder of 20 ~ 50 μm of granularity and 0.1% ~ 10% nickel powder of 20 ~ 80 μm of granularity with
And 1% ~ 5% nano-silver thread uniformly mixes, and obtains metal dust；
（Two）, by Ceramic Balls abrading-ball and step（One）Obtained metal dust is fitted into ball grinder, pours argon gas after vacuumizing, connects
Carry out ball milling, Ball-milling Time is 0.5 ~ 2h, and rotating speed is 50 ~ 300r/min, and ratio of grinding media to material is 5 ~ 10:1；
（Three）, by mass percentage 45% ~ 78% liquid simple metal indium is heated to 160 ~ 200 DEG C, then by step（Two）Obtain
Metal powder be slowly uniformly sprinkled into, and stir make metal powder fully and liquid mixing, insulation 5 ~ 15min after, be cooled to room temperature,
Liquid alloy is solidified as solid alloy；
（Four）, by step（Three）Obtained solid alloy by wire cutting method by brazing filler metal alloy block be cut into width for 10 ~ 30mm,
Thickness is 2 ~ 3mm alloy strip, produces part B low-temperature brazing filler metal.
The above-mentioned active solder for SiC ceramic low temperature brazing welds application method：
By uniform layer overlay nano-silver thread 4 on the joint face of SiC ceramic 3 during welding, then part A low-temperature brazing filler metal 1 and B portions
It is divided to low-temperature brazing filler metal 2 to be placed sequentially according to BAB order among 3 two joint faces of SiC ceramic, while applies 0.2 ~ 2MPa, adds
Heat is incubated 10min, then furnace cooling to 50 ~ 90 DEG C after brazing filler metal melts, completes the low temperature brazing connection of SiC ceramic 3.
Claims (3)
- A kind of 1. active solder for SiC ceramic low temperature brazing, it is characterised in that：It is this for SiC ceramic low temperature brazing Active solder is by one layer of part B low-temperature brazing filler metal（2）, one layer of part A low-temperature brazing filler metal（1）, one layer of part B low-temperature brazing filler metal（2）Successively Superposition is formed, and each layer low-temperature brazing filler metal volume is equal；Part A low-temperature brazing filler metal preparation method is completed according to the following steps：First, 3% ~ 8% pure titanium valve of 30 ~ 80 μm of 15% ~ 30% fine silver powder of 10 ~ 30 μm of granularity and granularity is mixed by mass percentage Close, obtain mixed metal powder.
- 2. the 2nd, the mixed metal powder that Ceramic Balls abrading-ball and step 1 obtain is fitted into ball grinder, argon gas is poured after vacuumizing, is connect Carry out ball milling, Ball-milling Time is 6 ~ 24h, and rotating speed is 250 ~ 350r/min, and ratio of grinding media to material is 6 ~ 15:1；3rd, 56% ~ 83% liquid simple metal gallium is heated to 120 ~ 200 DEG C by mass percentage, the gold for then obtaining step 2 Category powder is slowly uniformly sprinkled into, and stirring makes metal powder fully and liquid mixing, after being incubated 10 ~ 20min, is cooled to room temperature, liquid State alloy graining is solid alloy；4th, brazing filler metal alloy block is cut into width as 10 ~ 30mm, thickness by the solid alloy for obtaining step 3 by wire cutting method For 2 ~ 3mm alloy strip, part A low-temperature brazing filler metal is obtained；Part B low-temperature brazing filler metal preparation method is completed according to the following steps：（One）, by mass percentage by 10% ~ 30% copper powder of 20 ~ 50 μm of granularity and 0.1% ~ 10% nickel powder of 20 ~ 80 μm of granularity with And 1% ~ 5% nano-silver thread uniformly mixes, and obtains metal dust；（Two）, by Ceramic Balls abrading-ball and step（One）Obtained metal dust is fitted into ball grinder, pours argon gas after vacuumizing, connects Carry out ball milling, Ball-milling Time is 0.5 ~ 2h, and rotating speed is 50 ~ 300r/min, and ratio of grinding media to material is 5 ~ 10:1；（Three）, by mass percentage 45% ~ 78% liquid simple metal indium is heated to 160 ~ 200 DEG C, then by step（Two）Obtain Metal powder be slowly uniformly sprinkled into, and stir make metal powder fully and liquid mixing, insulation 5 ~ 15min after, be cooled to room temperature, Liquid alloy is solidified as solid alloy；（Four）, by step（Three）Obtained solid alloy by wire cutting method by brazing filler metal alloy block be cut into width for 10 ~ 30mm, Thickness is 2 ~ 3mm alloy strip, produces part B low-temperature brazing filler metal.
- 3. the active solder for SiC ceramic low temperature brazing described in a kind of claim 1 welds application method, its feature exists In：By SiC ceramic during welding（3）Joint face on uniform layer overlay nano-silver thread（4）, then part A low-temperature brazing filler metal（1） With part B low-temperature brazing filler metal（2）SiC ceramic is placed sequentially according to BAB order（3）Among two joint faces, while apply 0.2 ~ 2MPa, 50 ~ 90 DEG C are heated to, 10min are incubated after brazing filler metal melts, then furnace cooling, complete SiC ceramic（3）Low temperature pricker Weldering connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710715363.7A CN107470795B (en) | 2017-08-20 | 2017-08-20 | Active solder and its welding application method for SiC ceramic low temperature brazing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710715363.7A CN107470795B (en) | 2017-08-20 | 2017-08-20 | Active solder and its welding application method for SiC ceramic low temperature brazing |
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| CN107470795A true CN107470795A (en) | 2017-12-15 |
| CN107470795B CN107470795B (en) | 2019-10-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108774476A (en) * | 2018-06-29 | 2018-11-09 | 北京梦之墨科技有限公司 | A kind of bonding agent and its application method of metal material |
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| JPH02179387A (en) * | 1988-12-29 | 1990-07-12 | Tokuriki Honten Co Ltd | Low melting point ag solder |
| CN1686662A (en) * | 2005-04-29 | 2005-10-26 | 华南理工大学 | Self soldering solder used for brazing connecting PTC ceramic and aluminium alloy |
| CN101323062A (en) * | 2008-07-16 | 2008-12-17 | 太仓市南仓金属材料有限公司 | Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof |
| CN103722304A (en) * | 2014-01-09 | 2014-04-16 | 北京航空航天大学 | Material used for aluminum alloy interface low-temperature diffusion bonding in field of interface heat transfer enhancement |
| CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
| CN105458547A (en) * | 2015-12-28 | 2016-04-06 | 西安交通大学 | Active brazing filler metal suitable for cast aluminum-based composite material reinforced through high-volume-fraction SiC and preparation method of active brazing filler metal |
-
2017
- 2017-08-20 CN CN201710715363.7A patent/CN107470795B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02179387A (en) * | 1988-12-29 | 1990-07-12 | Tokuriki Honten Co Ltd | Low melting point ag solder |
| CN1686662A (en) * | 2005-04-29 | 2005-10-26 | 华南理工大学 | Self soldering solder used for brazing connecting PTC ceramic and aluminium alloy |
| CN101323062A (en) * | 2008-07-16 | 2008-12-17 | 太仓市南仓金属材料有限公司 | Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof |
| CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
| CN103722304A (en) * | 2014-01-09 | 2014-04-16 | 北京航空航天大学 | Material used for aluminum alloy interface low-temperature diffusion bonding in field of interface heat transfer enhancement |
| CN105458547A (en) * | 2015-12-28 | 2016-04-06 | 西安交通大学 | Active brazing filler metal suitable for cast aluminum-based composite material reinforced through high-volume-fraction SiC and preparation method of active brazing filler metal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108774476A (en) * | 2018-06-29 | 2018-11-09 | 北京梦之墨科技有限公司 | A kind of bonding agent and its application method of metal material |
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