KR101208577B1

KR101208577B1 - Cooling module and cooling system comprising the same

Info

Publication number: KR101208577B1
Application number: KR1020110000485A
Authority: KR
Inventors: 장인재
Original assignee: 주식회사 제이에스티
Priority date: 2011-01-04
Filing date: 2011-01-04
Publication date: 2012-12-06
Also published as: KR20120079277A

Abstract

The present invention relates to a cooling module and a cooling system including the same, and more particularly, can be used in the cooling process of various semiconductor equipment, medical equipment and laser equipment without limitation of installation space, and can improve heat exchange efficiency and product reliability. The present invention relates to a cooling module and a cooling system including the same that can reduce environmental pollution.

Description

Cooling module and cooling system comprising the same

The present invention relates to a cooling module and a cooling system including the same that can improve heat exchange efficiency and corrosion resistance and wear resistance.

In general, semiconductor processes include a wafer surface polishing process, an oxidation process, a photoresist coating process, an exposure process, a developing process, an etching process, an ion implantation process, a thin film deposition process, and a packaging process.

Here, the photoresist coating step is a step of evenly applying the photoresist to the surface of the wafer, and then slightly baked and sent to a photo taking apparatus called an aligner, the wafer serves as a photo paper for photographs.

In addition, the exposure process is a process of placing a photo mask on a wafer, then aiming and passing strong ultraviolet rays, and ultraviolet rays serve to draw a circuit pattern on the wafer on the wafer.

In addition, the developing process is a process of spraying a developer onto a wafer, wherein the wafer is divided into a lighted portion and an unlighted portion in the exposure process, and the developer of the lighted portion is blown away and the developer of the unlighted portion is intact. Remains.

Each of the processes described above includes a process of heating the wafer, and in order to reduce a defect rate due to thermal deformation, semiconductor devices used in each process are provided with a cooling device for controlling the temperature of the wafer.

However, since the cooling apparatus is provided inside the semiconductor equipment, the semiconductor equipment is gradually becoming larger, and there is a difficulty in repairing and replacing the cooling apparatus.

In addition, the conventional cooling apparatus is low in reliability and has a problem of causing environmental pollution by using freon gas as a refrigerant.

The present invention is to solve the problem to provide a cooling module and a cooling system including the same that can improve the heat exchange efficiency and corrosion resistance and wear resistance.

In addition, the present invention can be used in the cooling process of a variety of semiconductor equipment, medical equipment and laser equipment without the constraints of the installation space, can increase the reliability of the product, can reduce the environmental pollution cooling module and a cooling system including the same The task is to solve the problem.

In addition, an object of the present invention is to provide a cooling module that is compact, easy for mass production, and easily connected to an external device requiring cooling, and a cooling system including the same.

The cooling module according to an embodiment of the present invention includes one or more thermoelectric modules and one or more thermoelectric modules contacting one surface of the first cooling plate with a first cooling plate having an inlet and an outlet and a flow path connecting the inlet and the outlet. The heat generating unit of the thermoelectric module is in contact with, and includes a second cooling plate having a flow path connecting the inlet and the outlet and the inlet and the outlet.

Here, a first refrigerant flows through the first cooling plate, a second refrigerant flows through the second cooling plate, and heat transfer is performed from the first refrigerant to the second refrigerant through the thermoelectric module.

In addition, the cooling module according to an embodiment of the present invention, the first refrigerant flows, the third cooling plate having a flow path connecting the inlet and the discharge port and the inlet and the discharge port and the heating portion is in contact with the other surface of the second cooling plate. The heat absorbing part may further include one or more thermoelectric modules in contact with one surface of the third cooling plate.

In addition, each cooling plate may be formed of aluminum, and the flow path of each cooling plate may be formed of a stainless tube.

In addition, each flow path may have a meander line or a spiral line shape.

In addition, the cooling system according to an embodiment of the present invention, the first and second cooling plates, respectively, the first and second coolant flows, and the first and second cooling plate having a flow path connecting the inlet and outlet and the two adjacent cooling A cooling module disposed between the plates, the cooling module including a thermoelectric module for heat exchange between the first cooling plate and the second cooling plate, and a first refrigerant discharged from the first cooling plate; And a temperature controller for controlling the temperature of the first refrigerant discharged from the external device, and a pump for supplying the first refrigerant passed through the temperature controller to the first cooling plate. .

The cooling module may include a third cooling plate having a first refrigerant flowed therein, a third cooling plate having a flow path connecting the inlet and the outlet, and a heat generating part to contact the other surface of the second cooling plate, and the heat absorbing part to the third cooling plate. 3 may include one or more thermoelectric modules in contact with one surface of the cooling plate.

Here, heat transfer may be performed from the first refrigerant flowing through the first and third refrigerant plates through each thermoelectric module to the second refrigerant flowing through the second refrigerant plate.

In addition, each flow path may have a meander line or a spiral line shape.

In addition, the temperature control device may include a tank for accommodating the first refrigerant, a heater provided in the tank, and a level sensor for sensing the amount of the first refrigerant accommodated in the tank.

In addition, the cooling system according to an embodiment of the present invention further comprises a first refrigerant tank for replenishing the first refrigerant with the temperature control device and a second refrigerant supply for circulating the second refrigerant to the second cooling plate. It may include.

As described above, according to the cooling module and the cooling system including the same according to an embodiment of the present invention, heat exchange efficiency, corrosion resistance, and wear resistance may be improved.

In addition, according to the cooling module and the cooling system including the same according to an embodiment of the present invention, it can be used in the cooling process of various semiconductor equipment, medical equipment and laser equipment without limitation of the installation space, and can increase the reliability of the product It can reduce environmental pollution.

In addition, according to the cooling module and the cooling system including the same according to an embodiment of the present invention, it is compact, easy to mass production, and easy to connect to external devices that require cooling.

1 is a perspective view of a cooling plate constituting a cooling module according to an embodiment of the present invention.
FIG. 2 is a sectional view of the cooling plate shown in FIG. 1. FIG.
Figure 3 is a perspective view showing the main components of the cooling module related to one embodiment of the present invention.
4 is a conceptual diagram illustrating one operating state of the cooling module illustrated in FIG. 3.
5 is a cross-sectional view for explaining an operating state of a cooling module according to an embodiment of the present invention.
6 is a block diagram of a cooling system according to an embodiment of the present invention.

Hereinafter, a cooling module and a cooling system including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

In addition, the same or corresponding components are denoted by the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted. For convenience of explanation, the size and shape of each constituent member shown may be exaggerated or reduced have.

On the other hand, terms including an ordinal number such as a first or a second may be used to describe various elements, but the constituent elements are not limited by the terms, and the terms may refer to a constituent element from another constituent element It is used only for the purpose of discrimination.

1 is a perspective view of a cooling plate constituting a cooling module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the cooling plate shown in FIG. 1, and FIG. 3 is a view of a cooling module according to an embodiment of the present invention. 4 is a conceptual view illustrating one operating state of the cooling module illustrated in FIG. 3, and FIG. 5 is a view illustrating one operating state of the cooling module according to an embodiment of the present invention. It is a cross section.

1 to 5, the cooling module 1 according to an embodiment of the present invention has an inlet 11 and an outlet 12, and a flow path 10b connecting the inlet 11 and the outlet 12. One or more thermoelectric modules 20 and 20-1 and one surface of which the heat absorbing portion 21 is in contact with one surface of the first cooling plates 10 and 10-1 and the first cooling plates 10 and 10-1. The heat generating part 22 of the thermoelectric module 20, 20-1 is in contact with each other, and includes a second cooling plate 10-2 having an inlet and an outlet and a flow path connecting the inlet and the outlet.

Here, a first refrigerant R1 flows through the first cooling plate 10-1, a second refrigerant R2 flows through the second cooling plate 10-2, and the thermoelectric module ( Heat is transferred from the first refrigerant (R1) to the second refrigerant (R2) through 20, 20-1.

In addition, referring to FIG. 5, the cooling module 1 according to the embodiment of the present invention has a third cooling plate having a first refrigerant R1 flowing therein and having an inlet and an outlet and a flow path connecting the inlet and the outlet. (10-3) and the heat generating portion 22 is in contact with the other surface of the second cooling plate 10-2, and the heat absorbing portion 21 is in contact with one surface of the third cooling plate 10-3. The thermoelectric module 20-2 may be further included.

At this time, the second refrigerant plate (10-2) from the first refrigerant (R1) flowing the first and third refrigerant plates (10-2, 10-3) through each thermoelectric module (20-1, 20-2) Heat transfer is performed to the second refrigerant R2 flowing.

In this document, the structure of each cooling plate is the same, and the ordinal numbers of the first to the third are only used to distinguish the plurality of cooling plates from each other. In addition, the structure of each thermoelectric module (20, 20-1, 20-2) in this document are all the same, and different reference numerals are used only to distinguish the plurality of thermoelectric modules from each other according to the cooling plate to be mounted.

1 and 2, the cooling plate 10 according to the present invention is provided with an inlet 11 on one side, the discharge port 12 is provided on the other side, the inlet 11 and the discharge port 12 A flow path 10b for connecting is provided. In addition, spiral portions (not shown) may be respectively provided on the inner circumferential surfaces of the inlet 11 and the outlet 12 to facilitate a pipe connecting operation.

The cooling plate 10 may be manufactured in various sizes in consideration of cooling capacity, etc., may have a rectangular parallelepiped shape to facilitate lamination, and have a plurality of holes S for fastening with other adjacent cooling plates. Can be.

The flow path 10b may have various shapes in order to efficiently increase the heat exchange area, and in one embodiment, may have a meander line or a spiral line shape.

In addition, the cooling plate 10 may be formed of an aluminum main body 10a having an external shape, and a flow path 10b provided therein may be formed of a stainless tube 13.

The flow path 10b may be corroded or worn as the refrigerant flows for a long time, but in the cooling plate 10 according to the present invention, since the main body 10a is made of aluminum, the heat exchange efficiency is increased, and the flow path 10b is stainless. Since it is formed of the (SUS) tube 13, the corrosion resistance and the wear resistance are increased.

2 to 5, a plurality of thermoelectric modules 20, 20-1, and 20-2 are respectively disposed between two adjacent cooling plates 10-1 and 10-2 and 10-2 and 10-3. The thermoelectric modules 20, 20-1, and 20-2 are disposed in the two refrigerant plates 10-1, 10-2, 10-2, and 10-3. Heat exchange is carried out between R2).

Meanwhile, reference numeral C denotes a cable connected to the thermoelectric module 20.

On the other hand, a thermoelectric element is a thermistor, which is a device that uses a large temperature change of electrical resistance, an element using an Seebeck Effect, which is a phenomenon in which electromotive force is generated by a temperature difference, and heat absorption (or generation) is caused by current. Devices using the Peltier Effect, a phenomenon that occurs.

Thermoelectric module 20, 20-1, 20-2 related to the present invention includes a thermoelectric element using the Peltier effect, such a thermoelectric element is connected to the two types of metal ends and flowing current therein according to the current direction One terminal heats up and the other terminal uses heat-generating phenomenon.

At this time, if a semiconductor such as bismuth (Bi) or tellurium (Te) having different electric conductivity methods is used instead of the two kinds of metals, a Peltier device having efficient endothermic and exothermic action can be obtained.

The thermoelectric module 20 performs the functions of the heat absorbing portion 21 and the heat generating portion 22 of the two kinds of metals described above, and the heat generating portion 22 from the heat absorbing portion 21 supplied with power to the thermoelectric element. Furnace heat flows, and the endothermic portion 21 is cooled below a predetermined temperature.

Referring to FIG. 4, a first refrigerant R1 flows through the first cooling plate 10, and a plurality of thermoelectric modules 20 are disposed on one surface of the first cooling plate 10 so that the heat absorbing portion 21 is the same. When attached to correspond to the first cooling plate, the first refrigerant is cooled by the heat absorbing part 21 in the process of flowing through the first cooling plate 10.

Referring to FIG. 5, one embodiment of a cooling module according to the present invention will be described in detail. The first thermoelectric module 20-1 may be disposed between the first cooling plate 10-1 and the second cooling plate 10-2. ) May be disposed, and the second thermoelectric module 20-2 may be disposed between the second cooling plate 10-2 and the third cooling plate 10-3.

In addition, in the first thermoelectric module 20-1, the heat absorbing part 21 is in contact with the first cooling plate 10-1, and the heat generating part 22 is in contact with the second cooling plate 10-2. In the second thermoelectric module 20-2, the heat absorbing part 21 may contact the third cooling plate 10-3, and the heat generating part 22 may contact the second cooling plate 10-2.

Here, the first refrigerant (R1) flows in the first and third cooling plates, the second refrigerant (R2) may flow in the second cooling plate, the first refrigerant (R1) and the first to increase the heat exchange efficiency The second refrigerant R2 may be in a reverse direction of the flow direction, and the first refrigerant R1 and the second refrigerant R2 may be, for example, water (cooling water) having different temperatures.

When power is supplied to each of the thermoelectric modules 20-1 and 20-2, heat is transferred from the first refrigerant R1 to the second refrigerant R2, and each cooling plate 10-1, 10-2, and 10 is performed. In the process of flowing -3), the temperature of the first refrigerant R1 is lowered and the temperature of the second refrigerant R2 is increased. In other words, the first refrigerant R1 is cooled.

As described above, the cooling module according to an embodiment of the present invention may increase heat exchange efficiency, corrosion resistance, and wear resistance.

In addition, the cooling module according to an embodiment of the present invention is compact, easy to mass production, and can be easily manufactured since the cooling capacity can be increased by stacking a plurality of cooling plates through a thermoelectric element.

6 is a block diagram of a cooling system 100 according to an embodiment of the present invention.

Referring to FIG. 6, a cooling system 100 according to an embodiment of the present invention includes a cooling module 1 and an external device 110 that requires cooling, and between the external device 110 and the cooling module 1. It includes a temperature control device 120 and a pump 130 provided between the temperature control device 120 and the cooling module (1).]

The cooling system 100 also includes a controller (not shown) for controlling the overall operation.

In addition, the cooling module 1, the external device 110, the temperature control device 120, and the pump 130 may be connected through a refrigerant pipe, and various sensors (eg, for detecting a state of the refrigerant) may be in the refrigerant pipe. For example, a temperature sensor) and / or a valve for regulating the flow rate of the refrigerant may be mounted.

The cooling module 1 constituting the cooling system 100 according to the present embodiment is the same as the cooling module 1 described with reference to FIG. 5, and specifically, the first cooling plate 10-1 and the second cooling plate. The first thermoelectric module 20-1 is disposed between the second cooling plates 10-2, and the second thermoelectric module 20-2 is disposed between the second cooling plate 10-2 and the third cooling plate 10-3. This can be arranged.

In addition, the first refrigerant R1 is for cooling the external device, and the second refrigerant R2 is for cooling the first refrigerant R1.

In addition, the first coolant R1 cooled through the cooling module 1 is supplied to the external device 110 that requires cooling. Therefore, at least a portion of the external device 110 may be cooled by the flow of the first refrigerant R1.

The external device 110 may be a semiconductor device, a medical device, or a laser device in which temperature control is important because it is sensitive to temperature change. In the case of a semiconductor device, a photoresist coating process and / or developing process including a process of heating a wafer Can be.

In this case, the first refrigerant R1 may perform a function of cooling the wafer.

In addition, the temperature control device 120 adjusts the temperature of the first refrigerant R1 discharged from the external device. Since the first refrigerant R1 discharged from the external device absorbs heat from the wafer, the first refrigerant R1 has a higher temperature than the state discharged from the cooling module 1. The temperature controller 120 adjusts the temperature of the first refrigerant R1 discharged from the external device 110 and transmits the temperature to the cooling module 1.

In one embodiment, when the first refrigerant R1 is lowered by about 3 ° C. through the cooling module 1, the temperature of the first refrigerant flowing into the cooling module 1 is 23 ° C., and the second refrigerant is After the heat exchange with R2, the temperature of the first refrigerant discharged from the cooling module 1 becomes 20 ° C.

The first refrigerant R1 may be introduced into the external device 110 at a temperature of 20 ° C., absorb the heat of the wafer, and may be discharged from the external device 110 while the temperature is high.

However, when the temperature of the first refrigerant R1 discharged from the external device 110 is 22 ° C., when the first refrigerant R1 is supplied to the cooling module 1 at this temperature, the first refrigerant R1 is supplied. The temperature of is lowered to 19 ° C through heat exchange with the second refrigerant.

That is, when the temperature of the first refrigerant R1 to be supplied to the external device 110 at a constant temperature is changed every time through a cooling cycle constituting the cooling system 100, reliability may be deteriorated. Therefore, in order to compensate for the temperature difference, the first refrigerant R1 discharged from the external device 110 is not directly supplied to the cooling module 1, but is supplied to the temperature control device 120.

On the other hand, the controller may perform a PID control (proportional integral derivative control) to continuously correct the minute temperature difference accurately.

In addition, the cooling system 100 according to an embodiment of the present invention may further include a temperature sensor 150 provided between the external device 110 and the temperature control device 120.

The controller may control the temperature adjusting device 120 according to the temperature sensed by the temperature sensor 150.

The temperature control device 120 detects a water level for sensing a tank 121 for accommodating the first refrigerant, a heater 122 provided in the tank 121, and an amount of the first refrigerant R1 accommodated in the tank. It may include a sensor 123.

The pump 130 supplies the first refrigerant R1 passed through the temperature regulating device 120 to the first cooling plate.

In addition, the cooling system 100 according to an embodiment of the present invention is a second refrigerant plate 140 and the second cooling plate for refilling the first refrigerant (R1) with the temperature control device 120. A second refrigerant supply unit (not shown) for circulating the refrigerant R2 may be further included.

Preferred embodiments of the present invention described above are disclosed for purposes of illustration, and those skilled in the art having various ordinary knowledge of the present invention may make various modifications, changes, and additions within the spirit and scope of the present invention. And additions should be considered to be within the scope of the following claims.

1: cooling module 10: cooling plate
10a: main body 10b: flow path
11: inlet 12: outlet
10-1 to 10-3: first to third cooling plates
20: thermoelectric module 21: heat absorbing portion
22: heating section 100: cooling system
110: external device 120: thermostat
130: pump 140: the first refrigerant tank
150: temperature sensor R1: first refrigerant
R2: second refrigerant

Claims

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The first and second refrigerants flow, respectively, disposed between the first and second cooling plates having flow paths connecting the inlet and the outlet and the inlet and the outlet, and two adjacent cooling plates, and the first cooling plate and the second cooling plate. A cooling module including a thermoelectric module for heat exchange of the plate;
An external device into which the first refrigerant discharged from the first cooling plate flows and at least a portion of the region is cooled by the flow of the first refrigerant;
A temperature adjusting device for controlling a temperature of the first refrigerant discharged from the external device;
A pump for supplying the first refrigerant passing through the temperature control device to the first cooling plate;
A first refrigerant tank for replenishing the first refrigerant with the temperature control device; And
A second refrigerant supply unit for circulating a second refrigerant to the second cooling plate,
The flow path of the cooling plate is formed of a stainless tube,
The temperature control device includes a tank for accommodating the first refrigerant, a heater provided in the tank, and a water level sensor for sensing the amount of the first refrigerant accommodated in the tank.

The method of claim 5, wherein the cooling module,
A third cooling plate having a first refrigerant flowing therein, the third cooling plate having an inlet and an outlet and a flow path connecting the inlet and the outlet;
A heat generating unit includes at least one thermoelectric module in contact with the other surface of the second cooling plate, and the heat absorbing unit is in contact with one surface of the third cooling plate,
Cooling system characterized in that the heat transfer from the first refrigerant flowing through the first and third refrigerant plates through each thermoelectric module to the second refrigerant flowing through the second refrigerant plate.

The method according to claim 5 or 6,
Each cooling plate is formed of aluminum.

The method according to claim 5 or 6,
Wherein each flow passage has a meander line or spiral line shape.

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