JP2004126340A - Method and device for joining flexible circuit board to flat panel display panel and flat panel display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability of joint of a flexible circuit board to a flat panel display panel while material cost is suppressed. <P>SOLUTION: Non-conductive adhesive paste 5 is applied to a panel electrode part 3b formed on a glass substrate 3 of a panel part 1 of the flat display. A substrate electrode part 4a of the flexible circuit board 4 is arranged in a panel electrode part 3b. Heating and pressurization are performed from a flexible circuit board 4-side, and non-conductive adhesive paste 5 is hardened. Wiring of the panel electrode part 3b on the glass substrate 3 is set to be a silver thick film where irregularity on a surface is large. A projecting part is penetrated into wiring of a substrate electrode part 4a on the flexible circuit board 4-side by pressurization, so as to secure electric connection. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a flat panel display such as a plasma display, and more particularly to a technique for joining a flexible circuit board to a panel for a flat panel display.
[0002]
[Prior art]
Conventionally, in order to join a flexible circuit board to a panel for a flat panel display such as a plasma display, a pressure bonding method using an anisotropic conductive adhesive film has been used. The pressure bonding method using this anisotropic conductive adhesive film applies an anisotropic conductive adhesive film to the panel electrode part formed on the glass substrate of the panel for flat panel display or the substrate electrode part formed on the flexible circuit board. The panel electrode portion and the substrate electrode portion are opposed to each other, and the anisotropic conductive adhesive film is cured by applying pressure and heat to join the flexible circuit board to the panel.
[0003]
The anisotropic conductive adhesive film is obtained by mixing fine metal conductive particles as a filler into an insulating adhesive film, and exhibits conductivity in a pressed direction. Therefore, by applying pressure in a direction perpendicular to the electrodes of the panel electrode portion and the substrate electrode portion, the wiring of the panel electrode portion and the wiring of the substrate electrode portion can be electrically connected.
[0004]
[Problems to be solved by the invention]
However, if the conductive particles are not substantially uniformly present in the anisotropic conductive adhesive film, the conductive particles may aggregate between the electrodes, which must be insulated, and a short phenomenon may occur. is there. In addition, the conductive particles contained in the anisotropic conductive adhesive film are, for example, gold-plated nickel fine powder, which causes an increase in material cost.
[0005]
The present invention has been made in view of the above problems, and joins a flexible circuit board to a flat panel display panel that has high joining reliability while suppressing material costs without using an anisotropic conductive film. It aims to provide a new approach.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is a method for joining a flexible circuit board to a panel for a flat panel display, wherein a non-conductive adhesive paste is applied to a panel electrode portion formed on a main surface of a glass substrate of the panel. And a step of disposing a flexible circuit board having a substrate electrode portion with respect to the glass substrate so that the panel electrode portion and the substrate electrode portion face each other. And curing the non-conductive adhesive paste to electrically connect the panel electrode portion and the substrate electrode portion.
[0007]
The invention according to claim 2 is the method for joining a flexible circuit board to the panel according to claim 1, wherein the non-conductive adhesive paste is applied to the flexible circuit board by pressing the flexible circuit board from above. Protrude from the edge of the circuit board.
[0008]
According to a third aspect of the present invention, there is provided the method for joining a flexible circuit board to a panel according to the first or second aspect, wherein the panel electrode portion includes a plurality of wirings arranged in parallel with each other, and The conductive adhesive paste is continuously applied in the arrangement direction of the plurality of wirings.
[0009]
According to a fourth aspect of the present invention, there is provided the method for bonding a flexible circuit board to a panel according to the first or second aspect, wherein the panel electrode portion has a plurality of wirings arranged in parallel with each other, and A conductive adhesive paste is applied in a point-like manner between the plurality of wirings.
[0010]
According to a fifth aspect of the present invention, there is provided the method of bonding a flexible circuit board to a panel according to the first or second aspect, wherein the panel electrode portion has a plurality of wirings arranged in parallel with each other, and An adhesive paste is applied between the plurality of wirings in a linear shape parallel to the plurality of wirings.
[0011]
The invention according to claim 6 is a method for bonding a flexible circuit board to a panel for a flat panel display, wherein a step of applying a non-conductive adhesive paste to a substrate electrode portion formed on the flexible circuit board; Disposing the flexible circuit board so that the panel electrode section and the board electrode section face each other with respect to the glass substrate of the panel having the panel electrode section; and Curing the conductive adhesive paste to conduct the panel electrode portion and the substrate electrode portion.
[0012]
The invention according to claim 7 is a method for bonding a flexible circuit board to a panel according to claim 6, wherein the non-conductive adhesive paste is applied to the flexible circuit board by pressing from the flexible circuit board side. Protrude from the edge of the substrate.
[0013]
The invention according to claim 8 is the method for bonding a flexible circuit board to a panel according to claim 6 or 7, wherein in the step of applying the non-conductive adhesive paste, the substrate electrode portion is directed upward. The flexible circuit board is fixed on a flat base, and before the step of arranging the flexible circuit board, the method further comprises a step of turning the flexible circuit board upside down.
[0014]
According to a ninth aspect of the present invention, there is provided a method for bonding a flexible circuit board to a panel according to any one of the sixth to eighth aspects, wherein the substrate electrode portion has a plurality of wirings arranged in parallel with each other, The non-conductive adhesive paste is continuously applied in an arrangement direction of the plurality of wirings.
[0015]
According to a tenth aspect of the present invention, there is provided a method of bonding a flexible circuit board to a panel according to any one of the sixth to eighth aspects, wherein the substrate electrode portion has a plurality of wirings arranged in parallel with each other, The non-conductive adhesive paste is applied in a point-like manner between the plurality of wirings.
[0016]
According to an eleventh aspect of the present invention, there is provided a method of bonding a flexible circuit board to a panel according to any one of the sixth to eighth aspects, wherein the substrate electrode portion has a plurality of wirings arranged in parallel with each other, The non-conductive adhesive paste is applied between the plurality of wirings in a line parallel to the plurality of wirings.
[0017]
The invention according to claim 12 is an apparatus for bonding a flexible circuit board to a panel for a flat panel display, wherein the panel electrode portion formed on the main surface of the glass substrate of the panel faces upward. And a coating mechanism for applying a non-conductive adhesive paste toward the panel electrode portion of the glass substrate held by the holding portion, a substrate electrode portion formed on a flexible circuit board, and An arrangement mechanism for arranging the flexible circuit board with respect to the glass substrate so that the panel electrode section faces each other, and a positioning mechanism for arranging the flexible circuit board on the flexible circuit board in a state where the panel electrode section and the board electrode section face each other. And a pressure mechanism for curing the non-conductive adhesive paste while applying pressure from above.
[0018]
The invention according to claim 13 is an apparatus for joining a flexible circuit board to a panel according to claim 12, wherein the application mechanism includes: a discharge unit configured to discharge the non-conductive adhesive paste; A moving mechanism that moves along the panel electrode portion; and a contact member that is fixed relatively to the discharge portion and contacts the panel.
[0019]
According to a fourteenth aspect of the present invention, there is provided an apparatus for joining a flexible circuit board to a panel according to the thirteenth aspect, wherein the contact member is a pin or a roller.
[0020]
The invention according to claim 15 is the apparatus for joining a flexible circuit board to a panel according to claim 12 or 13, wherein the application mechanism is on a side opposite to a main surface on which the panel electrode portion is formed. And another contact member that contacts the main surface of the second member.
[0021]
The invention according to claim 16 is an apparatus for joining a flexible circuit board to a panel according to claim 15, wherein the abutting member, the another abutting member, and the discharge unit are provided on the panel. It is arranged on a plane perpendicular to the moving direction.
[0022]
The invention according to claim 17 is the apparatus for joining a flexible circuit board to a panel according to claim 16, wherein the another contact member is a pin or a roller.
[0023]
The invention according to claim 18 is an apparatus for joining a flexible circuit board to a panel for a flat panel display, wherein the holding section holds a board electrode section formed on the flexible circuit board upward, and A coating mechanism for applying a non-conductive adhesive paste toward the substrate electrode portion of the flexible circuit board held by the holding portion, and a panel electrode portion formed on a glass substrate of the panel and the substrate electrode portion facing each other An arrangement mechanism for arranging the flexible circuit board with respect to the glass substrate, and the non-conductive while pressing from the flexible circuit board side with the panel electrode section and the board electrode section facing each other. A pressure mechanism for curing the adhesive paste.
[0024]
The invention according to claim 19 is the apparatus for bonding a flexible circuit board to a panel according to claim 18, wherein the application mechanism includes: a discharge unit configured to discharge the non-conductive adhesive paste; And a moving mechanism for relatively moving along the substrate electrode portion.
[0025]
The invention according to claim 20, which is a flat panel display, comprising: a panel having a panel electrode portion; and a flexible circuit board joined to the panel electrode portion via a non-conductive adhesive material. The unit has a plurality of wirings formed of a silver paste.
[0026]
The invention according to claim 21 is the flat panel display according to claim 20, wherein the average roughness of the plurality of wirings in the height direction is 2 μm or more.
[0027]
The invention according to claim 22 is the flat panel display according to claim 20 or 21, wherein the non-conductive adhesive paste protrudes from an end of the flexible circuit board.
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
<1. First Embodiment>
A first embodiment of the present invention will be described. FIG. 1 is a plan view showing a configuration of a plasma display panel which is an embodiment of the flat panel display of the present invention. The panel portion 1 of the plasma display panel has a front glass substrate 2 and a rear glass substrate 3 bonded together by sealing the periphery of a rectangular discharge cell portion 1a with a fillet portion 1b. For example, argon gas or the like is sealed in the discharge cell section 1a.
[0029]
Electrodes constituting the discharge cells of the plasma display are formed on the surfaces (hereinafter, referred to as “first main surfaces”) of the main surfaces of the front glass substrate 2 and the rear glass substrate 3 that correspond to the discharge cell unit 1a side. (Not shown). Discharge cells are respectively provided on the first main surfaces of a flange portion 2a of the front glass substrate 2 projecting vertically above the discharge cell portion 1a and a flange portion 3a of the rear glass substrate 3 projecting left and right beyond the discharge cell portion 1a. Panel electrode portions 2b and 3b extended from portion 1a are formed. A flexible circuit board 4 is bonded to each of these panel electrode portions 2b and 3b.
[0030]
FIG. 2 is a side sectional view showing a state in which the flexible circuit board 4 is joined to the flange portion 3a of the rear glass substrate 3. The same applies to the case where the flexible circuit board 4 is joined to the flange portion 2a of the front glass substrate 2 (not shown).
[0031]
In the present embodiment, the flange portion 2a of the front glass substrate 2 and the flange portion 3a of the rear glass substrate 3 are bonded to the flexible circuit board 4 with a non-conductive adhesive paste 5 containing no conductive particles.
[0032]
In the case of a plasma display panel, since a relatively large current flows through the panel electrode portions 2b and 3b, the panel electrode portions 2b and 3b are each made of a silver thick film electrode. Silver electrode, for example, uniformly apply a resin containing a silver filler on a glass substrate, after exposing the non-electrode portion, remove the exposed portion to form an electrode pattern, further baking to remove the resin component, A silver electrode is formed. At the time of firing, the resin component is lost, so that it shrinks, and the surface of the silver electrode becomes uneven. The panel electrode portions 2b and 3b have irregularities with an average roughness in the height direction of about 2 μm to 5 μm. On the other hand, the board electrode portion 4a formed on the flexible circuit board 4 is formed of a thin film of, for example, chrome or copper.
[0033]
The panel electrode portions 2b and 3b thus formed are brought into contact with the substrate electrode portion 4a, and further pressurized, so that the projections of the panel electrode portions 2b and 3b enter the substrate electrode portion 4a, and electrical connection is established. Secured. The non-conductive adhesive paste 5 bonds the flange portion 2a of the front glass substrate 2 and the flange portion 3a of the rear glass substrate 3 to the non-electrode portions of the flexible circuit board 4, and protrudes from the end of the flexible circuit board 4. (The protruding portion is 5a), and adheres to the other portions of the front glass substrate 2 and the rear glass substrate 3. The protruding portion 5a improves the bonding strength between the front glass substrate 2 and the rear glass substrate 3 and the flexible circuit board 4. Further, a sealing agent 6 is applied to a joint between the front glass substrate 2 and the rear glass substrate 3 and the flexible circuit board 4 to protect the joint between the panel electrode portions 2b and 3b and the substrate electrode portion 4a. I have.
[0034]
Next, an apparatus for joining a flexible circuit board to a flat panel display panel according to the first embodiment will be described with reference to the drawings. In the first embodiment, a non-conductive adhesive paste is applied to panel electrode portions 2b and 3b formed on front glass substrate 2 and back glass substrate 3 of panel portion 1, and flexible circuit board 4 is placed thereon. Join.
[0035]
FIG. 3 shows a coating unit having a holding unit for holding the panel unit 1 and a coating mechanism for applying a non-conductive adhesive paste to a panel electrode unit formed on a glass substrate in a bonding apparatus for a flexible circuit board to a panel. FIG. 4 is a plan view showing the configuration of the device 10, and FIG. 4 is a front view thereof.
[0036]
The coating apparatus 10 holds the panel unit 1, translates the panel unit 1 in the Y direction, and rotates the panel unit 1 by 180 degrees about an axis in the Z direction (vertical direction) 11 (holding unit) 11. A coating head 12 for applying the non-conductive adhesive paste; a moving mechanism 13 for moving the coating head 12 in parallel in the X direction; and a control circuit (not shown) for controlling the table 11 and the moving mechanism 13. ). The panel section 1 is arranged such that the panel electrode section 2b or 3b formed on the first main surface of the flange section 2a or 3a (see FIG. 1) of the front glass substrate 2 or the rear glass substrate 3 faces upward. A non-conductive adhesive paste is applied to the panel electrode portion 2b or 3b held above and facing upward.
[0037]
By rotating the panel 1 by 180 degrees in a horizontal plane, one coating head 12 applies the non-conductive adhesive paste to both the flanges 2a of the front glass substrate 2 or both the flanges 3a of the rear glass substrate 3. be able to. Further, by moving the panel unit 1 in parallel in the Y direction, the application position of the non-conductive adhesive paste from the end of the front glass substrate 2 or the rear glass substrate 3 can be adjusted. The coating mechanism is constituted by the coating head 12, the moving mechanism 13, and the contact members 15 and 16, which will be described later.
[0038]
FIG. 5 shows an arrangement mechanism for arranging a flexible circuit board at a predetermined position of a panel electrode section on a glass substrate coated with a non-conductive adhesive paste, and a pressurizing and heating apparatus. FIG. 6 is a plan view showing a configuration of an arrangement and pressure device 20 having a pressure mechanism for curing a non-conductive adhesive paste according to the present invention, and FIG. 6 is a front view thereof.
[0039]
The arrangement pressurizing device 20 holds the panel unit 1, translates the panel unit 1 in the X direction and the Y direction, and rotates the panel unit 1 by 180 degrees about an axis in the Z direction. A tray 22 on which the flexible circuit boards 4 are arranged and arranged; an arm (arrangement mechanism) 23 for taking out the flexible circuit boards 4 from the tray 22 and arranging them at predetermined positions on the glass substrate 2 or 3 of the panel section 1; A pressurizing and heating head 24 for heating and pressurizing from above the flexible circuit board 4 disposed on 2 or 3; a cylinder 25 for vertically moving the pressurizing and heating head 24; , And the like.
[0040]
The pressurizing and heating head 24 includes a heater for heating a contact surface in contact with the flexible circuit board 4 to a predetermined temperature, a temperature sensor (thermocouple) for detecting the temperature of the contact surface, A pressure sensor (load cell) for detecting pressure is provided. A spherical bearing 26 is provided between the pressurizing / heating head 24 and the cylinder 25.
[0041]
FIG. 7 shows the transfer of the panel unit 1 on which the non-conductive adhesive paste is applied from the application device 10 shown in FIGS. 3 and 4 to the arrangement and pressurizing device 20 shown in FIGS. FIG. 9 is a view showing a transfer device 30 for turning over the panel unit 1 in order to apply a non-conductive adhesive paste to a panel electrode unit on the other glass substrate after bonding the flexible circuit board.
[0042]
The transfer device 30 includes an arm 31 for holding the panel unit 1 and a drive mechanism (not shown) for rotating the arm 31 up and down and right and left and rotating the arm 31 by 180 degrees about an axis in the Y direction. ). When the panel unit 1 is transferred from the coating device 10 to the disposition / pressing device 20, the arm 31 sandwiches the panel unit 1 on the table 11 of the coating device 10, and then rises in the vertical direction. The panel 1 is placed on the table 21 by moving in parallel on the table 21 and descending in the vertical direction. After that, the panel unit 1 is released and evacuated. On the other hand, when the panel unit 1 is transferred from the disposition / pressing device 20 to the coating device 10, the arm 31 sandwiches the panel unit 1 on the table 21 of the disposition / pressing device 20, then rises in the vertical direction, and is disposed as it is. The panel unit 1 is moved in parallel to the middle point between the pressurizing device 20 and the coating device 10, and is rotated by 180 degrees while holding the panel unit 1 upside down. The panel unit 1 is moved in parallel, lowered in the vertical direction, and placed on the table 11. After that, the panel unit 1 is released and evacuated. As described above, by using the transfer device 30 capable of reversing the panel portion 1 up and down, the two sides of the panel portion 1, that is, the front glass substrate 2 and the rear surface The flexible circuit board 4 can be joined to the glass substrate 3.
[0043]
By the way, while holding the panel portion 1 on the table 11, a non-conductive adhesive paste is applied to the panel electrode portion 2b or 3b formed on the flange portion 2a or 3a near the end of the front glass substrate 2 or the back glass substrate 3. In this case, depending on the screen size of the plasma display panel, that is, the size of the panel unit 1, the flange portion 2a or 3a of the front glass substrate 2 or the back glass substrate 3 may be warped up to about 2 mm. If the coating head 12 is moved in the X direction and the non-conductive adhesive paste is applied while the flange portion 2a or 3a of the front glass substrate 2 or the rear glass substrate 3 is warped, The distance between the discharge portion and the panel electrode portion 2b or 3b on the flange portion 2a or 3a of the front glass substrate 2 or the rear glass substrate 3 is not constant, and the non-conductive adhesive paste is not uniformly applied. Further, there is a possibility that the liquid is applied to a position different from the position where the liquid is to be applied.
[0044]
In the first embodiment, as shown in, for example, FIG. 8 or FIG. 9, the second glass plate 3 </ b> A of the rear glass substrate 3 on the opposite side to the first main surface 3 </ b> A of the flange 3 a on which the panel electrode unit 3 b is formed. The main surface 3B is held by the flat base 14. Further, a contact member 15 such as a resin pin is provided on the application head 12, and while the contact member 15 is in contact with the panel unit 1, X and a discharge unit 12 a for discharging the non-conductive adhesive paste 5 are provided. Move in the direction. The contact member 15 is pressurized in the (-Z) direction (downward), and corrects the warpage of the rear glass substrate 3 by sandwiching the panel unit 1 between the contact member 15 and the flat base 14 ( Alternatively, the application head 12 is moved up and down along the warp), and the distance between the ejection part 12a of the application head 12 and the panel electrode part 3b on the rear glass substrate 3 is maintained substantially constant. FIG. 8 shows an example in which the contact member 15 is brought into contact with the vicinity of the end of the flange portion 3a. FIG. This is an example. The same applies to the case where the non-conductive adhesive paste is applied to the panel electrode portion 2b of the front glass substrate 2, so that the description is omitted (the same applies to the following modified examples).
[0045]
10 and 11 show a modification in which the contact member 15 is a resin roller. FIG. 10 shows an example in which the contact member 15 is brought into contact with the vicinity of the end of the flange 3a, and FIG. 11 comes into contact with the fillet 1b of the panel 1 where the front glass substrate 2 and the rear glass substrate 3 are bonded. This is an example. When the contact member 15 is moved in the X direction together with the discharge portion 12a, in order to minimize the frictional resistance between the contact member 15 and the glass substrate 2 or 3, the contact member 15 is made of a resin pin or a resin having a small friction coefficient. A roller is preferred.
[0046]
FIGS. 12 and 13 show a modification in which the second main surface 3B of the back glass substrate 3 is held by a (lower) contact member 16 made of resin pins or rollers instead of the flat base. FIG. 12 shows an example in which a roller is used as the lower contact member 16 and the upper contact member 15 made of a roller is brought into contact with the vicinity of the end of the flange portion 3a. FIG. This is an example in which an upper contact member 15 using pins is brought into contact with a fillet portion 1b in which the front glass substrate 2 and the rear glass substrate 3 are adhered to each other.
[0047]
The lower contact member 16 is pressurized in the (+ Z) direction (upward), and by holding the panel unit 1 between the lower contact member 16 and the upper contact member 15 pressed downward, 3 is corrected (or the ejection section 12a is made to exactly follow the warp). The lower contact member 16 is provided on the coating head 12 so as to face the discharge unit 12a via the glass substrate 2 or 3, and the discharge unit 12a and the discharge unit 12a It moves together with the upper contact member 15. On the coating head 12, the upper contact member 15, the lower contact member 16, and the discharge unit 12 a are arranged on a plane perpendicular to the X direction, which is the moving direction of the coating head 12 having the discharge unit 12 a (the Y axis and the Z axis). (Including plane). This ensures that the distance between the discharge unit 12a and the panel electrode unit is constant.
[0048]
Note that the upper contact member 15 and the lower contact member 16 do not necessarily need to be of the same type, and the upper contact member 15 may be a pin and the lower contact member 16 may be a roller, or vice versa. It may be a combination.
[0049]
Next, a method of applying a non-conductive adhesive paste to the panel electrode portion 2b (the same applies to the panel electrode portion 3b) is shown in FIGS. FIG. 14 shows an example in which the non-conductive adhesive paste 5 is continuously applied while moving the application head 12 in the direction in which the plurality of wirings of the panel electrode portion 2b are arranged. In this case, the non-conductive adhesive paste 5 is applied not only between the plurality of wirings but also on the wirings. Further, since the non-conductive adhesive paste 5 is continuously applied, the upper contact member 15 and the lower contact member 16 are connected to the flange portion 2 a of the glass substrate 2 and the front glass substrate 2 and the rear glass substrate 3. Are moved in the X direction while constantly abutting the fillet portion 1b on which the is adhered.
[0050]
FIG. 15 shows an example in which the non-conductive adhesive paste 5 is applied in a dot-like manner between the plurality of wirings while moving the coating head 12 in the direction in which the plurality of wirings of the panel electrode portion 2b are arranged. In this case, the non-conductive adhesive paste 5 is applied only between the plurality of wirings, not on the wirings. Also, since the non-conductive adhesive paste 5 is intermittently applied, the upper contact member 15 and the lower contact member 16 are connected to the flange portion 2a of the glass substrate 2, the front glass substrate 2, and the rear glass substrate 3. May be moved in the X direction while constantly abutting the fillet portion 1b on which the non-conductive adhesive paste 5 is applied, or may be abutted only when the non-conductive adhesive paste 5 is applied. When the coating head 12 passes through the wiring portion, the contact members 15 and 16 may be retracted in the (+ Z) direction.
[0051]
In addition, in order to apply the non-conductive adhesive paste 5 in a dot-like manner between a plurality of wirings, in addition to the above-described method, a coating head having a plurality of discharge ports corresponding to a pitch of the plurality of wirings of the panel electrode portion 2b, or the like. , The non-conductive adhesive paste 5 may be simultaneously applied to a plurality of locations.
[0052]
FIG. 16 shows an example in which the non-conductive adhesive paste 5 is applied between the plurality of wires of the panel electrode portion 2b in a line parallel to the wires. In this case, a non-conductive adhesive paste 5 is simultaneously applied to a plurality of locations while moving the application head in the Y direction by using an application head having a plurality of discharge ports corresponding to a plurality of wiring pitches of the panel electrode portion 2b. do it. Further, the coating head does not necessarily have to have the same width as the width of the plurality of wirings of the panel electrode portion 2b, and uses a head having a shorter width than the coating head while moving it alternately in the X direction and the Y direction. It may be configured to apply a conductive adhesive paste.
[0053]
The application amount and the application position of the non-conductive adhesive paste 5 are determined by experiments, respectively. When the flexible circuit board 4 is bonded to the flange portion 2a or 3a of the glass substrate 2 or 3, as shown in FIG. Preferably, the amount and position of the non-conductive adhesive paste 5 protruding from the end of the flexible circuit board 4 or the like are preferable. Note that if sufficient bonding strength can be obtained, the non-conductive adhesive paste 5 does not necessarily need to protrude.
[0054]
Next, a method of joining the flexible circuit board to the flat panel display panel according to the first embodiment will be described with reference to FIG.
[0055]
First, the panel unit 1 is placed on the table 11 of the coating apparatus 10 such that, for example, the panel electrode unit 2b formed on the first main surface of the flange unit 2a of the front glass substrate 2 faces upward ( Step S11, see FIG. 3). Then, while moving the application head 12 in the X direction by the moving mechanism 13, the non-conductive adhesive paste 5 is applied onto the panel electrode portion 2b by any of the methods shown in FIGS. 14 to 16 (Step S12). When the application of the non-conductive adhesive paste 5 to the panel electrode portion 2b on the one flange portion 2a of the front glass substrate 2 is completed, the table 11 is rotated 180 degrees about the axis in the Z direction (steps S13 and S14). ), A non-conductive adhesive paste 5 is applied to the panel electrode portion 2b on the other flange portion 2a (Step S12).
[0056]
When the application of the non-conductive adhesive paste 5 to the panel electrode portions 2b on both the flange portions 2a is completed, the transfer device 30 shown in FIG. The panel unit 1 is moved vertically in the vertical direction, and is moved in parallel on the table 21 of the placement / pressing apparatus 20, and then lowered vertically to transfer the panel unit 1 onto the table 21 (step S21).
[0057]
Next, the arm 23 shown in FIG. 5 is driven to take out the flexible circuit board 4 from the tray 22, and the table 21 is driven to change the relative position of the front glass substrate 2 of the panel unit 1 with respect to the arm 23. Then, the flexible circuit board 4 is arranged at a predetermined position on the front glass substrate 2 (Step S22). Then, when a predetermined number or all necessary flexible circuit boards 4 are arranged, the pressurizing and heating head 24 is lowered in the (-Z) direction, and pressurizes and heats the flexible circuit board 4 from above (step S23).
[0058]
Due to the pressure at this time, the non-conductive adhesive paste 5 applied to the panel electrode portion 2b on the flange portion 2a of the front glass substrate 2 spreads between the flange portion 2a of the front glass substrate 2 and the flexible circuit board 4, In some cases, it protrudes from the end of the flexible circuit board 4. Further, the heat at this time cures the non-conductive adhesive paste 5, and the flexible circuit board 4 is joined to the flange portion 2 a of the front glass substrate 2.
[0059]
When all necessary flexible circuit boards 4 are joined to one of the flanges 2a, the table 21 is rotated by 180 degrees about the axis in the Z direction, and the above procedure is repeated to place the flexible circuit board 4 on the other flange 2a. The circuit board 4 is joined (steps S24, S25, S22, S23).
[0060]
When the flexible circuit board 4 is joined to both the flange portions 2a of the front glass substrate 2, the transfer device 30 is driven to clamp the panel portion 1 by the arm 31, and then rises in the vertical direction. 20 and the coating apparatus 10, the arm 31 is rotated 180 degrees about the axis in the Y direction while holding the panel section 1, and the panel section 1 is turned upside down (steps S 26 and S 27). ), It is moved in parallel to the table 11 of the coating apparatus 10, and is lowered vertically to mount the panel unit 1 on the table 11 (step S11). Then, the above procedure is repeated for the panel electrode portion 3b formed on the flange portion 3a of the rear glass substrate 3 of the panel portion 1. As a result, the flexible circuit board 4 can be bonded to both sides of the panel section 1, namely, the front glass substrate 2 and the rear glass substrate 3.
[0061]
As the non-conductive adhesive paste 5, for example, a thermosetting resin such as an epoxy resin, an acrylic resin, and a urethane resin can be used. As an experimental example, when an epoxy resin was used, curing was possible in a heat curing temperature range of 180 ° C. to 200 ° C. and a heating time of about 5 seconds to 10 seconds. The pressing force is determined by the area of the flexible circuit board 4 and the area of the contact surface of the pressurizing and heating head 24 (length and width of the contact surface), and is 500 N / cm. ² The degree was appropriate.
[0062]
As described above, according to the first embodiment, a flexible circuit board can be joined to a panel for a flat panel display using a relatively inexpensive non-conductive adhesive paste containing no conductive particles. The possibility of occurrence of the phenomenon can be reduced, and the reliability can be improved.
[0063]
<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. In the second embodiment, a non-conductive adhesive paste is applied to a substrate electrode portion formed on a flexible circuit board, and a flexible circuit board coated with the non-conductive adhesive paste is formed on a glass substrate of a panel portion. To the panel electrode part. Note that the configuration of the plasma display panel manufactured according to the second embodiment is substantially the same as the configuration of the plasma display panel according to the first embodiment, and a description thereof will be omitted.
[0064]
An apparatus for joining a flexible circuit board to a flat panel display panel according to a second embodiment will be described with reference to FIGS. FIG. 18 is a plan view showing the configuration of the joining device 40, and FIG. 19 is a front view thereof.
[0065]
On the base 40a of the joining device 40, the flexible circuit board 4 is held such that the board electrode portion 4a (see FIG. 2) formed thereon faces upward, and the circuit board is movable in the Y direction. A table 41 and its moving mechanism 42 are provided. The circuit board table 41 stops at the first predetermined position 41A and the second predetermined position 41B, which are both ends in the Y direction, and reciprocates between the first predetermined position 41A and the second predetermined position 41B at a predetermined speed.
[0066]
An application head 43 for applying a non-conductive adhesive paste is provided at a substantially intermediate position between the first predetermined position 41A and the second predetermined position 41B so as to face the moving path of the circuit board table 41. In the second embodiment, since the circuit board table 41 holding the flexible circuit board 4 moves, the coating head 43 is fixed on the base 40a.
[0067]
In the vicinity of the first predetermined position 41A, a tray 44 in which a plurality of flexible circuit boards 4 are arranged and arranged, and the flexible circuit board 4 is taken out from the tray 44 and transferred to the circuit board table 41 at the first predetermined position 41A. One arm 45 is provided. Further, in the vicinity of the second predetermined position 41B, the flexible circuit board 4 on which the non-conductive adhesive paste is applied is picked up from the circuit board table 41 and is placed on the front glass substrate 2 or the back glass substrate 3 of the panel unit 1 described later. A second arm 46 is provided at a position facing the panel electrode portion 2b or 3b formed at the second position.
[0068]
The first arm 45 moves the flexible circuit board 4 arranged on the tray 44 such that the substrate electrode unit 4a faces upward onto the circuit board table 41 so that the substrate electrode unit 4a faces upward. The vertical movement in the direction and the turning operation about the axis in the Z direction are performed. On the other hand, the second arm 46 turns the flexible circuit board 4 upside down (front and back) depending on whether the flexible circuit board 4 is bonded to the front glass substrate 2 or the rear glass substrate 3 of the panel unit 1. Therefore, in addition to the vertical movement in the Z direction and the turning operation about the axis in the Z direction, a rotating operation about the axis in the Y direction is also performed as necessary.
[0069]
On the (+ X) side of the second arm 46, the panel unit 1 is held, the panel unit 1 is moved in parallel in the X direction and the Y direction, and the panel unit 1 is rotated 180 degrees about an axis in the Z direction. A panel table 47 is provided. In the example shown in FIGS. 18 and 19, the panel unit 1 is held by the panel table 47 such that the front glass substrate 2 is on the upper side. In the second embodiment, unlike the case of the first embodiment, the panel section 1 is not turned upside down and replaced.
[0070]
Further, a first pressurizing and heating head 48 is provided at a position away from the (-Y) side of the second arm 46 by a predetermined distance. Further, a second pressure heating head 49 is provided at a position adjacent to the (+ X) side of the second arm 46. The first pressurizing and heating head 48 is substantially the same as the pressurizing and heating head 24 in the first embodiment shown in FIGS. 5 and 6, and moves the first pressurizing and heating head 48 up and down in the vertical direction. A cylinder, a heater, a temperature sensor (thermocouple), a pressure sensor (load cell), a control circuit (not shown), and the like are provided (reference numerals omitted). On the other hand, the second pressurizing and heating head 49 substantially has the first pressurizing and heating head 48 arranged upside down, and there is no substantial difference other than the operation direction.
[0071]
Next, a method of bonding a flexible circuit board to a flat panel display panel according to the second embodiment will be described with reference to FIG.
[0072]
First, the panel unit 1 is placed on the panel table 47 so that, for example, the front glass substrate 2 is located on the upper side (step S31). Then, the panel table 47 is moved in the X direction and the Y direction so that the end of the one flange portion 3 a of the rear glass substrate 3 faces the second arm 46.
[0073]
Further, the circuit board table 41 is moved to the first predetermined position 41A, the first arm 45 is driven to take out the flexible circuit board 4 from the tray 44, and the flexible circuit board 4 is placed at a predetermined position on the circuit board table 41. Place. Then, the moving mechanism 42 is driven to move the circuit board table 41 from the first predetermined position 41A toward the second predetermined position 41B.
[0074]
During this time, the circuit board table 41 passes under the coating head 43, so that the non-conductive adhesive paste 5 is applied to the board electrode portion 4a of the flexible circuit board 4 according to any one of the methods shown in FIGS. (Step S32). That is, the non-conductive adhesive paste 5 is applied continuously in the arrangement direction of the plurality of wirings of the substrate electrode portion 4a, is applied in a dotted pattern between the plurality of wirings, or is applied between the plurality of wirings. In a line parallel to the substrate.
[0075]
When the circuit board table 41 reaches the second predetermined position 41B, the second arm 46 is driven, the flexible circuit board 4 is picked up from the circuit board table 41, the flexible circuit board 4 is turned upside down, and the rear glass substrate 3 Is arranged at a predetermined position on one of the flange portions 3a (steps S33 to S35). When one flexible circuit board 4 is arranged, the panel table 47 is moved by a predetermined distance in the Y direction to prepare for the next flexible circuit board 4 arrangement. Then, the above procedure is repeated until a predetermined number or all necessary flexible circuit boards 4 are arranged on one flange portion 3a of the rear glass substrate 3 (step S36).
[0076]
When a predetermined number or all necessary flexible circuit boards 4 are arranged on one flange portion 3a of the rear glass substrate 3, the first pressurizing and heating head 48 is lowered in the (-Z) direction, and Then, pressure and heat are applied (step S37). Thereby, the non-conductive adhesive paste 5 is cured, and the flexible circuit board 4 is joined to the flange portion 3a of the rear glass substrate 3. When bonding the flexible circuit boards 4 by a predetermined number at a time, the panel table 47 is moved by a predetermined distance in the Y direction until the necessary bonding of all the flexible circuit boards 4 is completed, and And heating are repeated.
[0077]
When all the flexible circuit boards 4 are joined to the panel electrode portions 3b on one flange portion 3a of the rear glass substrate 3, the panel table 47 is rotated 180 degrees around the axis in the Z direction, and the above procedure is repeated. The flexible circuit board 4 is joined to the panel electrode section 3b on one flange section 3a (steps S38, S39).
[0078]
When the connection of the flexible circuit board 4 to both the flange portions 3a of the rear glass substrate 3 is completed, the panel table 47 is rotated 90 degrees around its central axis (step S39), and the one flange portion 2a of the front glass substrate 2 is rotated. The panel table 47 is moved in the X direction and the Y direction so that the end of the panel table 47 faces the second arm 46. Then, by driving the second arm 46, the flexible circuit board 4 is picked up from the circuit board table 41, and the flexible circuit board 4 is not turned upside down. It is arranged at a position facing the position (steps S33, S35).
[0079]
When a predetermined number of flexible circuit boards 4 are arranged on the panel electrode portion 2b (step S36), the second pressurizing and heating head 49 is raised in the (+ Z) direction, and pressurized and heated from the flexible circuit board 4 side. The non-conductive adhesive paste 5 is cured (step S37). When the flexible circuit board 4 is joined to the flange portion 2a of the front glass substrate 2, the second pressure heating head 49 is lowered in the (-Z) direction. If it is necessary to prevent the flexible circuit board 4 from dropping off during the arrangement, the joining may be performed while the flexible circuit board 4 is held by the second arm 46.
[0080]
When a predetermined number of flexible circuit boards 4 are bonded, the panel table 47 is moved by a predetermined distance in the Y direction to prepare for bonding of the next predetermined number of flexible circuit boards 4. When the joining to one flange 2a is completed, the panel 1 is rotated 180 ° about the axis in the Z direction (steps S38, S39), and the joining to the other flange 2a is performed. By the above operation, the flexible circuit board 4 is bonded to both surfaces of the panel section 1, namely, the front glass substrate 2 and the back glass substrate 3.
[0081]
As described above, according to the second embodiment, the flexible circuit board can be joined to the flat display panel using the relatively inexpensive non-conductive adhesive paste containing no conductive particles, and the short circuit phenomenon can be prevented. Can be reduced, and the reliability can be improved.
[0082]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible.
[0083]
In the above embodiment, a thermosetting resin is used as the non-conductive adhesive paste 5, but an ultraviolet curable resin or the like may be used. In that case, a pressure and ultraviolet irradiation head may be used instead of the pressure and heating heads 24, 48, and 49.
[0084]
Also, a plasma display has been illustrated as an example of a flat panel display, but the present invention can also be applied to a case where a flexible circuit board is connected to a liquid crystal panel, an electroluminescence panel, or the like.
[0085]
【The invention's effect】
According to the present invention, a flexible circuit board can be joined to a flat display panel using a relatively inexpensive non-conductive adhesive paste containing no conductive particles, and the possibility of occurrence of a short circuit phenomenon is reduced. , Reliability can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a panel unit of a plasma display.
FIG. 2 is a side sectional view showing a state in which a flexible circuit board is bonded to a glass substrate.
FIG. 3 is a plan view showing a configuration of a coating apparatus.
FIG. 4 is a front view showing a configuration of a coating apparatus.
FIG. 5 is a plan view showing the configuration of a placement and pressing device.
FIG. 6 is a front view showing the configuration of the arrangement pressing device.
FIG. 7 is a front view showing the configuration of the transfer device.
FIG. 8 is a cross-sectional view showing a shape and a contact position of a contact member.
FIG. 9 is a cross-sectional view showing another example of a shape and a contact position of a contact member.
FIG. 10 is a sectional view showing still another example of the shape and the contact position of the contact member.
FIG. 11 is a sectional view showing still another example of the shape and the contact position of the contact member.
FIG. 12 is a sectional view showing still another example of the shape and the contact position of the contact member.
FIG. 13 is a sectional view showing still another example of the shape and contact position of the contact member.
FIG. 14 is a perspective view showing an example of a method of applying a non-conductive adhesive paste.
FIG. 15 is a perspective view showing an example of a method of applying a non-conductive adhesive paste.
FIG. 16 is a perspective view showing an example of a method of applying a non-conductive adhesive paste.
FIG. 17 is a diagram showing a flow of the operation of the bonding apparatus.
FIG. 18 is a plan view showing a configuration of a joining device.
FIG. 19 is a plan view showing a configuration of a joining device.
FIG. 20 is a diagram showing a flow of the operation of the joining apparatus.
[Explanation of symbols]
1 Panel
2 Front glass substrate
3 Back glass substrate
2b, 3b Panel electrode part
4 Flexible circuit board
4a substrate electrode
5 Non-conductive adhesive paste
10 Coating device
11 tables
12,43 Coating head
12a discharge unit
13,42 Moving mechanism
14 Flatbed
15, 16 contact member
20 Placement press
21 table
23 arm
24 Pressurized heating head
40 Joining equipment
41 circuit board table
46 2nd arm
47 Panel Table
48 1st pressure heating head
49 Second pressure heating head
S12, S22, S23, S32, S34, S35, S37 Step

Claims (22)

A method for joining a flexible circuit board to a panel for a flat panel display,
A step of applying a non-conductive adhesive paste to the panel electrode portion formed on the main surface of the glass substrate of the panel,
A step of disposing a flexible circuit board having a substrate electrode portion on the glass substrate so that the panel electrode portion and the substrate electrode portion face each other,
Curing the non-conductive adhesive paste while pressing from above the flexible circuit board, and conducting the panel electrode section and the board electrode section,
A method for bonding a flexible circuit board to a panel, comprising: A method for joining a flexible circuit board to a panel according to claim 1,
A method of joining a flexible circuit board to a panel, wherein the non-conductive adhesive paste protrudes from an end of the flexible circuit board by pressing from above the flexible circuit board. A method for bonding a flexible circuit board to a panel according to claim 1 or 2,
The panel electrode portion has a plurality of wirings arranged in parallel with each other, and the non-conductive adhesive paste is continuously applied in an arrangement direction of the plurality of wirings. Joining method. A method for bonding a flexible circuit board to a panel according to claim 1 or 2,
The panel electrode portion has a plurality of wirings arranged in parallel with each other, and the non-conductive adhesive paste is applied in a point-like manner between the plurality of wirings. Method. A method for bonding a flexible circuit board to a panel according to claim 1 or 2,
The panel electrode section, wherein a plurality of wirings are arranged in parallel with each other, and the non-conductive adhesive paste is applied between the plurality of wirings in a linear shape parallel to the plurality of wirings. Method of bonding flexible circuit board to the board. A method for joining a flexible circuit board to a panel for a flat panel display,
A step of applying a non-conductive adhesive paste to the substrate electrode portion formed on the flexible circuit board,
For a glass substrate of a panel having a panel electrode portion, a step of arranging the flexible circuit board so that the panel electrode portion and the substrate electrode portion face each other,
Curing the non-conductive adhesive paste while applying pressure from the flexible circuit board side, and conducting the panel electrode section and the board electrode section,
A method for bonding a flexible circuit board to a panel, comprising: A method for joining a flexible circuit board to a panel according to claim 6,
A method of joining a flexible circuit board to a panel, wherein the non-conductive adhesive paste protrudes from an end of the flexible circuit board by pressing from the flexible circuit board side. A method for bonding a flexible circuit board to a panel according to claim 6 or 7,
In the step of applying the non-conductive adhesive paste, the flexible circuit board is fixed on a flat base with the substrate electrode portion facing upward,
A method of joining a flexible circuit board to a panel, further comprising a step of turning the flexible circuit board upside down before the step of arranging the flexible circuit board. A method for joining a flexible circuit board to a panel according to any one of claims 6 to 8,
The substrate electrode portion has a plurality of wirings arranged in parallel with each other, and the non-conductive adhesive paste is continuously applied in an arrangement direction of the plurality of wirings. Joining method. A method for joining a flexible circuit board to a panel according to any one of claims 6 to 8,
A plurality of wirings are arranged in parallel with each other in the substrate electrode portion, and the non-conductive adhesive paste is applied in a point-like manner between the plurality of wirings. Method. A method for joining a flexible circuit board to a panel according to any one of claims 6 to 8,
A panel, wherein a plurality of wirings are arranged in parallel with each other in the substrate electrode portion, and the non-conductive adhesive paste is applied between the plurality of wirings in a linear shape parallel to the plurality of wirings. Method of bonding flexible circuit board to the board. An apparatus for joining a flexible circuit board to a panel for a flat panel display,
A holding unit that holds the glass substrate with the panel electrode unit formed on the main surface of the glass substrate of the panel facing upward,
An application mechanism for applying a non-conductive adhesive paste toward the panel electrode portion of the glass substrate held by the holding portion,
An arrangement mechanism for arranging the flexible circuit board with respect to the glass substrate, such that the substrate electrode section and the panel electrode section formed on the flexible circuit board face each other,
A pressure mechanism for curing the non-conductive adhesive paste while pressing from above the flexible circuit board in a state where the panel electrode portion and the substrate electrode portion face each other, Flexible circuit board bonding equipment. An apparatus for joining a flexible circuit board to a panel according to claim 12,
The coating mechanism is
A discharge unit for discharging the non-conductive adhesive paste,
A moving mechanism for moving the discharge unit along the panel electrode unit,
A contact member that is fixed relative to the discharge unit and abuts the panel;
An apparatus for bonding a flexible circuit board to a panel, comprising: An apparatus for joining a flexible circuit board to a panel according to claim 13,
The said contact member is a pin or a roller, The joining apparatus of the flexible circuit board to the panel characterized by the above-mentioned. An apparatus for joining a flexible circuit board to a panel according to claim 12 or 13,
The apparatus for bonding a flexible circuit board to a panel, wherein the coating mechanism further includes another contact member that contacts a main surface opposite to a main surface on which the panel electrode portion is formed. An apparatus for joining a flexible circuit board to a panel according to claim 15,
The apparatus for joining a flexible circuit board to a panel, wherein the contact member, the another contact member, and the discharge unit are arranged on a plane perpendicular to a moving direction of the discharge unit. An apparatus for joining a flexible circuit board to a panel according to claim 16,
The said another contact member is a pin or a roller, The joining apparatus of the flexible circuit board to the panel characterized by the above-mentioned. An apparatus for joining a flexible circuit board to a panel for a flat panel display,
A holding portion for holding the board electrode portion formed on the flexible circuit board upward,
An application mechanism for applying a non-conductive adhesive paste toward the substrate electrode unit of the flexible circuit board held by the holding unit,
An arrangement mechanism for arranging the flexible circuit board with respect to the glass substrate, such that the panel electrode portion and the substrate electrode portion formed on the glass substrate of the panel face each other,
In a state where the panel electrode portion and the substrate electrode portion are opposed to each other, a pressure mechanism for curing the non-conductive adhesive paste while pressing from the flexible circuit board side,
A bonding apparatus for a flexible circuit board to a panel, comprising: An apparatus for joining a flexible circuit board to a panel according to claim 18,
The coating mechanism is
A discharge unit for discharging the non-conductive adhesive paste,
A moving mechanism for relatively moving the discharge unit along the substrate electrode unit,
An apparatus for bonding a flexible circuit board to a panel, comprising: A flat panel display,
A panel having a panel electrode portion;
A flexible circuit board joined to the panel electrode portion via a non-conductive adhesive material,
With
A flat panel display, wherein the panel electrode unit has a plurality of wirings formed of a silver paste. 21. The flat panel display according to claim 20, wherein
The average roughness of the plurality of wirings in a height direction is 2 μm or more. 22. The flat panel display according to claim 20, wherein
A flat panel display, wherein the non-conductive adhesive paste protrudes from an end of the flexible circuit board.

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