JP2004119992A5 - - Google Patents

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Publication number
JP2004119992A5
JP2004119992A5 JP2003418496A JP2003418496A JP2004119992A5 JP 2004119992 A5 JP2004119992 A5 JP 2004119992A5 JP 2003418496 A JP2003418496 A JP 2003418496A JP 2003418496 A JP2003418496 A JP 2003418496A JP 2004119992 A5 JP2004119992 A5 JP 2004119992A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003418496A
Other languages
Japanese (ja)
Other versions
JP4757442B2 (ja
JP2004119992A (ja
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Publication date
Application filed filed Critical
Priority to JP2003418496A priority Critical patent/JP4757442B2/ja
Priority claimed from JP2003418496A external-priority patent/JP4757442B2/ja
Publication of JP2004119992A publication Critical patent/JP2004119992A/ja
Publication of JP2004119992A5 publication Critical patent/JP2004119992A5/ja
Application granted granted Critical
Publication of JP4757442B2 publication Critical patent/JP4757442B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2003418496A 1997-02-10 2003-12-16 チップ体製造用粘着シート Expired - Lifetime JP4757442B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003418496A JP4757442B2 (ja) 1997-02-10 2003-12-16 チップ体製造用粘着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1997026571 1997-02-10
JP2657197 1997-02-10
JP2003418496A JP4757442B2 (ja) 1997-02-10 2003-12-16 チップ体製造用粘着シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP02865398A Division JP3535968B2 (ja) 1997-02-10 1998-02-10 チップ体の製造方法およびチップ体製造用粘着シート

Publications (3)

Publication Number Publication Date
JP2004119992A JP2004119992A (ja) 2004-04-15
JP2004119992A5 true JP2004119992A5 (enrdf_load_html_response) 2005-07-14
JP4757442B2 JP4757442B2 (ja) 2011-08-24

Family

ID=32299867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003418496A Expired - Lifetime JP4757442B2 (ja) 1997-02-10 2003-12-16 チップ体製造用粘着シート

Country Status (1)

Country Link
JP (1) JP4757442B2 (enrdf_load_html_response)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319233A (ja) * 2005-05-16 2006-11-24 Lintec Corp 脆質部材の処理装置
JP2007294748A (ja) * 2006-04-26 2007-11-08 Tokyo Seimitsu Co Ltd ウェーハ搬送方法
EP1921120B1 (en) 2006-11-10 2011-04-20 Nitto Denko Corporation Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet
JP5323779B2 (ja) * 2010-07-26 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ
JP5636266B2 (ja) * 2010-11-16 2014-12-03 株式会社ディスコ ワークの加工方法及びダイシングテープ
JP5554351B2 (ja) * 2012-01-25 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
WO2019172217A1 (ja) * 2018-03-07 2019-09-12 リンテック株式会社 エキスパンド方法、半導体装置の製造方法、及び粘着シート
BR112019019520B1 (pt) * 2018-03-28 2021-03-16 Furukawa Electric Co., Ltd fita para processamento de semicondutores
MY187307A (en) * 2018-03-28 2021-09-21 Furukawa Electric Co Ltd Tape for semiconductor processing
JP6535118B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535117B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535119B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
KR102351045B1 (ko) * 2019-12-19 2022-01-14 한국기계연구원 마이크로 소자의 간격 조절 전사방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181652A (ja) * 1984-09-28 1986-04-25 Shin Etsu Polymer Co Ltd ダイシングフイルム
JP2521459B2 (ja) * 1987-02-23 1996-08-07 日東電工株式会社 半導体チツプの製造方法
JPH01116606A (ja) * 1987-10-30 1989-05-09 Nec Corp 調光機能を有する受光モジュール
JPH07273173A (ja) * 1994-03-28 1995-10-20 Furukawa Electric Co Ltd:The 半導体ウエハ固定用粘着テープ
JPH08302293A (ja) * 1995-05-10 1996-11-19 Lintec Corp 熱収縮型表面保護シート
JP3408894B2 (ja) * 1995-05-17 2003-05-19 日東電工株式会社 半導体チップの製造方法

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