JP2004115310A - Metal-ceramic joined body and process for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a metal-ceramic joined body, by which a metal member and a ceramic substrate can be directly joined even in the case that an eutectic molten matter does not form, and the metal member and the ceramic substrate are directly joined without using molten metal; and to provide the metal-ceramic joined body. <P>SOLUTION: A manganin plate 14 is directly joined to the ceramic substrate 12 by mounting the ceramic substrate 12 on a bottom board 10, then directly arranging the manganin plate on the substrate 12, and heating to a temperature not lower than the solidus and not higher than the liquidus of the alloy under atmosphere or in an inert atmospheric gas. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a metal-ceramics joined body composed of a ceramics substrate and a metal member joined to the ceramics substrate, and a method of manufacturing the same, and more particularly to a shunt resistor in which a metal member made of a copper alloy as a resistance element is joined to a ceramics substrate. The present invention relates to a metal-ceramic joint used for a resistance electronic member such as an element and a method for producing the same.
[0002]
[Prior art]
Conventionally, for resistance electronic members such as shunt resistance elements that detect the current of a circuit, an alloy plate such as a manganin alloy plate as a sheet-like resistor that has been processed with high precision by pressing or the like in advance has been activated by an active material such as silver solder. It is joined to a ceramic substrate such as an alumina substrate by brazing using a metal-based brazing material containing metal (for example, see Patent Document 1).
[0003]
On the other hand, as a method of directly joining a metal plate and a ceramic substrate without using an intermediate material such as brazing material, the metal plate and the ceramic substrate are heated to a temperature between the eutectic temperature and the melting point of the metal in an inert atmosphere. Then, a eutectic melt is generated between the metal plate and the ceramic substrate to directly join the metal plate and the ceramic substrate (for example, see Patent Document 2). There is known a so-called molten metal joining method in which the substrate is brought into direct contact with a substrate and joined (for example, see Patent Document 3).
[0004]
[Patent Document 1]
JP-A-11-97203 (paragraph number 0007)
[Patent Document 2]
JP-A-52-37914 (page 5, lower left column 13 lines to lower right column 1 line)
[Patent Document 3]
JP-A-7-193358 (paragraph numbers 0015 to 0016)
[0005]
[Problems to be solved by the invention]
However, in brazing using a brazing material containing an active metal, it is necessary to use a noble metal material such as silver as the active metal or to join in a high vacuum, and there is also a problem that the manufacturing cost is relatively high. In addition, since resistance changes due to alloying between the alloy plate and the brazing material, it may not be preferable for use as an electronic member for a resistor. Also, when an alloy plate made of a copper-nickel alloy or a copper-nickel-manganese alloy is joined to a ceramic substrate with a brazing material, the hardness (strength) of the brazing material and the difference in the coefficient of thermal expansion between the brazing material and the ceramic substrate are increased. Due to the generated stress, the required reliability of the electronic member may not be obtained.
[0006]
In addition, the eutectic bonding method is limited to the case where a metal plate that produces a eutectic melt and a ceramic substrate are bonded. In many cases, oxygen in ceramics is used as a bonding material. It is difficult to join with the ceramics.
[0007]
Further, in the molten metal joining method, since the metal plate and the ceramic substrate are joined by bringing the molten metal into direct contact with the ceramic substrate, it may be difficult to produce an electronic material having a shape such as fine resistance.
[0008]
Accordingly, the present invention has been made in view of the above-described conventional problems, and enables a metal member and a ceramic substrate to be directly joined even when a eutectic melt is not generated, and a metal member and a ceramic substrate can be used without using a molten metal. An object of the present invention is to provide a metal-ceramic joined body that can be directly joined to a substrate and a method for manufacturing the same.
[0009]
[Means for Solving the Problems]
The present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, in a method of manufacturing a metal-ceramic joined body directly joining a metal member made of an alloy containing copper and nickel to at least one surface of a ceramic substrate, The present inventors have found that the metal member and the ceramic substrate can be directly joined by heating the alloy to a temperature not lower than the solidus line and not higher than the liquidus line in an inert atmosphere gas, and have completed the present invention.
[0010]
That is, the method for producing a metal-ceramic joined body according to the present invention is a method for producing a metal-ceramic joined body in which a metal member made of an alloy containing copper and nickel is directly joined to at least one surface of a ceramic substrate. The metal member is directly joined to the ceramic substrate by heating the alloy to a temperature not lower than the solidus line and not higher than the liquidus line in a gas.
[0011]
In this method for manufacturing a metal-ceramic joined body, it is preferable that the alloy is an all-solid-solution alloy. Further, the alloy may contain manganese. In this case, it is preferable that the alloy contains 1.0 to 4.0% by weight of nickel and 10.0 to 13.0% by weight of manganese, with the balance being copper and inevitable elements.
[0012]
The temperature above the solidus of the alloy and below the liquidus is preferably below 50 ° C. above the solidus of the alloy. Further, when the alloy is a manganin alloy, it is preferable that the temperature between the solidus line and the liquidus line of the alloy is 960 to 990 ° C. The inert atmosphere gas is preferably a nitrogen gas or an argon gas.
[0013]
Further, it is preferable to provide a thin plate portion thinner than the thickness of the metal member at the peripheral edge of the metal member. It is preferable that the thickness of the thin plate is 0.2 mm or less. Further, it is preferable that the metal member is processed in a predetermined shape in advance. Further, it is preferable to perform plating on the entire surface or a part of the metal member. Further, a metal-ceramics joined body can be used as an electronic member for resistance.
[0014]
Further, a metal-ceramic bonding body for an electronic member according to the present invention is a metal-ceramic bonding body comprising a ceramic substrate and a metal plate made of an alloy containing copper and nickel directly bonded to at least one surface of the ceramic substrate. The body is characterized in that the heat cycle resistance is 30 cycles or more, and the thickness of the metal plate is less than 0.4 mm. In the metal-ceramic bonding article for an electronic member, the alloy may include manganese.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
The embodiment of the method for manufacturing a metal-ceramic joined body according to the present invention relates to a method for manufacturing a metal-ceramic joined body in which a metal member made of an alloy containing copper and nickel is directly joined to at least one surface of a ceramic substrate. The method is characterized in that the metal member and the ceramic substrate are directly joined by heating to a temperature not lower than the solidus line and not higher than the liquidus line of the alloy in an active atmosphere gas.
[0016]
As the alloy containing copper and nickel, a manganin alloy or a constantan alloy used for current detection or the like is preferable. These alloys are all solid solutions, and have a composition having the largest volume resistivity and the smallest temperature coefficient of resistance, and are preferred as alloys for precision resistance.
[0017]
The ceramics mainly include oxide-based ceramics mainly composed of alumina and zirconia, non-oxide-based ceramics such as aluminum nitride and nitride-based silicon-nitride, and carbide-based ceramics such as SiC. Ceramics as a component can be used and are not particularly limited to oxide-based ceramics.
[0018]
The joining of the metal member and the ceramic substrate is preferably performed in an inert atmosphere gas such as nitrogen gas or argon gas. Since the joining can be performed in an inert atmosphere gas, a belt-type tunnel furnace or the like can be used, and the joined body can be continuously produced, and the productivity is high.
[0019]
The joining of the metal member and the ceramic substrate is performed by heating the alloy to a temperature not lower than the solidus and not higher than the liquidus. Particularly, a metal-ceramic bonded body used for precision resistance elements and the like is manufactured. In this case, it is preferable to carry out at a temperature not lower than the solidus of the alloy and not higher than 50 ° C. higher than the solidus of the alloy.
[0020]
Although the mechanism of this bonding is not clear, it is considered that the generation of the liquid phase in the solid-liquid coexisting phase wets the ceramic surface and leads to bonding. Therefore, when using a metal-ceramic joint as an electronic material, it is necessary to maintain the surface shape of the metal member, it is necessary not to generate an excessive liquid phase at a temperature closer to the solidus line, It is preferable to control the temperature to be equal to or higher than the solidus of the alloy and equal to or lower than 50 ° C. higher than the solidus of the alloy.
[0021]
When a metal member made of a manganin alloy, which is a material of the electronic member for precision resistance, is used, a preferable range of the joining temperature is 960 to 990 ° C, and a more preferable range is 960 to 980 ° C. For example, in the case of a manganin alloy containing 2% by weight of nickel and 12% by weight of manganese and the balance being copper and an unavoidable element, the temperature of the solidus is about 960 ° C. and the temperature of the liquidus is about It is 1000 ° C., and it is difficult to maintain a smooth surface of the metal member unless controlled in a narrow temperature range near the solidus.
[0022]
In the case of a metal member made of a manganin alloy, the plate thickness is preferably less than 0.4 mm, more preferably 0.2 mm or less. If the plate thickness is 0.4 mm or more, the ceramic substrate may be broken by the stress generated due to the difference in the coefficient of thermal expansion between the metal member and the ceramic substrate in joining. In order to reduce the thermal stress, it is preferable to gradually cool the metal member and the ceramic substrate after joining them without using a brazing material.
[0023]
When the thickness of the metal member made of manganin alloy is 0.4 mm or more, it is preferable to provide a thin plate at the end of the metal member, and it is preferable that the thickness of the thin plate is 0.2 mm or less. . Alloys such as manganin alloys have a higher 0.2% proof stress and higher residual stress applied to ceramic substrates than pure metals such as copper, so it is necessary to give due consideration to reliability. Because there is.
[0024]
As the reliability of electronic materials, heat cycle resistance is known. For example, room temperature → −40 ° C. × 30 minutes → room temperature × 10 minutes → 125 ° C. × 30 minutes → room temperature × 10 minutes Even after 30 repetitive heat cycles of one cycle, it is required that there is no cracking of the ceramic substrate or deterioration of electrical characteristics. When the thickness of the metal member is less than 0.4 mm, the conditions of these characteristics are satisfied.
[0025]
If the metal member is processed into a predetermined shape in advance, it is not necessary to perform post-processing. Therefore, it is preferable to bond the metal member to the ceramic substrate after processing the metal member into a predetermined shape by pressing or etching. Further, in order to facilitate soldering and prevent the metal member from changing with time, it is preferable to apply plating such as Ni plating or Ni alloy plating on the entire surface or a part of the surface of the metal member. This plating can be performed by electrolytic plating or electroless plating.
[0026]
Further, another type of metal member may be joined to the front and back of the ceramic substrate. For example, a copper member may be previously joined to one surface by a direct joining method, and a member made of a Cu-Ni-Mn alloy may be joined to the other surface. In this case, the copper member can be used as a heat sink.
[0027]
【Example】
Hereinafter, examples of the metal-ceramic bonding body and the method for manufacturing the same according to the present invention will be described in detail.
[0028]
[Example 1]
As shown in FIG. 1, a ceramic substrate 12 made of 96% alumina having a size of 45 mm × 67 mm × 0.635 mm is placed on a floor plate 10 made of alumina, and a size of 40 mm × 50 mm × 0.2 mm is placed on the upper surface thereof. The manganin plate 14 made of a 2Ni-12Mn-Cu alloy was directly arranged, placed in a belt-type tunnel furnace in which nitrogen gas was flown, heated at a maximum temperature of 975 ° C. for 10 minutes, and then cooled to form a metal-ceramic joint. Obtained. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0029]
[Example 2]
As shown in FIG. 2, a metal-ceramic bonded body was obtained in the same manner as in Example 1, except that the manganin plates 14 were directly arranged on both surfaces of the ceramic substrate 12 and mounted on the floor plate 10 via the spacers 16. Was. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0030]
[Example 3]
As shown in FIG. 3, a metal-ceramic joined body was obtained in the same manner as in Example 1, except that the manganin plate 14 was directly disposed on the lower surface of the ceramic substrate 12 and mounted on the floor plate 10 via the spacer 16. Was. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0031]
[Example 4]
A metal-ceramic joint was obtained in the same manner as in Example 1 except that the size of the manganin plate was 20 mm × 30 mm × 0.2 mm. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured. Furthermore, even after 30 repeated heat cycles of room temperature → −40 ° C. × 30 minutes → room temperature × 10 minutes → 125 ° C. × 30 minutes → room temperature × 10 minutes, there was no cracking of the ceramic substrate, There was no deterioration in characteristics.
[0032]
[Example 5]
A metal-ceramic joint was obtained in the same manner as in Example 1 except that the size of the manganin plate was 20 mm × 30 mm × 0.1 mm. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured. Furthermore, even after the same heat cycle as in Example 4 was performed 30 times, there was no crack in the ceramic substrate and no deterioration in the electrical characteristics.
[0033]
[Example 6]
A metal-ceramic joint was obtained in the same manner as in Example 1 except that the size of the manganin plate was 20 mm × 30 mm × 0.05 mm. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured. Furthermore, even after the same heat cycle as in Example 4 was performed 30 times, there was no crack in the ceramic substrate and no deterioration in the electrical characteristics.
[0034]
[Example 7]
A metal-ceramic joint was obtained in the same manner as in Example 4, except that an alumina substrate containing zirconia having a size of 45 mm × 67 mm × 0.25 mm was used as the ceramic substrate. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0035]
Example 8
A metal-ceramic joint was obtained in the same manner as in Example 5, except that an alumina substrate containing zirconia having a size of 45 mm × 67 mm × 0.25 mm was used as the ceramic substrate. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0036]
[Example 9]
A metal-ceramic joint was obtained in the same manner as in Example 6, except that an alumina substrate containing zirconia having a size of 45 mm × 67 mm × 0.25 mm was used as the ceramic substrate. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0037]
[Example 10]
A manganin plate having a thickness of 0.2 mm was processed into a predetermined shape by etching for a shunt resistor, and then directly disposed on an alumina substrate, and the maximum temperature was set to 980 ° C. -A ceramic joined body was obtained. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0038]
[Example 11]
A 0.2-manganin-thick plate was machined into a predetermined shape by etching for shunt resistance, and then directly placed on a zirconia-containing alumina substrate at a maximum temperature of 980 ° C., in the same manner as in Example 1, A metal-ceramic joint was obtained. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0039]
[Example 12]
Same as Example 1 except that a 1 mm portion of the outer periphery of a 20 mm × 30 mm × 0.4 mm manganin plate was machined to a thickness of 0.2 mm by etching, and then directly placed on an alumina substrate to a maximum temperature of 980 ° C. By the above method, a metal-ceramics joined body was obtained. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. In addition, there was no deterioration of the manganin plate, and an electronic component usable as a precision resistor could be manufactured.
[0040]
[Comparative example]
Metal-ceramic bonding was performed in the same manner as in Example 5, except that a silver solder containing titanium as an active metal was placed between the manganin plate and the alumina substrate, and bonding was performed in a vacuum at a bonding temperature of 850 ° C. Got a body. When the peel strength was measured for the metal-ceramic bonded article thus obtained, the peel strength was 5 kg / cm or more, and it was found that a sufficiently strong bond was obtained as an electronic member. However, the brazing filler metal diffused into the manganin plate and the manganin plate deteriorated, and could not be used as a resistor.
[0041]
【The invention's effect】
As described above, according to the present invention, a metal member and a ceramic substrate can be directly joined even when a eutectic melt is not generated, and the metal member and the ceramic substrate can be directly joined without using a molten metal. Can be joined. In addition, the metal-ceramic joined body manufactured by the method of the present invention is sufficiently firmly joined as an electronic member, maintains resistance characteristics as an alloy, and has sufficient reliability. It can be used for a shunt resistor used for measurement, a current detecting element in a hybrid integrated circuit, a temperature compensating circuit such as a strain gauge transducer, and the like. Furthermore, bonding can be performed in an inert atmosphere gas, and a continuous production using a tunnel furnace can provide a production method with high production efficiency.
[Brief description of the drawings]
FIG. 1 is a side view showing a step of directly joining a metal member to an upper surface of a ceramic substrate by a method of manufacturing a metal-ceramic joint according to the present invention.
FIG. 2 is a side view showing a step of directly joining metal members to both surfaces of a ceramic substrate by the method for producing a metal-ceramic joint according to the present invention.
FIG. 3 is a side view showing a step of directly joining a metal member to a lower surface of a ceramic substrate by a method of manufacturing a metal-ceramic joined body according to the present invention.
[Explanation of symbols]
Reference Signs List 10 base plate 12 ceramic substrate 14 manganin plate 16 spacer

Claims (14)

In a method for manufacturing a metal-ceramic joined body in which a metal member made of an alloy containing copper and nickel is directly joined to at least one surface of a ceramic substrate, a solidus line or more and a liquidus line or less of the alloy in an inert atmosphere gas. Wherein the metal member is directly joined to the ceramic substrate by heating the metal member to a temperature of the ceramic substrate. The method according to claim 1, wherein the alloy is a solid solution type alloy. The method according to claim 1, wherein the alloy contains manganese. 4. The alloy according to claim 3, wherein the alloy comprises 1.0 to 4.0% by weight of nickel and 10.0 to 13.0% by weight of manganese, with the balance being copper and unavoidable elements. 3. The method for producing a metal-ceramic bonded article according to item 1. The metal according to any one of claims 1 to 4, wherein the temperature not lower than the solidus and not higher than the liquidus of the alloy is not higher than 50 ° C higher than the solidus of the alloy. -A method for producing a ceramic joined body. The metal according to any one of claims 1 to 4, wherein the alloy is a manganin alloy, and the temperature of the alloy between the solidus temperature and the liquidus temperature is 960 to 990 ° C. -A method for producing a ceramic joined body. The method according to claim 1, wherein the inert atmosphere gas is a nitrogen gas or an argon gas. The method for manufacturing a metal-ceramic joined body according to any one of claims 1 to 7, wherein a thin plate portion thinner than the thickness of the metal member is provided at a peripheral portion of the metal member. The method according to claim 8, wherein the thickness of the thin plate portion is 0.2 mm or less. The method according to claim 1, wherein the metal member is processed into a predetermined shape in advance. The method according to claim 1, wherein plating is performed on an entire surface or a partial surface of the metal member. The method according to claim 1, wherein the metal-ceramic joint is an electronic member for resistance. In a metal-ceramic bonded body composed of a ceramic substrate and a metal plate made of an alloy containing copper and nickel directly bonded to at least one surface of the ceramic substrate, the metal has a heat cycle resistance of 30 cycles or more. A metal-ceramic joint for an electronic member, wherein the thickness of the plate is less than 0.4 mm. 14. The metal-ceramic joint according to claim 13, wherein the alloy contains manganese.

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