JP2004103814A - 発光ダイオード、その製造方法および白色照明装置 - Google Patents

発光ダイオード、その製造方法および白色照明装置 Download PDF

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Publication number
JP2004103814A
JP2004103814A JP2002263477A JP2002263477A JP2004103814A JP 2004103814 A JP2004103814 A JP 2004103814A JP 2002263477 A JP2002263477 A JP 2002263477A JP 2002263477 A JP2002263477 A JP 2002263477A JP 2004103814 A JP2004103814 A JP 2004103814A
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Japan
Prior art keywords
emitting diode
light emitting
led chip
phosphor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002263477A
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English (en)
Japanese (ja)
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JP2004103814A5 (enExample
Inventor
Takenori Yasuda
安田　剛規
Mineo Okuyama
奥山　峰夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2002263477A priority Critical patent/JP2004103814A/ja
Publication of JP2004103814A publication Critical patent/JP2004103814A/ja
Publication of JP2004103814A5 publication Critical patent/JP2004103814A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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JP2002263477A 2002-09-10 2002-09-10 発光ダイオード、その製造方法および白色照明装置 Pending JP2004103814A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002263477A JP2004103814A (ja) 2002-09-10 2002-09-10 発光ダイオード、その製造方法および白色照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002263477A JP2004103814A (ja) 2002-09-10 2002-09-10 発光ダイオード、その製造方法および白色照明装置

Related Child Applications (1)

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JP2008162339A Division JP2008227550A (ja) 2008-06-20 2008-06-20 発光ダイオード、その製造方法および白色照明装置

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JP2004103814A true JP2004103814A (ja) 2004-04-02
JP2004103814A5 JP2004103814A5 (enExample) 2005-10-27

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JP (1) JP2004103814A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007040107A1 (ja) * 2005-09-30 2007-04-12 Nitto Denko Corporation 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置
US7439668B2 (en) 2005-03-01 2008-10-21 Lumination Llc Oxynitride phosphors for use in lighting applications having improved color quality
CN100449802C (zh) * 2004-11-18 2009-01-07 皇家飞利浦电子股份有限公司 具有改善的调光性能的光源
KR101188566B1 (ko) * 2004-11-03 2012-10-05 트리도닉 예너스도르프 게엠베하 색변환재를 포함하는 발광다이오드 장치
TWI383519B (zh) * 2008-05-06 2013-01-21 Ching Wu Wang Preparation method of white light emitting diode and its fluorescent material for ultraviolet light and blue light excitation
CN102997081A (zh) * 2011-09-13 2013-03-27 优利德电球股份有限公司 发光二极管灯
CN104078548A (zh) * 2013-03-29 2014-10-01 易美芯光（北京）科技有限公司 一种全角度发光led白光光源及其制造方法
CN106784271A (zh) * 2016-11-24 2017-05-31 深圳市源磊科技有限公司 一种提升led灯亮度的方法与led灯

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101188566B1 (ko) * 2004-11-03 2012-10-05 트리도닉 예너스도르프 게엠베하 색변환재를 포함하는 발광다이오드 장치
CN100449802C (zh) * 2004-11-18 2009-01-07 皇家飞利浦电子股份有限公司 具有改善的调光性能的光源
US7439668B2 (en) 2005-03-01 2008-10-21 Lumination Llc Oxynitride phosphors for use in lighting applications having improved color quality
WO2007040107A1 (ja) * 2005-09-30 2007-04-12 Nitto Denko Corporation 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置
TWI383519B (zh) * 2008-05-06 2013-01-21 Ching Wu Wang Preparation method of white light emitting diode and its fluorescent material for ultraviolet light and blue light excitation
CN102997081A (zh) * 2011-09-13 2013-03-27 优利德电球股份有限公司 发光二极管灯
CN102997081B (zh) * 2011-09-13 2014-09-03 优利德电球股份有限公司 发光二极管灯
CN104078548A (zh) * 2013-03-29 2014-10-01 易美芯光（北京）科技有限公司 一种全角度发光led白光光源及其制造方法
CN106784271A (zh) * 2016-11-24 2017-05-31 深圳市源磊科技有限公司 一种提升led灯亮度的方法与led灯

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