JP2004099898A - つやのない表面を付与する熱可塑性組成物 - Google Patents
つやのない表面を付与する熱可塑性組成物 Download PDFInfo
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- JP2004099898A JP2004099898A JP2003317120A JP2003317120A JP2004099898A JP 2004099898 A JP2004099898 A JP 2004099898A JP 2003317120 A JP2003317120 A JP 2003317120A JP 2003317120 A JP2003317120 A JP 2003317120A JP 2004099898 A JP2004099898 A JP 2004099898A
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- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 229920001169 thermoplastic Polymers 0.000 title abstract description 11
- 239000004416 thermosoftening plastic Substances 0.000 title abstract description 11
- 229920001971 elastomer Polymers 0.000 claims abstract description 57
- 239000005060 rubber Substances 0.000 claims abstract description 57
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 32
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 18
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 11
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 14
- 238000009757 thermoplastic moulding Methods 0.000 claims description 11
- 125000003277 amino group Chemical group 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 23
- 239000011347 resin Substances 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 13
- 238000002156 mixing Methods 0.000 abstract description 9
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 238000010348 incorporation Methods 0.000 abstract description 4
- 239000000376 reactant Substances 0.000 abstract description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 27
- -1 alkyl methacrylate Chemical compound 0.000 description 23
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 22
- 229920000638 styrene acrylonitrile Polymers 0.000 description 21
- 239000000178 monomer Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 11
- 150000003141 primary amines Chemical group 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- 125000005250 alkyl acrylate group Chemical group 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 229920000578 graft copolymer Polymers 0.000 description 5
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Substances ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MOYAFQVGZZPNRA-UHFFFAOYSA-N Terpinolene Chemical compound CC(C)=C1CCC(C)=CC1 MOYAFQVGZZPNRA-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 2
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000120 polyethyl acrylate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 2
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- LGXVIGDEPROXKC-UHFFFAOYSA-N 1,1-dichloroethene Chemical class ClC(Cl)=C LGXVIGDEPROXKC-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- ACYXOHNDKRVKLH-UHFFFAOYSA-N 5-phenylpenta-2,4-dienenitrile prop-2-enoic acid Chemical compound OC(=O)C=C.N#CC=CC=CC1=CC=CC=C1 ACYXOHNDKRVKLH-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- YAAQEISEHDUIFO-UHFFFAOYSA-N C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 Chemical compound C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 YAAQEISEHDUIFO-UHFFFAOYSA-N 0.000 description 1
- BGQAZAHWMRSYGG-UHFFFAOYSA-N CCCCO.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O Chemical compound CCCCO.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O BGQAZAHWMRSYGG-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- BRDWIEOJOWJCLU-LTGWCKQJSA-N GS-441524 Chemical compound C=1C=C2C(N)=NC=NN2C=1[C@]1(C#N)O[C@H](CO)[C@@H](O)[C@H]1O BRDWIEOJOWJCLU-LTGWCKQJSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 description 1
- 125000000217 alkyl group Chemical class 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000002902 bimodal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- QSMOHLASMMAGIB-UHFFFAOYSA-N butyl prop-2-enoate;prop-2-enenitrile Chemical compound C=CC#N.CCCCOC(=O)C=C QSMOHLASMMAGIB-UHFFFAOYSA-N 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 150000008422 chlorobenzenes Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- AFOSIXZFDONLBT-UHFFFAOYSA-N divinyl sulfone Chemical compound C=CS(=O)(=O)C=C AFOSIXZFDONLBT-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012039 electrophile Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- UMORIIZQJQHCBX-UHFFFAOYSA-N furan-2,5-dione;methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 UMORIIZQJQHCBX-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- ABTNKPAZMOYEAS-UHFFFAOYSA-N oxo-bis(prop-2-enoxy)phosphanium Chemical compound C=CCO[P+](=O)OCC=C ABTNKPAZMOYEAS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000013031 physical testing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
Abstract
【解決手段】 この組成物は、(I)(a)グラフト相を含有しないことを特徴とする(コ)ポリアルキル(メタ)アクリレートゴム、(b)ポリ(ビニル芳香族−コ−ニトリル)グラフト(コ)ポリアルキル(メタ)アクリレートゴム、及び(c)ポリ(ビニル芳香族−コ−ニトリル)を含有する樹脂状成分、及び(II)(d)分子当たり2個以上の無水マレイン酸基を有する化合物と(e)分子当たり2個以上の末端一級アミン基を有する化合物の反応生成物であるが、但し、分子当たりの無水マレイン酸基と分子当たりの末端の一級アミン官能基の合計が4よりも大きい光沢低減剤を含有する。本発明の組成物の中へのこの光沢低減剤の組み込みは、本発明の光沢低減剤の系内での生成を引き起こすように設計された工程条件下で溶融樹脂成分中にこの反応生成物をブレンドするか、あるいは代替策として、反応物(d)及び(e)をブレンドする方法により行なうことができる。
【選択図】 なし
Description
(a)グラフト相を含有しないことを特徴とする(コ)ポリアルキル(メタ)アクリレートゴム、
(b)ポリ(ビニル芳香族−コ−ニトリル)グラフトの(コ)ポリアルキル(メタ)アクリレートゴム、及び
(c)ポリ(ビニル芳香族−コ−ニトリル)
を含有する樹脂成分、並びに
(d)分子当たり2個以上の無水マレイン酸基を有する化合物と
(e)分子当たり2個以上の末端一級アミン基を有する化合物
の反応生成物であるが、但し、分子当たりの無水マレイン酸基と分子当たりの末端の一級アミン官能基の合計が4よりも大きい光沢低減剤(gloss reducing agent)を含有する。本発明の組成物中へのこの光沢低減剤の組み込みは、本発明の光沢低減剤の系内での生成を引き起こすように設計された工程条件下で溶融樹脂成分中にこの反応生成物をブレンドするか、あるいは代替策として、反応物(d)及び(e)をブレンドする方法により行うことができる。
(I)(a)場合によっては架橋されていてもよい、非グラフトの(コ)ポリアルキル(メタ)アクリレートゴム、好ましくはポリブチル(メタ)アクリレートゴム、(b)ポリアルキル(メタ)アクリレート、好ましくはポリブチル(メタ)アクリレートとそれにグラフトされた相(本明細書では、グラフト相)の基材(substrate)であって、この基材はホモポリマー形あるいはコポリマー形であってもよく、このグラフト相がポリ(ビニル芳香族の−コ−ニトリル)、好ましくはスチレン−アクリロニトリル(SAN)を含むものを含有する、場合によっては架橋されていてもよいグラフトゴム、及び
(c)ポリ(ビニル芳香族−コ−ニトリル)、好ましくは約50,000ないし200,000の、好ましくは80,000ないし150,000g/モルの重量平均分子量を有するスチレン−アクリロニトリル(SAN)
を包含する樹脂成分と
(II)(d)分子当たり2個以上の無水マレイン酸基を有する化合物と
(e)分子当たり2個以上の末端一級アミン基を有する化合物
の反応生成物
である光沢低減剤
を含んでなる。
(d)分子当たり2個以上の無水マレイン酸基を有する化合物と
(e)分子当たり2個以上の末端一級アミン基(分子当たり1.8個以上の平均アミン官能性)を有する化合物
との反応生成物である。
溶融温度−ダイから出た時の押し出されたシートの表面温度の直接測定(IRメーターを用いた);
押出し圧力−押し出し機バレルの末端近くでのオンライン圧力測定;
MFI−ASTMD1238に従って10kgの荷重下230℃で求めたg/10分でのメルトフローインデックス;
粘度−Kayeness毛細管レオメーターを使用して、ASTMD3835に従って100 1/秒、220℃で粘度を評価した;
光沢(85°)−押し出されたシート上でASTMD523に示されている方法に従ってガードナー光沢メーターを用いて室温で測定、流れ方向に対して垂直及び平行の両方の配向における測定であった。
A−1:SANグラフトの架橋されたポリ(ブチルアクリレート−アクリロニトリル)ゴム;このゴムは単頂(monomodal)の粒径分布を有し、平均粒径は0.15ミクロンであった。グラフトSANに対するゴムの重量比は100:60であった。アクリロニトリルに対するスチレンの重量比は約70/30であった。A−1は、約12%のSAN(このSANのアクリロニトリル含量は23%であり、そして分子量(数平均)は47,000gm/モルであった)を含有していた。A−1のゴムの量は約55%であった。
A−2:0.4と0.15ミクロンの2頂(bimodal)モードの粒径分布を有する2種のSANグラフトのブチルアクリレートゴムのブレンドである。
ゴムのコア/シェル構造(スチレンコアと架橋されたポリ(ブチルアクリレートシェル)は本発見に重要でないと考えられる。グラフトSANに対するゴムの重量比は約100:80であった。アクリロニトリルに対するスチレンの重量比は約70/30であった。ゴム含量は約55重量%である。
A−3:SANグラフトのアクリレートゴム(このグラフトSANに対するこのゴムの重量比は約100:60であった)、44%;非グラフトアクリレートゴム、27.5%;及びSAN、28.5%(23%AN、47,000g/モルの数平均分子量)のブレンド。このゴムの粒径は0.15ミクロンであり、ゴムの量は55%であった(グラフト部(a)と非グラフト部(b)の両方におけるゴムは6重量%のアクリロニトリルを含むブチルアクリレートであった)。
(b)ポリ(ビニル芳香族−コ−ニトリル)−グラフト(コ)ポリアルキル(メタ)アクリレートゴム、及び
(c)ポリ(ビニル芳香族−コ−ニトリル)
を含有する樹脂成分、並びに
(II)(d)分子当たり2個以上の無水マレイン酸基を有する化合物と
(e)分子当たり2個以上の末端一級アミン基を有する化合物
の反応生成物であるが、但し分子当たりの無水マレイン酸基と分子当たりの末端の一級アミン官能基の合計が4よりも大きい光沢低減剤
を含んでなる熱可塑性成形組成物。
Claims (4)
- (I)(a)グラフト相を含有しないことを特徴とする(コ)ポリアルキル(メタ)アクリレートゴム、
(b)ポリ(ビニル芳香族−コ−ニトリル)−グラフト(コ)ポリアルキル(メタ)アクリレートゴム、及び
(c)ポリ(ビニル芳香族−コ−ニトリル)
を含有する樹脂成分、並びに
(II)(d)分子当たり2個以上の無水マレイン酸基を有する化合物と
(e)分子当たり2個以上の末端一級アミン基を有する化合物
の反応生成物であるが、但し分子当たりの無水マレイン酸基と分子当たりの末端の一級アミン官能基の合計が4よりも大きい光沢低減剤
を含んでなる熱可塑性成形組成物。 - (コ)ポリアルキル(メタ)アクリレートゴムが該組成物の重量に対して10ないし40%の量で該組成物中に存在する請求項1の組成物。
- (a)+(b)の合計に対する(a)の比が0.1ないし0.8であるように(a)と(b)の量が重量で関係付けられる請求項1の組成物。
- 該a(コ)ポリアルキル(メタ)アクリレートゴムの粒径(重量平均粒径)が0.02ないし10ミクロンである請求項1の組成物。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/241,598 US6812282B2 (en) | 2002-09-10 | 2002-09-10 | Thermoplastic compositions providing matt surface |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004099898A true JP2004099898A (ja) | 2004-04-02 |
Family
ID=31887753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003317120A Pending JP2004099898A (ja) | 2002-09-10 | 2003-09-09 | つやのない表面を付与する熱可塑性組成物 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6812282B2 (ja) |
EP (1) | EP1398348B1 (ja) |
JP (1) | JP2004099898A (ja) |
CN (1) | CN1315940C (ja) |
CA (1) | CA2439782A1 (ja) |
DE (1) | DE60307389T2 (ja) |
ES (1) | ES2269888T3 (ja) |
HK (1) | HK1067653A1 (ja) |
MX (1) | MXPA03007955A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010106249A (ja) * | 2008-10-29 | 2010-05-13 | Cheil Industries Inc | 低光沢性耐候性熱可塑性樹脂およびその製造方法 |
US7834376B2 (en) | 2005-03-04 | 2010-11-16 | Siliconix Technology C. V. | Power semiconductor switch |
US8368165B2 (en) | 2005-10-20 | 2013-02-05 | Siliconix Technology C. V. | Silicon carbide Schottky diode |
US9412880B2 (en) | 2004-10-21 | 2016-08-09 | Vishay-Siliconix | Schottky diode with improved surge capability |
US9419092B2 (en) | 2005-03-04 | 2016-08-16 | Vishay-Siliconix | Termination for SiC trench devices |
US9496421B2 (en) | 2004-10-21 | 2016-11-15 | Siliconix Technology C.V. | Solderable top metal for silicon carbide semiconductor devices |
US9627552B2 (en) | 2006-07-31 | 2017-04-18 | Vishay-Siliconix | Molybdenum barrier metal for SiC Schottky diode and process of manufacture |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7557158B2 (en) * | 2004-09-15 | 2009-07-07 | Rohm And Haas Company | Gloss reducing polymer composition |
JP4699031B2 (ja) * | 2005-01-13 | 2011-06-08 | 日東電工株式会社 | 粘着製品および粘着製品用基材 |
US8222351B2 (en) * | 2007-02-12 | 2012-07-17 | Sabic Innovative Plastics Ip B.V. | Low gloss polycarbonate compositions |
US8222350B2 (en) * | 2007-02-12 | 2012-07-17 | Sabic Innovative Plastics Ip B.V. | Low gloss polycarbonate compositions |
KR101531613B1 (ko) * | 2011-11-24 | 2015-06-25 | 제일모직 주식회사 | 열가소성 수지 조성물 및 이를 이용한 성형품 |
CN106810809B (zh) | 2016-12-26 | 2019-03-29 | 上海锦湖日丽塑料有限公司 | 超低光泽、超耐低温asa树脂组合物及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5688460A (en) | 1979-11-26 | 1981-07-17 | Mitsubishi Rayon Co Ltd | Matte thermoplastic resin composition |
US4894416A (en) | 1988-12-27 | 1990-01-16 | General Electric Company | Low gloss thermoplastic blends |
TW222660B (ja) | 1992-02-25 | 1994-04-21 | Gen Electric | |
DE4221293A1 (de) | 1992-06-29 | 1994-01-05 | Basf Ag | Formmasse mit matter Oberfläche |
US5990239A (en) | 1997-04-16 | 1999-11-23 | Bayer Corporation | Weatherable ASA composition |
DE69809129T2 (de) | 1997-06-12 | 2003-07-17 | Gen Electric | Thermoplastische Harzzusammensetzung mit geringem Glanz |
CA2244138A1 (en) | 1997-12-29 | 1999-06-29 | Klaus Muehlbach | Styrene copolymer compositions having reduced surface gloss and composite articles incorporating same |
US6395828B1 (en) | 2001-09-26 | 2002-05-28 | Bayer Corporation | Low gloss ASA resin |
-
2002
- 2002-09-10 US US10/241,598 patent/US6812282B2/en not_active Expired - Fee Related
-
2003
- 2003-09-02 DE DE60307389T patent/DE60307389T2/de not_active Expired - Fee Related
- 2003-09-02 EP EP03019559A patent/EP1398348B1/en not_active Expired - Fee Related
- 2003-09-02 ES ES03019559T patent/ES2269888T3/es not_active Expired - Lifetime
- 2003-09-04 MX MXPA03007955A patent/MXPA03007955A/es active IP Right Grant
- 2003-09-05 CA CA002439782A patent/CA2439782A1/en not_active Abandoned
- 2003-09-09 JP JP2003317120A patent/JP2004099898A/ja active Pending
- 2003-09-10 CN CNB031255248A patent/CN1315940C/zh not_active Expired - Fee Related
-
2005
- 2005-01-04 HK HK05100031A patent/HK1067653A1/xx not_active IP Right Cessation
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9412880B2 (en) | 2004-10-21 | 2016-08-09 | Vishay-Siliconix | Schottky diode with improved surge capability |
US9496421B2 (en) | 2004-10-21 | 2016-11-15 | Siliconix Technology C.V. | Solderable top metal for silicon carbide semiconductor devices |
US7834376B2 (en) | 2005-03-04 | 2010-11-16 | Siliconix Technology C. V. | Power semiconductor switch |
US9419092B2 (en) | 2005-03-04 | 2016-08-16 | Vishay-Siliconix | Termination for SiC trench devices |
US9472403B2 (en) | 2005-03-04 | 2016-10-18 | Siliconix Technology C.V. | Power semiconductor switch with plurality of trenches |
US8368165B2 (en) | 2005-10-20 | 2013-02-05 | Siliconix Technology C. V. | Silicon carbide Schottky diode |
US9627553B2 (en) | 2005-10-20 | 2017-04-18 | Siliconix Technology C.V. | Silicon carbide schottky diode |
US9627552B2 (en) | 2006-07-31 | 2017-04-18 | Vishay-Siliconix | Molybdenum barrier metal for SiC Schottky diode and process of manufacture |
JP2010106249A (ja) * | 2008-10-29 | 2010-05-13 | Cheil Industries Inc | 低光沢性耐候性熱可塑性樹脂およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1315940C (zh) | 2007-05-16 |
HK1067653A1 (en) | 2005-04-15 |
MXPA03007955A (es) | 2004-10-15 |
DE60307389T2 (de) | 2007-08-23 |
US6812282B2 (en) | 2004-11-02 |
CA2439782A1 (en) | 2004-03-10 |
DE60307389D1 (de) | 2006-09-21 |
ES2269888T3 (es) | 2007-04-01 |
US20040048980A1 (en) | 2004-03-11 |
EP1398348A1 (en) | 2004-03-17 |
EP1398348B1 (en) | 2006-08-09 |
CN1511875A (zh) | 2004-07-14 |
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