JP2004071796A5 - - Google Patents

Download PDF

Info

Publication number
JP2004071796A5
JP2004071796A5 JP2002228502A JP2002228502A JP2004071796A5 JP 2004071796 A5 JP2004071796 A5 JP 2004071796A5 JP 2002228502 A JP2002228502 A JP 2002228502A JP 2002228502 A JP2002228502 A JP 2002228502A JP 2004071796 A5 JP2004071796 A5 JP 2004071796A5
Authority
JP
Japan
Prior art keywords
substrate
reactor
processed
holding container
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002228502A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004071796A (ja
JP3897167B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002228502A priority Critical patent/JP3897167B2/ja
Priority claimed from JP2002228502A external-priority patent/JP3897167B2/ja
Publication of JP2004071796A publication Critical patent/JP2004071796A/ja
Publication of JP2004071796A5 publication Critical patent/JP2004071796A5/ja
Application granted granted Critical
Publication of JP3897167B2 publication Critical patent/JP3897167B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002228502A 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法 Expired - Lifetime JP3897167B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002228502A JP3897167B2 (ja) 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002228502A JP3897167B2 (ja) 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2004071796A JP2004071796A (ja) 2004-03-04
JP2004071796A5 true JP2004071796A5 (https=) 2005-10-13
JP3897167B2 JP3897167B2 (ja) 2007-03-22

Family

ID=32015167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002228502A Expired - Lifetime JP3897167B2 (ja) 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP3897167B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088401A (ja) * 2005-08-25 2007-04-05 Tokyo Electron Ltd 基板処理装置，基板処理方法，プログラム，プログラムを記録した記録媒体
JP4942174B2 (ja) * 2006-10-05 2012-05-30 東京エレクトロン株式会社 基板処理システムの処理レシピ最適化方法，基板処理システム，基板処理装置
JP2017055036A (ja) * 2015-09-11 2017-03-16 株式会社東芝 半導体装置製造システムおよび半導体装置の製造方法
JP6785699B2 (ja) * 2017-03-28 2020-11-18 東京エレクトロン株式会社 基板処理システム及び制御装置

Similar Documents

Publication Publication Date Title
JP2005522585A5 (https=)
TWI643684B (zh) 淨化倉儲及淨化方法
US9177850B2 (en) Substrate carrying mechanism, substrate processing apparatus, and semiconductor device manufacturing method
JP2011530003A5 (https=)
JP2008502134A5 (https=)
JP2009283699A5 (https=)
JP2017098279A (ja) ウエハボート支持台及びこれを用いた熱処理装置
JP2004071796A5 (https=)
CN211017026U (zh) 晶圆湿处理工作站
TWI710017B (zh) 晶圓濕處理工作站
CN107346757A (zh) 传输腔室及半导体加工设备
CN208767258U (zh) 基板移送装置
JP2012084574A5 (https=)
JP2006086534A5 (https=)
WO2008102603A1 (ja) 基板処理装置および基板処理方法
CN102435058B (zh) 干燥设备、去光阻设备及干燥方法
TW200636808A (en) Novel semicoductor wafer lifter
TW200717643A (en) Substrate process apparatus, chemical oxide remove process module and substrate lifting apparatus
JP4358690B2 (ja) 縦型熱処理装置及びその運用方法
JP2012049349A5 (ja) 基板処理装置及び半導体装置の製造方法
KR20150059704A (ko) 설비 전방 단부 모듈
JPH0661331A (ja) 基板搬送装置
JPH1140509A5 (ja) 半導体製造装置
JP2006086180A5 (https=)
TWD234071S (zh) 基板處理裝置