JP3897167B2 - 縦型半導体製造装置および半導体デバイスの製造方法 - Google Patents

縦型半導体製造装置および半導体デバイスの製造方法 Download PDF

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Publication number
JP3897167B2
JP3897167B2 JP2002228502A JP2002228502A JP3897167B2 JP 3897167 B2 JP3897167 B2 JP 3897167B2 JP 2002228502 A JP2002228502 A JP 2002228502A JP 2002228502 A JP2002228502 A JP 2002228502A JP 3897167 B2 JP3897167 B2 JP 3897167B2
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substrate
reactor
sequence
reaction furnace
maintenance
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Expired - Lifetime
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JP2002228502A
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Japanese (ja)
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JP2004071796A5 (https=
JP2004071796A (ja
Inventor
秀之 塚本
真一 島田
克尚 笠次
敏光 宮田
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Publication of JP2004071796A5 publication Critical patent/JP2004071796A5/ja
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2002228502A 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法 Expired - Lifetime JP3897167B2 (ja)

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JP2002228502A JP3897167B2 (ja) 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法

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JP2002228502A JP3897167B2 (ja) 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法

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JP2004071796A JP2004071796A (ja) 2004-03-04
JP2004071796A5 JP2004071796A5 (https=) 2005-10-13
JP3897167B2 true JP3897167B2 (ja) 2007-03-22

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JP2002228502A Expired - Lifetime JP3897167B2 (ja) 2002-08-06 2002-08-06 縦型半導体製造装置および半導体デバイスの製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088401A (ja) * 2005-08-25 2007-04-05 Tokyo Electron Ltd 基板処理装置，基板処理方法，プログラム，プログラムを記録した記録媒体
JP4942174B2 (ja) * 2006-10-05 2012-05-30 東京エレクトロン株式会社 基板処理システムの処理レシピ最適化方法，基板処理システム，基板処理装置
JP2017055036A (ja) * 2015-09-11 2017-03-16 株式会社東芝 半導体装置製造システムおよび半導体装置の製造方法
JP6785699B2 (ja) * 2017-03-28 2020-11-18 東京エレクトロン株式会社 基板処理システム及び制御装置

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