JP2004071565A - 静電気放電防止機能を設ける方法およびエッジコネクタならびにそれを使用するデジタルカメラ - Google Patents

静電気放電防止機能を設ける方法およびエッジコネクタならびにそれを使用するデジタルカメラ Download PDF

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Publication number
JP2004071565A
JP2004071565A JP2003283714A JP2003283714A JP2004071565A JP 2004071565 A JP2004071565 A JP 2004071565A JP 2003283714 A JP2003283714 A JP 2003283714A JP 2003283714 A JP2003283714 A JP 2003283714A JP 2004071565 A JP2004071565 A JP 2004071565A
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JP
Japan
Prior art keywords
contact
connector
edge
circuit board
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003283714A
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English (en)
Japanese (ja)
Other versions
JP2004071565A5 (https=
Inventor
Ted Ziemkowski
テッド ジームコウスキー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2004071565A publication Critical patent/JP2004071565A/ja
Publication of JP2004071565A5 publication Critical patent/JP2004071565A5/ja
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257Overvoltage protection
    • H05K1/0259Electrostatic discharge [ESD] protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485Electrostatic discharge protection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09354Ground conductor along edge of main surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/094Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09618Via fence, i.e. one-dimensional array of vias
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/951PCB having detailed leading edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
JP2003283714A 2002-07-31 2003-07-31 静電気放電防止機能を設ける方法およびエッジコネクタならびにそれを使用するデジタルカメラ Withdrawn JP2004071565A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/209,136 US6804119B2 (en) 2002-07-31 2002-07-31 Method and edge connector providing electrostatic discharge arrest features and digital camera employing same

Publications (2)

Publication Number Publication Date
JP2004071565A true JP2004071565A (ja) 2004-03-04
JP2004071565A5 JP2004071565A5 (https=) 2006-09-07

Family

ID=30115216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003283714A Withdrawn JP2004071565A (ja) 2002-07-31 2003-07-31 静電気放電防止機能を設ける方法およびエッジコネクタならびにそれを使用するデジタルカメラ

Country Status (4)

Country Link
US (1) US6804119B2 (https=)
EP (1) EP1387445B1 (https=)
JP (1) JP2004071565A (https=)
DE (1) DE60301099T2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12150231B2 (en) 2022-09-06 2024-11-19 International Business Machines Corporation Stored energy discharge tool for component protection

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US20050122645A1 (en) * 2003-12-04 2005-06-09 Industrial Technology Research Institute ESD protection design against charge-device model ESD events
JP4564321B2 (ja) * 2004-09-30 2010-10-20 株式会社東芝 カード型電子機器
US7948772B2 (en) * 2006-07-04 2011-05-24 Orient Semiconductor Electronics Memory card with electrostatic discharge protection and manufacturing method thereof
TWI301984B (en) * 2006-07-04 2008-10-11 Orient Semiconductor Elect Ltd Memory card with electrostatic discharge protection
JP2010003290A (ja) * 2008-05-22 2010-01-07 Panasonic Corp リムーバブルメモリカード
EP2479231B1 (en) * 2009-02-13 2020-07-08 Avery Dennison Corporation Adhesive compounds
US8289727B2 (en) * 2010-06-11 2012-10-16 Taiwan Semiconductor Manufacturing Company, Ltd. Package substrate
KR20130084033A (ko) * 2012-01-16 2013-07-24 삼성전자주식회사 반도체 모듈용 인쇄회로 기판
US9863616B2 (en) * 2012-01-30 2018-01-09 Bridgelux Inc. Circuit board for LED applications
USD730907S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD730910S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD730908S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD727913S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
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USD727911S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD729251S1 (en) * 2014-06-27 2015-05-12 Samsung Electronics Co., Ltd. Memory card
USD730909S1 (en) * 2014-06-27 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736214S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736215S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD727910S1 (en) * 2014-07-02 2015-04-28 Samsung Electronics Co., Ltd. Memory card
KR20160141585A (ko) * 2015-06-01 2016-12-09 삼성전자주식회사 메모리 카드 어댑터
USD783622S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD783621S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
JP7203653B2 (ja) * 2019-03-20 2023-01-13 キオクシア株式会社 ストレージデバイスおよび情報処理装置
TWM595899U (zh) * 2019-12-06 2020-05-21 貿聯國際股份有限公司 電路板結構及具有該電路板結構的連接器

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12150231B2 (en) 2022-09-06 2024-11-19 International Business Machines Corporation Stored energy discharge tool for component protection

Also Published As

Publication number Publication date
DE60301099T2 (de) 2006-06-01
EP1387445B1 (en) 2005-07-27
EP1387445A1 (en) 2004-02-04
US6804119B2 (en) 2004-10-12
US20040022030A1 (en) 2004-02-05
DE60301099D1 (de) 2005-09-01

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