JP2004064082A5 - - Google Patents

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Publication number
JP2004064082A5
JP2004064082A5 JP2003207767A JP2003207767A JP2004064082A5 JP 2004064082 A5 JP2004064082 A5 JP 2004064082A5 JP 2003207767 A JP2003207767 A JP 2003207767A JP 2003207767 A JP2003207767 A JP 2003207767A JP 2004064082 A5 JP2004064082 A5 JP 2004064082A5
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JP
Japan
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JP2003207767A
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Japanese (ja)
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JP2004064082A (ja
JP4819304B2 (ja
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Priority to JP2003207767A priority Critical patent/JP4819304B2/ja
Priority claimed from JP2003207767A external-priority patent/JP4819304B2/ja
Publication of JP2004064082A publication Critical patent/JP2004064082A/ja
Publication of JP2004064082A5 publication Critical patent/JP2004064082A5/ja
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Publication of JP4819304B2 publication Critical patent/JP4819304B2/ja
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Expired - Lifetime legal-status Critical Current

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JP2003207767A 2000-10-18 2003-08-18 半導体パッケージ Expired - Lifetime JP4819304B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003207767A JP4819304B2 (ja) 2000-10-18 2003-08-18 半導体パッケージ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000318449 2000-10-18
JP2000318449 2000-10-18
JP2003207767A JP4819304B2 (ja) 2000-10-18 2003-08-18 半導体パッケージ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001265802A Division JP3546961B2 (ja) 2000-10-18 2001-09-03 半導体装置搭載用配線基板およびその製造方法、並びに半導体パッケージ

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2005010033A Division JP4345679B2 (ja) 2000-10-18 2005-01-18 半導体装置搭載用配線基板の製造方法
JP2007257730A Division JP2008047936A (ja) 2000-10-18 2007-10-01 半導体パッケージおよびその製造方法
JP2008295444A Division JP5029581B2 (ja) 2000-10-18 2008-11-19 半導体パッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2004064082A JP2004064082A (ja) 2004-02-26
JP2004064082A5 true JP2004064082A5 (xx) 2005-08-25
JP4819304B2 JP4819304B2 (ja) 2011-11-24

Family

ID=31948897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003207767A Expired - Lifetime JP4819304B2 (ja) 2000-10-18 2003-08-18 半導体パッケージ

Country Status (1)

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JP (1) JP4819304B2 (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4434845B2 (ja) 2004-06-08 2010-03-17 三洋電機株式会社 半導体モジュールとその製造方法および半導体装置
JP3961537B2 (ja) 2004-07-07 2007-08-22 日本電気株式会社 半導体搭載用配線基板の製造方法、及び半導体パッケージの製造方法
JP2006186321A (ja) 2004-12-01 2006-07-13 Shinko Electric Ind Co Ltd 回路基板の製造方法及び電子部品実装構造体の製造方法
JP4619223B2 (ja) 2004-12-16 2011-01-26 新光電気工業株式会社 半導体パッケージ及びその製造方法
JP5653144B2 (ja) * 2004-12-16 2015-01-14 新光電気工業株式会社 半導体パッケージの製造方法
JP2008084959A (ja) * 2006-09-26 2008-04-10 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
KR101360600B1 (ko) * 2007-02-05 2014-02-10 엘지이노텍 주식회사 수동소자의 솔더링 실장을 위한 구조를 가지는인쇄회로기판과 인쇄회로기판을 이용한 피씨비 카드 및그의 제조방법
JP4800253B2 (ja) 2007-04-04 2011-10-26 新光電気工業株式会社 配線基板の製造方法
JP5101451B2 (ja) 2008-10-03 2012-12-19 新光電気工業株式会社 配線基板及びその製造方法
CN112831776A (zh) * 2021-02-08 2021-05-25 福州大学 一种3-3型陶瓷-聚合物介电复合材料金属化的方法

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