JP2004064013A - Cap sealing method of package for electronic component - Google Patents

Cap sealing method of package for electronic component Download PDF

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Publication number
JP2004064013A
JP2004064013A JP2002223750A JP2002223750A JP2004064013A JP 2004064013 A JP2004064013 A JP 2004064013A JP 2002223750 A JP2002223750 A JP 2002223750A JP 2002223750 A JP2002223750 A JP 2002223750A JP 2004064013 A JP2004064013 A JP 2004064013A
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Japan
Prior art keywords
cap
base
electronic component
sealing
peripheral end
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Pending
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JP2002223750A
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Japanese (ja)
Inventor
Osamu Eguchi
江口　治
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Priority to JP2002223750A priority Critical patent/JP2004064013A/en
Publication of JP2004064013A publication Critical patent/JP2004064013A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

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  • Casings For Electric Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cap sealing method of a package for an electronic component such as a quartz device or a semiconductor, capable of preventing a sealing agent used for sealing from entering the mounting/housing space for components, for continuously maintaining an atmosphere, resulting in suppressed degradation in characteristics of a housed electronic component to improve reliability as an electronic component. <P>SOLUTION: A cap 3 has a space for housing/protecting an electronic component 2, a flat part 3a formed at a peripheral end part, and a protruding part 3b integrally formed on a surface joining the peripheral end part of a base 1 of the flat part 3a. The cap 3 is capped over the base 1 where a sealing agent 4 is applied on the peripheral end part. Then it is heated to melt the sealing agent 4, so that the peripheral end part of the base 1 is bonded to the flat end part 3a and the protruding part 3b of the cap 3. The protruding part 3b prevents, when the sealing agent 4 melts, the melted sealing agent 4 from flowing to a housing space S side where the electronic component is mounted. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、水晶デバイスや半導体などの電子部品を搭載したベ−スと、そのベ−スに被せて電子部品を保護する空間を形成するとともに、その周辺端部がベ−ス周辺端部と接触するキャップとの間をシ−ル剤を用いて接合し、電子部品を封止する電子部品用パッケ−ジのキャップ封止方法に関する。
【０００２】
【従来の技術】
図２は、従来のこの種のパッケ−ジのキャップ封止方法の第１の例を説明する図であり、図２（ａ）はその主要部断面図であり、図２（ｂ）はその封止後の状態を説明するための主要部断面図である。以下、図を用いて説明する。
【０００３】
図２において、２１は電子部品２２を搭載したベ−スであり、２３は電子部品２２を覆い保護する格納空間Ｓを有するキャップである。また、２４は導電性を備えたシ−ル剤で、ベ−ス２１とキャップ２３を接合して、電子部品２２を封止して格納空間Ｓの気密性を維持し、雰囲気の継続保持を実現している。
【０００４】
図３は、従来のこの種のパッケ−ジのキャップ封止方法の第２の例を説明する図であって、その封止状態を説明するための主要部断面図である。以下、図を用いて説明する。
【０００５】
図３において、３１は電子部品３２を搭載したベ−スであり、３３は電子部品３２を覆い保護する格納空間Ｓを有するキャップである。また、３４はベ−ス３１とキャップ３３を接合するシ−ル剤で、電子部品３２を封止して格納空間Ｓの気密性を維持し、雰囲気の継続保持を実現している。この例では、キャップ３３の周辺端部には、先が尖った突起部３３ａが形成されている。
この場合には、封止方法にもよるが、突起部３３ａの多くは金属で形成され、封止時にこの金属突起部３３ａを対面するベ−ス３１に食い込ませることによって、第１の例と比較してシ−ル剤３４の格納空間Ｓへの進入を防ぎ、気密状態の維持を向上させている。
【０００６】
【発明が解決しようとする課題】
上記第１の従来例の場合では、封止時にシ−ル剤２４を溶かし、接合することになるが、その際、キャップ２３上からの圧力の加減によって、図２（ｂ）に示すように、シ−ル剤２４がはみ出すことがある。外側にはみ出した場合には、電子部品としての特性に影響を与えることはないが、内側にはみ出し、換言すると一部のシ−ル剤２４ａが部品の格納空間Ｓに進入した場合には、格納している電子部品２２の特性に影響を与えることになる。即ち、シ−ル剤の欠損を招き十分な封止状態が保証出来なくなり、結果として電子部品格納空間Ｓの所期の気密状態が維持出来ず、雰囲気の継続保持が困難となり、電子部品２２の特性劣化を招くことになるのである。
【０００７】
また、上記第２の従来例の場合には、第１の例と較べて気密状態の維持が期待できるが、多くの場合、突起部３３ａは金属で形成され、封止時にこの金属突起部を対面する基材、この場合ベ−ス３１に十分な加圧工程を経て食い込ませ、潰していることからベ−ス３１に対して少なからずダメ−ジを与え、場合によってはベ−ス３１を破損する事態を招く恐れがあった。このような事態にならないよう、ベ−ス材にも金属を用いることも考えられるが、この場合には、近年の携帯電話機やデジタルカメラ等に使用する小さな電子部品の場合には全体の軽量化を損ねることになり、好ましい実施形態ではなかった。
【０００８】
本発明は上記課題を解消するためになされたものであって、ベ−ス材とキャップの接合時、シ−ル材が電子部品格納空間への流入を阻止して、その後の気密状態の継続維持を実現し、パッケ−ジとしての信頼性をより高めた電子部品用パッケ−ジのキャップ封止方法を提供しようとするものである。
【０００９】
【課題を解決するための手段】
上記目的を達成するために、本発明に関わる電子部品用パッケ−ジのキャップ封止方法においては、キャップの周辺端部に、部品搭載ベ−スの周辺端部と接合する面に突出部を形成した平坦部を一体形成し、上記ベ−スの周辺端部へのシ−ル剤の塗布後に上記キャップをベ−ス上に載置することで、ベ−スとキャップとがシ−ル剤を介して接合することになり、この接合時、キャップに形成された突出部によってシ−ル剤の電子部品搭載側への流入を阻止して、封止出来るようにしたものである。
【００１０】
【発明の実施の形態】
以下、本発明による電子部品用パッケ−ジのキャップ封止方法の実施形態を図面を参照しながら説明する。
図１は本発明に関わる電子部品用パッケ−ジのキャップ封止方法の一実施形態の主要部を示す断面図である。
【００１１】
図１において、１は、厚さが１ミリ程度のセラミック材よりなり、その上面には、収納する電子部品２、例えば帯域フィルタであるＳＡＷ（Ｓｕｒｆａｃｅ　Ａｃｏｕｓｔｉｃ　Ｗａｖｅ：弾性表面波）フィルタを搭載したベ−スである。
３は前記ベ−ス１に搭載された電子部品２を保護する格納空間Ｓを形成した金属材より成るキャップである。また、このキャップ３の周辺端部には平坦部３ａが形成され、併せて、この平坦部３ａの前記ベ−ス１の周辺端部と接着する面となる内側には、面接触となるように先端が平坦を形成した突出部３ｂが一体形成されている。
【００１２】
この時の突出部３ｂの高さは、その役割から０．１ミリ程度あれば十分であり、同様に突出部３ｂ先端に形成の平坦幅については広くするほどその作用の向上が期待出来るが、必要以上に広くする必要はなく、その形成する位置もシ−ル剤の種類、塗布量に応じて適宜選択して形成される。また、先端はベ−ス１との接触面積が確保出来れば、平坦でなく、多少の丸みがあってもその作用に影響はない。
【００１３】
以下、以上の構成において、本発明に関わる電子部品用パッケ−ジのキャップ封止方法について、図１を参照しつつ順を追って詳述する。
【００１４】
先ず、図１から明らかなように、電子部品２が搭載されたセラミック材から成るベ−ス１の周辺端部外側にシ−ル剤４を塗布する。
ここでのシ−ル剤としては、導電性を備えた半田、樹脂、Ａｇロウ材等があり、ベ−ス１やキャップ３の材質に応じて適宜選択し、使用することになるが、ここでは、半田を例として説明する。
続いて、図１からも明らかなように、ベ−ス１上に位置合わせをしつつキャップ３を被せ、載置する。この時、キャップ３の平坦部３ａはその突出部３ｂが、ベ−ス１と面接触して載置されるので、該突出部３ｂによってシ−ル剤４を充填出来る一定の隙間、ここでは、前述の通り０．１ミリ程度の隙間が確保されるとともに、この突出部３ｂ（高さ相当）と平坦部３ａ（上辺部相当）、およびベ−ス１の周辺端部（下辺部相当）とで一辺が開放されたシ−ル剤４の充填空間を形成する。
この時の充填空間は、封止後のシ−ル剤４の厚みが突出部３ｂと同じとなるように、事前に使用するシ−ル剤４の種類、及びその塗布量を考慮して形成することが好ましい。
【００１５】
この後、加熱することで前記塗布したシ−ル剤４の半田が溶け、ベ−ス１の周辺端部と、キャップ３の平坦部３ａと突出部３ｂとで形成される空間がシ−ル剤４で充填されて固化する。これにより、ベ−ス１とキャップ３とは接合し、パッケ−ジとして封止される。
この時加熱によりシ−ル剤４の半田は溶けて流動性を持つが、キャップ３に形成された突出部３ｂの作用によって、電子部品２が搭載される格納空間Ｓへの流入は阻止されることになる。
また、この時の上記形成されたシ−ル剤充填空間に充填し切れなかったシ−ル剤４が存在していた場合、その時の半田は溢れることになるが、その場合にはベ−ス１とキャップ３より組み立てられるパッケ−ジ外にはみ出すことになり、電子部品２の格納空間Ｓに流入することはない。
【００１６】
尚、上記加熱時、キャップ３はその自重で溶融したシ−ル剤４を押し下げつつベ−ス１と接合することは出来るが、キャップ３上から軽く押圧しながら加熱することで、シ−ル剤４の電子部品用パッケ−ジの格納空間Ｓへの流入を阻止するとともに、両者の接着をより確実なものとすることが出来る。加えて、押圧によってベ−ス１とキャップ３の傾き接着も防げるので、電子部品としての外観上の見栄えの良さの確保や、高さのバラツキを抑えることが出来る。
【００１７】
その他の実施形態例として、ベ−ス１の周辺端部に、キャップ３の突出部３ｂ先端に対応する位置に窪み（図示せず）を形成し、組み立て時、ベ−ス１の周辺端部外側にシ−ル剤４を塗布し、このベ−ス１の周辺端部に形成した窪みに前記突出部先端３ｂを填め込み、加熱して接合し、封止する構成としてもよい。
この場合には、キャップ３の一部である突出部３ｂ先端が填め込まれた窪みの作用により、先の例と比較しても、電子部品２の搭載、格納空間へのシ−ル剤４（半田）の流入阻止効果は優れたものが期待出来ることは明らかである。尚、この時の突出部３ｂの高さは、先の例で述べた高さに加え、窪みの深さを考慮して形成することは説明するまでもない事項である。
【００１８】
また、上述のキャップ３の一実施形態として金属材を用いて説明したが、これは、搭載する電子部品がＳＡＷフィルタを例としたためであり、この場合、電磁シ−ルド効果（グランド効果）を高めてフィルタの帯域特性を維持する必要があることに配慮したもので、ＳＡＷフィルタを金属のキャップで覆うことで、帯域特性の維持を実現したものである。
【００１９】
このように、本発明では、ベ−スに搭載する電子部品や、本パッケ−ジを組み込み使用する携帯電話機やデジタルカメラ等の電子機器に応じて、ベ−ス材とキャップの素材をセラミック、金属材、及び樹脂材の中から適宜選択し、組合せ使用することも可能で、このことにより、本発明の効果をより高めることが期待出来る。
【００２０】
また、シ−ル剤４は、ベ−スに塗布後、加熱工程を経て、固化（硬化）し、接合するものとして説明したが、本発明は、その他、粘性を持ち、経時変化により固化、硬化する材料であって、特に加熱工程を経る必要がないものであっても適用可能である。
【００２１】
更に、実施形態の中で、突出部３ｂの高さを０．１ミリ程度としたが、シ−ル剤としてクラッド（半田などを圧延にて接合したもの）や、シ−ル剤を薄膜化したものを利用した場合、前者では４０μｍ、後者では３００μｍ程度の厚みがあれば充分であることから、突出部３ｂの高さを使用するシ−ル剤に応じて変化させることで、発明の効果を高めることが出来る。
【００２２】
【発明の効果】
以上詳述の通り、本発明に関わる電子部品用パッケ−ジのキャップ封止方法によれば、電子部品を搭載するベ−スとシ−ル剤を用いて接合、封止するキャップの周辺端部に突出部を一体形成することで、封止時における電子部品格納空間へのシ−ル剤の流入を確実に阻止できるもので、該空間の雰囲気の継続保持を実現して、搭載、格納している電子部品の特性劣化を抑え、電子部品としての信頼性の向上を実現させたパッケ−ジを提供できる効果が得られる。
【図面の簡単な説明】
【図１】本発明に関わる電子部品用パッケ−ジのキャップ封止方法の一実施形態の主要部を示す断面図である。
【図２】従来の電子部品用パッケ−ジのキャップ封止方法の第１の構成例を示す断面図である。
【図３】従来の電子部品用パッケ−ジのキャップ封止方法の第２の構成例を示す断面図である。
【符号の説明】
１　　ベ−ス
２　　電子部品
３　　キャップ
３ａ　平坦部
３ｂ　突出部
４　　シ−ル剤
Ｓ　　格納空間[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention forms a base on which electronic components such as a quartz crystal device and a semiconductor are mounted, forms a space for covering the base and protects the electronic components, and has a peripheral end formed with a base peripheral end. The present invention relates to a method for sealing a cap for an electronic component package, which seals an electronic component by joining a contacting cap with a sealing agent.
[0002]
[Prior art]
FIG. 2 is a view for explaining a first example of a conventional method of sealing a cap of this type of package. FIG. 2 (a) is a sectional view of a main part thereof, and FIG. FIG. 4 is a sectional view of a main part for describing a state after sealing. This will be described below with reference to the drawings.
[0003]
In FIG. 2, reference numeral 21 denotes a base on which an electronic component 22 is mounted, and reference numeral 23 denotes a cap having a storage space S for covering and protecting the electronic component 22. Reference numeral 24 denotes a conductive sealant that joins the base 21 and the cap 23, seals the electronic component 22, maintains the airtightness of the storage space S, and maintains the atmosphere continuously. Has been realized.
[0004]
FIG. 3 is a view for explaining a second example of a conventional method for sealing a package of this type, and is a cross-sectional view of a main part for explaining the sealing state. This will be described below with reference to the drawings.
[0005]
In FIG. 3, reference numeral 31 denotes a base on which an electronic component 32 is mounted, and reference numeral 33 denotes a cap having a storage space S for covering and protecting the electronic component 32. Reference numeral 34 denotes a sealant for joining the base 31 and the cap 33, which seals the electronic component 32, maintains the airtightness of the storage space S, and realizes the continuous maintenance of the atmosphere. In this example, a sharp projection 33a is formed at the peripheral end of the cap 33.
In this case, although it depends on the sealing method, most of the projections 33a are formed of metal, and the metal projections 33a are cut into the facing base 31 at the time of sealing, thereby achieving the first example. In comparison, the sealant 34 is prevented from entering the storage space S, and the maintenance of the airtight state is improved.
[0006]
[Problems to be solved by the invention]
In the case of the first conventional example, the sealing agent 24 is melted and sealed at the time of sealing. At this time, the pressure is applied from above the cap 23, as shown in FIG. , The sealant 24 may protrude. If it protrudes outside, it does not affect the characteristics as an electronic component, but it protrudes inward, in other words, if some of the sealant 24a enters the storage space S of the component, it is stored. The characteristics of the electronic component 22 are affected. That is, the sealing agent is lost, and a sufficient sealing state cannot be guaranteed. As a result, the desired airtight state of the electronic component storage space S cannot be maintained, and it becomes difficult to maintain the atmosphere continuously. This leads to characteristic deterioration.
[0007]
Further, in the case of the second conventional example, the maintenance of the airtight state can be expected as compared with the first example. However, in many cases, the protrusion 33a is formed of metal, and this metal protrusion is formed at the time of sealing. The facing base material, in this case, the base 31 is bitten through a sufficient pressurizing step, so that the base 31 is not damaged by the crushing, and in some cases, the base 31 is removed. There was a risk of damage. In order to avoid such a situation, it is conceivable to use a metal for the base material, but in this case, in the case of small electronic parts used in recent mobile phones, digital cameras, etc., the overall weight is reduced. , Which is not a preferred embodiment.
[0008]
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and when the base material and the cap are joined, the sealing material is prevented from flowing into the electronic component storage space, and the airtight state is continued thereafter. It is an object of the present invention to provide a method for sealing a package for an electronic component which realizes the maintenance and further enhances the reliability as a package.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, in the method of sealing a cap for an electronic component package according to the present invention, a projecting portion is provided at a peripheral end of the cap, at a surface joined to a peripheral end of the component mounting base. The formed flat portion is formed integrally, and the cap is placed on the base after the sealing agent is applied to the peripheral end of the base, so that the base and the cap are sealed. In this connection, the protrusion formed on the cap prevents the sealant from flowing into the electronic component mounting side, thereby enabling sealing.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a method for sealing a cap of a package for an electronic component according to the present invention will be described with reference to the drawings.
FIG. 1 is a sectional view showing a main part of an embodiment of a method for sealing a cap of an electronic component package according to the present invention.
[0011]
In FIG. 1, reference numeral 1 denotes a ceramic material having a thickness of about 1 mm, and an electronic component 2 to be housed thereon, such as a SAW (Surface Acoustic Wave) filter serving as a bandpass filter, is mounted on an upper surface thereof. -
Reference numeral 3 denotes a cap made of a metal material having a storage space S for protecting the electronic component 2 mounted on the base 1. A flat portion 3a is formed at the peripheral end of the cap 3, and the inside of the flat portion 3a which is to be bonded to the peripheral end of the base 1 is in surface contact. And a protruding portion 3b having a flat end is integrally formed.
[0012]
At this time, the height of the protrusion 3b is sufficient to be about 0.1 mm from its role. Similarly, the larger the flat width formed at the tip of the protrusion 3b, the more the effect can be expected. It is not necessary to make it wider than necessary, and the position where it is formed is appropriately selected according to the type and application amount of the sealant. In addition, if the tip has a sufficient contact area with the base 1, the tip is not flat, and even if it is slightly rounded, the operation is not affected.
[0013]
Hereinafter, a method for sealing a cap for an electronic component package according to the present invention in the above configuration will be described in order with reference to FIG.
[0014]
First, as is clear from FIG. 1, a sealing agent 4 is applied to the outside of the peripheral end of a base 1 made of a ceramic material on which an electronic component 2 is mounted.
Examples of the sealing agent include conductive solder, resin, Ag brazing material, etc., which are appropriately selected and used according to the material of the base 1 and the cap 3. A description will be given of solder as an example.
Subsequently, as is clear from FIG. 1, the cap 3 is put on the base 1 while being positioned, and placed. At this time, the flat portion 3a of the cap 3 is placed with its protruding portion 3b in surface contact with the base 1, so that the protruding portion 3b can fill the sealant 4 with a certain gap, in this case, As described above, a gap of about 0.1 mm is ensured, and the protruding portion 3b (corresponding to the height), the flat portion 3a (corresponding to the upper side), and the peripheral end of the base 1 (corresponding to the lower side). This forms a filling space for the sealant 4 whose one side is open.
The filling space at this time is formed in consideration of the type of the sealing agent 4 to be used in advance and the application amount thereof so that the thickness of the sealing agent 4 after sealing is the same as that of the protrusion 3b. Is preferred.
[0015]
Thereafter, the solder of the applied sealing agent 4 is melted by heating, and the space formed by the peripheral end of the base 1, the flat portion 3a of the cap 3, and the protruding portion 3b is sealed. Filled with agent 4 and solidified. As a result, the base 1 and the cap 3 are joined and sealed as a package.
At this time, the solder of the sealant 4 is melted by the heating to have fluidity, but due to the action of the protrusion 3b formed on the cap 3, the solder is prevented from flowing into the storage space S in which the electronic component 2 is mounted. Will be.
If the sealant 4 which has not been completely filled is present in the formed sealant filling space at this time, the solder at that time overflows. The protrusions protrude out of the package assembled from the cap 1 and the cap 3 and do not flow into the storage space S of the electronic component 2.
[0016]
At the time of heating, the cap 3 can be joined to the base 1 while pushing down the molten sealing agent 4 by its own weight. It is possible to prevent the agent 4 from flowing into the storage space S of the electronic component package, and to make the adhesion between the two more reliable. In addition, since the base 1 and the cap 3 can be prevented from being tilted and adhered by the pressing, it is possible to secure a good external appearance and suppress a variation in height as an electronic component.
[0017]
In another embodiment, a recess (not shown) is formed at a peripheral end of the base 1 at a position corresponding to the tip of the protrusion 3b of the cap 3, and the peripheral end of the base 1 is assembled at the time of assembly. A configuration may be adopted in which a sealant 4 is applied to the outside, and the protruding portion tip 3b is filled in a recess formed at the peripheral end of the base 1, heated, joined, and sealed.
In this case, the action of the recess into which the tip of the protruding portion 3b which is a part of the cap 3 is fitted causes the mounting of the electronic component 2 and the sealing agent 4 in the storage space as compared with the previous example. It is clear that an excellent effect of preventing the inflow of (solder) can be expected. It is needless to say that the height of the projection 3b at this time is formed in consideration of the depth of the depression in addition to the height described in the previous example.
[0018]
Also, the embodiment of the above-described cap 3 has been described using a metal material, but this is because the mounted electronic component is a SAW filter as an example, and in this case, the electromagnetic shield effect (ground effect) is reduced. Considering that it is necessary to maintain the band characteristic of the filter by increasing the SAW filter, the band characteristic is maintained by covering the SAW filter with a metal cap.
[0019]
As described above, according to the present invention, the material of the base material and the cap is made of ceramic, depending on the electronic components mounted on the base and the electronic device such as a mobile phone or a digital camera incorporating the package. It is also possible to appropriately select from a metal material and a resin material and use them in combination, and thereby it is expected that the effects of the present invention can be further enhanced.
[0020]
In addition, the sealant 4 has been described as being solidified (cured) and then joined through a heating process after being applied to the base. However, the present invention also has a viscosity, The present invention can be applied to a hardening material that does not need to go through a heating step.
[0021]
Further, in the embodiment, the height of the protruding portion 3b is set to about 0.1 mm. However, as the sealing agent, a clad (joined by rolling solder or the like) or a thinner sealing agent is used. When the former is used, it is sufficient that the former has a thickness of about 40 μm, and the latter has a thickness of about 300 μm. Can be increased.
[0022]
【The invention's effect】
As described above in detail, according to the method of sealing a cap of an electronic component package according to the present invention, the base on which the electronic component is mounted and the peripheral edge of the cap to be joined and sealed using a sealant. By integrally forming the protruding portion in the portion, it is possible to reliably prevent the flow of the sealant into the electronic component storage space at the time of sealing, and realize the continuous maintenance of the atmosphere of the space, thereby mounting and storing the electronic component. In this case, it is possible to provide a package that suppresses the deterioration of the characteristics of the electronic component and improves the reliability of the electronic component.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a main part of an embodiment of a method for sealing a cap of an electronic component package according to the present invention.
FIG. 2 is a cross-sectional view showing a first configuration example of a conventional method for sealing a cap of an electronic component package.
FIG. 3 is a cross-sectional view showing a second configuration example of a conventional method for sealing a cap of an electronic component package.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 2 Electronic component 3 Cap 3a Flat part 3b Projection part 4 Sealant S Storage space

Claims (5)

半導体などの電子部品を搭載したベ−スと、そのベ−ス上面に被せて搭載の電子部品を格納し保護する空間を形成するとともに、その周辺端部がベ−ス周辺端部と接触するキャップとの間をシ−ル剤を用いて接合し、電子部品を封止する電子部品用パッケ−ジのキャップ封止方法において、
上記キャップの周辺端部に、上記ベ−スの周辺端部と接合する面に突出部を形成した平坦部を一体形成し、
上記ベ−スの周辺端部にシ−ル剤を塗布し、
上記キャップをベ−ス上に載置後、シ−ル剤にてベ−スとキャップとを接合することにより、キャップに形成された突出部によってシ−ル剤の電子部品格納空間への流入を阻止して、封止することを特徴とする電子部品用パッケ−ジのキャップ封止方法。A base on which electronic components such as semiconductors are mounted and a space for storing and protecting the mounted electronic components over the base upper surface are formed, and a peripheral end thereof is in contact with a peripheral end of the base. A method for sealing a package for an electronic component, in which the electronic component is sealed by joining a cap and a cap with a sealant,
A flat portion having a projection formed on a surface joined to the peripheral end of the base is integrally formed with the peripheral end of the cap;
Apply a sealant to the peripheral end of the base,
After the cap is placed on the base, the base and the cap are joined with a sealant, so that the sealant flows into the electronic component storage space by the protrusion formed on the cap. And sealing the package for electronic components. 請求項１に記載の電子部品用パッケ−ジのキャップ封止方法において、前記封止するシ−ル剤として、半田、樹脂、またはＡｇロウを用いたことを特徴とする電子部品用パッケ−ジのキャップ封止方法。2. The method according to claim 1, wherein said sealing agent is solder, resin, or Ag braze. Cap sealing method. 請求項１及び請求項２に記載の電子部品用パッケ−ジのキャップ封止方法において、前記ベ−スとキャップとの接合を、加熱してシ−ル剤を溶融させて行うことを特徴とする電子部品用パッケ−ジのキャップ封止方法。3. The method according to claim 1, wherein the joining of the base and the cap is performed by heating to melt the sealant. Sealing method for a package for electronic parts. 請求項１に記載の電子部品用パッケ−ジのキャップ封止方法において、前記ベ−ス材とキャップ材として、セラミック、金属材、及び樹脂材を選択し、組合せ使用したことを特徴とする電子部品用パッケ−ジのキャップ封止方法。2. The method according to claim 1, wherein a ceramic, a metal, and a resin material are selected and used as the base material and the cap material. Cap sealing method for package for parts. 請求項１に記載の電子部品用パッケ−ジのキャップ封止方法において、前記ベ−ス周辺端部に、キャップの突出部先端に対応する位置に窪みを形成し、封止時、ベ−ス周辺端部に形成した窪みに前記キャップの突出部先端を填め込み、封止することを特徴とする電子部品用パッケ−ジのキャップ封止方法。2. A method according to claim 1, wherein a recess is formed at a peripheral end of said base at a position corresponding to a tip of a protruding portion of said cap. A cap sealing method for a package for an electronic component, wherein a tip of the projecting portion of the cap is fitted into a recess formed at a peripheral end and sealed.
JP2002223750A 2002-07-31 2002-07-31 Cap sealing method of package for electronic component Pending JP2004064013A (en)

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