JP2004053329A - 半導体センサ組み立て体およびタイヤモニタセンサ - Google Patents

半導体センサ組み立て体およびタイヤモニタセンサ Download PDF

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Publication number
JP2004053329A
JP2004053329A JP2002209028A JP2002209028A JP2004053329A JP 2004053329 A JP2004053329 A JP 2004053329A JP 2002209028 A JP2002209028 A JP 2002209028A JP 2002209028 A JP2002209028 A JP 2002209028A JP 2004053329 A JP2004053329 A JP 2004053329A
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Japan
Prior art keywords
sensor
vibration
pressure
diaphragm
circuit
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Pending
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JP2002209028A
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English (en)
Japanese (ja)
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JP2004053329A5 (https=
Inventor
Satoshi Shimada
嶋田　　智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Astemo Ltd
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Hitachi Ltd
Hitachi Car Engineering Co Ltd
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Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP2002209028A priority Critical patent/JP2004053329A/ja
Publication of JP2004053329A publication Critical patent/JP2004053329A/ja
Publication of JP2004053329A5 publication Critical patent/JP2004053329A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
JP2002209028A 2002-07-18 2002-07-18 半導体センサ組み立て体およびタイヤモニタセンサ Pending JP2004053329A (ja)

Priority Applications (1)

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JP2002209028A JP2004053329A (ja) 2002-07-18 2002-07-18 半導体センサ組み立て体およびタイヤモニタセンサ

Applications Claiming Priority (1)

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JP2002209028A JP2004053329A (ja) 2002-07-18 2002-07-18 半導体センサ組み立て体およびタイヤモニタセンサ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006299800A Division JP2007114205A (ja) 2006-11-06 2006-11-06 タイヤモニタセンサ

Publications (2)

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JP2004053329A true JP2004053329A (ja) 2004-02-19
JP2004053329A5 JP2004053329A5 (https=) 2005-06-09

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ID=31932985

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JP2002209028A Pending JP2004053329A (ja) 2002-07-18 2002-07-18 半導体センサ組み立て体およびタイヤモニタセンサ

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JP (1) JP2004053329A (https=)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005086202A (ja) * 2003-09-04 2005-03-31 Liteon It Corp 振動／衝撃検知装置
JP2006234481A (ja) * 2005-02-23 2006-09-07 Bridgestone Corp センサモジュール及びセンサモジュールを備えた空気入りタイヤ
WO2007086390A1 (ja) * 2006-01-30 2007-08-02 Sanyo Electric Co., Ltd. 圧力センサ取り付け方法、圧力センサを取り付けたタイヤ及びホイール、及びタイヤ圧力検知装置
JP2007327922A (ja) * 2006-06-09 2007-12-20 Epson Toyocom Corp 圧力センサ用ダイヤフラム、及び圧力センサ
JP2008028425A (ja) * 2007-10-12 2008-02-07 Yamaha Corp 半導体装置の封止樹脂層及び半導体装置の封止樹脂層の形成方法
JP2008028427A (ja) * 2007-10-15 2008-02-07 Yamaha Corp 蓋体フレーム及びその製造方法
JP2008111795A (ja) * 2006-10-31 2008-05-15 Denso Corp 圧力センサ
JP2009139202A (ja) * 2007-12-06 2009-06-25 Oki Semiconductor Co Ltd 静電容量型センサ及びその製造方法
JP2010151469A (ja) * 2008-12-24 2010-07-08 Denso Corp センサチップおよびその製造方法並びに圧力センサ
EP1740922A4 (en) * 2004-04-19 2012-01-04 Freescale Semiconductor Inc MOTION DETECTION FOR CONTROLLING TIRE PRESSURE
JP2012068229A (ja) * 2010-07-21 2012-04-05 Hella Kgaa Hueck & Co 媒体の物理的な状態変数を検出するためのデバイス
CN102596600A (zh) * 2009-11-20 2012-07-18 法国欧陆汽车公司 适于布置在轮胎的胎面内表面上的电子单元
WO2012124282A1 (ja) * 2011-03-11 2012-09-20 パナソニック株式会社 センサ
JP2013203312A (ja) * 2012-03-29 2013-10-07 Honda Motor Co Ltd 電動車両
JP2015045513A (ja) * 2013-08-27 2015-03-12 株式会社デンソー 半導体圧力センサ
DE102010043393B4 (de) * 2009-12-08 2015-11-26 Continental Automotive Systems, Inc. Drucksensorgehäuse mit Strömungshindernis zur Reduktion von Schutzgelvibrationen
US9207137B2 (en) 2013-12-18 2015-12-08 Seiko Epson Corporation Physical quantity sensor, pressure sensor, altimeter, electronic apparatus, and moving object
JP2015232494A (ja) * 2014-06-10 2015-12-24 日本電信電話株式会社 センサ回路
CN106895924A (zh) * 2015-12-21 2017-06-27 中国电力科学研究院 一种柔性温度压力传感器
WO2019176527A1 (ja) * 2018-03-15 2019-09-19 株式会社村田製作所 半導体装置及び電子機器
WO2019230490A1 (ja) * 2018-05-28 2019-12-05 日本精機株式会社 振動検出センサ
CN112848815A (zh) * 2019-11-27 2021-05-28 财团法人工业技术研究院 发电感测传输装置
CN113899992A (zh) * 2021-09-29 2022-01-07 天津市捷威动力工业有限公司 一种带有凝胶隔膜的芯包绝缘耐压测试标准制定方法
JP2022115829A (ja) * 2021-01-28 2022-08-09 ジック アーゲー 圧力センサ
US20220268800A1 (en) * 2019-09-26 2022-08-25 Molex, Llc Hybrid sensor assembly for use with active noise cancellation
DE102009038706B4 (de) 2008-08-25 2023-01-12 Infineon Technologies Ag Sensorbauelement

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005086202A (ja) * 2003-09-04 2005-03-31 Liteon It Corp 振動／衝撃検知装置
EP1740922A4 (en) * 2004-04-19 2012-01-04 Freescale Semiconductor Inc MOTION DETECTION FOR CONTROLLING TIRE PRESSURE
JP2006234481A (ja) * 2005-02-23 2006-09-07 Bridgestone Corp センサモジュール及びセンサモジュールを備えた空気入りタイヤ
JPWO2007086390A1 (ja) * 2006-01-30 2009-06-18 三洋電機株式会社 圧力センサ取り付け方法、圧力センサを取り付けたタイヤ及びホイール、及びタイヤ圧力検知装置
WO2007086390A1 (ja) * 2006-01-30 2007-08-02 Sanyo Electric Co., Ltd. 圧力センサ取り付け方法、圧力センサを取り付けたタイヤ及びホイール、及びタイヤ圧力検知装置
US8176776B2 (en) 2006-01-30 2012-05-15 Sanyo Electric Co., Ltd. Pressure sensor mounting method, tire and wheel having pressure sensor, and tire pressure detection device
US20100147063A1 (en) * 2006-01-30 2010-06-17 Sanyo Electric Co., Ltd. Pressure Sensor Mounting Method, Tire and Wheel Having Pressure Sensor, and Tire Pressure Detection Device
JP2007327922A (ja) * 2006-06-09 2007-12-20 Epson Toyocom Corp 圧力センサ用ダイヤフラム、及び圧力センサ
JP2008111795A (ja) * 2006-10-31 2008-05-15 Denso Corp 圧力センサ
JP2008028425A (ja) * 2007-10-12 2008-02-07 Yamaha Corp 半導体装置の封止樹脂層及び半導体装置の封止樹脂層の形成方法
JP2008028427A (ja) * 2007-10-15 2008-02-07 Yamaha Corp 蓋体フレーム及びその製造方法
JP2009139202A (ja) * 2007-12-06 2009-06-25 Oki Semiconductor Co Ltd 静電容量型センサ及びその製造方法
DE102009038706B4 (de) 2008-08-25 2023-01-12 Infineon Technologies Ag Sensorbauelement
JP2010151469A (ja) * 2008-12-24 2010-07-08 Denso Corp センサチップおよびその製造方法並びに圧力センサ
CN102596600B (zh) * 2009-11-20 2015-08-19 法国欧陆汽车公司 适于布置在轮胎的胎面内表面上的电子单元
CN102596600A (zh) * 2009-11-20 2012-07-18 法国欧陆汽车公司 适于布置在轮胎的胎面内表面上的电子单元
DE102010043393B4 (de) * 2009-12-08 2015-11-26 Continental Automotive Systems, Inc. Drucksensorgehäuse mit Strömungshindernis zur Reduktion von Schutzgelvibrationen
JP2012068229A (ja) * 2010-07-21 2012-04-05 Hella Kgaa Hueck & Co 媒体の物理的な状態変数を検出するためのデバイス
US9231119B2 (en) 2011-03-11 2016-01-05 Panasonic Intellectual Property Management Co., Ltd. Sensor
WO2012124282A1 (ja) * 2011-03-11 2012-09-20 パナソニック株式会社 センサ
JP2013203312A (ja) * 2012-03-29 2013-10-07 Honda Motor Co Ltd 電動車両
JP2015045513A (ja) * 2013-08-27 2015-03-12 株式会社デンソー 半導体圧力センサ
US9207137B2 (en) 2013-12-18 2015-12-08 Seiko Epson Corporation Physical quantity sensor, pressure sensor, altimeter, electronic apparatus, and moving object
US9541460B2 (en) 2013-12-18 2017-01-10 Seiko Epson Corporation Physical quantity sensor, pressure sensor, altimeter, electronic apparatus, and moving object
JP2015232494A (ja) * 2014-06-10 2015-12-24 日本電信電話株式会社 センサ回路
CN106895924B (zh) * 2015-12-21 2020-01-17 中国电力科学研究院 一种柔性温度压力传感器
CN106895924A (zh) * 2015-12-21 2017-06-27 中国电力科学研究院 一种柔性温度压力传感器
WO2019176527A1 (ja) * 2018-03-15 2019-09-19 株式会社村田製作所 半導体装置及び電子機器
US11348880B2 (en) 2018-03-15 2022-05-31 Murata Manufacturing Co., Ltd. Semiconductor device and electronic apparatus
WO2019230490A1 (ja) * 2018-05-28 2019-12-05 日本精機株式会社 振動検出センサ
US20220268800A1 (en) * 2019-09-26 2022-08-25 Molex, Llc Hybrid sensor assembly for use with active noise cancellation
CN112848815A (zh) * 2019-11-27 2021-05-28 财团法人工业技术研究院 发电感测传输装置
US11919336B2 (en) 2019-11-27 2024-03-05 Industrial Technology Research Institute Self-powered sensing and transmitting device
JP2022115829A (ja) * 2021-01-28 2022-08-09 ジック アーゲー 圧力センサ
JP7282935B2 (ja) 2021-01-28 2023-05-29 ジック アーゲー 圧力センサ
US11703409B2 (en) 2021-01-28 2023-07-18 Sick Ag Pressure sensor with reduced measurement error
CN113899992A (zh) * 2021-09-29 2022-01-07 天津市捷威动力工业有限公司 一种带有凝胶隔膜的芯包绝缘耐压测试标准制定方法
CN113899992B (zh) * 2021-09-29 2023-06-13 天津市捷威动力工业有限公司 一种带有凝胶隔膜的芯包绝缘耐压测试标准制定方法

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