JP2004047955A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2004047955A
JP2004047955A JP2003118752A JP2003118752A JP2004047955A JP 2004047955 A JP2004047955 A JP 2004047955A JP 2003118752 A JP2003118752 A JP 2003118752A JP 2003118752 A JP2003118752 A JP 2003118752A JP 2004047955 A JP2004047955 A JP 2004047955A
Authority
JP
Japan
Prior art keywords
chip
die pad
semiconductor device
electronic component
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003118752A
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English (en)
Japanese (ja)
Other versions
JP2004047955A5 (https=
Inventor
Takashi Kunimatsu
崇 國松
Minoru Fukui
穣 福井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2003118752A priority Critical patent/JP2004047955A/ja
Publication of JP2004047955A publication Critical patent/JP2004047955A/ja
Publication of JP2004047955A5 publication Critical patent/JP2004047955A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2003118752A 2002-05-22 2003-04-23 半導体装置 Withdrawn JP2004047955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003118752A JP2004047955A (ja) 2002-05-22 2003-04-23 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002147416 2002-05-22
JP2003118752A JP2004047955A (ja) 2002-05-22 2003-04-23 半導体装置

Publications (2)

Publication Number Publication Date
JP2004047955A true JP2004047955A (ja) 2004-02-12
JP2004047955A5 JP2004047955A5 (https=) 2006-06-08

Family

ID=31719621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003118752A Withdrawn JP2004047955A (ja) 2002-05-22 2003-04-23 半導体装置

Country Status (1)

Country Link
JP (1) JP2004047955A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111154A (ja) * 2007-10-30 2009-05-21 Mitsubishi Electric Corp 電力半導体モジュール
JP2010258289A (ja) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2012248736A (ja) * 2011-05-30 2012-12-13 Sanken Electric Co Ltd 半導体装置
KR20190024840A (ko) * 2017-08-31 2019-03-08 익시스, 엘엘씨 Pfc에의 적용을 위한 패키징된 고속 역 다이오드 성분
JP2022143166A (ja) * 2021-03-17 2022-10-03 ローム株式会社 半導体装置
WO2023176332A1 (ja) * 2022-03-17 2023-09-21 ローム株式会社 電子装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111154A (ja) * 2007-10-30 2009-05-21 Mitsubishi Electric Corp 電力半導体モジュール
JP2010258289A (ja) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2012248736A (ja) * 2011-05-30 2012-12-13 Sanken Electric Co Ltd 半導体装置
KR20190024840A (ko) * 2017-08-31 2019-03-08 익시스, 엘엘씨 Pfc에의 적용을 위한 패키징된 고속 역 다이오드 성분
JP2019075548A (ja) * 2017-08-31 2019-05-16 イクシス・リミテッド・ライアビリティ・カンパニーＩｘｙｓ， Ｌｌｃ Ｐｆｃ用途のためのパッケージされたファストインバースダイオード部品
KR102512166B1 (ko) * 2017-08-31 2023-03-21 익시스, 엘엘씨 Pfc에의 적용을 위한 패키징된 고속 역 다이오드 성분
JP2022143166A (ja) * 2021-03-17 2022-10-03 ローム株式会社 半導体装置
JP7845824B2 (ja) 2021-03-17 2026-04-14 ローム株式会社 半導体装置
WO2023176332A1 (ja) * 2022-03-17 2023-09-21 ローム株式会社 電子装置

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